CN210121141U - Medical imaging facility and cooling system, component and component system and cooling element thereof - Google Patents

Abstract

The utility model relates to a medical imaging facility and cooling system thereof, part and part system and cooling element. The cooling system includes: a cooling circuit comprising a first cooling loop; a compression unit disposed in the first cooling loop; a condensing unit disposed downstream of the compressing unit in a flow direction; a throttling unit arranged at the downstream of the condensing unit; and at least one heat-generating component of the medical imaging facility, which is arranged downstream of the throttling unit, which is thermally connected with the cooling medium. The component system of the component is used for cooling a medical imaging facility comprising the above-mentioned cooling system or the above-mentioned component system, the cooling element being a cooling element of a cooling circuit through which a cooling medium flows.

Description

Medical imaging facility and cooling system, component and component system and cooling element thereof

Technical Field

The utility model relates to a medical imaging facility and cooling system thereof, part and part system and cooling element.

Background

Cooling systems with different topologies can be used today for cooling Magnetic Resonance (MR) installations. Water or glycol/water mixtures are usually used as coolants. The coolant is usually circulated in the secondary circuit through the heat-generating main components of the MR system, for example a magnet cooler (cold head) or a gradient amplifier. The secondary circuit is usually cooled by a primary circuit filled with water, rarely having only one cooling circuit. The coolant of the secondary circuit is thus either air-cooled (rarely) directly by the heat exchanger or flows uninterruptedly to cool the integrated cooling device. If a primary circuit is present, the hot coolant of the secondary circuit is coupled to the primary circuit by means of a heat exchanger. The primary circuit provides cold water to the secondary circuit and transports heat from the secondary circuit to cooling equipment, which is mostly erected externally (outside the building). The cooling device outputs heat to the outside air. In any case, the main components of the MR system, such as gradient amplifiers, high-frequency power amplifiers, gradient coil or magnet coolers, and small-signal electronics, are generally individually traversed by the coolant of the secondary circuit by means of individual cooling loops. If the primary circuit, i.e. the primary heat sink of the cooling system, then ceases to operate in relation to the usual cooling system topology, the temperature in the secondary circuit rises and the MR system cannot be used further. If the cooling water temperature at the magnet cooler of the reservoir reaches 30 to 40 c by means of large helium cooling, the magnet cooling device stops running, the pressure in the magnet rises and after a few hours the magnet starts to lose helium due to evaporation. Due to the evaporation, the magnet can be prevented from quenching (depending on the amount of helium present) within a few days. In magnets with low or no helium content, the shutdown of the cooling system has resulted in a rapid quench or slow drop (if possible) in 10 to 1000 minutes. Thereafter, the magnet warms up and requires several days of cooling time to reconstruct the magnetic field required for the imaging run (slow acceleration).

It has also been shown that water or glycol-water-mixture is a critical cooling medium because chemical and biological processes in water and interactions with materials contained in the cooling system can lead to corrosion, fouling and plugging. Air ingress or leakage at the connector or through the plastic hose can cause problems (chemical, biological, mechanical) requiring extensive maintenance. At the same time, temperature fluctuations occur within the secondary circuit as a result of the heat output of the connected plant components in the flow direction. For example, the transistors located on the part of the cooling plate and further downstream in the flow direction in the secondary circuit receive warmer water than the components arranged at the start. This can affect the electrical performance of the component and compromise long term stability.

SUMMERY OF THE UTILITY MODEL

In contrast, it is an object of the present invention to provide an alternative mechanism which allows an improved reliability of cooling of a medical imaging facility, in particular a magnetic resonance facility, to improve the operating conditions of the various components of the facility and at the same time save costs. In particular, it is an object of the invention to improve the reliability of cooling an MR installation comprising a magnet with a small helium content and/or no helium content.

This object is achieved by a cooling system for cooling a component of a medical imaging facility, a corresponding component system, a medical imaging facility, a component according to the invention and a corresponding cooling element. Preferred and/or alternative advantageous embodiments are described below.

The solution according to the invention of said object will be described below with respect to the claimed device. The features, advantages or alternative embodiments of the device mentioned in this case can also be transferred to the other claimed subject matter and vice versa.

In a first aspect, the present invention relates to a cooling system for cooling a component of a medical imaging facility. The cooling system includes:

a closed cooling circuit through which a cooling medium flows, the cooling circuit comprising a first cooling circuit,

a compression unit arranged in the first cooling loop, the compression unit being configured to increase the pressure in the cooling medium upon introduction of energy,

a condensing unit arranged downstream of the compression unit in the flow direction in the first cooling circuit, the condensing unit being designed to convert the cooling medium from a gaseous state of aggregation to a liquid state of aggregation,

-a throttling unit arranged downstream of the condensing unit in the flow direction in the first cooling loop, the throttling unit being configured for reducing the pressure in the cooling medium, and

at least one heat-generating component of the medical imaging facility, which component is arranged downstream of the throttle unit in the flow direction in the first cooling circuit, is thermally connected to a cooling medium for the purpose of outputting heat to the cooling medium.

A medical imaging facility is an imaging facility that utilizes different physical effects to generate image data for medical purposes (e.g., diagnosing a patient).

The components of the medical imaging unit correspond to structural subgroups or functional subunits of the imaging facility. The component according to the invention can in particular comprise at least one electronic component, such as a coil, a semiconductor component, a resistor, a capacitor or the like, in particular a plurality of electronic components, and in operation, generally has a (continuously) high thermal load, for example in the range of a few kw. The heat load must be permanently cooled during operation.

According to the invention, the cooling system comprises at least one component, particularly preferably a plurality of components. In other words, the cooling system serves to supply at least one component, but advantageously to supply a plurality of components with cold or to carry away the heat generated. The components are preferably connected in series, i.e. one after the other in the flow direction, to the first cooling circuit. Alternatively and/or additionally, at least individual components can also be connected to the first cooling circuit parallel to one another, i.e. at the same location along the flow direction.

The medical imaging facility can be configured, for example, as a computed tomography scanner, a C-arm X-ray machine, a positron emission tomography scanner, or the like. However, the medical imaging facility is particularly preferably designed as a magnetic resonance facility.

Accordingly, according to a preferred embodiment of the cooling system, the at least one component of the medical imaging facility is a component out of the group of: gradient amplifiers, high-frequency amplifiers, gradient coils, cooling heads for superconducting magnets, air conditioning facilities for component systems, medical imaging facilities or cooling systems. Other components are also contemplated, particularly with respect to components of other medical imaging facilities.

The cooling medium according to the invention is a two-phase cooling medium which, in the course of the flow circulation through the cooling system, at least partially undergoes a phase change between a gaseous state of aggregation and a liquid state of aggregation. The coolant absorbs heat from at least one component upon transition from a liquid state to a gaseous state (evaporation), and releases heat upon transition from a gaseous state to a liquid state (condensation). In this way, cooling of the components of the medical imaging facility is induced. The cooling medium is preferably a synthetic cooling medium. Thereby preventing problems of corrosion and/or algae or bacteria growth in water-based cooling systems. The cooling system is closed in the following respects: it is a hermetically sealed and eventually leak checked system from manufacture. This also simplifies maintenance.

By selecting a suitable cooling medium, the evaporation temperature of the cooling medium can be defined taking into account the design of the cooling system and the pressure ratios set therein. The evaporation temperature of the coolant is preferably in the range of 5 degrees celsius to about 100 degrees celsius. The evaporation temperature is an approximately fixed upper temperature limit of the cooling system. The magnitude of the phase change energy of the coolant is very high. Thus, in the cooling system and in particular between the individual components, there is advantageously only a small or no temperature difference. In other words, such an approximately constant operating temperature of the components can be achieved, to be precise, independently of the order of the components within the cooling circuit. In other words, there is only a small temperature difference between the components arranged directly downstream of the throttling unit and the components arranged directly upstream of the compression unit. In particular, the operating temperature of the component can advantageously be set below 12 degrees celsius, in which case in particular the semiconductor element operates particularly effectively. Overall, a more efficient component design can thus be achieved.

Cooling by phase change achieves greater power consumption than conventional water cooling. The system pressure and coolant flow can be designed accordingly small, for example, to about ten percent of the current typical flow rate of a water cooling system. This simplifies the design of the cooling system and reduces costs.

In a preferred embodiment of the cooling system, the cooling medium is a cooling medium from the group of: tetrafluoroethane, tetrafluoropropene, carbon dioxide.

A compression unit is arranged in the first cooling circuit, more precisely downstream of at least one component. The compression unit receives gaseous, i.e. "hot" cooling medium from at least one component and compresses it. In other words, the compression unit is used for pressure increase of the cooling medium. The compression unit can be formed by any and per se known compressor for cooling a medium. Subsequently, the cooling medium flows through the condensation unit. The condensation unit is designed such that it is thermally connected to a heat sink, and the condensation unit can output heat conducted away by at least one component to the heat sink. The cooling medium is thereby condensed, i.e. transformed from a gaseous state of aggregation to a liquid state of aggregation. The heat sink can for example be air surrounding the condensation unit or another refrigeration circuit. The condensing unit preferably has a large outer face in order to enhance energy transfer onto the heat sink. In this connection, the condensation unit is preferably designed as a condenser or heat exchanger known per se. Thereafter, the liquefied, "cold" cooling medium reaches the throttling unit. The throttling unit reduces the pressure of the cooling medium. The throttle unit can be realized in a simple manner as a local cross-sectional narrowing of the first cooling circuit.

Advantageously, the cooling system further comprises a pump known per se for generating a flow of the cooling medium through the cooling system. Depending on the location at which the pump is integrated into the cooling system, the pump must be designed for liquid and/or gaseous cooling media.

In an advantageous embodiment, the cooling system comprises at least one cooling element which is arranged downstream of the throttle unit in the flow direction in the first cooling circuit and via which at least one component of the magnetic resonance facility is detachably connected to the first cooling circuit.

As an alternative to a single cooling element, a plurality of, in particular two or three, cooling elements can be provided in the first cooling circuit. This is particularly advantageous if components with greatly different thermal loads are present. Each cooling element can thus be designed or dimensioned according to the temperature difference between the connected component and the cooling medium, and the components can be associated with one of the cooling elements according to their operating temperature.

The cooling element is preferably a cooling plate through which a cooling medium flows. The cooling element preferably has a rectangular cross section in the flow direction. Other embodiments of the cooling element are likewise conceivable, for example a circular cross section. In particular, the cooling element has a larger cross section than the first cooling loop and is thus a cold reservoir within the first cooling loop. According to the invention, at least one component, preferably a plurality of components, is connected to the cooling circuit via the cooling element. Connecting a plurality of components to a central cooling element advantageously allows temperature equalization between the individual components and/or a substantially constant setting of the operating temperature, which increases the service life and thus minimizes maintenance effort. The use of one or a small number of cooling elements also results in compactness of the cooling system and reduces the number and cost of piping and/or hoses.

Furthermore, at least one component is detachably connected with the first cooling circuit, for example by means of a connector. Thereby, the cooling system and the at least one component can be separated from each other and maintained independently of each other. Accordingly, replacement of components can be performed, for example, without interrupting the operation of the cooling system relative to the remaining components.

Alternatively and/or additionally, it can be provided that individual components outside the at least one cooling element are connected to the first cooling circuit.

In an advantageous embodiment of the cooling system, at least one component has a configuration which, when connected to the cooling element, allows a heat exchange between at least one heat-generating electronic component of the component and the cooling medium.

The central cooling element in the cooling system effects a central cold distribution. Due to the separability, the component and the cooling circuit can be developed separately from each other. In contrast to the design of the component integrated with regard to cooling, it is particularly advantageous if at least one electronic component, for example a semiconductor, enclosed by the component is arranged inside the component, so that the thermal load generated by the electronic component can be directly dissipated to the cooling medium when the component is connected to the cooling system. In other words, the components are designed such that the electronics element to be cooled can be arranged thermally directly on the cooling element. This requires, in principle, a mechanically modified component development guide. In particular, it is advantageous if at least one electronics component is arranged such that the other subassemblies of the component and/or the electronics component are not or only slightly subjected to the generated thermal load. This reduces costs and improves the reliability of the cooling system.

In a further embodiment of the cooling system, the at least one cooling element has at least two sides on which in each case at least one component of the medical imaging facility is arranged.

The cooling element is preferably at least accessible from two opposite sides. On each side, a plurality of components are preferably connected in series along the flow direction. This additionally increases the compactness of the cooling system.

In a further preferred embodiment of the cooling system, the cooling circuit is formed by metal tubes which are connected by a crimp connection in addition to the included units and components of the medical imaging facility.

A crimp connection denotes a connection established by plastic deformation of a metal tube. Crimping can be effected, for example, by crimping, pressing, crimping or folding. The crimp connection is substantially non-removable or can only be disconnected by breaking the metal tube. In this respect, a local cooling system is a substantially sealed or hermetically sealed system when the components are not connected. The coolant circuit can be realized via metal tubes which are firmly crimped to one another. These connections can be simply maintained in the field, are inexpensive and reliably leak-proof.

In a further embodiment of the cooling system, the cooling circuit comprises a second cooling loop arranged parallel to the first cooling loop, said second cooling loop also comprising at least one further component of the compression unit, the condensation unit, the throttling unit and the medical imaging facility arranged downstream of the throttling unit in the flow direction, said further component being thermally connected to the cooling medium for outputting heat to the cooling medium. The second cooling loop optionally also includes the pump of the first cooling loop or has its own pump.

If necessary, the design scheme realizes that: cooling components of the medical imaging facility remote from the remaining components. The second cooling circuit and the components connected thereto can be conventionally configured in terms of: no central cooling element is provided and at least one component is connected thereto in a non-detachable manner. However, it is particularly preferred that the second cooling loop also corresponds to the configuration and function according to the first cooling loop, as described above.

In a further preferred embodiment of the cooling system, the first and/or the second cooling circuit is designed such that the flow direction of the cooling medium is directed upwards along the at least one component. In other words, the at least one cooling element and the at least one component to be cooled are arranged such that the gaseous cooling medium formed, for example, by the introduction of heat into the component can rise upwards. The individual components or cooling elements are traversed by the cooling medium from below upwards, so that the gaseous cooling medium is not stationary anywhere and is potentially recooled again in the flow direction by the surrounding liquid coolant in the further course of the cooling circuit.

In another aspect, the present invention relates to a component system for cooling a component of a medical imaging facility. The component system includes:

a closed cooling circuit through which a cooling medium flows, the cooling circuit comprising a first cooling circuit,

a compression unit arranged in the first cooling circuit, which compression unit is designed to increase the pressure in the cooling medium upon introduction of energy,

a condensing unit arranged downstream of the compression unit in the first cooling circuit in the flow direction, the condensing unit being designed for converting the cooling medium from a gaseous state of aggregation into a liquid state of aggregation,

-a throttling unit arranged downstream of the condensing unit in the first cooling loop in the flow direction, the throttling unit being configured for reducing the pressure in the cooling medium, and

at least one heat-generating component of the medical imaging facility, which is arranged downstream of the throttle unit in the first cooling circuit, is thermally connected to the cooling medium for the purpose of outputting heat to the cooling medium.

The component system is arranged in an insulated manner. The component system comprises a plurality of, i.e. at least two, components which are connected to the first cooling circuit of the cooling circuit via at least one cooling element. The component system is spatially and/or thermally separated from the region surrounding it. The component system can include a housing or an outer boundary. The component system can be designed in particular as a sealed electronics cabinet of an imaging facility in a laboratory. The component system can alternatively be designed as a separate room, for example as a technical room arranged next to a laboratory, which includes superconducting magnet coils and/or gradient coils. In this case, the spatial boundary can be enclosed by the component system. In particular, the component system is additionally provided with an insulating element, in particular an insulating layer, in order to minimize the heat balance with the environment.

The component system preferably also comprises components which are designed as air conditioning systems and serve for (additionally) cooling the air in the closed environment of the component system.

The component system can in particular also be connected to a second cooling circuit, wherein the second cooling circuit can also run outside the component system in order to cool at least one remote component. In particular, a second cooling loop for cooling the cooling head of the superconducting magnet coil can extend between the component system and the laboratory. The second cooling circuit can be configured conventionally or corresponds in structure and function to the first cooling circuit, as described at the outset.

In another aspect, the invention relates to a medical imaging facility for cooling components thereof, comprising a cooling system according to the invention and/or a component system according to the invention. The imaging facility according to the invention is in particular designed as a magnetic resonance facility.

In another aspect, the present invention relates to a component of a medical imaging facility. The component is designed such that it can be detachably mounted on a cooling element of a cooling circuit of a medical imaging facility through which a cooling medium flows and, when connected to the cooling element, allows a heat exchange between at least one heat-generating electronic component of the component and the cooling medium, as described above.

In another aspect, the present invention relates to a cooling element of a cooling circuit of a medical imaging facility through which a cooling medium flows. The outer surface of the cooling element is configured such that, when the component of the medical imaging facility is mounted, the surface allows heat exchange between the at least one electronics element of the component and the cooling medium.

The component and the cooling element are formed or shaped complementarily at least on their outer partial regions, which are provided for fastening the component to the cooling element. By forming the outer partial region, a self-supporting, detachable connection can be achieved, for example by means of a tongue-and-groove arrangement, an insertion arrangement or a clamping arrangement. Each of the devices has at least two connecting elements, one of which is arranged on the component and the cooling element. The component as a connecting element can have, for example, a tongue, while the cooling element can have a groove, wherein the groove can be pushed into the tongue. Alternatively or additionally, at least one holding mechanism may be required in order to place the component on the cooling element, for example a screw or bolt.

Drawings

The above features, characteristics and advantages of the present invention and the manner of attaining them will become more apparent and the invention will be better understood by reference to the following description of embodiments, which is set forth in detail in connection with the accompanying drawings. The present invention is not limited to these embodiments by this description. In the different figures, identical components are provided with the same reference numerals. The figures are generally not to scale. The figures show:

fig. 1 shows a schematic view of a medical imaging facility in the form of a magnetic resonance facility, respectively, in an embodiment of the invention, the magnetic resonance facility comprising a cooling system,

figure 2 shows a schematic view of a component system in one embodiment of the invention,

figure 3 shows a schematic view of a component system in another embodiment of the invention,

fig. 4 shows a schematic view of a component system in another embodiment of the invention.

Detailed Description

The medical imaging facility 2 shown in fig. 1 in the form of a magnetic resonance facility comprises a hollow cylindrical basic unit 4, in the interior of which, i.e. in the interior of a so-called tunnel 6, an electromagnetic field is generated during operation for magnetic resonance measurements or for the examination of an examination subject in the form of a patient 8. Furthermore, the patient bed 14 is provided with a movable couch plate 16. The patient 8 can be positioned, for example, as depicted on a lying plate 16. The patient bed 14 is positioned outside the base unit 4 such that the couch plate 16 together with the patient 8 can be moved at least partially into the tunnel 6 for the examination.

The tomography scanner 2 has an arithmetic unit 12 in the form of a computer system which is designed as a computer and has a display unit 10, for example for the graphic display of the magnetic resonance data reconstructed into an image. The display unit 10 can be, for example, an LCD, plasma or OLED screen. It can also be a touch-sensitive screen, which is also designed as an input unit 16. Such touch sensitive screens can be integrated into imaging devices or be formed as part of mobile devices. The input unit 16 is, for example, a keyboard, a mouse, a so-called "touch screen" or also a microphone for voice input. The input unit 16 can also be designed to recognize the movement of the user and to convert it into corresponding instructions.

The computer system 12 can be designed, in particular, for reconstructing a magnetic resonance image or a tomograph from the magnetic resonance raw data or for generating control signals for the base unit, which are received as a result of user inputs via the input unit 16, for example, the selection of a measurement protocol suitable for the patient 8. The computer system 12 is connected to the base unit 4 of the tomography scanner 2 for data exchange. For example, control signals for the tomography scanner 2 can be transmitted. The connection 22 is realized in a known manner, wired or wirelessly, via a suitable interface.

In the base unit 4, preferably for each spatial direction x, y and z, a superconducting magnet coil, a gradient coil and a high-frequency coil are provided, which together allow for the construction of all the magnetic fields required for the magnetic resonance measurement. In general, a component K of the cooling system 24 according to the invention in the form of a cooling head/magnet cooling device (MREF) for superconducting magnet coils is provided on the base unit 4. The cooling of superconducting magnet coils is usually carried out with helium, wherein depending on the type of coil, different amounts of helium are required for cooling. Alternatively, the coolant head K can be designed such that it achieves cooling without helium or with helium only very little (e.g. <100 liters).

The magnetic resonance facility 2 further comprises a cooling system 24. The cooling system has a cooling circuit with a first cooling loop S1. Further, the cooling circuit includes a second cooling loop S2. The second cooling loop S2 is used for cold supply of the cold head K on the base unit 4.

The cooling circuit is characterized in that it is hermetically sealed. In other words, the cooling circuit has no inlet or outlet. Ideally, the cooling circuit also has no leakage. This is achieved by a crimped connection between the metal tubes of the cooling system 24, which cannot be released without damaging the tubes. The cooling circuit is filled with a two-phase, synthetic cooling medium which moves in a loop in the first and/or second cooling loop S1, S2. The coolant flow is caused by a pump P arranged in the first cooling loop S1, which pump pumps the cooling medium, which is here in a liquefied state. The pump P also moves the cooling medium through the second cooling loop S2. The coolant has a phase transition temperature which is predefined and matched to the necessary cooling capacity. This is preferably set to a value between 0 and 100 degrees celsius. It is particularly preferred to set the phase change temperature to a value below 12 degrees celsius in order to achieve an optimum operating temperature of the electronics element EE of the at least one component K of the magnetic resonance system 2.

A throttle element D in the form of a throttle or expansion valve is provided downstream of the pump P in the flow direction F (indicated by the arrow) in the first cooling loop S1 of the cooling system 24. The throttle element can be designed as an unregulated or regulated throttle element D. The non-regulated throttle element D is realized, for example, by a local constriction of the tube cross section, a so-called capillary tube. The regulated throttle element D can set a desired pressure or a desired temperature of the (liquid) cooling medium. Another throttling element D is also provided at a similar location in the second cooling circuit S2. Alternatively, only one throttle element D can be provided for both cooling circuits S1 and S2. In this case, the two cooling loops S1 and S2 branch only downstream of the throttling element D. Downstream of the restriction element D in the flow direction F, but already upstream thereof. The branching of the two cooling circuits can be realized, for example, by a three-way valve known per se. Downstream of the throttling element D in the flow direction F, a central cooling element KE in the form of a central cooling plate follows the first cooling loop S1 in the present embodiment. The central cooling plate is dimensioned such that a plurality of magnetic resonance systems 2, in this case five different components K, can be arranged thereon. The components K of the magnetic resonance system 2 can each have at least one electronic component EE, such as a semiconductor component, a coil, a capacitor, etc., which generates thermal energy during operation. The component K can be embodied, for example, in the form of a gradient power amplifier (GPAx, GPAy, GPAz) for one of the gradient coils for each spatial direction x, y, z of the magnetic resonance system 2, in the form of a Radio Frequency Power Amplifier (RFPA) or in the form of an Air Conditioning System (ACS) for cooling the ambient air of the cooling system 24. Other embodiments of the component K are likewise conceivable and can be integrated into the first cooling circuit. In this embodiment, the cooling element KE has a square cross section, which is larger than the cross section of the metal tube of the cooling circuit. In this connection, the cooling element KE is a reservoir of coolant. By connecting the component K to the cooling element KE, the component K is thermally connected to the cooling medium on the one hand and can deliver the heat generated to the cooling medium during operation. Furthermore, the design of the cooling element KE as a cooling container advantageously results in a more constant operating temperature for the connected components K, since it results in a temperature equilibrium between these components. The thermal energy transferred from the component K to the cooling medium causes a phase change of the cooling medium from the liquid state to the gaseous state. Downstream of the cooling element KE in the flow direction F, a further three-way valve follows, which again merges the cooling medium flows of the first and second cooling circuits S1 and S2. The gaseous cooling medium is then pressurized or compressed by the compression unit KOMP. The compression unit KOMP is designed as a compressor known per se. The compression unit KOPM further guides the cooling medium to the condensation unit KOND. The condensation unit is in thermal contact with the cold sink and transmits the heat energy of the component K, which is conducted therewith, to the heat sink. For this purpose, the condensation unit KOND has an enlarged outer face in order to promote heat transfer to the cold sink. The condensation unit KOND can be embodied in the form of a heat exchanger which is matched to the type or medium of the cold sink. Due to the energy output, the cooling medium condenses and returns to a liquid state of aggregation. In this embodiment, the heat sink is formed in the form of the ambient air of the cooling system 24, which is permanently cooled by a component K in the form of an air conditioning installation integrated into the first cooling loop S1.

The cooling system 24 of this embodiment, and in particular the first cooling loop S1, is constructed in the form of an electronics cabinet in a sealed environment. Alternatively, the first cooling loop S1 can also be arranged in a technical room separate from the examination room comprising the magnetic resonance facility 2 and the second cooling loop S2. The illustrated cooling system 24 forms a component system 20 according to the invention together with a heat insulation unit 26 in the form of an insulation layer which is arranged on a wall of a technical room or a wall of an electronics cabinet.

Fig. 2 shows a schematic view of a component system 20 in an embodiment of the invention. This component system differs from the component system 20 shown in fig. 1 by the second cooling element KE which is arranged in the first cooling circuit S1. The two cooling elements KE serve to dissipate heat from a corresponding plurality of components K of the magnetic resonance system 2. The cooling plates KE can be shaped and dimensioned differently, to be precise, depending on the respectively required cooling capacity of the connected components K. The component system 20 shown here furthermore differs in that the second cooling circuit S2 is a branched cooling circuit, wherein one of the branches is formed according to the invention, i.e. is formed with a cooling element KE and two components K connected thereto. The other branch is formed in a conventional manner, i.e. it does not comprise a central cooling element KE, but is connected directly to the other component K.

In this embodiment, the condensation unit KOND of the component system 20 transfers heat to the ambient air. This ambient air is conducted out via a ventilation facility 28, for example in the form of a fan. The ventilation facility 28 can transport the heated ambient air into another space or outdoors.

Fig. 3 shows a schematic view of a component system in another embodiment of the invention. The component system 20 shown here includes only the first cooling loop S1. In addition to the plurality of components K connected by the central cooling element KE, in the cooling circuit S1, a further component K is connected in series with the cooling circuit S1 in a conventional manner, i.e. directly or integrally. In addition, the condensation unit KOND is formed as part of a heat exchanger 32 for transferring thermal energy removed from the component K to the further cooling circuit 30. The heat exchanger 32 is arranged inside the insulation unit 26, as long as the thermal delimitation/insulation of the component arrangement is not interrupted thereby. The cooling circuit 30 can be filled with synthetic cooling medium or water or a water-glycol mixture. The cooling circuit serves to carry out thermal energy and is very suitable when a spatial distance has to be spanned until the thermal energy can be taken out of the open air, for example, by means of the ventilation facility 28. Instead of only one further cooling circuit 30, a plurality of additional cooling circuits can also be provided.

Fig. 4 shows a schematic view of a component system in another embodiment of the invention. Here, the first cooling loop S1 passes through the insulation unit 26 and transports thermal energy directly out of the sealed environment of the component system 20. Here, the thermal energy (with or without further intermediate cooling circuits) can also be output to the outside via the ventilation facility 28.

All the components K connected to the cooling element KE in the figures have in common that the connection is designed to be detachable. Furthermore, component K can be designed such that thermal transport between at least one electronics component EE of component K and the cooling medium takes place directly.

The utility model is summarized again as follows:

the cooling medium used is a two-phase, synthetic coolant. Corrosion or algae or bacteria growth in water-based coolant systems can be avoided. The cooling system according to the invention is also tightly closed, preferably from the point of manufacture. A similar technique is verified by domestic refrigerators (with lower power) and is very reliable. Maintenance can be performed in the field. The cooling principle is based on a phase change between liquid and gaseous state. This achieves a high power consumption, wherein a high cooling power can be achieved even with low flow rates and low pressures. The entire cooling system and the components of the magnetic resonance facility can be designed more advantageously. In contrast to previous cooling designs, the cooling system according to the invention has only one or a few central cooling elements to which the heat-generating installation components can be connected. The connection between the cooling element and the component is formed detachably. This way of mounting the component to be cooled allows: in the event of a fault or for maintenance of one of the components, independently of the cooling element, only that component is replaced. This can also be a cost saving with regard to the housing and the plurality of cooling plates which are distributed over or integrated into the component today. Component cooling is performed using a phase change of a cooling medium to achieve a constant and, if necessary or desired, uniform operating temperature for semiconductor and other components on the component. The electronics are particularly capable of cooling to temperatures of less than 12 degrees celsius without the problems of regulatory requirements. This achieves efficient operation of the semiconductor. The overall design of the amplifier can be so optimized. The coolant system can be used flexibly, in particular in combination with cooling systems already present on site/at the customer, such as ventilation installations, hot transport circuits, etc. This minimizes installation costs and expenses as a whole. Maintenance of the components and thus of the cooling system is simplified since the components are detachably arranged. When replacing a component, a service technician need not look at the coolant loop. If the cooling circuit fails, the cooling circuit is replaced independently of the component.

By using the described cooling topology and cooling techniques, the reliability of the cooling system can be improved by an order of magnitude over cooling systems used today in medical imaging facilities.

The inventive core of the proposed cooling design lies in the centralization of the cooling system, which comprises a two-phase cooling medium, preferably for the majority of the components of the medical imaging facility to be cooled.

Claims (14)

1. A cooling system (24) for cooling a component (K) of a medical imaging facility (2), characterized in that the cooling system comprises:

-a closed cooling circuit traversed by a cooling medium, the cooling circuit comprising a first cooling loop (S1),

a compression unit (KOMP) arranged in the first cooling circuit, the compression unit being designed to increase the pressure in the cooling medium upon introduction of energy,

-a condensing unit (KOND) arranged downstream of the compression unit in the first cooling circuit in the flow direction, the condensing unit being configured for transforming the cooling medium from a gaseous state of aggregation into a liquid state of aggregation,

-a throttling unit (D) arranged downstream of the condensing unit in the first cooling loop in the flow direction, the throttling unit being configured for reducing the pressure in the cooling medium, and

-at least one component (K) of the medical imaging facility generating heat, which component is arranged downstream of the throttling unit in the first cooling loop in the flow direction, which component is thermally connected with the cooling medium for outputting heat to the cooling medium.

2. The cooling system according to claim 1, characterized in that the cooling system comprises at least one cooling element (KE) arranged downstream of the throttling unit in the flow direction in the first cooling loop, via which cooling element the at least one component of the medical imaging facility is detachably connected with the first cooling loop.

3. Cooling system according to claim 2, characterized in that the at least one component has a configuration which, when the component is connected with the cooling element, allows a heat exchange between the at least one heat-generating electronic instrument element (EE) of the component and the cooling medium.

4. The cooling system according to claim 2 or 3, characterized in that the at least one cooling element has at least two sides on which at least one component of the medical imaging facility is respectively disposed.

5. The cooling system according to claim 1 or 2, characterized in that the cooling circuit is formed by a metal tube, which is connected by means of a crimp connection, in addition to the included units and components of the medical imaging facility.

6. The cooling system according to claim 1 or 2, characterized in that the cooling circuit comprises a second cooling loop (S2) arranged parallel to the first cooling loop, the second cooling loop also comprising the compression unit (KOMP), the condensation unit (KOND), the throttle unit (D) and at least one component (K) of the medical imaging facility arranged downstream of the throttle unit in the flow direction, which component is thermally connected with the cooling medium for outputting heat to the cooling medium.

7. The cooling system according to claim 1 or 2, characterized in that the first cooling loop and/or the second cooling loop are arranged such that the flow direction of the cooling medium is oriented upwards along the at least one component.

8. The cooling system according to claim 1 or 2, wherein the at least one component of the medical imaging facility is derived from: gradient amplifier, high-frequency amplifier, superconducting magnet cooling head, and air conditioning facility of component system.

9. Cooling system according to claim 1 or 2, characterised in that the cooling medium is derived from the following cooling media: tetrafluoroethane, tetrafluoropropene, carbon dioxide.

10. A component system (20) for cooling a component (K) of a medical imaging facility (2), the component system comprising:

-a closed cooling circuit traversed by a cooling medium, the cooling circuit comprising a first cooling loop (S1),

a compression unit (KOMP) arranged in the first cooling loop, the compression unit being configured to increase the pressure in the cooling medium upon introduction of energy,

-a condensing unit (KOND) arranged downstream of the compression unit in the flow direction in the first cooling circuit, the condensing unit being designed for converting the cooling medium from a gaseous state of aggregation into a liquid state of aggregation,

-a throttling unit (D) arranged downstream of the condensing unit in the first cooling loop in the flow direction, the throttling unit being configured for reducing the pressure in the cooling medium, and

-at least one heat generating component (K) of the medical imaging facility, which component is arranged downstream of a throttling unit in the first cooling loop, which component is thermally connected with the cooling medium for outputting heat to the cooling medium,

wherein the component system is arranged to be thermally insulated.

11. A medical imaging facility (2) for cooling a component (K) thereof, characterized in that the medical imaging facility comprises a cooling system (24) according to any one of claims 1 to 9.

12. A medical imaging facility (2) for cooling components (K) thereof, characterized in that the medical imaging facility comprises a component system (20) according to claim 10.

13. A component (K) of a medical imaging facility (2), characterized in that the component is configured such that it can be detachably placed on a cooling element (KE) of a cooling circuit of the medical imaging facility through which a cooling medium flows and, when connected with the cooling element, allows heat exchange between at least one heat-generating Electronics Element (EE) of the component and the cooling medium.

14. A cooling element (KE) of a cooling circuit of a medical imaging facility (2) through which a cooling medium flows, characterized in that an outer face of the cooling element is designed such that, when a component (K) of the medical imaging facility is mounted, the outer face allows a heat exchange between at least one Electronics Element (EE) of the component and the cooling medium.

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