CN210120764U - Four-module chip mounter - Google Patents
Four-module chip mounter Download PDFInfo
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- CN210120764U CN210120764U CN201920940477.6U CN201920940477U CN210120764U CN 210120764 U CN210120764 U CN 210120764U CN 201920940477 U CN201920940477 U CN 201920940477U CN 210120764 U CN210120764 U CN 210120764U
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- conveying mechanism
- mounting head
- portal frame
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Abstract
The utility model relates to the technical field of SMT chip mounters, in particular to a four-module chip mounter.A chip mounting device and a portal frame assembly are arranged on a frame; the quantity of paster device is a set of at least, and the paster device includes two subsides dress heads, and a subsides dress head sets up in portal frame subassembly one end, and another subsides dress head sets up at the portal frame subassembly other end. Use the utility model discloses the time, utilize the idle region under the gantry rack subassembly to treat the material district as one, not only can improve the first continuity of subsides dress, improve dress efficiency, make the chip mounter structure compacter moreover, the space of frame obtains the maximize utilization, reduces the volume of equipment.
Description
Technical Field
The utility model relates to a SMT chip mounter technical field, in particular to four module chip mounters.
Background
In the existing four-module chip mounter, two groups of mutually independent mounting mechanisms are arranged; each mounting mechanism is fixed through a rack; the mounting mechanism comprises a PCB conveying device and two mounting heads along the conveying direction of the PCB conveying device; the two mounting heads are respectively responsible for different mounting areas on the PCB; the mounting heads on the two mounting mechanisms are arranged oppositely, and the PCB conveying device is arranged between the two racks; because the required dress time of two dress heads on same group of paster device can not be controlled to be the complete coincidence, such chip mounter need set up one between two dress heads on same group of paster device and wait the material district, makes the volume grow of whole chip mounter like this, and at whole dress in-process of pasting, the stroke of PCB board is bigger moreover, pastes the dress inefficiency.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to prior art's defect with not enough, provide a four module chip mounter.
In order to achieve the above object, the utility model adopts the following technical scheme:
the utility model relates to a four-module chip mounter, which comprises a frame; the frame is provided with a patch device and a portal frame assembly; the number of the patch devices is at least one group.
The paster device comprises two mounting heads, one mounting head is arranged at one end of the portal frame component, and the other mounting head is arranged at the other end of the portal frame component.
Furthermore, the chip mounting device also comprises a PCB conveying mechanism, and the PCB conveying mechanism penetrates through the inner cavity of the gantry assembly; longitudinal conveying mechanisms are arranged between the gantry frame assembly and the mounting head; two mounting heads are arranged right above the PCB conveying mechanism.
Furthermore, a cantilever is arranged between the longitudinal conveying mechanism and the mounting head, and the longitudinal conveying mechanism is used for driving the cantilever to move on the gantry frame assembly; the cantilever is provided with a transverse conveying mechanism for driving the mounting head to move on the cantilever; the two cantilevers are arranged oppositely.
Furthermore, the PCB conveying mechanism consists of two board inlet and outlet tables; one of the board inlet and outlet tables is arranged right below one of the mounting heads; and the other plate entering and exiting platform is arranged right below the other mounting head.
Furthermore, the portal frame assembly consists of two portal frames; the mounting head is arranged on the end face of the outer side of the portal frame; and the other mounting head is arranged on the outer side end face of the other portal frame.
Further, the number of the patch devices is two groups; the patch devices are arranged along the length direction of the gantry frame assembly.
After the structure is adopted, the utility model discloses beneficial effect does: the utility model discloses a four-module chip mounter, a chip mounting device and a portal frame assembly are arranged on a frame; the quantity of paster device is a set of at least, and the paster device includes two subsides dress heads, and a subsides dress head sets up in portal frame subassembly one end, and another subsides dress head sets up at the portal frame subassembly other end. When the utility model is used, two mounting heads on the mounting device are respectively used for mounting different areas of a PCB, when a first mounting head mounts a component on the PCB at a first station, then the PCB is sent to the position under the portal frame component for standby, after the mounting head on a second station mounts the previous PCB and sends the previous PCB to the second station, the PCB under the portal frame component is sent to the second station, and the mounting is continued through the mounting head of the station; the both sides of portal frame subassembly are for pasting the dress region in this structure, utilize the idle region under the portal frame subassembly to treat the material district as one, not only can improve the first continuity of pasting the dress of subsides, improve and paste dress efficiency, make chip mounter structure compacter moreover, the space of frame obtains the maximize utilization, reduces the volume of equipment.
Drawings
Fig. 1 is a schematic structural diagram of the present invention;
fig. 2 is a perspective view of the present invention;
description of reference numerals:
1. a frame; 2. a cantilever; 3. a mounting head; 4. a transverse conveying mechanism; 5. a longitudinal conveying mechanism;
6. entering and exiting the pallet; 7. a gantry; A. and (7) a PCB board.
Detailed Description
The present invention will be further described with reference to the accompanying drawings.
As shown in fig. 1 to 2, the four-module chip mounter according to the present invention includes a frame 1; the frame 1 is provided with a patch device and a portal frame assembly; the number of the patch devices is at least one group.
The surface mounting device comprises two mounting heads 3, wherein one mounting head 3 is arranged at one end of the gantry assembly, and the other mounting head 3 is arranged at the other end of the gantry assembly; the two mounting heads 3 on the mounting device are respectively used for mounting different areas of the PCB A, when a first mounting head 3 mounts a component on the PCB A at a first station, then the PCB A is sent to the position right below the gantry assembly for standby, after the mounting head 3 on a second station mounts the previous PCB A and sends the previous PCB A to a second station, the PCB A right below the gantry assembly is sent to the second station, and the mounting is continued through the mounting head 3 of the station; the both sides of portal frame subassembly are for pasting the dress region in this structure, utilize the idle region under the portal frame subassembly to treat the material district as one, not only can improve the first 3 continuity of pasting the dress of subsides, improve and paste dress efficiency, make chip mounter structure compacter moreover, the space of frame 1 obtains the maximize utilization, reduces the volume of equipment.
As a preferred mode of the utility model, the chip mounting device further comprises a PCB conveying mechanism, and the PCB conveying mechanism passes through the inner cavity of the gantry assembly; a longitudinal conveying mechanism 5 is arranged between the gantry frame assembly and the mounting head 3; the two mounting heads 3 are both arranged right above the PCB conveying mechanism; the longitudinal conveying mechanism 5 drives a screw rod to rotate by a motor, and a screw rod nut is fixed on the support plate; the screw rod rotates in the screw rod nut to enable the mounting head on the support plate to do directional motion on the guide rail, and the linear driving mechanism is not essentially different from the existing linear driving mechanism, so that the detailed description is omitted; the longitudinal conveying mechanism 5 drives the mounting head 3 to do transverse motion on the gantry frame assembly and the mounting head 3 to do lifting motion on the gantry frame assembly, so that the actions of taking components by the mounting head 3 and mounting the components on the PCB A are realized.
As a preferred mode of the present invention, a cantilever 2 is disposed between the longitudinal conveying mechanism 5 and the mounting head 3, and the longitudinal conveying mechanism 5 is used for driving the cantilever 2 to move on the gantry frame assembly; the cantilever 2 is provided with a transverse conveying mechanism 4 for driving the mounting head 3 to move on the cantilever 2; the two cantilevers 2 are arranged in a back-to-back mode; the transverse conveying mechanism 4 drives a screw rod to rotate by a motor, and a screw rod nut is fixed on the support plate; the screw rod rotates in the screw rod nut to enable the cantilever 2 on the carrier plate to do directional motion on the guide rail, and the mechanism is not essentially different from the existing linear driving mechanism, so that the detailed description is omitted; the planar motion of the mounting head 3 is realized by the matching motion of the transverse conveying mechanism 4 and the longitudinal conveying mechanism 5.
As a preferred mode of the present invention, the PCB conveying mechanism is composed of two in-out pallets 6; one of the board access tables 6 is arranged right below one of the mounting heads 3; the other plate entering and exiting platform 6 is arranged right below the other mounting head 3; the plate-in and plate-out table 6 is not essentially different from the prior art, so it is not described in detail; the in-out bedplate 6 not only can accurately convey the PCB A, but also can clamp and fix the PCB A; the PCB A can enter from one of the board inlet and outlet platforms 6 of the PCB conveying mechanism to the other board inlet and outlet platform 6 of the PCB conveying mechanism; the material waiting area is arranged between the two plate inlet and outlet tables 6.
As a preferred mode of the present invention, the gantry assembly is composed of two gantries 7; a mounting head 3 is arranged on the end face of the outer side of a portal frame 7; the other mounting head 3 is arranged on the outer end face of the other portal frame 7; the gantry frame assembly consisting of the two gantry frames 7 can adjust the gap between the gantry frames 7 according to the length of the PCB A, so that the material area to be treated has enough space to accommodate the PCB A, and the chip mounter is more flexible and changeable to use.
As a preferred mode of the present invention, the number of the patch devices is two groups; the patch devices are arranged along the length direction of the portal frame assembly; two sets of paster devices constitute a four module chip mounter, improve the efficiency of subsides dress.
When the utility model is used, two mounting heads on the mounting device are respectively used for mounting different areas of a PCB, the PCB is firstly conveyed to the position right below the mounting head of the front station on the mounting device through the inlet and outlet bedplate and is clamped and fixed, the mounting heads move in a matching way through the transverse conveying mechanism and the longitudinal conveying mechanism, the planar motion of the mounting heads is realized and then combined with the lifting motion of the mounting heads, and the mounting of a first area is carried out on the PCB which is taken out from the side and is aligned to the lower part; after the first area is pasted, the PCB pasted with a part of components is conveyed to the position under the two portal frames through the in-out bedplate for standby; after the PCB of the current station is sent into the material waiting area, the board entering and exiting platform immediately sends another PCB to the previous station for mounting, so that the working continuity of the previous station is ensured; when the second area on the PCB is mounted at the next station, the entering-exiting bedplate conveys the PCB right below the two portal frames to a mounting head at the next station; mounting the second area of the PCB; the both sides of portal frame are for pasting the dress region in this structure, utilize the idle region under the portal frame to wait to expect the district as one, not only can improve the first continuity of pasting the dress of subsides, improve and paste dress efficiency, make the space of frame obtain the maximize moreover and utilize, reduce the volume of equipment.
The above is only the preferred embodiment of the present invention, so all the equivalent changes or modifications made by the structure, features and principles in accordance with the claims of the present invention are included in the claims of the present invention.
Claims (6)
1. A four-module chip mounter comprises a frame (1); the frame (1) is provided with a patch device and a portal frame assembly; the method is characterized in that: the number of the patch devices is at least one group;
the paster device comprises two mounting heads (3), one mounting head (3) is arranged at one end of the portal frame assembly, and the other mounting head (3) is arranged at the other end of the portal frame assembly.
2. The four-module chip mounter according to claim 1, wherein: the chip mounting device also comprises a PCB conveying mechanism, and the PCB conveying mechanism penetrates through the inner cavity of the gantry assembly; a longitudinal conveying mechanism (5) is arranged between the gantry frame assembly and the mounting head (3); the two mounting heads (3) are arranged right above the PCB conveying mechanism.
3. The four-module chip mounter according to claim 2, wherein: a cantilever (2) is arranged between the longitudinal conveying mechanism (5) and the mounting head (3), and the longitudinal conveying mechanism (5) is used for driving the cantilever (2) to move on the portal frame component; the cantilever (2) is provided with a transverse conveying mechanism (4) for driving the mounting head (3) to move on the cantilever (2); the two cantilevers (2) are arranged back to back.
4. The four-module chip mounter according to claim 2, wherein: the PCB conveying mechanism consists of two board inlet and outlet tables (6); one of the board inlet and outlet tables (6) is arranged right below one of the mounting heads (3); the other plate inlet and outlet table (6) is arranged right below the other mounting head (3).
5. The four-module chip mounter according to claim 1, wherein: the gantry frame assembly consists of two gantry frames (7); the mounting head (3) is arranged on the end face of the outer side of a portal frame (7); the other mounting head (3) is arranged on the outer end face of the other portal frame (7).
6. The four-module chip mounter according to claim 1, wherein: the number of the patch devices is two; the patch devices are arranged along the length direction of the gantry frame assembly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920940477.6U CN210120764U (en) | 2019-06-21 | 2019-06-21 | Four-module chip mounter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920940477.6U CN210120764U (en) | 2019-06-21 | 2019-06-21 | Four-module chip mounter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210120764U true CN210120764U (en) | 2020-02-28 |
Family
ID=69616035
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920940477.6U Active CN210120764U (en) | 2019-06-21 | 2019-06-21 | Four-module chip mounter |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210120764U (en) |
-
2019
- 2019-06-21 CN CN201920940477.6U patent/CN210120764U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20221014 Address after: 323000 No.1 shanha Road, nanmingshan street, Liandu District, Lishui City, Zhejiang Province (Lijing National Industrial Park) Patentee after: Zhejiang Huaqi Zhengbang Automation Technology Co.,Ltd. Address before: 528415 1-2 / F, building B, 30 Jucheng Avenue, Xiaolan Town, Zhongshan City, Guangdong Province Patentee before: ZHONGSHAN HONGJU AUTOMATION EQUIPMENT MANUFACTURING Co.,Ltd. |