CN210116064U

CN210116064U - Crystal silicon clipper

Info

Publication number: CN210116064U
Application number: CN201920362724.9U
Authority: CN
Inventors: 解培玉; 段景波; 付涛; 崔陈晨; 孙萌
Original assignee: Qingdao Gaoce Technology Co Ltd
Current assignee: Qingdao Gaoce Technology Co Ltd
Priority date: 2019-03-20
Filing date: 2019-03-20
Publication date: 2020-02-28
Anticipated expiration: 2029-03-20

Abstract

The utility model relates to a crystal silicon cutting machine, which belongs to the technical field of crystal silicon processing, and comprises a base component, a cutting component arranged on the base component in a straddling manner, a crystal support device arranged on the base component and a winding mechanism arranged on two sides of the cutting component, wherein the winding mechanism is arranged on the base component and comprises a take-up pulley and a paying-off pulley, the take-up pulley and the paying-off pulley are respectively arranged on the left side and the right side of the cutting component, the cutting component comprises a wire net bracket, a left cutting component and a right cutting component which are fixed on the wire net bracket, the left cutting component and the right cutting component are oppositely arranged, a reel and a cutting wheel are fixedly arranged on the left cutting component and the right cutting component, the reel and the cutting wheel are both arranged on the same plane, the wire net is arranged on the same plane, the distortion of the reciprocating motion of the wire net is reduced, the, the silicon crystal with large diameter can be conveniently cut.

Description

Crystal silicon clipper

Technical Field

The utility model belongs to the technical field of crystal silicon processing, specifically speaking relates to a crystal silicon clipper.

Background

The manufacturing process of the silicon wafer for manufacturing the solar cell panel comprises the following steps: pulling crystal, cutting off, squaring, grinding, slicing and the like. At present, the linear cutting technology is a relatively advanced crystalline silicon cutting processing technology, and the principle of the linear cutting technology is that crystalline silicon is rubbed by a cutting wire moving at a high speed, so that the purpose of cutting is achieved. The silicon crystal cutting machine is widely used, cutting wires are distributed into a net shape through the guide wheel, and the silicon crystal cutting machine can complete multi-knife cutting of silicon crystal through one-time operation from top to bottom. Along with the improvement of the crystal pulling process, the diameter of the crystal silicon smelted by the crystal pulling furnace is increased to reach 300-500 mm; and the cutting equipment on the market generally cuts the crystalline silicon with the diameter of 200-260. Meanwhile, when a large number of crystal silicon factories are built, the crystal silicon crystal pulling process of the silicon rods needs to be broken through, and the crystal rods with larger sizes are developed. Therefore, how to enable the existing crystal silicon cutting machine to cut large-diameter crystal silicon is a problem to be solved.

SUMMERY OF THE UTILITY MODEL

Aiming at various defects of the prior art, the crystal silicon cutting machine with the cutting wheel and the winding wheel positioned in the same plane is provided.

In order to achieve the above object, the utility model provides a following technical scheme:

a crystal silicon cutting machine comprises a base assembly, a cutting assembly, a crystal support device and winding mechanisms, wherein the cutting assembly is arranged on the base assembly in a spanning mode, the crystal support device is arranged on the base assembly, the winding mechanisms are located on two sides of the cutting assembly, the winding mechanisms are mounted on the base assembly and comprise a paying-off wheel and a winding wheel, the paying-off wheel and the winding wheel are respectively located on the left side and the right side of the cutting assembly, the cutting assembly comprises a wire net support, a left cutting assembly and a right cutting assembly, the left cutting assembly and the right cutting assembly are symmetrically arranged, a winding wheel and a cutting wheel are fixedly arranged on the left cutting assembly and the right cutting assembly, and the winding wheel and the cutting wheel are located in the same plane;

the reel includes that winding displacement wheel, take-up pulley, first transition wheel and second pass the transition wheel, the cutting wheel is including the left cutting wheel that is located left cutting assembly and the right cutting wheel that is located right cutting assembly, be equipped with the clearance of stepping down that holds crystal silicon between left side cutting wheel and the right cutting wheel.

Furthermore, the left cutting wheel and the right cutting wheel are positioned in the same plane, and the lowest point of the wheel groove of the left cutting wheel and the lowest point of the wheel groove of the right cutting wheel are positioned in the same horizontal plane.

Further, slide rails are installed on two sides of the wire mesh support, a feed driving motor for driving the left cutting assembly and the right cutting assembly to move is installed at the top of the wire mesh support, and the output end of the feed driving motor drives the left cutting assembly and the right cutting assembly to move along the vertical direction through a lead screw.

Furthermore, the tensioning wheel is rotatably connected through a tension bracket, one side of the tension bracket is connected with the tensioning wheel, the other side of the tension bracket is fixedly connected with the piston end of the tension cylinder through a rotating shaft, and the piston end of the tension cylinder moves downwards to drive the rotating shaft to rotate downwards, so that the tensioning wheel is driven to rotate to tension the cutting line.

Further, the base subassembly includes that two relative settings are wing-shaped bottom plate and fix the base between two bottom plates, cutting assembly links firmly with two bottom plates, the brilliant device bottom surface of holding in the palm has seted up the guide rail groove, just set firmly on the base with guide rail groove matched with guide rail and rack, brilliant holds in the palm the device and can slide on the base, and crystal silicon is fixed and is cut through cutting assembly on brilliant holds in the palm the device.

Furthermore, a control box is installed on one side of the wire mesh support, which is not provided with the cutting wheel, and the control box is connected with the operation screen through a data transmission line.

Further, still install cooling spray set on the gauze support, cooling spray set is including holding liquid supply tank and the spray set of coolant liquid, spray set's hydrojet mouth is just to the line of cut.

The utility model has the advantages that:

1. the left cutting assembly and the right cutting assembly are respectively and fixedly provided with a reel and a cutting wheel, the reels and the cutting wheels are both located on the same plane, the reels comprise a wire arranging wheel, a tension wheel, a first transition wheel and a second transition wheel, the number of the transition wheels is reduced, the whole wire net is located on the same plane, the arrangement of the wire net is simplified, the wire net is always located on the same plane, the torsion of the cutting line during reciprocating operation is reduced, and the service life of the cutting line is effectively prolonged.

2. The winding mechanism is fixed on the bottom plate, so that the height of the winding mechanism is effectively reduced, and the installation and maintenance are more convenient.

3. Left side cutting wheel and right cutting wheel become the present outside that is located the gauze support by the inboard that is located the gauze support before, and lie in the coplanar with the reel, under the unchangeable circumstances of gauze support width, have effectively increased the line between left side cutting wheel and the right cutting wheel and have cut the interval, and the suitability reinforcing. Can be better cut major diameter crystal silicon, need not change the gauze frame, very big saving cost.

Drawings

Fig. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a schematic view of the cutting assembly;

fig. 3 is a partial structural view at a in fig. 1.

In the drawings: 1-base component, 101-bottom plate, 102-base, 2-cutting component, 3-crystal support device, 4-winding mechanism, 401-paying off wheel, 402-take-up wheel, 5-wire net bracket, 6-left cutting component, 7-right cutting component, 8-tensioning wheel, 801-tension bracket, 802-rotating shaft, 803-tension cylinder, 9-wire arranging wheel, 10-first transition wheel, 11-second transition wheel, 12-left cutting wheel, 13-right cutting wheel, 14-feeding driving motor, 15-sliding rail, 16-control box and 17-operation screen.

Detailed Description

In order to make those skilled in the art better understand the technical solution of the present invention, the following description, together with the drawings of the present invention, clearly and completely describes the technical solution of the present invention, and based on the embodiments in the present application, other similar embodiments obtained by those skilled in the art without creative efforts shall all belong to the protection scope of the present application. In addition, directional terms such as "upper", "lower", "left", "right", etc. in the following embodiments are directions with reference to the drawings only, and thus, the directional terms are used for illustrating the present invention and not for limiting the present invention.

The present invention will be further described with reference to the accompanying drawings and preferred embodiments.

As shown in fig. 1-3, a crystalline silicon cutting machine includes a base assembly 1, a cutting assembly 2 straddling the base assembly 1, a crystal support device 3 disposed on the base assembly 1, and a winding mechanism 4 disposed on two sides of the cutting assembly 2. Wire winding mechanism 4 is installed on base subassembly 1, it includes actinobacillus wheel 401 and take-up pulley 402, just actinobacillus wheel 401 and take-up pulley 402 are located respectively the left side and the right side of cutting assembly 2.

As shown in fig. 2, the cutting assembly 2 includes a wire mesh bracket 5, and a left cutting assembly 6 and a right cutting assembly 7 fixed on the wire mesh bracket 5, and the left cutting assembly 6 and the right cutting assembly 7 are symmetrically arranged, a reel and a cutting wheel are fixedly arranged on the left cutting assembly 6 and the right cutting assembly 7, and the reel and the cutting wheel are located on the same plane, and simultaneously, the reel includes a tension wheel 8, a wire arranging wheel 9, a first transition wheel 10 and a second transition wheel 11, the cutting wheel includes a left cutting wheel 12 located on the left cutting assembly 6 and a right cutting wheel 13 located on the right cutting assembly 7, and a abdicating gap for accommodating crystalline silicon is arranged between the left cutting wheel 12 and the right cutting wheel 13.

The left cutting wheel 12 and the right cutting wheel 13 are located in the same plane, the lowest point of the wheel groove of the left cutting wheel 12 and the lowest point of the wheel groove of the right cutting wheel 13 are located on the same plane, meanwhile, the first transition wheel 10 on the left cutting assembly 6 is fixedly arranged above the left cutting wheel 12, the second transition wheel 11 and the tensioning wheel 8 are fixedly arranged on one side, close to the pay-off wheel 401, of the left cutting wheel 12 in sequence, the highest points of the wheel grooves of the first transition wheel 10, the second transition wheel 11 and the tensioning wheel 8 are located in the same plane, and meanwhile, the wire arranging wheel 9 is located below the tensioning wheel 8. The distribution positions of the reels on the right cutting assembly 6 and the right cutting wheel 13 are symmetrically distributed with the reels on the left cutting assembly 6 and the left cutting wheel 12, the cutting lines sequentially bypass the wire arranging wheel 9, the tensioning wheel 8, the second transition wheel 11 and the first transition wheel 10 after passing through 401, sequentially bypass the reels on the right cutting assembly through the right cutting wheel 13 after passing through the left cutting wheel 12, and finally are connected with the take-up pulley 402. Like this, guaranteed that whole gauze is in the coplanar, changed in the past left cutting wheel 12 and right cutting wheel 13 and the not situation in the coplanar of reel, increased left cutting wheel 12 and right cutting wheel 13's interval, more be suitable for the crystal silicon of cutting major diameter, simultaneously, very big reduction the cutting line twist reverse when reciprocating, effectively improve the life of cutting line.

As shown in fig. 3, the tensioning wheel 8 is rotatably connected through a tensioning bracket 801, one side of the tensioning bracket 801 is connected with the tensioning wheel 8, the other side of the tensioning bracket 801 is fixedly connected with a rotating shaft 802, and the rotating shaft 802 is fixedly connected with a piston end of a tensioning cylinder 803, the piston end of the tensioning cylinder 803 moves downwards to drive the rotating shaft 802 to rotate downwards, and the rotating shaft 802 rotates downwards and simultaneously tensions the cutting line.

Slide rail 15 is all installed to the both sides of gauze support 5, and its top installs the drive left side cutting assembly 6 and the feed driving motor 14 of right cutting assembly 7 motion, and left side cutting assembly 6 links firmly through fixed plate and lead screw with right cutting assembly 7 one side that is close to gauze support 5, feed driving motor 14's output and screw connection, through the motion of lead screw drive left side cutting assembly 6 and right cutting assembly 7 in the vertical direction to cut crystal silicon.

Base subassembly 1 includes that two relative settings are wing bottom plate 101 and fix the base 102 between two bottom plates 101, cutting assembly 2's both sides respectively with two bottom plate 101 fixed connection, the effectual height that reduces cutting assembly 2, the equipment maintenance of being convenient for, simultaneously, the brilliant guide rail groove has been seted up on holding in the palm device 3, the base 102 on set firmly with guide rail groove matched with guide rail and rack, the bottom that the brilliant device 3 was held in the palm has set firmly first lead screw to support the brilliant device 3 through servo motor drive and slide along the guide rail.

A control box 16 is arranged on one side of the wire mesh bracket 5 far away from the right cutting assembly 7 and the left cutting assembly 6, and the control box 16 is connected with an operation screen 17 through a data transmission line.

And the wire mesh support 5 is also provided with a cooling spray device, the cooling spray device comprises a liquid supply box for containing cooling liquid and a spray device, and a liquid spray port of the spray device is opposite to the cutting line. When cutting, the coolant is ejected from the liquid ejection port to cool the cutting line.

The structure of the winding mechanism 4 is the same as that of the CN201820700032.6 cutting head and the winding mechanism in the two-wire squaring machine comprising the cutting head, and the description is omitted here.

The structure of the crystal support device 3 is the same as that of the crystal support device in the monocrystalline silicon cutting machine of CN201610037191, and the description is omitted here.

Set up the data of the crystal silicon of cutting on operation screen 17, when cutting, crystal silicon moves to cutting assembly 2 department along the guide rail along brilliant device 3 that holds in the palm, and cutting assembly 2 cuts crystal silicon, and the coolant liquid of spray set's hydrojet department is spouted and is cooled off the line of cut on the line of cut.

The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the scope of the invention, i.e. the present invention is intended to cover all equivalent variations and modifications within the scope of the present invention.

Claims

1. A crystal silicon cutting machine comprises a base assembly (1), a cutting assembly (2) arranged on the base assembly (1) in a crossing mode, a crystal support device (3) arranged on the base assembly (1) and winding mechanisms (4) located on two sides of the cutting assembly (2), and is characterized in that the winding mechanisms (4) are installed on the base assembly and comprise a paying-off wheel (401) and a winding wheel (402), the paying-off wheel (401) and the winding wheel (402) are respectively located on the left side and the right side of the cutting assembly (2), the cutting assembly (2) comprises a wire net support (5) and a left cutting assembly (6) and a right cutting assembly (7) which are fixed on the wire net support (5), the left cutting assembly (6) and the right cutting assembly (7) are symmetrically arranged, and a winding wheel and a cutting wheel are fixedly arranged on the left cutting assembly (6) and the right cutting assembly (7), and the reel and the cutting wheel are both positioned in the same plane;

the reel includes that calandria wheel (9), take-up pulley (8), first transition wheel (10) and second transition wheel (11), the cutting wheel is including left cutting wheel (12) that is located on left cutting subassembly (6) and right cutting wheel (13) that is located on right cutting subassembly (7), be equipped with the clearance of stepping down that holds crystal silicon between left side cutting wheel (12) and right cutting wheel (13).

2. The crystalline silicon truncation machine of claim 1, wherein the left cutting wheel (12) and the right cutting wheel (13) are positioned in the same plane, and the lowest point of the wheel groove of the left cutting wheel (12) and the lowest point of the wheel groove of the right cutting wheel (13) are positioned in the same plane.

3. The silicon seed crystal cutting machine according to claim 2, characterized in that a first transition wheel (10) on the left cutting assembly (6) is positioned above a left cutting wheel (12), a second transition wheel (11) and a tension wheel (8) are fixedly arranged on one side of the left cutting wheel close to the pay-off wheel (401) in sequence, peaks of grooves of the first transition wheel (10), the second transition wheel (11) and the tension wheel (8) are positioned in the same horizontal plane, and the wire arranging wheel is positioned below the tension wheel (8).

4. The crystalline silicon truncation machine of claim 3, wherein slide rails (15) are installed on two sides of the wire mesh support (5), a feed driving motor (14) for driving the left cutting assembly (6) and the right cutting assembly (7) to move is installed on the top of the wire mesh support, and the output end of the feed driving motor (14) drives the left cutting assembly (6) and the right cutting assembly (7) to move in the vertical direction through a lead screw.

5. A crystalline silicon cutting machine as claimed in claim 4, characterized in that the tension wheel (8) is rotatably connected through a tension bracket (801), one side of the tension bracket (801) is rotatably connected with the tension wheel (8), the other side of the tension bracket is fixedly connected with the piston end of the tension cylinder (803) through a rotating shaft (802), the piston end of the tension cylinder (803) moves downwards to drive the rotating shaft (802) to rotate downwards, and thereby the tension wheel (8) is driven to rotate to tension the cutting line.

6. The crystalline silicon cutting machine according to claim 1, wherein the base assembly comprises two base plates (101) which are oppositely arranged and are wing-shaped and a base (102) fixed between the two base plates (101), the cutting assembly (2) is fixedly connected with the two base plates (101), a guide rail groove is formed in the bottom surface of the crystalline support device (3), a guide rail and a rack which are matched with the guide rail groove are fixedly arranged on the base (102), the crystalline support device (3) can slide on the base (102), and crystalline silicon is fixed on the crystalline support device (3) and is cut through the cutting assembly (2).

7. The crystal silicon cutting machine according to claim 1, characterized in that a control box (16) is installed on one side of the wire mesh support (5), and the control box (16) is connected with an operation screen (17) through a data transmission line.

8. A crystalline silicon clipper according to any one of claims 1 to 7, characterized in that a cooling spray device is further installed on the wire net support (5), the cooling spray device comprises a liquid supply tank containing cooling liquid and a spray device, and a liquid spray port of the spray device faces the cutting line.