CN210111007U

CN210111007U - Ceramic filter with mixed metal coating and electronic device

Info

Publication number: CN210111007U
Application number: CN201921484304.4U
Authority: CN
Inventors: 卜庆革
Original assignee: Individual
Current assignee: Individual
Priority date: 2019-09-05
Filing date: 2019-09-05
Publication date: 2020-02-21
Anticipated expiration: 2029-09-05

Abstract

The utility model provides a ceramic filter and electron device with mix metal coating. The ceramic filter sequentially comprises a ceramic substrate, a reinforcing layer and a mixed metal plating layer: wherein the reinforcing layer is bonded to at least a portion of the outer surface of the ceramic substrate, and the hybrid plated metal layer is further bonded to the reinforcing layer, whereby the hybrid plated layer constitutes at least a portion of the outer surface of the ceramic filter. The utility model discloses a ceramic filter has stable and fine and close metal coating layer structure, shows its performance excellence through the test, and the yield is high, is applied to domestic appliance and electronic product and has good performance.

Description

Ceramic filter with mixed metal coating and electronic device

Technical Field

The utility model discloses the wave filter field specifically relates to ceramic filter, especially has ceramic filter who mixes the metallization layer and reach including its electron device.

Background

Ceramic filters are classified into band-stop filters (also called traps) and band-pass filters (also called filters) according to their amplitude-frequency characteristics. The frequency divider is mainly used in circuits such as frequency selection networks, intermediate frequency tuning, frequency discrimination and filtering, achieves the purpose of separating currents with different frequencies, and has the characteristics of high Q value, good amplitude-frequency and phase-frequency characteristics, small size, high signal-to-noise ratio and the like. Has been widely applied to household appliances such as color TV, radio and the like and other electronic products. The ceramic filter mainly utilizes the piezoelectric effect of the ceramic material to realize the conversion of the electric signal → the mechanical vibration → the electric signal, thereby replacing an LC filter circuit in part of electronic circuits and ensuring that the work of the ceramic filter is more stable.

The structure of current ceramic filters generally includes a ceramic substrate and a metal layer (e.g., a silver layer) disposed on the ceramic substrate. The silver powder is generally prepared by dipping a silver powder slurry on a substrate and then sintering at high temperature. Due to the different steps of the method, the obtained metal layer, such as a silver layer, has poor adhesion to the ceramic substrate, and therefore, the sintering treatment needs to be repeated for many times. Even so, the yield is still low.

Various attempts have been made to improve the adhesion of metals to ceramic substrates. For example, CN104575677A discloses a conductive silver paste for a filter and a preparation method thereof. The conductive silver paste for the filter comprises, by mass, 65% -80% of silver powder, 1% -5% of glass powder, 1% -6% of resin, 0.1% -8% of an inorganic additive and 12% -21% of an organic solvent. And obtaining the conductive silver paste for the filter by adopting a proper component proportion. The conductive silver paste for the filter is coated on a substrate and sintered to form a silver conductive layer with high compactness, high adhesive force, high conductivity and good weldability. For another example, CN104143383A discloses a carbon nanotube conductive silver paste for a filter and a manufacturing method thereof, wherein the conductive silver paste is prepared from the following raw materials in parts by weight: 40-50 parts of silver powder, 3-4 parts of carbon nano tube, 1-2 parts of boron oxide, 2.1-3.4 parts of precipitated barium sulfate, 0.4-0.9 part of sodium zirconate, 0.2-0.4 part of titanate coupling agent, 0.4-0.7 part of sodium diacetate, 1.2-2.3 parts of methyl imidazoline, 4-6 parts of ethylene glycol monobutyl ether, 3-5 parts of acrylic resin, 30-40 parts of assistant and a proper amount of water. The technology is easy to implement and simple and convenient to operate, and after the carbon nanotube conductive silver paste for the filter is coated on the substrate and sintered, a silver conductive layer with high compactness, strong adhesive force, excellent conductive performance and better weldability can be formed.

As mentioned above, in order to improve the bonding between the metal layer and the ceramic substrate, the improvement of the conductive silver paste formulation is mainly focused. There remains a need for alternative approaches to improving binding.

SUMMERY OF THE UTILITY MODEL

In order to solve at least part of the above technical problems, the present invention provides a ceramic filter and an electronic device having a stable and dense metal plating layer structure and excellent performance. Specifically, the present invention includes the following.

The utility model discloses a first aspect provides a ceramic filter and electron device with mix metal coating, and it includes ceramic substrate, enhancement layer and mixed metal coating in proper order: wherein the reinforcing layer is bonded to at least a portion of the outer surface of the ceramic substrate, and the hybrid plated metal layer is further bonded to the reinforcing layer, whereby the hybrid plated layer constitutes at least a portion of the outer surface of the ceramic filter.

In certain exemplary embodiments, the mixed plated metal layer of the ceramic filter having the mixed plated metal layer is a silver metal layer.

In certain exemplary embodiments, the mixed plated metal layer of the ceramic filter having the mixed plated metal layer is obtained by electroless plating and electroplating.

In certain exemplary embodiments, the reinforcement layer of the ceramic filter with the hybrid metallization layer is a palladium metal layer.

In certain exemplary embodiments, the reinforcement layer of the ceramic filter with the hybrid metallization layer is obtained by electroless plating.

In certain exemplary embodiments, the reinforcement layer of the ceramic filter having the hybrid metal plated layer has a thickness of 50nm to 800nm, and the thickness of the hybrid metal plated layer is 3 μm or more.

In certain exemplary embodiments, the ceramic filter with the hybrid metallization layer is a band stop filter or a band pass filter.

In certain exemplary embodiments, the ceramic filter with the hybrid metallization layer is a two-terminal filter, a three-terminal filter, or a four-terminal filter.

In certain exemplary embodiments, the ceramic substrate of the ceramic filter having the hybrid metallization layer includes an upper surface and a lower surface, a first side, a second side, a third side, and a fourth side connecting the upper surface and the lower surface, and a through hole penetrating the upper surface and the lower surface, wherein the reinforcement layer is bonded to the upper surface, the first side, the second side, the third side, and the fourth side, and the hybrid metallization is bonded to the reinforcement layer.

In a second aspect of the present invention, an electronic device is provided, which comprises the ceramic filter with the hybrid metal-plated layer.

Drawings

FIG. 1 is a schematic diagram of a cross-sectional structure of a plating layer of a hybrid metallized ceramic filter according to the present invention.

Fig. 2 is a schematic perspective view of another exemplary hybrid metallized ceramic filter according to the present invention.

Description of the reference numerals

100-ceramic substrate, 200-reinforcing layer, 300-mixed metal plating layer, 110-upper surface, 120-lower surface, 130-first side surface, 140-second side surface, 150-third side surface, 160-fourth side surface and 170-through hole.

Detailed Description

Reference will now be made in detail to various exemplary embodiments of the invention, which should not be considered limiting of the invention, but rather should be understood to be a more detailed description of certain aspects, features and embodiments of the invention.

It is to be understood that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. Further, to the extent that numerical ranges are recited in the present disclosure, it is understood that the upper and lower limits of the range, and each intervening value therebetween, is specifically disclosed. Every smaller range between any stated value or intervening value in a stated range and any other stated or intervening value in a stated range is also encompassed within the invention. The upper and lower limits of these smaller ranges may independently be included or excluded in the range.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Although only the preferred methods and materials are described in this disclosure, any methods and materials similar or equivalent to those described herein can be used in the practice or testing of the present disclosure. All documents mentioned in this specification are incorporated by reference herein for the purpose of disclosing and describing the methods and/or materials associated with the documents.

Considering the defects of the existing surface metallized ceramic filter, particularly the surface of the a. silver layer is not smooth; b. the metal layer is uneven in thickness and low in conductivity; c. the metal layer falls off in practical application and the environment, the adhesive force between the metal layer and the base material is poor, the yield is low, and the like. The utility model provides a ceramic filter and electron device with mix metal coating, it includes ceramic substrate, enhancement layer and mix metal coating in proper order. Wherein the reinforcing layer is bonded to at least a portion of the outer surface of the ceramic substrate, and the hybrid plated metal layer is further bonded to the reinforcing layer, whereby the hybrid plated layer constitutes at least a portion of the outer surface of the ceramic filter. Thereby solving at least some of the problems of the prior art.

The ceramic filter of the present invention contains a metallized coating layer containing hybrid plating, which is obtained by different known plating techniques, for example, by two techniques of electroless plating and electroplating, and at this time, may be referred to as "metallized ceramic filter containing electroplating and electroless plating", which is suitable for band stop filters, band pass filters, or two-terminal filters, three-terminal filters, and four-terminal filters.

The utility model discloses a mix plating metal ceramic filter includes ceramic substrate, enhancement layer and mixed metal coating layer. Wherein the reinforcing layer is bonded to at least a portion of the outer surface of the ceramic substrate, and the hybrid plated metal layer is further bonded to the reinforcing layer, whereby the hybrid plated layer constitutes at least a portion of the outer surface of the ceramic filter.

[ ceramic substrate ]

The ceramic substrate of the present invention, also called ceramic base, is the main body of the filter for bearing the metallized coating. The ceramic substrate is made of a material known in the market, and in certain embodiments, the ceramic substrate of the present invention is PbZrO₃And PbTiO₃The solid solution material of (4). Such solid solution materials are known. In a further embodiment, the ceramic substrate is a ceramic substrate comprising PbZrO₃、PbTiO₃And partial alumina-derived aluminum-modified lead zirconate titanateA ceramic material. The utility model discloses preferred aluminium modified ceramic material. The content of Al is not particularly limited, and is generally 0.08 wt% or less based on the total weight of the ceramic material. The size and shape of the ceramic substrate are not particularly limited, and include, but are not limited to, a rectangular parallelepiped, a cube, a cylinder, or a prism, and other shapes may be designed according to actual needs, and may also be irregular. Preferably, the ceramic substrate used in the present invention is a rectangular parallelepiped sheet structure suitable for the size of a filter. In certain embodiments, the ceramic substrate of the present invention is a generally rectangular structure comprising an upper surface and a lower surface, a first side, a second side, a third side, and a fourth side connecting the upper surface and the lower surface, and a through-hole passing through the upper surface and the lower surface, wherein a reinforcing layer is bonded to the upper surface, the first side, the second side, the third side, and the fourth side.

[ reinforcing layer ]

The reinforcement layer of the hybrid metallized ceramic filter of the present invention is a palladium metal layer, which is obtained by known methods, in certain embodiments, the reinforcement layer is obtained by a chemical plating method. Preferably, the thickness of the stiffening layer may be 50nm to 800nm, more preferably 80nm to 500nm, still more preferably 100 nm to 350 nm. The electroless plating method may employ a known electroless plating step. The utility model discloses a cohesion of enhancement layer and pottery is stronger. In addition, the palladium metal characteristic of the reinforcing layer can catalyze the oxidation-reduction reaction controllably, so that silver metal ions can be further deposited on the surface of the ceramic substrate, and a thicker silver metal layer can be formed in the plating process.

[ Mixed Metal coating layer ]

The mixed metal plating layer of the utility model is a silver metal coating, and the thickness is more than 3 μm, preferably 3.5-5 μm, more preferably 3.6-4 μm. This thickness is greater than the thickness of the metal layer in conventional filters. The present invention obtains the above thickness range by a mixed plating such as electroless plating and electroplating. The electroless plating method may employ a conventional electroless plating step. In an exemplary process, a system of formaldehyde with silver nitrate and ammonia is employed. The plating method may use a known method such as a method using cyanide-free silver plating, that is, a method of performing plating using a system of cyanide-free silver plating solution. In an exemplary method, a ceramic substrate containing a silver layer obtained by an electroless plating method is used as a cathode, a known silver plating solution is used as an anode, and metal ions are reduced at the cathode by using a direct current or a pulse power supply. The current conversion reduces the resistance between the metal layer structures, so that the mixed metal plating layer has better stability.

The utility model discloses a mixed metal-plated ceramic filter's metallic coating has stable and fine and close metal plating structure. The bonding performance between the metal layers is effectively improved, the yield is high, and the ceramic filter material is a ceramic filter material with good performance in household appliances and electronic products.

Example 1

This embodiment is a schematic diagram of a cross-sectional structure of a plating layer of a hybrid plated ceramic filter, as shown in fig. 1, which includes a ceramic substrate 100, a reinforcing layer 200 and a hybrid plated metal layer 300. The reinforcing layer 200 is bonded to the outer surface of the ceramic substrate 100, and the hybrid plated metal layer 300 is further bonded to the reinforcing layer 200, whereby the hybrid plated layer constitutes the outer surface of the ceramic filter.

Example 2

The present embodiment is a structural view of an exemplary hybrid metallized ceramic filter, and as shown in fig. 2, the ceramic filter of the present embodiment has a substantially rectangular parallelepiped shape, and includes an upper surface 110 and a lower surface 120, a first side 130, a second side 140, a third side 150, and a fourth side 160 connecting the upper surface 110 and the lower surface 120, and a through hole 170 penetrating the upper surface 110 and the lower surface 120. Wherein there are two through holes 170, wherein the reinforcing layer 200 is bonded to the upper surface 110, the first side 130, the second side 140, the third side 150, and the fourth side 160. The hybrid metallized ceramic filter of the present example has the same two-layer structure as that of example 1, i.e., includes a ceramic substrate 100, a reinforcing layer 200, and a hybrid metallized layer 300.

Example 3

This example is a quality measurement of an exemplary hybrid metallized ceramic filter that includes measurements of the thickness, adhesion, and resistance of the metallized layer. The thickness is measured by adopting a light section microscope and an XRF thickness gauge; the adhesive force of the metal coating is tested by a scratching method, a sample is cut into 2mm multiplied by 2mm grids by a small knife, the surface is observed whether to have stripping, falling off and other phenomena, meanwhile, the sample without a reinforcing layer is used as a contrast to detect the influence of the sample on the adhesive force of the metal coating, the sample is heated to 200 ℃ and is kept warm for 1h, then the sample is quenched in water to room temperature, and the phenomena of peeling and bubbling are observed; the resistance of the sample was measured using a multimeter. The adhesion results show that the individual samples subjected to the production test have the peeling, peeling and bubbling phenomena of different degrees, the yield is 96 percent, the average thickness of the metal coating is 8 mu m, and the surface resistance is 0.45 ohm. It is noted that, in the absence of the reinforcing layer, the adhesion results show that some samples tested by production have different peeling, peeling and bubbling phenomena, the yield is 68%, the average thickness of the metal coating is 6 μm, and the surface resistance is 2.6 ohms.

While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. Various modifications or changes may be made to the exemplary embodiments of the description without departing from the scope or spirit of the present invention. The scope of the following claims is to be accorded the broadest interpretation so as to encompass all modifications and equivalent structures and functions.

Claims

1. A ceramic filter with a mixed metal coating is characterized by sequentially comprising a ceramic substrate, a reinforcing layer and a mixed metal coating; wherein the reinforcing layer is bonded to at least a portion of an outer surface of the ceramic substrate, and the hybrid plated metal layer is further bonded to the reinforcing layer, whereby the hybrid plated layer constitutes at least a portion of an outer surface of the ceramic filter.

2. The ceramic filter with hybrid metallization of claim 1, wherein the hybrid metallization is a silver metallization.

3. The ceramic filter with hybrid metallization layer of claim 1, wherein the hybrid metallization layer is obtained by electroless and electrolytic plating.

4. The ceramic filter with hybrid metallization layer of claim 1, wherein the reinforcement layer is a palladium metal layer.

5. The ceramic filter with hybrid metallization layer of claim 1, wherein the reinforcement layer is obtained by electroless plating.

6. The ceramic filter with a hybrid metal plated layer according to claim 1, wherein the thickness of the reinforcement layer is 50nm to 800nm, and the thickness of the hybrid metal plated layer is 3 μm or more.

7. The ceramic filter with hybrid metallization layer of claim 1, wherein the ceramic filter is a band stop filter or a band pass filter.

8. The ceramic filter with hybrid metallization of claim 1, wherein the ceramic filter is a two-terminal filter, a three-terminal filter, or a four-terminal filter.

9. The ceramic filter with the hybrid metallization layer of claim 1, wherein the ceramic substrate comprises an upper surface and a lower surface, a first side, a second side, a third side, and a fourth side connecting the upper surface and the lower surface, and a via hole passing through the upper surface and the lower surface, wherein the reinforcement layer is bonded to the upper surface, the first side, the second side, the third side, and the fourth side, and the hybrid metallization layer is bonded to the reinforcement layer.

10. An electronic device comprising a ceramic filter with a hybrid metallization layer according to any of claims 1-9.