CN210104113U - Mounting structure of electroplating rack - Google Patents
Mounting structure of electroplating rack Download PDFInfo
- Publication number
- CN210104113U CN210104113U CN201920228052.2U CN201920228052U CN210104113U CN 210104113 U CN210104113 U CN 210104113U CN 201920228052 U CN201920228052 U CN 201920228052U CN 210104113 U CN210104113 U CN 210104113U
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- mounting
- electroplating
- rack
- sliding plate
- sliding
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- 238000009713 electroplating Methods 0.000 title claims abstract description 81
- 230000005540 biological transmission Effects 0.000 claims abstract description 12
- 238000009434 installation Methods 0.000 abstract description 27
- 238000007747 plating Methods 0.000 abstract description 19
- 230000033001 locomotion Effects 0.000 abstract description 13
- 230000000694 effects Effects 0.000 abstract description 7
- 238000003756 stirring Methods 0.000 abstract description 4
- 230000006872 improvement Effects 0.000 description 10
- 239000002184 metal Substances 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 230000008901 benefit Effects 0.000 description 7
- 238000000034 method Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 238000005868 electrolysis reaction Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000002198 insoluble material Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
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- Electroplating Methods And Accessories (AREA)
Abstract
The utility model provides an installation structure of an electroplating hanger, which comprises an electroplating bath, an installation component and a moving component, wherein the installation component and the moving component are arranged on the electroplating bath, the installation component comprises an installation frame and an installation seat, the moving component comprises a sliding plate, a sliding rail, a driving gear and a motor which are positioned at two sides of the electroplating bath, the side surface of the sliding plate is provided with a rack, the driving gear is in transmission connection with the rack, the motor is in transmission connection with the driving gear, and the sliding; the side edge of the electroplating bath is provided with an installation groove, and the sliding plate and the sliding rail are positioned below the installation groove; the mounting seat is arranged on the sliding plate, and two ends of the mounting frame are connected with the sliding plate through the mounting seat; adopt the utility model provides a mounting structure of electroplating stores pylon can follow the mounting bracket back and forth movement in the plating bath, forms relative motion with the plating solution to let plating solution and product fully contact, and the indirect plating solution that stirs makes it more even, improve the electroplating effect of product.
Description
Technical Field
The utility model relates to an electroplate the field, particularly, relate to an electroplate mounting structure of stores pylon.
Background
Electroplating (electroplating) is a process of plating a thin layer of other metals or alloys on the surface of some metals by using the principle of electrolysis, and is a process of attaching a layer of metal film on the surface of a metal or other material product by using the action of electrolysis so as to play roles of preventing metal oxidation (such as corrosion), improving wear resistance, conductivity, light reflection, corrosion resistance (such as copper sulfate and the like), enhancing the appearance and the like. During electroplating, plating metal or other insoluble materials are used as an anode, a workpiece to be plated is used as a cathode, and cations of the plating metal are reduced on the surface of the workpiece to be plated to form a plating layer.
During electroplating, metal parts are hung on the electroplating hanger and then placed in the electroplating bath, and the electroplating bath contains electroplating solution, so that products on the electroplating hanger can be electroplated. Due to the defects of the connecting structure, the electroplating hanging rack is placed in the electroplating bath, the position of the electroplating hanging rack is fixed, and the product and the electroplating solution can not form relative motion, so that the electroplating is uneven and the electroplating effect is poor.
SUMMERY OF THE UTILITY MODEL
In view of this, the utility model provides a mounting structure of electroplating rack aims at solving among the prior art electroplating rack and puts the rigidity in the plating bath, can't be at the problem of electroplating in-process motion, through institutional advancement, can follow the mounting bracket back and forth movement in the plating bath, and the plating solution forms relative motion to let plating solution and product fully contact, and stir the plating solution indirectly and make it more even, improve the electroplating effect of product.
The utility model provides an installation structure of an electroplating hanger, which comprises an electroplating bath, an installation component and a moving component, wherein the installation component and the moving component are arranged on the electroplating bath, the installation component is movably connected with the moving component, the installation component comprises an installation rack and an installation seat, the moving component comprises a sliding plate, a sliding rail, a driving gear and a motor which are arranged at two sides of the electroplating bath, the side surface of the sliding plate is provided with a rack, the driving gear is connected with the rack in a transmission way, the motor is connected with the driving gear in a transmission way, and the sliding plate is movably connected with the; the side edge of the electroplating bath is provided with an installation groove, and the sliding plate and the sliding rail are positioned below the installation groove; the mounting seat set up in on the slide, just the both ends of mounting bracket are passed through the mounting seat is connected the slide.
Further, the mounting structure of electroplating stores pylon still includes the direction subassembly, the direction subassembly includes guide block, deflector and connection lagging, the guide block set up in on the mounting bracket, the one end of connecting the lagging is connected the guide block, and its other end cover is located on the deflector.
Furthermore, the side of mount pad is "V" type, the tip joint of mounting bracket the opening of mount pad.
Further, the both ends of mounting bracket are provided with the installation and detain, the transversal inverted triangle-shaped that personally submits of installation knot, and with the opening phase-match of mount pad.
Furthermore, two ends of the slide rail are provided with limiting blocks.
Further, the inboard of stopper is provided with position sensor, position sensor is photoelectric sensor
The utility model provides a mounting structure of an electroplating rack, which mainly comprises an electroplating bath, a mounting component and a moving component, wherein the mounting component and the moving component are arranged on the electroplating bath, the mounting component is used for hanging the electroplating rack, and the mounting component is movably connected with the moving component, so that the electroplating rack can be driven to move together; the mounting assembly comprises a mounting frame and a mounting seat, the moving assembly comprises a sliding plate, a sliding rail, a driving gear and a motor, the sliding plate, the sliding rail, the driving gear and the motor are positioned on two sides of the electroplating bath, a rack is arranged on the side surface of the sliding plate, the driving gear is in transmission connection with the rack, the motor is in transmission connection with the driving gear, and the sliding plate is in moving connection with the sliding rail, so that the motor drives the driving gear to rotate, the rack; the side edge of the electroplating bath is provided with an installation groove, and the sliding plate and the sliding rail are positioned below the installation groove, so that an installation space is just provided for the installation frame and the installation seat, and interference is avoided; the mount pad sets up on the slide, and the both ends of mounting bracket are passed through the mount pad and are connected the slide, can take mount pad and mounting bracket to move together when consequently the slide back and forth movement, and electroplating hanger articulates on the mounting bracket, consequently finally realizes electroplating hanger round trip movement in the plating solution, not only plating solution and product fully contact, and the indirect plating solution that stirs makes it more even, improves the electroplating effect of product.
Drawings
Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the invention. Also, like reference numerals are used to refer to like parts throughout the drawings. In the drawings:
fig. 1 is a top view of an installation structure of an electroplating rack according to an embodiment of the present invention;
fig. 2 is a front view of an installation structure of an electroplating rack according to an embodiment of the present invention (the electroplating bath is omitted);
fig. 3 is a schematic view of the connection between the middle mounting buckle and the mounting seat of the present invention.
Detailed Description
Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
The first embodiment is as follows:
referring to fig. 1-2, a mounting structure of an electroplating rack provided by an embodiment of the present invention is shown in the drawings, which includes an electroplating bath 1, a mounting assembly and a moving assembly disposed on the electroplating bath 1, the mounting assembly is movably connected to the moving assembly, the mounting assembly includes a mounting frame 21 and a mounting base 22, the moving assembly includes a sliding plate 31, a sliding rail 32, a driving gear and a motor disposed on two sides of the electroplating bath 1, a rack 33 is disposed on a side surface of the sliding plate 31, the driving gear is connected to the rack 33 in a transmission manner, the motor is connected to the driving gear in a transmission manner, and the sliding plate 31 is; the side edge of the electroplating bath 1 is provided with a mounting groove 11, and the sliding plate 31 and the sliding rail 32 are positioned below the mounting groove 11; the mounting seat 22 is disposed on the sliding plate 31, and two ends of the mounting frame 21 are connected to the sliding plate 31 through the mounting seat 22.
The mounting structure of the electroplating rack provided by the embodiment mainly comprises an electroplating bath 1, a mounting component and a moving component, wherein the mounting component and the moving component are arranged on the electroplating bath 1, the mounting component is used for hanging the electroplating rack, and the mounting component is movably connected with the moving component, so that the electroplating rack can be driven to move together; the mounting assembly comprises a mounting frame 21 and a mounting seat 22, the moving assembly comprises a sliding plate 31, a sliding rail 32, a driving gear and a motor which are positioned on two sides of the electroplating bath 1, a rack 33 is arranged on the side surface of the sliding plate 31, the driving gear is in transmission connection with the rack 33, the motor is in transmission connection with the driving gear, and the sliding plate 31 is in movable connection with the sliding rail 32, so that the motor drives the driving gear to rotate, the rack 33 is driven to move, and the sliding plate 31 can finally move back and forth; the side edge of the electroplating bath 1 is provided with a mounting groove 11, and the sliding plate 31 and the sliding rail 32 are positioned below the mounting groove 11 and just provide a mounting space for the mounting frame 21 and the mounting seat 22 so as to avoid interference; mount pad 21 sets up on slide 31, and the slide is connected through the mount pad at the both ends of mounting bracket, can take mount pad and mounting bracket 21 to move together when consequently the slide back and forth movement, and electroplating hanger articulates on mounting bracket 21, consequently finally realizes electroplating hanger round trip movement in the plating solution, not only plating solution and product fully contact, and the indirect plating solution that stirs makes it more even, improves the electroplating effect of product.
Example two:
referring to fig. 2, a mounting structure of an electroplating rack according to a second embodiment of the present invention is shown in the drawing, and the present embodiment further adopts the following technical solutions as improvements on the basis of the above embodiment: the mounting structure of electroplating rack still includes the direction subassembly, and the direction subassembly includes guide block 41, deflector 42 and connects lagging 43, and guide block 41 sets up on mounting bracket 21, connects the one end of lagging 43 and connects guide block 41, and its other end cover is located on deflector 42.
Through the above further improvement, the present embodiment has the following advantages compared with the prior art: the guide block 41 is connected with the mounting frame 21 and the connecting sleeve plate 43, and the connecting sleeve plate 43 moves back and forth along the guide plate 42 while the mounting frame 21 moves along with the sliding plate 31, so that the mounting frame 21 is guided, and the movement precision is improved.
Example three:
referring to fig. 3, a mounting structure of an electroplating rack according to a third embodiment of the present invention is shown, and on the basis of the third embodiment, the present embodiment further provides the following technical solutions as improvements: the side of the mounting seat 22 is in a V shape, and the end of the mounting frame 21 is clamped with the opening of the mounting seat 22.
Through the above further improvement, the present embodiment has the following advantages compared with the prior art: after the mounting frame 21 and the mounting seat 22 are clamped, the connecting strength of the mounting frame 21 and the mounting seat 22 is strong, the clamping is tighter, the position deviation cannot occur in the mounting seat 22, and the positioning effect is good.
Example four:
referring to fig. 3, a mounting structure of an electroplating rack according to a fourth embodiment of the present invention is shown, and on the basis of the foregoing embodiment, the present embodiment further provides the following technical solutions as improvements: the two ends of the mounting frame 21 are provided with mounting buckles 23, the cross sections of the mounting buckles 23 are in an inverted triangle shape, and the mounting buckles 23 are matched with the openings of the mounting seat 22.
Through the above further improvement, the present embodiment has the following advantages compared with the prior art: the installation is detained 23 and the setting of mount pad 22, further improves connection dynamics and location effect, is convenient for install simultaneously and dismantles.
Example five:
referring to fig. 1, a mounting structure of an electroplating rack according to a fifth embodiment of the present invention is shown in the drawing, and on the basis of the foregoing embodiment, the present embodiment further provides the following technical solutions as improvements: the two ends of the slide rail 32 are provided with stoppers 34.
Through the above further improvement, the present embodiment has the following advantages compared with the prior art: the arrangement of the limiting block 34 can limit the movement stroke of the sliding plate 31, prevent the sliding plate from exceeding the stroke and enable the mounting seat 22 to be mounted on the electroplating bath 1, and improve the safe operation coefficient.
Example six:
referring to fig. 1, a mounting structure of an electroplating rack according to a sixth embodiment of the present invention is shown in the drawing, and on the basis of the foregoing embodiment, the present embodiment further provides the following technical solutions as improvements: the inner side of the limiting block 34 is provided with a position sensor 35, and the position sensor 35 is a photoelectric sensor and is embedded in the side edge of the electroplating bath 1. The photoelectric sensor is connected with the motor through signals, the sliding plate 31 is sensed to transmit the signals to the motor in time, and the motor stops running or rotates reversely according to the signals.
Through the above further improvement, the present embodiment has the following advantages compared with the prior art: when slide 31 moved to photoelectric sensor department, photoelectric sensor will sense, will transmit the signal for the motor at once, and the stop motion, later the motor reversal, slide 31 moves back, further improves the factor of safety of operation, prevents that the collision phenomenon from taking place.
It will be apparent to those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (6)
1. The mounting structure of the electroplating hanger is characterized by comprising an electroplating bath (1), a mounting assembly and a moving assembly, wherein the mounting assembly and the moving assembly are arranged on the electroplating bath (1), the mounting assembly is movably connected with the moving assembly, the mounting assembly comprises a mounting frame (21) and a mounting seat (22), the moving assembly comprises sliding plates (31), sliding rails (32), a driving gear and a motor, the sliding plates (31) are positioned on two sides of the electroplating bath (1), a rack (33) is arranged on the side surface of each sliding plate (31), the driving gear is in transmission connection with the rack (33), the motor is in transmission connection with the driving gear, and the sliding plates (31) are movably connected with the sliding rails (32); a mounting groove (11) is formed in the side edge of the electroplating bath (1), and the sliding plate (31) and the sliding rail (32) are located below the mounting groove (11); the mounting seat (22) is arranged on the sliding plate (31), and two ends of the mounting frame (21) are connected with the sliding plate (31) through the mounting seat (22).
2. The mounting structure of an electroplating rack according to claim 1, further comprising a guide assembly, wherein the guide assembly comprises a guide block (41), a guide plate (42) and a connecting sleeve plate (43), the guide block (41) is disposed on the mounting frame (21), one end of the connecting sleeve plate (43) is connected with the guide block (41), and the other end of the connecting sleeve plate is sleeved on the guide plate (42).
3. The mounting structure of an electroplating hanger according to claim 2, wherein the side surface of the mounting seat (22) is V-shaped, and the end of the mounting frame (21) is clamped with the opening of the mounting seat (22).
4. The mounting structure of an electroplating hanger according to claim 3, wherein mounting buckles (23) are arranged at two ends of the mounting rack (21), the cross section of each mounting buckle (23) is in an inverted triangle shape, and the mounting buckles are matched with the openings of the mounting seats (22).
5. The mounting structure of an electroplating hanger according to claim 4, wherein the two ends of the slide rail (32) are provided with a limiting block (34).
6. The mounting structure of an electroplating hanger according to claim 5, wherein a position sensor (35) is arranged at the inner side of the limiting block (34), and the position sensor (35) is a photoelectric sensor and is embedded in the side of the electroplating bath (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920228052.2U CN210104113U (en) | 2019-02-21 | 2019-02-21 | Mounting structure of electroplating rack |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920228052.2U CN210104113U (en) | 2019-02-21 | 2019-02-21 | Mounting structure of electroplating rack |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210104113U true CN210104113U (en) | 2020-02-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920228052.2U Expired - Fee Related CN210104113U (en) | 2019-02-21 | 2019-02-21 | Mounting structure of electroplating rack |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210104113U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109722701A (en) * | 2019-02-21 | 2019-05-07 | 苏州市安派精密电子有限公司 | A kind of mounting structure of Electroplating Rack |
| CN111705356A (en) * | 2020-05-16 | 2020-09-25 | 崔留顺 | Surface treatment device and method for silver plating on stainless steel surface |
-
2019
- 2019-02-21 CN CN201920228052.2U patent/CN210104113U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109722701A (en) * | 2019-02-21 | 2019-05-07 | 苏州市安派精密电子有限公司 | A kind of mounting structure of Electroplating Rack |
| CN111705356A (en) * | 2020-05-16 | 2020-09-25 | 崔留顺 | Surface treatment device and method for silver plating on stainless steel surface |
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200221 |