CN210100927U

CN210100927U - Protection film with dustproof construction

Info

Publication number: CN210100927U
Application number: CN201920502561.XU
Authority: CN
Inventors: 陈冠华
Original assignee: Dongguan City Guan He Optical Glass Co Ltd
Current assignee: Dongguan City Guan He Optical Glass Co Ltd
Priority date: 2019-04-11
Filing date: 2019-04-11
Publication date: 2020-02-21
Anticipated expiration: 2029-04-11

Abstract

The utility model discloses a protection film with dustproof construction, including glass layer and adhesive linkage, be equipped with the glass layer through-hole that corresponds the electronic product earphone on the glass layer, be equipped with in the glass layer through-hole and cover the dustproof construction that corresponds the electronic product earphone size, dustproof construction overall structure adopts the platform type structure, and the inside in dustproof construction has set up the cavity, wherein, the through-hole and the edge on glass layer set up the cambered surface frame, the lower surface on glass layer and the upper surface bonding of adhesive linkage, dustproof construction arranges in the glass layer through-hole and covers on the electronic product earphone, make it cover electronic product earphone when dustproof, can effectively protect the electronic product earphone when not influencing normal sound quality, fault-tolerant rate when still can increasing the pad pasting, the structure is very simple, has increased the accuracy when installing.

Description

Protection film with dustproof construction

[ technical field ] A method for producing a semiconductor device

The utility model relates to an electronic product protection accessory technical field specifically is a protection film with dustproof construction.

[ background of the invention ]

The electronic product film is an indispensable part for protecting the screen of the electronic product at present, can be used for mounting the outer surface of the body of the electronic product and the outer surface of the screen, is attractive, and can play a certain role in protecting the electronic product;

at present, most electronic product membrane often directly adopts through-hole or breach to make the earphone directly expose in the earphone position, does not have the structure that covers, but daily sweat and dust cause the jam in electronic product earphone hole easily, seriously influence electronic product's stereo set quality and normal use. The few partial earphone dust-proof membrane in current market often also adopts the simple dustproof construction of the straight shape of taking the sieve hole, the user is in the use, the pad pasting is askew easily, just lead to dustproof construction to misplace easily when covering the earphone and lead to hiding the phonatory hole of most earphones easily, how provide an electronic product membrane, make it can guarantee not to shelter from the earphone and play dirt-proof effect on the basis of guaranteeing toughness, luminousness, be the problem that technical staff in the field awaits urgent need to solve at present.

[ Utility model ] content

When overcoming the operation of current earphone dustproof installation, there is the shortcoming that the fault-tolerance is low, the utility model provides an easy and simple to handle, safe practical, simple structure's electronic product protection film with dust mask.

In order to solve the above technical problems, the present invention provides a technical solution as follows: the utility model provides a protection film with dustproof construction, including glass layer and adhesive linkage, set up corresponding electronic product earphone position and big or small assorted glass layer through-hole on the glass layer, be equipped with in the glass layer through-hole and can cover the dustproof construction that corresponds electronic product earphone size, dustproof construction includes the connection structure who bonds with the adhesive linkage and deviates from the dust layer of adhesive linkage direction, and dust layer and connection structure enclose to close to form and have an open-ended cavity.

Preferably, the size of the opening of the dust-proof structure is larger than that of the dust-proof layer; the connecting structure and the plane of the dust-proof layer are arranged in an obtuse angle.

Preferably, the outer contour of the connecting structure matches the inner contour of the glass layer passage opening.

Preferably, the dust protective layer comprises: one or more of porous structure, grid structure and silk screen structure; the dust-proof layer comprises a single layer or a plurality of layers.

Preferably, the dustproof layer is provided with a plurality of through holes, the diameter of each through hole is set to be 0.05mm-0.1mm, and the diameter of each through hole is larger than the center distance between two adjacent through holes.

Preferably, after the dustproof structure is arranged in the through hole of the glass layer, the dustproof layer is flush with the surface of the glass layer far away from the bonding layer.

Preferably, one side of the connecting structure close to the bonding layer is a plane, and the plane is fixedly bonded with the bonding layer.

Preferably, the adhesive layer comprises an adhesive film and adhesive substance layers formed on the upper and lower surfaces of the adhesive film; or the adhesive layer is formed by directly coating an adhesive substance on one surface of the glass layer facing the electronic device of the electronic product.

Preferably, the glass layer includes a transparent region, and the size of the adhesive layer is greater than or equal to the size of the transparent region of the glass layer.

Preferably, the bonding layer through hole is formed in the position, corresponding to the glass layer through hole, of the bonding layer, the bonding layer through hole is matched with the glass layer through hole in shape, and the size of the bonding layer through hole is smaller than that of the glass layer through hole.

Compared with the prior art, the protective film with the dustproof structure has the following beneficial effects:

the utility model discloses an improve on earphone dustproof construction to combine current ripe protection film technology, when covering and keeping apart the electronic product earphone, can effectively protect the electronic product earphone when not influencing normal stereo set quality, fault-tolerant rate when still can increase the pad pasting, the structure is very simple, accuracy when having increased the installation.

[ description of the drawings ]

Fig. 1 is an exploded schematic view of a protective film with a dustproof structure provided by the present invention;

fig. 2 is a bottom view of a dustproof structure of a protective film with a dustproof structure provided by the present invention;

fig. 3 is a cross-sectional view of D-D shown in fig. 2 illustrating a protective film with a dustproof structure according to the present invention;

fig. 4 is a schematic view of a combined structure of a protective film with a dustproof structure provided by the present invention;

fig. 5 is a cross-sectional view of E-E shown in fig. 4 illustrating a protective film having a dustproof structure according to the present invention.

The attached drawings indicate the following:

1. a dust-proof structure; 101. a cavity; 102. a dust-proof layer; 103. a connecting structure; 2. a glass layer; 201. a glass layer through hole; 3. an adhesive layer; 301. and (6) bonding layer through holes.

[ detailed description ] embodiments

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and the embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

The utility model provides a pair of protection film with dustproof construction for thereby with electronic product adaptation, make electronic product and external isolation prevent the effect of dust, this electronic product can be cell-phone, panel, computer, in this embodiment, the electronic product is comprehensive screen cell-phone.

Referring to fig. 1, the protective film with a dustproof structure includes a glass layer 2 and an adhesive layer 3, the glass layer 2 is provided with a glass layer through hole 201 corresponding to a receiver of an electronic product and having a size matched with that of the receiver, and the glass layer through hole 201 is provided with the dustproof structure 1 capable of covering the receiver of the electronic product;

referring to fig. 2 and 3, the dustproof structure 1 includes a connection structure 103 adhered to the adhesive layer 3, and a dustproof layer 102 facing away from the adhesive layer 3, wherein the dustproof layer 102 and the connection structure 103 enclose a cavity 101 having an opening facing away from the glass layer 2.

The dustproof structure 1 is arranged in the glass layer through hole 201 and covers an electronic product receiver, and is adhered to the upper surface of the adhesive layer 3 through the connecting structure 103, so that the dustproof structure 1, the glass layer 2 and the adhesive layer 3 are adhered into a whole; the dust-proof layer 102 is generally arranged to be thin, so that a larger space is reserved for the cavity 101, the dust-proof layer 102 and the electronic product telephone receiver can have a certain distance, and the phenomenon that the sound volume of the sound is influenced due to the fact that the covering hole of the dust-proof layer 102 and the sound outlet hole of the electronic product telephone receiver are staggered and overlapped with each other is avoided.

In some embodiments, please continue to refer to fig. 3 and fig. 2, the size of the opening of the dust-proof structure 1 is larger than the size of the dust-proof layer. This structural feature makes dustproof construction 1 wholly present the structure of platform type similar loudspeaker, strengthens gathering the sound effect. The connecting structure is arranged to be larger, so that the earphone of the electronic product can be more easily covered, and the dustproof structure is easier to install;

with continued reference to fig. 3, the connecting structure 103 is disposed at an angle to the plane of the dust-proof layer 102, specifically, as shown in fig. 3, the angle is further preferably an obtuse angle. When dustproof construction 1 covers on the electronic product earphone, dustproof construction 1 keeps away from the one side of electronic product screen direction just to the user and exposes outside, prevents that the user installation in-process or installation back dustproof construction 1 perk from leading to sharp-pointed part to the injury of human body.

Referring to fig. 2 and 3, the dust-proof layer includes, but is not limited to: one or more of porous structure, grid structure and silk screen structure; the dust-proof layer includes but not limited to individual layer or multilayer, and grid structure, silk screen structure relatively make processing comparatively simple, the cost is lower, and dust-proof layer structural stability is stronger, in this embodiment, adopts porous structure.

Referring to fig. 2 and 3, the dust-proof layer 102 is provided with a plurality of through holes (not numbered) arranged in a matrix form, the diameter of the through holes is set to be 0.05mm-0.1mm, and the diameter of each through hole is greater than the center distance between two through holes.

When the dustproof structure 1 covers the earphone of the electronic product, the through holes on the dustproof layer 102 can preferably adopt the diameter of 0.05mm-0.1mm, dust particles and water drops with common sizes in a better filtering environment can be better arranged closely among the through holes, the arrangement space of the through holes on the dustproof layer 102 is increased, the number of the holes is increased, and the permeability of sound is increased while the dustproof and waterproof functions are realized.

Referring to fig. 1, 2 and 5, the outer contour of the connecting structure 103 matches the inner contour of the glass layer through hole 201. When the dustproof structure 1 is arranged in the glass layer through hole 201, the accommodating space of the connecting structure 103 and the glass layer through hole 201 can be completely matched.

In other embodiments, referring to fig. 5, after the dust-proof structure 1 is inserted into the through hole 201 of the glass layer, the dust-proof layer 102 is flush with the surface of the glass layer 2 away from the adhesive layer 3. After the dust-proof structure 1 is inserted into the glass layer through hole 201, the surface of the glass layer through hole 201 away from the adhesive layer 3 and the dust-proof layer 102 are kept in a plane.

With continued reference to fig. 4 and fig. 5, a side of the connecting structure 103 close to the adhesive layer 3 is a plane. The adhesive layer 3 may fix the dust-proof structure 1 by adhering the bottom of the connection structure 103, thereby fixing the dust-proof structure 1 in the glass layer through hole 201. Arranging the connection structure 103 as a plane further increases the contact surface between the adhesive layer 3 and the connection structure 103 and also further increases the stability of the adhesion.

Referring to fig. 1 and 5, the adhesive layer 3 includes an adhesive film (not shown) and adhesive substance layers (not shown) formed on the upper and lower surfaces of the adhesive film;

alternatively, in some other embodiments, the adhesive layer 3 is formed by directly coating an adhesive substance on a surface of the glass layer 2 facing the electronic device.

As can be understood from the above: the one side that adhesive linkage 3 deviates from the electronic product should bond in the one side that glass layer 2 faces the electronic product, can one side adhesive linkage glass layer 2, the positive screen of electronic product is bonded to the one side, also can adopt single face viscidity, consequently at the one side coating bonding material of glass layer 2 towards the electronic product be used for bonding in on the display screen of electronic equipment.

With continued reference to fig. 1 and 5, the glass layer includes a transparent region, and the size of the adhesive layer is greater than or equal to the size of the transparent region of the glass layer. When the adhesive layer 3 is adhered to the glass layer 2 of an electronic product, the part of the side of the glass layer 2 facing the electronic product corresponding to the screen area needs to be completely adhered to the screen, and therefore the adhesive layer 3 needs to completely cover the area corresponding to the glass layer 2.

With reference to fig. 1 and fig. 5, an adhesive layer through hole 301 is formed in the adhesive layer 3 at a position corresponding to the glass layer through hole 201 and located on the glass layer 2, the shape of the adhesive layer through hole 301 matches with the shape of the glass layer through hole 201, and the size of the adhesive layer through hole 301 is smaller than the size of the glass layer through hole 201. Because the dustproof structure 1 is only bonded on the upper surface of the bonding layer 3 through the connecting structure 103, the lower surface of the bonding layer 3 is bonded on the front surface of the screen of the electronic device, the size of the bonding layer through hole 301 is limited to be smaller than that of the glass layer through hole 201, the requirement that the bonding layer 3 needs to simultaneously cover an earphone of the electronic device is considered, and the bonding areas of the dustproof structure 1 and the upper surface of the bonding layer 3 can be properly reserved to increase two requirements of adhesiveness.

Compared with the prior art, the protective film with the dustproof structure of the electronic product has the following beneficial effects:

the utility model discloses an improve on earphone dust-proof structure to combine current ripe protection film technique, when covering and keeping apart the electronic product earphone, can effectively protect the electronic product earphone again when not influencing normal stereo set quality, the degree of difficulty when the production equipment of setting up reducible pad pasting of structure, the structure is very simple, has increased the accuracy when installing.

1. The arrangement of the earphone dustproof structure can ensure that the electric product earphone has high sound volume conductivity and good sound aggregation;

2. the user is very simple to install, the fault tolerance rate is high during production and assembly, and the installation failure rate is low;

3. the dustproof structure of the telephone receiver is relatively safe in arrangement, has no sharp part, and prevents the harm to a human body caused by the raised edge.

The present invention is not limited to the above preferred embodiments, and any modifications, equivalent replacements, and improvements made within the principle of the present invention should be included within the protection scope of the present invention.

Claims

1. The utility model provides a protection film with dustproof construction, its characterized in that includes glass layer and adhesive linkage, set up on the glass layer and correspond electronic product earphone position and big or small assorted glass layer through-hole, be equipped with electronic product dustproof construction in the glass layer through-hole, dustproof construction include with the connection structure that the adhesive linkage bonded and deviate from the dust layer of adhesive linkage direction, the dust layer with connection structure encloses to close and forms and has an open-ended cavity.

2. The protective film having a dust-proof structure according to claim 1, wherein: the size of the opening of the dustproof structure is larger than that of the dustproof layer; the connecting structure and the plane where the dustproof layer is located are arranged at an obtuse angle.

3. The protective film having a dust-proof structure according to claim 1, wherein: the outer contour of the connecting structure is matched with the inner contour of the glass layer through hole.

4. The protective film having a dust-proof structure according to claim 1, wherein: the dust-proof layer comprises: one or more of porous structure, grid structure and silk screen structure; the dust-proof layer comprises a single layer or a plurality of layers.

5. The protective film having a dust-proof structure according to claim 1, wherein: the dustproof layer is provided with a plurality of through holes, the diameter of each through hole is set to be 0.05mm-0.1mm, and the diameter of each through hole is larger than the center distance between two adjacent through holes.

6. The protective film having a dust-proof structure according to claim 1, wherein: the dustproof structure is placed in the glass layer through hole, and then the dustproof layer is flush with the surface of the glass layer far away from the bonding layer.

7. The protective film having a dust-proof structure according to claim 1, wherein: one side of the connecting structure, which is close to the bonding layer, is a plane, and the plane is bonded and fixed with the bonding layer.

8. The protective film having a dust-proof structure according to claim 7, wherein: the adhesive layer comprises an adhesive film and adhesive substance layers formed on the upper and lower surfaces of the adhesive film; or the adhesive layer is formed by directly coating an adhesive substance on one surface of the glass layer facing to the electronic device of the electronic product.

9. The protective film having a dust-proof structure according to claim 1, wherein: the glass layer comprises a transparent area, and the size of the bonding layer is larger than or equal to that of the transparent area of the glass layer.

10. The protective film having a dust-proof structure according to any one of claims 1 to 9, wherein: the glass layer is characterized in that a bonding layer through hole is formed in the position, corresponding to the glass layer through hole, of the bonding layer, the shape of the bonding layer through hole is matched with that of the glass layer through hole, and the size of the bonding layer through hole is smaller than that of the glass layer through hole.