CN210093260U

CN210093260U - Electronic device

Info

Publication number: CN210093260U
Application number: CN201920786585.2U
Authority: CN
Inventors: 黄茂昭; 杨自美; 余厚晖
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2018-07-26
Filing date: 2019-05-28
Publication date: 2020-02-18
Anticipated expiration: 2029-05-28

Abstract

The application relates to an electronic device which comprises a terminal device and an image acquisition module. The terminal equipment comprises a front surface, a rear surface and a side circumferential surface which are arranged in a back-to-back mode. The terminal equipment comprises a display screen and a first extremely high frequency communication chip, and a mounting groove penetrating through the lateral periphery is formed in the terminal equipment. The image acquisition module comprises a first camera module and a second high-frequency communication chip. The image acquisition module can be installed in the mounting groove and can rotate relative to the terminal equipment so as to be located at a first position and a second position in the mounting groove. The image acquisition module is located in the terminal equipment when in the first position, at least part of the structure of the image acquisition module is located outside the mounting groove when in the second position, the ambient light on one side of the display screen can irradiate the first camera module, and the first extremely-high frequency communication chip can be paired with the second extremely-high frequency communication chip to realize communication connection when in the second position. The electronic equipment is beneficial to increasing the available space in the terminal equipment.

Description

Electronic device

Technical Field

The present application relates to the field of electronic devices.

Background

In order to improve the screen occupation ratio of terminal devices such as mobile phones, a common scheme is to set a telescopic image acquisition module at the top of the terminal device, the telescopic image acquisition module is connected with a main board of the terminal device through a flexible circuit board, the flexible circuit board needs to occupy the internal space of the terminal device, and the available space of components such as a battery of the terminal device is compressed.

SUMMERY OF THE UTILITY MODEL

An embodiment of the present application provides an electronic device to solve a problem that a flexible circuit board of a scalable image capture module compresses an available space inside a terminal device.

An electronic device, comprising:

the terminal equipment comprises a front surface, a rear surface and a side peripheral surface, wherein the front surface and the rear surface are arranged oppositely, and the side peripheral surface is connected between the front surface and the rear surface; the terminal equipment comprises a display screen and a first extremely high frequency communication chip, and the orientation of a displayable area of the display screen is the same as that of the front surface; the terminal equipment is provided with an installation groove penetrating through the side circumferential surface; and

the image acquisition module comprises a first camera module and a second high-frequency communication chip, and the first camera module can be in communication connection with the second high-frequency communication chip; the image acquisition module can install in the mounting groove, just the image acquisition module can be relative terminal equipment rotates to primary importance and second position, wherein, when primary importance the image acquisition module is located in the mounting groove, when the second position at least partial structure of image acquisition module is located outside the mounting groove, the ambient light of one side at display screen place can shine to in the first camera module, and when the second position first extremely high frequency communication chip can with second extremely high frequency communication chip pairs, so that first extremely high frequency communication chip can with second extremely high frequency communication chip communication connection.

In one embodiment, the side peripheral surface comprises a top side surface and a bottom side surface which are arranged oppositely, and a first side surface and a second side surface which are arranged oppositely; the first side surface is positioned between the top side surface and the bottom side surface, the second side surface is positioned between the top side surface and the bottom side surface, the top side surface is connected to one end of the first side surface and one end of the second side surface, and the bottom side surface is connected to the other end of the first side surface and the other end of the second side surface; the mounting groove penetrates through the top side surface.

In one embodiment, the image acquisition module comprises a front end surface, a rear end surface and an outer peripheral surface, wherein the front end surface and the rear end surface are arranged oppositely, the outer peripheral surface is connected between the front end surface and the rear end surface, and the outer peripheral surface comprises a top end surface and a connecting surface connected with the top end surface; the top end face is flush with the top side face when in the first position; and when the second position is adopted, the ambient light can irradiate into the first camera module from one side where the front end face is positioned.

In one embodiment, the mounting slot opens between the front surface and the rear surface.

In one embodiment, the image acquisition module comprises a power module and a module main board, and the power module can supply power to the module main board.

In one embodiment, the image acquisition module can be detached from the mounting groove, and after the image acquisition module is detached from the mounting groove, the image acquisition module can be in communication connection with the terminal device.

In one embodiment, the image acquisition module comprises a third pole high-frequency communication chip which can be in communication connection with the first camera module; the image acquisition module can be dismantled from the mounting groove, and after the image acquisition module is dismantled from the mounting groove, the image acquisition module can be repacked in the mounting groove so that the image acquisition module is located the third position, and when the third position the ambient light of one side of rear surface place can shine to in the first camera module, and the third pole high frequency communication chip can pair with first extremely high frequency communication chip, so that the third pole high frequency communication chip can with first extremely high frequency communication chip communication connection.

In one embodiment, the image capturing module includes a second camera module, the second camera module can be in communication connection with the second polar high-frequency communication chip, and when the second camera module is in the second position, the ambient light on the side where the rear end face is located can be irradiated into the second camera module.

In one embodiment, the mounting slot extends through the rear surface.

In one embodiment, the terminal device comprises a third pole high-frequency communication chip which can be in communication connection with the first camera module; the image acquisition module can be dismantled from the mounting groove, and after the image acquisition module is dismantled from the mounting groove, the image acquisition module can be repacked in the mounting groove so that the image acquisition module is located the third position, and when the third position the ambient light of one side of rear surface place can shine to in the first camera module, and the third pole high frequency communication chip can pair with first extremely high frequency communication chip, so that the third pole high frequency communication chip can with first extremely high frequency communication chip communication connection.

In one embodiment, the terminal device comprises a fourth pole high-frequency communication chip, and the second pole high-frequency communication chip can be paired with the fourth pole high-frequency communication chip in the first position so that the second pole high-frequency communication chip can be in communication connection with the fourth pole high-frequency communication chip.

In one embodiment, the mounting slot is located between the first side surface and the second side surface; or, the mounting groove penetrates through the first side surface and the second side surface.

In one embodiment, a first contact is arranged on the terminal device, a second contact is arranged on the image acquisition module, and the first contact can be in contact connection with the second contact in the second position, so that the terminal device can supply power to the image acquisition module.

In one embodiment, the terminal device comprises a rear shell, the display screen is connected with the rear shell, and the rear surface is positioned on one side of the rear shell, which faces away from the display screen; the terminal equipment comprises a magnetic suction assembly, and the magnetic suction assembly comprises a magnet and an adsorption piece; one of the magnet and the adsorption piece is connected with the rear shell, the other of the magnet and the adsorption piece is connected with the image acquisition module, and the magnet can be adsorbed on the adsorption piece when in the second position.

In one embodiment, the terminal device comprises a rear shell, the display screen is connected with the rear shell, and the rear surface is positioned on one side of the rear shell, which faces away from the display screen; the image acquisition module is provided with an arc-shaped guide rail, the rear shell is provided with a guide groove, and the arc-shaped guide rail is in sliding fit with the guide groove so that the image acquisition module can rotate relative to the terminal equipment.

In one embodiment, the terminal device comprises a rear shell, a motor, a first gear and a second gear, the display screen is connected with the rear shell, and the rear surface is positioned on one side of the rear shell, which faces away from the display screen; the motor is respectively and fixedly connected with the rear shell and the first gear, and the second gear is rotationally connected with the rear shell and meshed with the first gear; a third gear is arranged on the image acquisition module and meshed with the second gear; the motor can drive the first gear to rotate, the first gear can drive the third gear to rotate through the second gear, and the third gear can drive the image acquisition module to rotate relative to the terminal equipment.

In one embodiment, the image acquisition module comprises a housing, and a power module and a module mainboard which are arranged in the housing, wherein the power module can supply power to the module mainboard; the first camera module is arranged in the housing, and ambient light can irradiate into the first camera module from the light hole; the module main board is provided with a first through hole, the power supply module is provided with a second through hole, and the module main board is overlapped on the power supply module; the first camera module comprises a lens barrel, and the lens barrel penetrates through the first through hole and the second through hole.

In one embodiment, the first camera module comprises a lens barrel, and the second diode high-frequency communication chip is connected with the lens barrel.

Above-mentioned electronic equipment, image acquisition module rotate to the second position so that the light of one side at display screen place shines to first camera module in the time, image acquisition module can be through the first extremely high frequency communication chip communication connection of second extremely high frequency communication chip with terminal equipment, above-mentioned setting can avoid adopting the flexible line way board to realize the communication connection of image acquisition module and terminal equipment's mainboard, therefore can increase the inside usable space of terminal equipment.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

FIG. 1 is a perspective view of an image capture module of an electronic device in a first position according to an embodiment;

fig. 2 is a perspective view of the electronic device shown in fig. 1 after the image acquisition module rotates relative to the terminal device;

FIG. 3 is a front view of the image capture module of the electronic device of FIG. 2 in a second position;

FIG. 4 is an exploded view of an embodiment of an image capture module of the electronic device of FIG. 3;

FIG. 5 is a perspective view of a viewing angle of the image capture module of the electronic device of FIG. 3 in a second position;

FIG. 6 is a perspective view of the image capture module apparatus of the electronic device of FIG. 5 in a second position;

FIG. 7 is a schematic diagram of the spatial positions of a first UHF communication chip and a second UHF communication chip in an embodiment of the electronic device shown in FIG. 3;

FIG. 8 is a perspective view of an image capture module of the electronic device of FIG. 3;

FIG. 9 is a perspective view of another perspective of the image capture module of the electronic device of FIG. 8;

FIG. 10 is a perspective view of the electronic device shown in FIG. 3 with the image capture module removed from the terminal device;

FIG. 11 is a schematic view of a usage scenario of an image capture module of the electronic device shown in FIG. 10;

FIG. 12 is a perspective view of a viewing angle of the image capture module of FIG. 3 in a third position;

FIG. 13 is a perspective view of another perspective of the image capture module of FIG. 12 in a third position;

FIG. 14 is a perspective view of another embodiment of the electronic device shown in FIG. 3 with the image capture module in a second position;

FIG. 15 is a perspective view of an image capture module of an electronic device in a second position in accordance with another embodiment;

FIG. 16 is a perspective view of an image capture module of an electronic device in a second position in accordance with yet another embodiment;

FIG. 17 is a partial cross-sectional view of an image capture module of an electronic device in a first position in accordance with yet another embodiment;

FIG. 18 is a rear view of the electronic device of FIG. 15 with the image capture module in a first position;

FIG. 19 is a partial cross-sectional view of the electronic device of FIG. 18 taken along line A-A;

FIG. 20 is a perspective view of an embodiment of an image capture module of the electronic device of FIG. 18;

FIG. 21 is a perspective view of a transmission mechanism between an image capture module and a terminal device in an embodiment of the electronic device shown in FIG. 1;

FIG. 22 is a perspective view of the image acquisition module of FIG. 4 with the cover removed;

FIG. 23 is an exploded view of another embodiment of an image capture module of the electronic device of FIG. 3;

fig. 24 is a schematic structural diagram of a terminal device according to an embodiment of the present application.

Detailed Description

To facilitate an understanding of the present application, the present application will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present application are illustrated in the accompanying drawings. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

As used herein, "terminal device" refers to a device capable of receiving and/or transmitting communication signals including, but not limited to, devices connected via any one or more of the following connections:

(1) via wireline connections, such as via Public Switched Telephone Network (PSTN), Digital Subscriber Line (DSL), Digital cable, direct cable connections;

(2) via a Wireless interface means such as a cellular network, a Wireless Local Area Network (WLAN), a digital television network such as a DVB-H network, a satellite network, an AM-FM broadcast transmitter.

A terminal device arranged to communicate over a wireless interface may be referred to as a "mobile terminal". Examples of mobile terminals include, but are not limited to, the following electronic devices:

(1) satellite or cellular telephones;

(2) personal Communications Systems (PCS) terminals that may combine cellular radiotelephones with data processing, facsimile, and data Communications capabilities;

(3) radiotelephones, pagers, internet/intranet access, Web browsers, notebooks, calendars, Personal Digital Assistants (PDAs) equipped with Global Positioning System (GPS) receivers;

(4) conventional laptop and/or palmtop receivers;

(5) conventional laptop and/or palmtop radiotelephone transceivers, and the like.

Referring to fig. 1 and 2, in one embodiment, the electronic device 10 is a smartphone. The electronic device 10 includes a terminal device 100 and an image capture module 200. Terminal device 100 has a generally rectangular block shape, and terminal device 100 includes opposing front and

rear surfaces

111, 113, and a side surface 115 connected between front and

rear surfaces

111, 113, where side surface 115 includes opposing top and

bottom sides

1151, 1153, and opposing first and

second sides

1155, 1157. First side 1155 is located between top 1151 and bottom 1153 sides, second side 1157 is located between top 1151 and bottom 1153 sides, top 1151 is located between first 1155 and second 1157 sides, and bottom 1153 is located between first 1155 and second 1157 sides. Referring also to fig. 3, the terminal device 100 includes a display screen 120 and a first uhf communication chip 140, and the display screen 120 may be used to display information and provide an interactive interface for a user. It is understood that the Display screen 120 may be an LCD (Liquid Crystal Display) screen or an OLED (Organic Light-Emitting Diode) screen. Referring to fig. 2, the displayable region of the display screen 120 constitutes all or part of the front surface 111, and the terminal device 100 is provided with a mounting groove 130 penetrating the top side 1151.

Referring also to fig. 4, the image capturing module 200 includes a first camera module 210 and a second polar high frequency communication chip 150, and the first camera module can be communicatively connected to the second polar high frequency communication chip 150. The first camera module 210 has a first light incident surface 211, and ambient light can pass through the first light incident surface 211 and enter the light sensing element of the first camera module 210. The image capturing module 200 can be installed in the installation groove 130, and the image capturing module 200 can rotate relative to the terminal device 100 to be located at a first position and a second position in the installation groove 130. Referring to fig. 1, in the first position, the first light incident surface 211 is hidden in the terminal device 100. Referring to fig. 5 and 6, in the second position, the first light incident surface 211 is exposed to the side where the display screen 120 is located, and in the second position, the first vhf communication chip 140 can be paired with the second vhf communication chip 150, so that the first vhf communication chip 140 can be communicatively connected with the second vhf communication chip 150.

In one embodiment, the first UHF communication chip 140 and the second UHF communication chip 150 are both UHF communication chips. The extremely high frequency communication chip is an IC (Integrated Circuit) chip in which an EHF (extremely high frequency) antenna is packaged, and when the two extremely high frequency communication chips are close enough, pairing can be completed to perform wireless communication. An example of an extremely high frequency communication chip is an EHF common link chip. The terms "common link chip," "common link chip package," and "EHF comm-link chip package" are used to refer to an EHF antenna embedded in an IC package. Examples of the chip for very high frequency communication can refer to the information described in the U.S. patent application publication nos. 2012/0263244 and 2012/0307932, and also refer to the information disclosed in chinese patent publications CN103563166A and CN 104145380A.

An example of an extremely high frequency communication chip can be found in the chinese granted patent publication No. CN 105264785B. The image capture module 200 configured with the extremely high frequency communication chip can realize high-speed wireless transmission of data (for example, a transmission speed up to 6 GB/s) with the terminal device 100 configured with the extremely high frequency communication chip based on a high carrier frequency (for example, 60 GHz).

It can be understood that the high carrier frequency-based near field communication has the advantages of low power consumption, small volume, high transmission rate, non-contact transmission and the like, can also realize the function of a plug-and-play module, can greatly improve the signal integrity, support more flexible system realization, reduce the standby power consumption, increase the bandwidth amplitude and the safety of data transmission, and is compatible with the support of high-speed video signals and the like.

It will be appreciated that the high carrier frequency may be a carrier frequency that enables high speed wireless transmission of data. The high carrier frequency may be a specific carrier frequency, or may be a carrier frequency band, for example, 30GHz to 300GHz, which is not specifically limited in this embodiment of the present application. Optionally, the high carrier frequency is 60 GHz.

In one embodiment, the first very high frequency communication chip 140 may include a first transducer for converting electromagnetic signals to radio frequency electrical signals and a first Integrated Circuit (IC) for coupling to the first transducer. The first integrated circuit includes a receiver circuit for receiving a first radio frequency electrical signal from the first transducer and transforming the first radio frequency electrical signal into a first baseband signal and outputting the first baseband signal when the control signal has a first state and not outputting the first baseband signal when the control signal has a second state different from the first state, and a signal detector circuit. The signal detector circuit is responsive to a monitor signal representative of the received first radio frequency electrical signal for generating a control signal having a first state when the monitor signal indicates that the received first radio frequency electrical signal is an acceptable signal and a second state when the monitor signal indicates that the received first radio frequency electrical signal is not an acceptable signal. This type of very high frequency communication chip is a very high frequency communication chip with a receiving electromagnetic signal.

The second polar high frequency communication chip 150 may include a second transducer for converting radio frequency electrical signals to electromagnetic signals and a second integrated circuit sufficiently close to the first transducer for the first transducer to receive the electromagnetic signals generated by the second transducer. The second integrated circuit is for coupling to a second transducer, the second integrated circuit containing transmitter circuitry for receiving and converting a second baseband signal to a second radio frequency electrical signal and conducting the second radio frequency electrical signal to the second transducer. This type of very high frequency communication chip is a very high frequency communication chip with a transmitting electromagnetic signal.

Of course, the first or second extremely high

frequency communication chip

140 or 150 may be an extremely high frequency communication chip having both functions of transmitting and receiving signals. When the first extremely high frequency communication chip 140 is an extremely high frequency communication chip having both functions of transmitting and receiving signals, the first extremely high frequency communication chip 140 may include a transducer for converting between a radio frequency electric signal and an electromagnetic signal and an Integrated Circuit (IC). The integrated circuit is used for being coupled to the energy converter, the integrated circuit comprises a transmitter circuit and a receiver circuit, the transmitter circuit can convert a baseband signal into a radio-frequency electric signal, the radio-frequency electric signal is conducted to the energy converter, and then the energy converter converts the radio-frequency electric signal into an electromagnetic signal and transmits the electromagnetic signal; the transducer can receive the electromagnetic signal and then convert the electromagnetic signal into a radio frequency electrical signal, and the receiver circuit can receive the radio frequency electrical signal from the transducer and convert the radio frequency electrical signal into a baseband signal. The first extremely high frequency communication chip 140 may also include an electromagnetic energy directing assembly mounted relative to the transducer for directing electromagnetic energy in a region containing the transducer and in a direction away from the integrated circuit.

Specifically, when the first extremely high frequency communication chip 140 is an extremely high frequency communication chip having a function of transmitting and receiving signals at the same time, the first extremely high frequency communication chip 140 may include a first transducer, a second transducer, a first integrated circuit, and a second integrated circuit. The first transducer is for converting an electromagnetic signal to a radio frequency electrical signal and the first integrated circuit is for coupling to the first transducer. The first integrated circuit includes a receiver circuit for receiving a first radio frequency electrical signal from the first transducer and transforming the first radio frequency electrical signal into a first baseband signal and outputting the first baseband signal when the control signal has a first state and not outputting the first baseband signal when the control signal has a second state different from the first state, and a signal detector circuit. The signal detector circuit is responsive to a monitor signal representative of the received first radio frequency electrical signal for generating a control signal having a first state when the monitor signal indicates that the received first radio frequency electrical signal is an acceptable signal and a second state when the monitor signal indicates that the received first radio frequency electrical signal is not an acceptable signal. The second transducer is for converting the radio frequency electrical signal to an electromagnetic signal, the second transducer being sufficiently close to the first transducer to allow the first transducer to receive the electromagnetic signal generated by the second transducer. The second integrated circuit is for coupling to a second transducer, the second integrated circuit containing transmitter circuitry for receiving and converting a second baseband signal to a second radio frequency electrical signal and conducting the second radio frequency electrical signal to the second transducer.

Referring to fig. 7, in one embodiment, the first vhf communication chip 140 has a substantially rectangular block shape, and the second vhf communication chip 150 has a substantially rectangular block shape. When the first extremely high frequency communication chip 140 and the second extremely high frequency communication chip 150 are close enough to complete pairing, an intersection point exists between a normal line passing through the centroid of the first extremely high frequency communication chip 140 and the surface of the second extremely high frequency communication chip 150, the distance between the intersection point and the centroid of the second extremely high frequency communication chip 150 is smaller than or equal to 2.5 mm, and the distance between the centroid of the first extremely high frequency communication chip 140 and the centroid of the second extremely high frequency communication chip 150 is smaller than or equal to 8.5 mm, and the arrangement can realize reliable communication between the first extremely high frequency communication chip 140 and the second extremely high frequency communication chip 150, so as to facilitate data transmission between the terminal device 100 and the image acquisition module 200. When in the second position, the user can perform operations such as self-timer shooting and video call through the image capturing module 200. By rotating the image capturing module 200, the image capturing module 200 can be switched between the first position and the second position.

In the electronic device, the first light incident surface 211 of the image capturing module 200 can be hidden in the terminal device 100 when in the first position, and can be exposed at one side of the display screen 120 of the terminal device 100 when in the second position, and after the first light incident surface 211 is exposed, a user can perform operations such as self-shooting and video call through the image capturing module 200. The above structure is advantageous for increasing the screen occupation ratio of the terminal device 100. For example, the screen occupation ratio of the terminal device 100 adopting the above-described setting may be 85% or more. Since the first vhf communication chip 140 can perform wireless communication with the second vhf communication chip 150 when in the second position, the image capturing module 200 can be wirelessly connected with the terminal device 100. The first vhf communication chip 140 and the second vhf communication chip 150 are arranged to avoid the flexible circuit board from being used to implement the communication connection between the image capturing module 200 and the main board of the terminal device 100, so that the utilization rate of the internal space of the terminal device 100 can be improved, and the compact arrangement of the electronic components inside the terminal device 100 is facilitated. For example, the first vhf communication chip 140 may be integrated on a motherboard inside the terminal device 100, and the space saved after removing the flexible circuit board may be used to install a battery with a larger capacity, so as to improve the cruising ability of the terminal device 100. The arrangement of the first extremely high frequency communication chip 140 and the second extremely high frequency communication chip 150 can also improve the data transmission efficiency between the terminal device 100 and the image acquisition module 200.

Referring to fig. 8 and 9, the image capturing module 200 may include a front end surface 221 and a rear end surface 223 that are opposite to each other, and an outer peripheral surface connected between the front end surface 221 and the rear end surface 223, where the outer peripheral surface includes a top end surface 225 and a connection surface 227, and the first light incident surface 211 is exposed on a side where the front end surface 221 is located. Referring to fig. 1, in the first position, top end face 225 is flush with top side 1151. With the above-described structure of the electronic device 10, when the image capturing module 200 is located at the first position, the image capturing module 200 can be received in the mounting groove 130, so that the electronic device 10 has a high appearance integrity.

Referring to FIG. 2, in one embodiment, the mounting slot 130 is located between the front surface 111 and the rear surface 113. Referring also to fig. 4, in an embodiment in which the mounting groove 130 is located between the front surface 111 and the rear surface 113, the image capture module 200 may include a case 220, and a power module 240 and a module main board 230 provided in the case 220, and a front end surface 221, a rear end surface 223, a top end surface 225, and a connection surface 227 of the image capture module 200 are located on the case 220. A light hole 222 penetrating through the front end surface 221 is formed in the housing 220, the first camera module 210 is arranged in the housing 220, the first light incident surface 211 is exposed out of the light hole 222, the power module 240 can supply power to the module main board 230, electric energy is further provided for the first camera module 210, and the module main board 230 can be in communication connection with the terminal device 100. Further, the terminal device 100 is provided with a first contact, the image capturing module 200 is provided with a second contact, and the first contact can be in contact connection with the second contact at the second position so that the terminal device 100 can charge the power module 240 in the image capturing module 200, so that the power module 240 can retain sufficient electric quantity to facilitate the communication connection between the image capturing module 200 and the terminal device 100. It is to be understood that the power module 240 within the image acquisition module 200 is not required. When power module 240 is omitted, terminal device 100 may be enabled to power image capture module 200 with the powered connection of the first and second contacts to enable image capture module 200 to be communicatively coupled with terminal device 100 in the second position.

Referring to fig. 10 and 11, in an embodiment in which the mounting slot 130 is located between the front surface 111 and the rear surface 113, when the image capture module 200 includes the power supply module 240 and the module main board 230, as an implementable manner, the image capture module 200 can be further detachable from within the mounting slot 130, and after the image capture module 200 is detached from within the mounting slot 130, the image capture module 200 can be communicatively connected with the terminal device 100. Referring to fig. 10, after the image capturing module 200 is detached from the mounting groove 130, the image capturing module 200 can independently operate and perform operations such as shooting, video recording, and the like, and transmit data to the terminal device 100, and the terminal device 100 can process the data shot or recorded by the image capturing module 200. For example, in one embodiment, a photograph taken by the image capture module 200 may be viewed in real time by the terminal device 100. The image acquisition module 200 with the structure can realize multi-angle and multi-scene shooting, and is favorable for improving user experience.

It is understood that the module main board 230 may include a first wireless communication module. The terminal device 100 may include a second wireless communication module capable of being communicatively connected with the first wireless communication module. After the image capturing module 200 is detached from the terminal device 100, it can be connected to a second wireless communication module through the first wireless communication module. The first wireless communication module and the second wireless communication module may implement near field communication, and both of them use the same communication protocol, for example, the first wireless communication module and the second wireless communication module may both be Bluetooth (Bluetooth) communication modules, or both be wifi (wireless fidelity) communication modules, or both be ZigBee communication modules, or both be nfc (near field communication) communication modules. In an embodiment, the terminal device 100 may include a third wireless communication module, which is used for being communicatively connected to an external device, such as a base station or other electronic device 10, and will not be described herein again.

After the image capturing module 200 is detached from the terminal device 100, the first wireless communication module and the second wireless communication module can be used to realize the communication connection between the image capturing module 200 and the terminal device 100. The user can hold the image capturing module 200 to capture multiple angles and multiple scenes, and transmit captured data to the terminal device 100. Referring to fig. 11, in one embodiment, a user may hold the image capturing module 200 with one hand and the terminal device 100 with the other hand, and may capture images at various positions and angles through the image capturing module 200 and view the images through the display screen 120 of the terminal device 100. In other embodiments, the user may place the image capturing module 200 somewhere and view the image captured by the image capturing module 200 through the terminal device 100 at another place.

Referring to fig. 8 and 9, in an embodiment in which the mounting groove 130 is located between the front surface 111 and the rear surface 113, when the image capture module 200 includes the power module 240 and the module main board 230, as an implementable manner, the image capture module 200 includes the third pole high frequency communication chip 160 capable of being communicatively connected with the first camera module 210. The image capturing module 200 can be detached from the mounting groove 130, and after the image capturing module 200 is detached from the mounting groove 130, the image capturing module 200 can be re-installed in the mounting groove 130 to locate the image capturing module 200 at a third position, as shown in fig. 12 and 13. In the third position, the first light incident surface 211 is exposed to the side of the rear surface 113, and the third polar high-frequency communication chip 160 can be paired with the first polar high-frequency communication chip 140, so that the third polar high-frequency communication chip 160 can be in communication connection with the first polar high-frequency communication chip 140. At this time, the image capturing module 200 may perform a function of a rear camera, for example, a user may perform operations such as long-range shooting, video screen recording, and the like through the image capturing module 200. Because image acquisition module 200 is installed in mounting groove 130 again after dismantling from mounting groove 130, can make first income plain noodles 211 towards the one side at display screen 120 place or make first income plain noodles 211 be located the one side at display screen 120 place dorsad, the image acquisition module 200 of above-mentioned structure both can regard as leading camera to use, can regard as rear camera to use again, consequently, can need not to set up other rear camera in terminal equipment 100's one side that is dorsad to display screen 120, thereby electronic components's cost can be saved, and can avoid seting up the mounting hole of rear camera on terminal equipment 100, thereby be favorable to promoting terminal equipment 100's outward appearance wholeness. It is understood that the side of the terminal device 100 facing away from the display screen 120 may also be provided with a rear-facing camera, which is not limited in this embodiment of the application.

Referring to fig. 14, in an embodiment where the mounting groove 130 is located between the front surface 111 and the rear surface 113, when the image capturing module 200 includes the power module 240 and the module main board 230, as another possible implementation manner, the image capturing module 200 may include a second camera module 212, the second camera module 212 may be capable of being in communication connection with the second polar high frequency communication chip 150, the second camera module 212 has a second incident surface 214, and the second incident surface 214 is exposed on a side where the rear end surface 223 is located. The second light incident surface 214 is hidden within the terminal device 100 in the first position, and the second light incident surface 214 is exposed from the side of the rear surface 113 in the second position. The ambient light can pass through the second light incident surface 214 and be combined with the photosensitive element on which the second camera module 212 is disposed. In the second position, the second camera module 212 can perform the function of the rear camera, which is not described herein. In this embodiment, the image capturing module 200 can perform the function of the rear camera without being detached from the mounting groove 130.

In the embodiment where the mounting groove 130 is located between the front surface 111 and the rear surface 113, when the image capturing module 200 does not include the power module 240 and the module main board 230, as an implementation manner, the image capturing module 200 may also include a second camera module 212, the second camera module 212 may be in communication connection with the second polar high frequency communication chip 150, the second camera module 212 has a second light incident surface 214, and the second light incident surface 214 is exposed at a side where the rear end surface 223 is located. The second light incident surface 214 is hidden within the terminal device 100 in the first position, and the second light incident surface 214 is exposed from the side of the rear surface 113 in the second position. In the second position, the second camera module 212 can perform the function of the rear camera, which is not described herein. In this embodiment, the image capturing module 200 can perform the function of the rear camera without being detached from the mounting groove 130.

In an embodiment in which the mounting groove 130 is located between the front surface 111 and the rear surface 113, when the image capture module 200 does not include the power module 240 and the module main board 230, as another possible implementation, the image capture module 200 may include a third pole high frequency communication chip 160 capable of being communicatively connected with the first camera module 210. The image capturing module 200 can be detached from the mounting groove 130, and after the image capturing module 200 is detached from the mounting groove 130, the image capturing module 200 can be installed in the mounting groove 130 again to locate the image capturing module 200 at a third position, the first light incident surface 211 is exposed at one side of the rear surface 113 at the third position, and the third pole high frequency communication chip 160 can be paired with the first pole high frequency communication chip 140, so that the third pole high frequency communication chip 160 can be in communication connection with the first pole high frequency communication chip 140. At this time, the image capturing module 200 may perform a function of a rear camera, for example, a user may perform operations such as long-range shooting, video screen recording, and the like through the image capturing module 200. Because image acquisition module 200 is installed in mounting groove 130 again after dismantling from mounting groove 130, can make first income plain noodles 211 towards the one side at display screen 120 place or make first income plain noodles 211 be located the one side at display screen 120 place dorsad, the image acquisition module 200 of above-mentioned structure both can regard as leading camera to use, can regard as rear camera to use again, consequently, can need not to set up other rear camera in terminal equipment 100's one side that is dorsad to display screen 120, thereby electronic components's cost can be saved, and can avoid seting up the mounting hole of rear camera on terminal equipment 100, thereby be favorable to promoting terminal equipment 100's outward appearance wholeness.

Referring to fig. 15, in another embodiment, the mounting groove 130 penetrates the rear surface 113. In the electronic device 10 with the above structure, the thickness of the image capturing module 200 can be set to be thicker, which is beneficial to the arrangement of the electronic components inside the image capturing module 200. In an embodiment where the mounting groove 130 penetrates the rear surface 113, the image capturing module 200 may include a housing 220, and a power module 240 and a module main board 230 disposed in the housing 220, and the front end surface 221, the rear end surface 223, the top end surface 225, and the connection surface 227 of the image capturing module 200 are located on the housing 220. A light hole 222 penetrating through the front end surface 221 is formed in the housing 220, the first camera module 210 is arranged in the housing 220, the first light incident surface 211 is exposed out of the light hole 222, the power module 240 can supply power to the module main board 230, electric energy is further provided for the first camera module 210, and the module main board 230 can be in communication connection with the terminal device 100. Further, the terminal device 100 is provided with a first contact, the image capturing module 200 is provided with a second contact, and the first contact can be in contact connection with the second contact at the second position so that the terminal device 100 can charge the power module 240 in the image capturing module 200, so that the power module 240 can retain sufficient electric quantity to facilitate the communication connection between the image capturing module 200 and the terminal device 100. It is to be understood that the power module 240 within the image acquisition module 200 is not required. When power module 240 is omitted, terminal device 100 may be enabled to power image capture module 200 with the powered connection of the first and second contacts to enable image capture module 200 to be communicatively coupled with terminal device 100 in the second position.

In an embodiment where the mounting groove 130 penetrates the rear surface 113, when the image capture module 200 includes the power supply module 240 and the module main board 230, as an implementable manner, the image capture module 200 can be further detached from the mounting groove 130, and after the image capture module 200 is detached from the mounting groove 130, the image capture module 200 can be communicatively connected with the terminal device 100. After the image capturing module 200 is detached from the mounting groove 130, the image capturing module 200 can independently operate and perform operations such as shooting and video recording, and transmit data to the terminal device 100, and the terminal device 100 can process the data shot or recorded by the image capturing module 200. For example, in one embodiment, a photograph taken by the image capture module 200 may be viewed in real time by the terminal device 100. The image acquisition module 200 with the structure can realize multi-angle and multi-scene shooting, and is favorable for improving user experience.

It is understood that the module main board 230 may include a first wireless communication module. The terminal device 100 may include a second wireless communication module capable of being communicatively connected with the first wireless communication module. After the image capturing module 200 is detached from the terminal device 100, it can be connected to a second wireless communication module through the first wireless communication module. The first wireless communication module and the second wireless communication module may implement near field communication, and both of them use the same communication protocol, for example, the first wireless communication module and the second wireless communication module may both be Bluetooth (Bluetooth) communication modules, or both be wifi (wireless fidelity) communication modules, or both be ZigBee communication modules, or both be nfc (near field communication) communication modules.

In an embodiment where the mounting groove 130 penetrates the rear surface 113, when the image capture module 200 includes the power module 240 and the module main board 230, as an implementable manner, the image capture module 200 includes the third pole high frequency communication chip 160 capable of being communicatively connected with the first camera module 210. The image capturing module 200 can be detached from the mounting groove 130, and after the image capturing module 200 is detached from the mounting groove 130, the image capturing module 200 can be installed in the mounting groove 130 again to locate the image capturing module 200 at a third position, the first light incident surface 211 is exposed at one side of the rear surface 113 at the third position, and the third pole high frequency communication chip 160 can be paired with the first pole high frequency communication chip 140, so that the third pole high frequency communication chip 160 can be in communication connection with the first pole high frequency communication chip 140. At this time, the image capturing module 200 may perform the function of the rear camera, which is not described herein again.

Referring to fig. 16, in an embodiment where the mounting groove 130 penetrates through the rear surface 113, when the image capturing module 200 includes a power module 240 and a module main board 230, as another possible implementation manner, the image capturing module 200 may include a second camera module 212, the second camera module 212 may be capable of being communicatively connected to the second uhf communication chip 150, the second camera module 212 has a second light incident surface 214, and the ambient light may penetrate through the second light incident surface 214 and be incorporated on the photosensitive element on which the second camera module 212 is disposed. The second light incident surface 214 is exposed at a side where the rear end surface 223 is located, and the second light incident surface 214 is exposed at a side where the rear surface 113 is located. The second camera module 212 can perform the function of the rear camera without rotating relative to the terminal device, which is not described herein again. In this embodiment, the image capturing module 200 can perform the function of the rear camera without being detached from the mounting groove 130.

In an embodiment where the mounting groove 130 penetrates through the rear surface 113, when the image capturing module 200 does not include the power module 240 and the module main board 230, as an implementation manner, the image capturing module 200 may include a second camera module 212, the second camera module 212 may be in communication connection with the second polar high frequency communication chip 150, the second camera module 212 has a second light incident surface 214, the second light incident surface 214 is exposed at a side where the rear end surface 223 is located, and the second light incident surface 214 is exposed at a side where the rear surface 113 is located. The terminal device 100 may include a fourth pole high-frequency communication chip with which the second pole high-frequency communication chip 150 can be paired in the first position to enable the second pole high-frequency communication chip 150 to be communicatively connected. When the second camera module 212 is at the first position, the function of the rear camera can be executed without rotating relative to the terminal device 100, which is not described herein again. In this embodiment, the image capturing module 200 can perform the function of the rear camera without being detached from the mounting groove 130.

In an embodiment where the mounting slot 130 penetrates the rear surface 113, when the image capturing module 200 does not include the power module 240 and the module main board 230, as another possible implementation, the image capturing module 200 includes a third pole high frequency communication chip 160 capable of being communicatively connected with the first camera module 210. The image capturing module 200 can be detached from the mounting groove 130, and after the image capturing module 200 is detached from the mounting groove 130, the image capturing module 200 can be installed in the mounting groove 130 again to locate the image capturing module 200 at a third position, the first light incident surface 211 is exposed at one side of the rear surface 113 at the third position, and the third pole high frequency communication chip 160 can be paired with the first pole high frequency communication chip 140, so that the third pole high frequency communication chip 160 can be in communication connection with the first pole high frequency communication chip 140. At this time, the image capturing module 200 may perform the function of the rear camera, which is not described herein again.

In an embodiment, the mounting slot 130 may extend through the top side 1151, with the mounting slot 130 being located between the first and

second side

1155, 1157. Referring to fig. 17, in another embodiment, the mounting groove 130 may extend through the top side 1151, the first side 1155 and the second side 1157, which facilitates the force application of the image capturing module 200 by fingers and thus the rotation of the image capturing module 200 by the user since the image capturing module 200 may be exposed from the corners of the terminal device 100. The terminal device 100 with the above structure can switch the image capturing module 200 between the first position and the second position, and details thereof are not repeated here.

Referring to fig. 15, a coordinate system is established with the length direction of the terminal device 100 as an x-axis, the width direction as a y-axis, and the thickness direction as a z-axis, a plane perpendicular to the thickness direction (z-axis direction) of the terminal device 100 is made, and with the plane as a reference plane, the rotation axis of the image capturing module 200 passes through the center of a circumscribed circle of the orthographic projection of the image capturing module 200 on the reference plane. The image capturing module 200 with the above structure can avoid setting the rotation axis of the image capturing module 200 too close to the edge of the side circumferential surface 115 of the terminal device 100, thereby facilitating the stability of the rotation of the image capturing module 200. Further, in an embodiment, an orthographic projection of the image capturing module 200 on the reference plane is a major arc bow, an orthographic projection of the connecting surface 227 of the image capturing module 200 on the reference plane is an arc, and an orthographic projection of the top end surface 225 of the image capturing module 200 on the reference plane is a straight line, so that the image capturing module 200 with the above structure has a regular appearance, which is beneficial to processing and forming and obtains a good appearance effect. In one embodiment, the central angle of the arc of the major arc is greater than 180 degrees and less than 270 degrees. When the central angle corresponding to the arc of the major arc of the orthographic projection of the image acquisition module 200 on the reference plane is in the above range, a certain distance exists between the rotation axis of the image acquisition module 200 and the side peripheral surface 115 of the terminal device 100, so that the rotation structure of the image acquisition module 200 protruding from the side peripheral surface 115 due to the rotation axis being arranged on the side peripheral surface 115 can be prevented from generating adverse effect on the appearance of the terminal device 100.

Referring to fig. 15, in an embodiment, the terminal device 100 includes a rear case 110, a display screen 120 is connected to the rear case 110, and a rear surface 113 is located on a side of the rear case 110 facing away from the display screen 120. It is understood that the side circumference 115 may be integral with the rear surface 113, and the rear housing 110 may cover the battery of the terminal device 100 and surround the display 120. In other embodiments, the rear surface 113 and the side circumferential surface 115 may be independent, for example, the rear case 110 includes a battery cover disposed on the battery of the terminal device 100 and a middle frame disposed around the outer circumference of the display screen 120. Referring to fig. 8 and 9 together, the electronic device 10 may include a magnetic attraction assembly including a magnet 310 and an attraction member. One of the magnet 310 and the adsorption member is coupled to the rear case 110, and the other of the magnet 310 and the adsorption member is coupled to the image pickup module 200, and the magnet 310 can be adsorbed to the adsorption member in the second position, so that the image pickup module 200 can be reliably positioned in the mounting groove 130.

Specifically, in the embodiment shown in fig. 8 and 9, the magnet 310 is disposed on the connection surface 227 of the casing 220 of the image capturing module 200, and the attraction member is disposed on the rear casing 110, and the magnet 310 can be attracted to the attraction member in the first position. In an embodiment, the magnet 310 is a permanent magnet, the absorption member is an iron piece, and when the image capturing module 200 is located at the first position, the magnet 310 can be absorbed on the absorption member, so that the image capturing module 200 can be reliably located in the mounting groove 130, and the image capturing module 200 is prevented from being easily rotated out of the mounting groove 130. In one embodiment, the magnetic attraction assembly can also be used for positioning the image capture module 200 in the third position. In other embodiments, the adsorption member may be a permanent magnet. In an embodiment, one of the magnet 310 and the adsorption member may be disposed on the connection surface 227, and the other may be disposed on a sidewall of the mounting groove 130, so that the image capturing module 200 can be reliably positioned at the second position and the third position. It is understood that the magnet 310 may be disposed on the bottom wall of the mounting groove 130, and the front end surface 221 and the rear end surface 223 of the image capturing module 200 may be correspondingly disposed with an attraction member, respectively, so that the image capturing module 200 can be positioned at the second position and the third position, which will not be described herein again.

Referring to fig. 18, 19 and 20, in an embodiment, the electronic device 10 may include an arc-shaped guide rail 320 disposed on the housing 220 of the image capturing module 200, and the rear housing 110 has a guide slot 330, where the arc-shaped guide rail 320 is slidably engaged with the guide slot 330 to enable the image capturing module 200 to rotate relative to the terminal device 100. By arranging the arc-shaped guide rail 320 and the guide groove 330, when the arc-shaped guide rail 320 slides in the guide groove 330, the image acquisition module 200 can rotate relative to the terminal device 100, so that the camera is accommodated in the mounting groove 130 or is rotated out of the mounting groove 130, and the image acquisition module 200 can be assembled and disassembled on the terminal device 100 by matching the arc-shaped guide rail 320 with the guide groove 330. When the arc-shaped guide rail 320 and the guide groove 330 are slidably engaged, the rotation structure of the image capturing module 200 and the rear case 110 does not need to be provided with a rotating shaft, so that the rotation mechanism of the image capturing module 200 and the terminal device 100 can be simplified. It is understood that the arcuate rail 320 may be integrally formed with the housing 220 such that the arcuate rail 320 is a part of the housing 220 to simplify the construction of the image acquisition module 200.

Referring to fig. 21, in an embodiment, the electronic device 10 may include a transmission mechanism including a motor 410, a first gear 420 and a second gear 430, wherein the motor 410 is fixedly connected to the rear case 110 and the first gear 420, respectively, and the second gear 430 is rotatably connected to the rear case 110 and is engaged with the first gear 420. The image capturing module 200 is provided with a third gear 440, the third gear 440 may be integrally formed with the housing 220, and the third gear 440 may be engaged with the second gear 430. The motor 410 can drive the first gear 420 to rotate, the first gear 420 can drive the third gear 440 to rotate through the second gear 430, and the third gear 440 can drive the image capturing module 200 to rotate relative to the terminal device 100. It is understood that the motor 410 may be a stepper motor, the motor 410 may be electrically connected to a battery within the terminal device 100, and the motor 410 may be communicatively coupled to a processor within the terminal device 100. After motor 410 switched on, first gear 420 can be driven to rotate, first gear 420 can drive third gear 440 to rotate through second gear 430, third gear 440 then drives image acquisition module 200 to rotate relative to terminal device 100 to rotate in order to rotate from mounting groove 130, and then is favorable to dismantling image acquisition module 200 from terminal device 100, and above-mentioned structure is still favorable to image acquisition module 200 to pack into in mounting groove 130. For example, after the image capturing module 200 is installed in the installation groove 130, the third gear 440 may be engaged with the second gear 430, so that the image capturing module 200 is engaged with the installation groove 130.

Referring to fig. 4, in an embodiment that the image capturing module 200 includes a power module 240 and a module main board 230, the module main board 230 has a first through hole 231, the power module 240 has a second through hole 241, the first camera module 210 includes a lens barrel 213, a camera flexible circuit board 215 and a first connection end 217, and the camera flexible circuit board 215 is connected to the lens barrel 213 and the first connection end 217, respectively. The module main board 230 is provided with a second connection end 233, and the first camera module 210 is connected with the second connection end 233 through the first connection end 217, so as to realize the communication connection between the first camera module 210 and the module main board 230. Referring also to fig. 22, the module main board 230 is stacked on the power module 240. The lens barrel 213 penetrates through the first through hole 231 and the second through hole 241, and the structure can avoid overlapping the lens barrel 213 of the first camera module 210 on the module main board 230 or the power module 240, so that the thickness of the whole image acquisition module 200 can be reduced.

In an embodiment, the first connection end 217 and the second connection end 233 are two terminals of a Board-to-Board connector (BTB) capable of being mated with each other, and the structure of the Board-to-Board connector facilitates standardization of the first connection end 217 and the second connection end 233 and communication connection between the first camera module 210 and the module main Board 230.

Referring to fig. 23, in an embodiment where the image capturing module 200 does not include the power module 240 and the module main board 230, the camera flexible wiring board 215 and the first connection terminal 217 of the first camera module 210 may be omitted. When the camera flexible circuit board 215 and the first connection end 217 are omitted, the terminal device 100 may be provided with a first contact, the image capturing module 200 is provided with a second contact 219, the first contact may be in contact connection with the second contact 219 at the second position, and the terminal device 100 may supply power to the image capturing module 200 through the contact connection between the second contact 219 and the first contact, so that the image capturing module 200 may work normally. Referring to fig. 23, in an embodiment in which the power module 250 and the module main board 260 of the image pickup module 200 are omitted, the second pole high frequency communication chip 220 may be connected to the lens barrel 213. The above structure can improve the integration of the first camera module 210 to reduce the volume of the image capturing module 200.

Referring to fig. 24, fig. 24 is a schematic structural diagram of a terminal device 100 according to an embodiment of the present application. The terminal device 100 may include Radio Frequency (RF) circuitry 501, memory 502 including one or more computer-readable storage media, input unit 503, display unit 504, sensor 504, audio circuitry 506, Wireless Fidelity (WiFi) module 507, processor 508 including one or more processing cores, and power supply 509. Those skilled in the art will appreciate that the terminal device 100 configuration shown in fig. 24 does not constitute a limitation of the terminal device 100 and may include more or fewer components than those shown, or some components may be combined, or a different arrangement of components.

The rf circuit 501 may be used for receiving and transmitting information, or receiving and transmitting signals during a call, and in particular, receives downlink information of a base station and then sends the received downlink information to one or more processors 508 for processing; in addition, data relating to uplink is transmitted to the base station. In general, radio frequency circuit 501 includes, but is not limited to, an antenna, at least one Amplifier, a tuner, one or more oscillators, a Subscriber Identity Module (SIM) card, a transceiver, a coupler, a Low Noise Amplifier (LNA), a duplexer, and the like. In addition, the radio frequency circuit 501 may also communicate with a network and other devices through wireless communication. The wireless communication may use any communication standard or protocol, including but not limited to Global System for Mobile communications (GSM), General Packet Radio Service (GPRS), Code Division Multiple Access (CDMA), Wideband Code Division Multiple Access (WCDMA), Long Term Evolution (LTE), email, Short Message Service (SMS), and the like.

The memory 502 may be used to store applications and data. Memory 502 stores applications containing executable code. The application programs may constitute various functional modules. The processor 508 executes various functional applications and data processing by executing application programs stored in the memory 502. The memory 502 may mainly include a program storage area and a data storage area, wherein the program storage area may store an operating system, an application program required by at least one function (such as a sound playing function, an image playing function, etc.), and the like; the storage data area may store data (such as audio data, a phonebook, etc.) created according to the use of the terminal device 100, and the like. Further, the memory 502 may include high speed random access memory, and may also include non-volatile memory, such as at least one magnetic disk storage device, flash memory device, or other volatile solid state storage device. Accordingly, the memory 502 may also include a memory controller to provide the processor 508 and the input unit 503 access to the memory 502.

The input unit 503 may be used to receive input numbers, character information, or user characteristic information (such as a fingerprint), and generate a keyboard, mouse, joystick, optical, or trackball signal input related to user setting and function control. In particular, in one particular embodiment, the input unit 503 may include a touch-sensitive surface as well as other input devices. The touch-sensitive surface, also referred to as a touch display screen or a touch pad, may collect touch operations by a user (e.g., operations by a user on or near the touch-sensitive surface using a finger, a stylus, or any other suitable object or attachment) thereon or nearby, and drive the corresponding connection device according to a predetermined program. Alternatively, the touch sensitive surface may comprise two parts, a touch detection means and a touch controller. The touch detection device detects the touch direction of a user, detects a signal brought by touch operation and transmits the signal to the touch controller; the touch controller receives touch information from the touch sensing device, converts the touch information into touch point coordinates, sends the touch point coordinates to the processor 508, and can receive and execute commands sent by the processor 508.

The display unit 504 may be used to display information input by or provided to the user and various graphical user interfaces of the terminal device 100, which may be made up of graphics, text, icons, video, and any combination thereof. The display unit 504 may include a display panel. Alternatively, the display panel may be configured in the form of a Liquid Crystal Display (LCD), an Organic Light-Emitting Diode (OLED), or the like. Further, the touch-sensitive surface may overlay the display panel, and when a touch operation is detected on or near the touch-sensitive surface, the touch operation is transmitted to the processor 508 to determine the type of touch event, and then the processor 508 provides a corresponding visual output on the display panel according to the type of touch event. Although in FIG. 24 the touch sensitive surface and the display panel are implemented as two separate components for input and output functions, in some embodiments the touch sensitive surface may be integrated with the display panel for input and output functions. It is understood that the display screen 120 may include an input unit 503 and a display unit 504.

The terminal device 100 may also include at least one sensor 505, such as light sensors, motion sensors, and other sensors. Specifically, the light sensor may include an ambient light sensor that adjusts the brightness of the display panel according to the brightness of ambient light, and a proximity sensor that turns off the display panel and/or the backlight when the terminal device 100 is moved to the ear. As one of the motion sensors, the gravity acceleration sensor can detect the magnitude of acceleration in each direction (generally, three axes), can detect the magnitude and direction of gravity when the mobile phone is stationary, and can be used for applications of recognizing the posture of the mobile phone (such as horizontal and vertical screen switching, related games, magnetometer posture calibration), vibration recognition related functions (such as pedometer and tapping), and the like; as for other sensors such as a gyroscope, a barometer, a hygrometer, a thermometer, and an infrared sensor, which can be configured in the terminal device 100, detailed descriptions thereof are omitted.

The audio circuit 506 may provide an audio interface between the user and the terminal device 100 through a speaker, microphone. The audio circuit 506 can convert the received audio data into an electrical signal, transmit the electrical signal to a speaker, and convert the electrical signal into a sound signal to output; on the other hand, the microphone converts the collected sound signal into an electrical signal, which is received by the audio circuit 506 and converted into audio data, and then the audio data is processed by the audio data output processor 508, and then the processed audio data is sent to, for example, another terminal device 100 via the radio frequency circuit 501, or the audio data is output to the memory 502 for further processing. The audio circuit 506 may also include an earbud jack to provide communication of a peripheral headset with the terminal device 100.

Wireless fidelity (WiFi) belongs to short-distance wireless transmission technology, and the terminal device 100 can help the user send and receive e-mail, browse web pages, access streaming media and the like through the wireless fidelity module 507, and provides wireless broadband internet access for the user. Although fig. 24 shows the wireless fidelity module 507, it is understood that it does not belong to the essential constitution of the terminal device 100, and may be omitted entirely as needed within the scope not changing the essence of the invention.

The processor 508 is a control center of the terminal device 100, connects various parts of the entire terminal device 100 with various interfaces and lines, and performs various functions of the terminal device 100 and processes data by running or executing an application program stored in the memory 502 and calling data stored in the memory 502, thereby performing overall monitoring of the terminal device 100. Optionally, processor 508 may include one or more processing cores; preferably, the processor 508 may integrate an application processor, which primarily handles operating systems, user interfaces, application programs, etc., and a modem processor, which primarily handles wireless communications. It will be appreciated that the modem processor described above may not be integrated into the processor 508.

The terminal device 100 also includes a power supply 509 (such as a battery) for powering the various components. Preferably, the power source may be logically connected to the processor 508 through a power management system, so that the power management system may manage charging, discharging, and power consumption management functions. The power supply 509 may also include any component such as one or more dc or ac power sources, recharging systems, power failure detection circuitry, power converters or inverters, power status indicators, and the like.

Although not shown in fig. 24, the terminal device 100 may further include a bluetooth module or the like, which is not described in detail herein. In specific implementation, the above modules may be implemented as independent entities, or may be combined arbitrarily to be implemented as the same or several entities, and specific implementation of the above modules may refer to the foregoing method embodiments, which are not described herein again.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the claims. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. An electronic device, comprising:

2. The electronic device of claim 1, wherein the side perimeter surfaces comprise opposing top and bottom side surfaces, and opposing first and second side surfaces; the first side surface is positioned between the top side surface and the bottom side surface, the second side surface is positioned between the top side surface and the bottom side surface, the top side surface is connected to one end of the first side surface and one end of the second side surface, and the bottom side surface is connected to the other end of the first side surface and the other end of the second side surface; the mounting groove penetrates through the top side surface.

3. The electronic device of claim 2, wherein the image capturing module comprises a front end surface, a rear end surface, and a peripheral surface connected between the front end surface and the rear end surface, the peripheral surface comprising a top end surface and a connecting surface connected to the top end surface; the top end face is flush with the top side face when in the first position; and when the second position is adopted, the ambient light can irradiate into the first camera module from one side where the front end face is positioned.

4. The electronic device of claim 3, wherein the mounting slot opens between the front surface and the back surface.

5. The electronic device of claim 4, wherein the image capture module comprises a power module and a module motherboard, the power module being capable of supplying power to the module motherboard.

6. The electronic device of claim 5, wherein the image capture module is removable from within the mounting slot, and wherein the image capture module is communicatively connectable with the terminal device after the image capture module is removed from within the mounting slot.

7. The electronic device of claim 4 or 5, wherein the image acquisition module comprises a third pole high frequency communication chip communicatively connectable with the first camera module; the image acquisition module can be dismantled from the mounting groove, and after the image acquisition module is dismantled from the mounting groove, the image acquisition module can be repacked in the mounting groove so that the image acquisition module is located the third position, and when the third position the ambient light of one side of rear surface place can shine to in the first camera module, and the third pole high frequency communication chip can pair with first extremely high frequency communication chip, so that the third pole high frequency communication chip can with first extremely high frequency communication chip communication connection.

8. The electronic device according to claim 4 or 5, wherein the image capturing module comprises a second camera module, the second camera module is capable of being in communication connection with the second polar high-frequency communication chip, and in the second position, the ambient light on the side where the rear end face is located can be irradiated into the second camera module.

9. The electronic device of claim 3, wherein the mounting slot extends through the rear surface.

10. The electronic device of claim 9, wherein the image capture module comprises a power module and a module motherboard, the power module being capable of supplying power to the module motherboard.

11. The electronic device of claim 10, wherein the image capture module is removable from within the mounting slot, and wherein the image capture module is communicatively connectable to the terminal device after the image capture module is removed from within the mounting slot.

12. The electronic device according to claim 9 or 10, wherein the terminal device comprises a third pole high frequency communication chip capable of being in communication connection with the first camera module; the image acquisition module can be dismantled from the mounting groove, and after the image acquisition module is dismantled from the mounting groove, the image acquisition module can be repacked in the mounting groove so that the image acquisition module is located the third position, and when the third position the ambient light of one side of rear surface place can shine to in the first camera module, and the third pole high frequency communication chip can pair with first extremely high frequency communication chip, so that the third pole high frequency communication chip can with first extremely high frequency communication chip communication connection.

13. The electronic device according to claim 9 or 10, wherein the image capturing module comprises a second camera module, the second camera module is capable of being in communication connection with the second polar high frequency communication chip, and in the second position, the ambient light on the side where the rear end surface is located can be irradiated into the second camera module.

14. The electronic device according to claim 13, characterized in that the terminal device comprises a fourth pole high-frequency communication chip, the second pole high-frequency communication chip being mateable with the fourth pole high-frequency communication chip in the first position to enable the second pole high-frequency communication chip to be communicatively connected with the fourth pole high-frequency communication chip.

15. The electronic device of claim 2, wherein the mounting slot is located between the first side and the second side; or, the mounting groove penetrates through the first side surface and the second side surface.

16. The electronic device of claim 1, wherein a first contact is disposed on the terminal device, and a second contact is disposed on the image capture module, wherein in the second position, the first contact is capable of contacting the second contact, so that the terminal device can supply power to the image capture module.

17. The electronic device of claim 1, wherein the terminal device comprises a rear housing, the display screen is connected with the rear housing, and the rear surface is located on a side of the rear housing facing away from the display screen; the terminal equipment comprises a magnetic suction assembly, and the magnetic suction assembly comprises a magnet and an adsorption piece; one of the magnet and the adsorption piece is connected with the rear shell, the other of the magnet and the adsorption piece is connected with the image acquisition module, and the magnet can be adsorbed on the adsorption piece when in the second position.

18. The electronic device of claim 1, wherein the terminal device comprises a rear housing, the display screen is connected with the rear housing, and the rear surface is located on a side of the rear housing facing away from the display screen; the image acquisition module is provided with an arc-shaped guide rail, the rear shell is provided with a guide groove, and the arc-shaped guide rail is in sliding fit with the guide groove so that the image acquisition module can rotate relative to the terminal equipment.

19. The electronic device according to claim 1, wherein the terminal device comprises a rear housing, a motor, a first gear and a second gear, the display screen is connected with the rear housing, and the rear surface is located on a side of the rear housing facing away from the display screen; the motor is respectively and fixedly connected with the rear shell and the first gear, and the second gear is rotationally connected with the rear shell and meshed with the first gear; a third gear is arranged on the image acquisition module and meshed with the second gear; the motor can drive the first gear to rotate, the first gear can drive the third gear to rotate through the second gear, and the third gear can drive the image acquisition module to rotate relative to the terminal equipment.

20. The electronic device of claim 1, wherein the image capture module comprises a housing, and a power module and a module motherboard disposed in the housing, the power module being capable of supplying power to the module motherboard; the first camera module is arranged in the housing, and ambient light can irradiate into the first camera module from the light hole; the module main board is provided with a first through hole, the power supply module is provided with a second through hole, and the module main board is overlapped on the power supply module; the first camera module comprises a lens barrel, and the lens barrel penetrates through the first through hole and the second through hole.

21. The electronic device according to claim 1, wherein the first camera module includes a lens barrel, and the second polar high frequency communication chip is connected to the lens barrel.