CN210073778U - Etching processing equipment for semiconductor production - Google Patents

Etching processing equipment for semiconductor production Download PDF

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Publication number
CN210073778U
CN210073778U CN201920917816.9U CN201920917816U CN210073778U CN 210073778 U CN210073778 U CN 210073778U CN 201920917816 U CN201920917816 U CN 201920917816U CN 210073778 U CN210073778 U CN 210073778U
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Prior art keywords
fan
belt
air
semiconductor production
outer shell
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CN201920917816.9U
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Chinese (zh)
Inventor
廖海涛
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Wuxi Yiwen Microelectronics Technology Co ltd
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Advanced Materials Technology and Engineering Inc
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Priority to CN201920917816.9U priority Critical patent/CN210073778U/en
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Abstract

The utility model belongs to the technical field of etching equipment, and discloses etching processing equipment for semiconductor production, which comprises an outer shell, wherein driving motor rollers are arranged on the surfaces of two ends of the outer shell, a conveying belt is sleeved outside the driving motor rollers, and a liquid storage tank is arranged inside the driving motor rollers; the utility model also discloses an implementation system of the etching processing equipment for semiconductor production, which comprises an external power switch, an input panel, a signal processing module, a control module and an electronic pressure valve, wherein the external power switch is connected with the driving motor roller, the water pump, the centrifugal fan, the first fan, the second fan and the control box in parallel in sequence; through the splash shield of shell body internally mounted for the splash shield blocks the etching solution, avoids the semiconductor plate etching solution of shower nozzle injection to outwards spill, and the spacing wheelset of belt is installed to shower nozzle and air-out board pipe below simultaneously, makes the conveyer belt carry on spacingly through the spacing wheelset of belt.

Description

Etching processing equipment for semiconductor production
Technical Field
The utility model belongs to the technical field of etching equipment, concretely relates to etching processing equipment is used in semiconductor production.
Background
An etching machine is used for equipment for etching a semiconductor plate, so that grains with fixed trend are etched on the surface of the semiconductor plate, the etching is a technology for removing materials by using a chemical reaction or physical impact effect, the etching machine can be used for manufacturing printing concave-convex plates such as coppers, zincs and the like at the earliest time, and can also be widely used for processing thin workpieces and the like which are difficult to process by using a weight-reducing instrument panel and a nameplate and a traditional processing method.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an etching processing equipment for semiconductor manufacture to solve the problem that proposes among the above-mentioned background art. The utility model provides a pair of etching processing equipment is used in semiconductor production has that the etching solution retrieves conveniently, and the fast characteristics of stoving after the semiconductor board etching simultaneously.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides an etching processing equipment for semiconductor production, includes the shell body, the driving motor cylinder is all installed on the surface at shell body both ends, the conveyer belt has been cup jointed to the outside of driving motor cylinder, the internally mounted of driving motor cylinder has the liquid reserve tank, shower nozzle and air-out board pipe are installed directly over the liquid reserve tank, the shower nozzle is different from one side of air-out board pipe and installs the splash shield, just the internal surface at the shell body is fixed to the splash shield, the internal surface mounting of shell body has the spacing wheelset of belt, the spacing wheelset of belt includes spacing cylinder and voltage limiting wheel, the voltage limiting wheel rotates the both ends of connecting at spacing cylinder, the spacing groove has been seted up on the surface of voltage limiting wheel, the surface integrated into one piece of conveyer belt have with the spacing sand grip of spacing groove looks adaptation, the stoving subassembly is still.
The utility model discloses in furtherly, the stoving subassembly includes collection tuber pipe, first fan, heating resistor silk and second fan, first fan and heating resistor silk are all fixed in the inside of collection tuber pipe, the external fixed surface of shell body has the air duct, just the both ends of air duct all communicate with the shell body, the second fan passes through the tip of bolt fastening at the air duct.
The utility model discloses in furtherly, the collection tuber pipe is provided with threely, the air duct is provided with two, two the air duct is located between the three collection tuber pipe.
The utility model discloses in furtherly, water pump, honeycomb duct and electronic pressure valve have connected gradually between liquid reserve tank and the shower nozzle, the input port and the liquid reserve tank of water pump link up, the one end of honeycomb duct is connected with the delivery outlet of water pump, the other end at the honeycomb duct is installed to the electronic pressure valve, shower nozzle and electronic pressure valve are connected.
The utility model discloses in furtherly, the interior surface mounting of shell body upper end has centrifugal fan, centrifugal fan's delivery outlet and air-out board pipe link up.
The utility model discloses in furtherly, the surface of shell body is rotated and is connected with the support cylinder, the support cylinder is provided with threely, and is three altogether the support cylinder is triangular distribution, the spacing wheelset of belt is provided with two, two altogether the spacing wheelset of belt is located between the three support cylinder.
The utility model discloses in furtherly, the surface mounting of shell body has the control box, the control box includes input panel, signal processing module, control module, and input panel installs on the surface of control box, and signal processing module and control module all install the inside at the control box.
Compared with the prior art, the beneficial effects of the utility model are that:
1. through shell body internally mounted's splash shield, make the splash shield block etching liquid, avoid the shower nozzle to spray the outside spill of semiconductor plate etching liquid, install in the spacing wheelset of belt with air-out board pipe below simultaneously shower nozzle, make the conveyer belt carry on spacingly through the spacing wheelset of belt, spacing cylinder supports the conveyer belt simultaneously, the spacing groove cover that the pressure limiting wheel surface was seted up is in the outside of spacing sand grip, the stability of conveyer belt removal between spacing cylinder and pressure limiting wheel has been increased, make the conveyer belt undercut that is located the liquid reserve tank top, avoid etching liquid to outwards flow, the loss of etching liquid has been reduced.
2. Through shell body internally mounted's collection tuber pipe for the air of first fan after to collection tuber pipe heating blows the surface of conveyer belt, the stoving of the semiconductor board of being convenient for, and the air lifting of the shell body lower extreme of being convenient for is to the upper end to the second fan of installation of air duct upper end simultaneously, makes the inside air top-down of shell body flow, has improved the efficiency that the semiconductor board was dried.
Drawings
Fig. 1 is a schematic side view of the present invention;
fig. 2 is a schematic cross-sectional structure diagram of the present invention;
FIG. 3 is a schematic structural view of a belt limiting pulley set of the present invention;
fig. 4 is a schematic view of the structure of the conveying belt of the present invention;
fig. 5 is a schematic structural view of the air collecting cover, the first fan and the heating resistance wire of the present invention;
fig. 6 is a system architecture diagram of the present invention;
in the figure: 1. an outer housing; 2. driving a motor drum; 3. a conveyor belt; 4. a liquid storage tank; 5. a water pump; 6. a flow guide pipe; 7. an electronic pressure valve; 8. a spray head; 9. limiting convex strips; 10. a centrifugal fan; 11. an air outlet plate pipe; 12. a splash shield; 13. a support roller; 14. a belt limiting wheel set; 15. a limiting roller; 16. a pressure limiting wheel; 17. a limiting groove; 18. an air collecting pipe; 19. a first fan; 20. heating resistance wires; 21. an air duct; 22. a second fan; 23. and a control box.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Examples
Referring to fig. 1-6, the present invention provides the following technical solutions: an etching processing device for semiconductor production comprises an outer shell 1, wherein driving motor rollers 2 are respectively arranged on the surfaces of two ends of the outer shell 1, a conveying belt 3 is sleeved outside the driving motor rollers 2, a liquid storage tank 4 is arranged inside the driving motor rollers 2, a spray head 8 and an air outlet plate pipe 11 are arranged right above the liquid storage tank 4, a splash plate 12 is arranged on one side of the spray head 8, which is different from the air outlet plate pipe 11, the splash plate 12 is fixed on the inner surface of the outer shell 1, a belt limiting wheel set 14 is arranged on the inner surface of the outer shell 1, the belt limiting wheel set 14 comprises a limiting roller 15 and a pressure limiting wheel 16, the pressure limiting wheel 16 is rotatably connected with two ends of the limiting roller 15, a limiting groove 17 is formed on the surface of the pressure limiting wheel 16, a limiting convex strip 9 matched with the limiting groove 17 is integrally formed on the outer surface of the conveying belt 3, a drying component is also arranged inside the outer, make splash guard 12 block the etching solution, avoid the outside spill of the semiconductor plate etching solution that shower nozzle 8 sprays, shower nozzle 8 and air-out board pipe 11 below are installed at the spacing wheelset 14 of belt simultaneously, make conveyer belt 3 carry on spacingly through the spacing wheelset 14 of belt, spacing cylinder 15 supports conveyer belt 3 simultaneously, the spacing groove 17 cover that the pressure limiting wheel 16 surface was seted up is in the outside of spacing sand grip 9, the stability of conveyer belt 3 removal between spacing cylinder 15 and pressure limiting wheel 16 has been increased, make the conveyer belt 3 undercut that is located the liquid reserve tank 4 top, avoid the etching solution to outwards flow out, the loss of etching solution has been reduced.
Further, the drying component comprises an air collecting pipe 18, a first fan 19, a heating resistance wire 20 and a second fan 22, the first fan 19 and the heating resistance wire 20 are both fixed inside the air collecting pipe 18, an air duct 21 is fixed on the outer surface of the outer shell 1, and both ends of the air duct 21 are communicated with the outer shell 1, the second fan 22 is fixed at the end part of the air duct 21 through bolts, three air collecting pipes 18 are arranged, two air ducts 21 are arranged between the three air collecting pipes 18, the air heated by the first fan 19 to the air collecting pipe 18 is blown to the surface of the conveyer belt 3 through the air collecting pipe 18 arranged in the outer shell 1, which is convenient for drying the semiconductor board, meanwhile, the second fan 22 arranged at the upper end of the air duct 21 is convenient for the air at the lower end of the outer shell 1 to be lifted to the upper end, the air in the outer shell 1 flows from top to bottom, and the drying efficiency of the semiconductor board is improved.
Furthermore, a water pump 5, a flow guide pipe 6 and an electronic pressure valve 7 are sequentially connected between the liquid storage tank 4 and the spray head 8, an input port of the water pump 5 is communicated with the liquid storage tank 4, one end of the flow guide pipe 6 is connected with an output port of the water pump 5, the electronic pressure valve 7 is installed at the other end of the flow guide pipe 6, the spray head 8 is connected with the electronic pressure valve 7, and etching liquid inside the liquid storage tank 4 can flow circularly.
Further, the internal surface mounting of shell body 1 upper end has centrifugal fan 10, and centrifugal fan 10's delivery outlet and air-out board pipe 11 link up, are convenient for air-out board pipe 11 to carry out preliminary air-drying to the semiconductor board.
Further, the surface of shell body 1 rotates and is connected with supporting roller 13, and supporting roller 13 is provided with three altogether, and three supporting roller 13 is triangular distribution, and the spacing wheelset 14 of belt is provided with two altogether, and two spacing wheelsets 14 of belt are located between three supporting roller 13 for conveyer belt 3 is sunken under the effect of supporting roller 13 and the spacing wheelset 14 of belt, makes the inside that the etching solution flowed into liquid reserve tank 4 under the effect of gravity.
Further, the outer surface of the outer shell 1 is provided with a control box 23, the control box 23 comprises an input panel, a signal processing module and a control module, the input panel is arranged on the surface of the control box 23, and the signal processing module and the control module are arranged inside the control box 23.
Further, a semiconductor production is with realization system of etching processing equipment, include with driving motor cylinder 2, water pump 5, centrifugal fan 10, first fan 19, second fan 22 and control box 23 external power switch parallelly connected in proper order, input panel, signal processing module, control module and electronic pressure valve 7 are series connection in proper order, input panel is used for the input of numerical value, and give signal processing module to the numerical value transmission of input, signal processing module is used for receiving the signal that input panel uploaded and carries out the analysis to the signal, signal processing module issues the order simultaneously and gives control module, control module is used for receiving command control electronic pressure valve 7 that signal processing module issued.
The utility model provides a: the driving motor roller 2 is made of Huangjiang province of Dongguan city and is made of YY030 model, the water pump 5 is made of Hunan Hanren electromechanical limited company and is made of 15WBX model, the electronic pressure valve 7 is made of Yuyao Yueer valve limited company and is made of ZCT-20 model, the centrifugal fan 10 is made of YX-51D model, the first fan 19 and the second fan 22 are made of ACFP-108K model, the heating resistance wire 20 is made of Jinhua Jing Tan heat pipe factory and is made of JT380V12KW model, the signal processing module is made of LQFP64 model, and the control module is made of Shenzhedi technology company and is made of A33 model.
The utility model discloses a theory of operation and use flow: when the device is used, an external power supply is conducted, so that the driving motor roller 2, the water pump 5, the centrifugal fan 10, the first fan 19, the second fan 22 and the control box 23 are electrified, an input panel arranged on the surface of the control box 23 inputs a proper numerical value, the pressure value of the electronic pressure valve 7 is fixed, the driving motor roller 2 drives the conveying belt 3 to move at the moment, the conveying belt 3 moves on the surfaces of the supporting roller 13, the limiting roller 15 and the pressure limiting wheel 16, the limiting convex strip 9 moves in the limiting groove 17, the water pump 5 enables etching liquid in the liquid storage box 4 to reach the inside of the electronic pressure valve 7 through the guide pipe 6, liquid in the electronic pressure valve 7 is sprayed out through the spray head 8, meanwhile, airflow generated by the centrifugal fan 10 is blown to the surface of a semiconductor plate through the air outlet plate pipe 11, and air heated by the air collecting pipe 18 is blown to the surface of the conveying belt 3 by the first fan 19, the drying of the semiconductor board is convenient, and the air at the lower end of the outer shell 1 is lifted to the upper end by the second fan 22 arranged at the upper end of the air duct 21, so that the air in the outer shell 1 flows from top to bottom.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (7)

1. An etching processing apparatus for semiconductor production, characterized in that: the device comprises an outer shell (1), driving motor rollers (2) are installed on the surfaces of two ends of the outer shell (1), a conveying belt (3) is sleeved outside the driving motor rollers (2), a liquid storage box (4) is installed inside the driving motor rollers (2), a spray head (8) and an air outlet plate pipe (11) are installed right above the liquid storage box (4), a splash plate (12) is installed on one side of the spray head (8) different from the air outlet plate pipe (11), the splash plate (12) is fixed on the inner surface of the outer shell (1), a belt limiting wheel set (14) is installed on the inner surface of the outer shell (1), the belt limiting wheel set (14) comprises a limiting roller (15) and a pressure limiting wheel (16), the pressure limiting wheel (16) is rotatably connected to two ends of the limiting roller (15), a limiting groove (17) is formed in the surface of the pressure limiting wheel (16), the outer surface integrated into one piece of conveyer belt (3) has spacing sand grip (9) with spacing groove (17) looks adaptation, the inside of shell body (1) still installs the stoving subassembly.
2. The etching processing apparatus for semiconductor production according to claim 1, wherein: the drying component comprises an air collecting pipe (18), a first fan (19), a heating resistance wire (20) and a second fan (22), wherein the first fan (19) and the heating resistance wire (20) are fixed inside the air collecting pipe (18), an air duct (21) is fixed on the outer surface of the outer shell (1), two ends of the air duct (21) are communicated with the outer shell (1), and the second fan (22) is fixed at the end part of the air duct (21) through bolts.
3. The etching processing apparatus for semiconductor production according to claim 2, wherein: the air collecting pipes (18) are three, the air guide pipes (21) are two, and the two air guide pipes (21) are located between the three air collecting pipes (18).
4. The etching processing apparatus for semiconductor production according to claim 1, wherein: connect gradually water pump (5), honeycomb duct (6) and electronic pressure valve (7) between liquid reserve tank (4) and shower nozzle (8), the input port of water pump (5) link up with liquid reserve tank (4), the one end of honeycomb duct (6) is connected with the delivery outlet of water pump (5), the other end at honeycomb duct (6) is installed in electronic pressure valve (7), shower nozzle (8) and electronic pressure valve (7) are connected.
5. The etching processing apparatus for semiconductor production according to claim 1, wherein: the inner surface of the upper end of the outer shell (1) is provided with a centrifugal fan (10), and an output port of the centrifugal fan (10) is communicated with the air outlet plate pipe (11).
6. The etching processing apparatus for semiconductor production according to claim 1, wherein: the surface of shell body (1) rotates and is connected with supporting roller (13), supporting roller (13) are provided with threely altogether, and are three supporting roller (13) are triangular distribution, the spacing wheelset of belt (14) are provided with two altogether, two spacing wheelset of belt (14) are located between three supporting roller (13).
7. The etching processing apparatus for semiconductor production according to claim 1, wherein: the surface mounting of shell body (1) has control box (23), control box (23) include input panel, signal processing module, control module, and input panel installs the surface at control box (23), and signal processing module and control module all install the inside at control box (23).
CN201920917816.9U 2019-06-18 2019-06-18 Etching processing equipment for semiconductor production Active CN210073778U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201920917816.9U CN210073778U (en) 2019-06-18 2019-06-18 Etching processing equipment for semiconductor production

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201920917816.9U CN210073778U (en) 2019-06-18 2019-06-18 Etching processing equipment for semiconductor production

Publications (1)

Publication Number Publication Date
CN210073778U true CN210073778U (en) 2020-02-14

Family

ID=69427858

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201920917816.9U Active CN210073778U (en) 2019-06-18 2019-06-18 Etching processing equipment for semiconductor production

Country Status (1)

Country Link
CN (1) CN210073778U (en)

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Address after: Room 101, Building B, China Sensor Network International Innovation Park, No. 200, Linghu Avenue, the Taihu Lake International Science Park, Wuxi New District, Jiangsu Province, 214000

Patentee after: Wuxi Yiwen Microelectronics Technology Co.,Ltd.

Address before: Room 101, Building B, China Sensor Network International Innovation Park, No. 200, Linghu Avenue, the Taihu Lake International Science Park, Wuxi New District, Jiangsu Province, 214000

Patentee before: WUXI YIWEN ELECTRONIC TECHNOLOGY Co.,Ltd.

CP01 Change in the name or title of a patent holder