CN210073512U - Ultrathin ultralight high-power resistor - Google Patents
Ultrathin ultralight high-power resistor Download PDFInfo
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- CN210073512U CN210073512U CN201920817244.7U CN201920817244U CN210073512U CN 210073512 U CN210073512 U CN 210073512U CN 201920817244 U CN201920817244 U CN 201920817244U CN 210073512 U CN210073512 U CN 210073512U
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- mica
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- heat dissipation
- power resistor
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Abstract
An ultrathin and ultralight high-power resistor comprises a pair of mica substrates, a pair of connecting terminals, a resistance wire and a plurality of eyelet rivets, wherein each mica substrate is provided with a plurality of heat dissipation holes and a plurality of first fixing holes; compared with the prior art, the beneficial effects of the utility model reside in that: a pair of mica matrixes are used as base materials, so that the mica matrix has the characteristics of high temperature resistance and high pressure resistance, and is convenient to transport and store; each mica substrate can be processed separately, so that the processing difficulty is reduced, and meanwhile, the strength can be increased when two mica substrates are laminated together; the mica substrate is provided with heat dissipation holes, so that the wind resistance is small, the air cooling and heat dissipation are facilitated, and the module type installation can be realized; the insulating flame-retardant coating can play insulating and flame-retardant effects; the long round holes in the connecting terminals facilitate the mutual serial use of a plurality of ultrathin, ultralight and high-power resistors.
Description
[ technical field ] A method for producing a semiconductor device
The utility model relates to a high-power resistance technical field, specificly relate to an ultra-thin ultralight high-power resistor.
[ background of the invention ]
The most common high-power resistor widely used at present is a corrugated porcelain tube resistor, namely, an alloy resistance wire with a certain specification and model is wound on a ceramic round tube, a layer of insulating paint is coated on the surface of the alloy resistance wire, and two connecting terminals are arranged at two ends of the ceramic round tube.
However, the resistor of this structure has the following problems in use and production processes: the pottery pipe is not resistant vibration, and is breakable, and the weight is heavy, and is bulky, and traditional resistance 360 the volume of 70 130MM needs weight 2.5KG just can accomplish 1KW, and the installation is inconvenient, and resistance heat storage volume itself is big, and it is long when the back heat dissipation stops working.
In view of the above, it is desirable to provide an ultra-thin and ultra-light high power resistor to overcome the deficiencies of the prior art.
[ Utility model ] content
The utility model aims at providing an ultra-thin ultralight high-power resistance aims at imposing intensity, and the transportation of being convenient for and save reduce the processing degree of difficulty, reduce the heat-retaining of itself, improve the radiating effect, and easy to assemble reduces volume and weight.
In order to achieve the purpose, the utility model provides an ultrathin and ultralight high-power resistor, which comprises a pair of mica basal bodies, a pair of connecting terminals, a resistance wire and a plurality of eyelet rivets;
the pair of mica base members are stacked, a plurality of heat dissipation holes and a plurality of first fixing holes are formed in each mica base member, the heat dissipation holes are evenly distributed, the first fixing holes are located at two ends of each mica base member, a plurality of second fixing holes and a plurality of long round holes are formed in each connecting terminal, each eyelet rivet penetrates through the corresponding first fixing hole and the corresponding second fixing hole to enable the connecting terminals to be fixed at two ends of the pair of mica base members, the resistance wire is wound on the pair of mica base members, two ends of the resistance wire are respectively in spot welding on the connecting terminals, and the outer surfaces of the mica base members and the resistance wire are coated with insulating flame-retardant paint.
In a preferred embodiment, the resistance wire is made of iron-chromium-aluminum alloy.
In a preferred embodiment, the thickness of each sheet of mica matrix is 1 mm.
In a preferred embodiment, the insulating flame retardant coating is an oxide film coating.
In a preferred embodiment, the number of eyelet rivets is 4, and each connection terminal is fixed to one end of a pair of mica substrates by 2 eyelet rivets.
Compared with the prior art, the utility model provides a pair of ultra-thin ultralight high-power resistance's beneficial effect lies in: a pair of mica matrixes are used as base materials, so that the mica matrix has the characteristics of high temperature resistance and high pressure resistance, and is convenient to transport and store; each mica substrate can be processed separately, so that the processing difficulty is reduced, and meanwhile, the strength can be increased when two mica substrates are laminated together; the mica substrate is provided with heat dissipation holes, so that the wind resistance is small, the air cooling and heat dissipation are facilitated, and the module type installation can be realized; the insulating flame-retardant coating can play insulating and flame-retardant effects; the long round holes in the connecting terminals facilitate the mutual serial use of a plurality of ultrathin, ultralight and high-power resistors.
[ description of the drawings ]
Fig. 1 is a perspective view of the ultra-thin ultra-light high-power resistor provided by the present invention.
Fig. 2 is an exploded view of the ultra-thin ultra-light high-power resistor shown in fig. 1.
[ detailed description ] embodiments
In order to make the above objects, features and advantages of the present invention more comprehensible, embodiments of the present invention are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, as those skilled in the art will be able to make similar modifications without departing from the spirit and scope of the present invention.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
Referring to fig. 1, the present invention provides an ultra-thin ultra-light high-power resistor 100.
In the embodiment of the present invention, the ultra-thin ultra-light high-power resistor 100 includes a pair of mica substrates 10, a pair of connection terminals 20, a resistance wire 30 and a plurality of eyelet rivets 40.
Specifically, referring to fig. 2, the pair of mica substrates 10 are stacked, each mica substrate 10 is provided with a plurality of heat dissipation holes 11 and a plurality of first fixing holes 12, the plurality of heat dissipation holes 11 are uniformly distributed, the plurality of first fixing holes 12 are located at two ends of the mica substrate 10, each connection terminal 20 is provided with a plurality of second fixing holes 21 and a plurality of long round holes 22, each eyelet rivet 40 penetrates through the corresponding first fixing hole 12 and second fixing hole 21 to fix the connection terminal 20 at two ends of the pair of mica substrates 10, the resistance wire 30 is wound on the pair of mica substrates 10, two ends of the resistance wire 30 are respectively spot-welded on the connection terminal 20, and the outer surfaces of the mica substrates 10 and the resistance wire 30 are provided with insulating flame retardant coatings.
It can be understood that the pair of mica substrates 10 are adopted as the base materials, and have the characteristics of high temperature resistance and high pressure resistance, and are convenient to transport and store; each mica substrate 10 can be processed separately, the processing difficulty can be reduced because the thickness is thinner, and the strength can be increased when two mica substrates 10 are laminated together; the mica substrate 10 is provided with the heat dissipation holes 11, so that the wind resistance is small, the air cooling and heat dissipation are convenient, and the module type installation can be realized; the insulating flame-retardant coating can play insulating and flame-retardant effects; the long circular hole 22 on the connection terminal 20 facilitates the serial connection of a plurality of ultra-thin ultra-light high-power resistors 100.
Further, the resistance wire 30 is made of iron-chromium-aluminum alloy. The iron-chromium-aluminum alloy has small energy storage and is very quick to cool, and is a preferred material of the resistance wire 30, but not limited to the resistance wire 30 made of the iron-chromium-aluminum alloy.
Further, each sheet of mica substrate 10 has a thickness of 1mm, a small thickness and a light weight.
Furthermore, the insulating flame-retardant coating is an oxide film coating which is strong in corrosion resistance and prolonged in service life.
Further, the number of the eyelet rivets 40 is 4, and each of the connection terminals 20 is fixed to one end of the pair of mica substrates 10 by 2 eyelet rivets 40.
Compared with the prior art, the utility model provides a pair of ultra-thin ultralight high-power resistance's beneficial effect lies in: a pair of mica matrixes are used as base materials, so that the mica matrix has the characteristics of high temperature resistance and high pressure resistance, and is convenient to transport and store; each mica substrate can be processed separately, so that the processing difficulty is reduced, and meanwhile, the strength can be increased when two mica substrates are laminated together; the mica substrate is provided with heat dissipation holes, so that the wind resistance is small, the air cooling and heat dissipation are facilitated, and the module type installation can be realized; the insulating flame-retardant coating can play insulating and flame-retardant effects; the long round holes in the connecting terminals facilitate the mutual serial use of a plurality of ultrathin, ultralight and high-power resistors.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (5)
1. An ultra-thin ultra-light high-power resistor is characterized in that: comprises a pair of mica substrates, a pair of connecting terminals, a resistance wire and a plurality of eyelet rivets;
the pair of mica base members are stacked, a plurality of heat dissipation holes and a plurality of first fixing holes are formed in each mica base member, the heat dissipation holes are evenly distributed, the first fixing holes are located at two ends of each mica base member, a plurality of second fixing holes and a plurality of long round holes are formed in each connecting terminal, each eyelet rivet penetrates through the corresponding first fixing hole and the corresponding second fixing hole to enable the connecting terminals to be fixed at two ends of the pair of mica base members, the resistance wire is wound on the pair of mica base members, two ends of the resistance wire are respectively in spot welding on the connecting terminals, and the outer surfaces of the mica base members and the resistance wire are coated with insulating flame-retardant paint.
2. The ultra-thin ultra-light high power resistor of claim 1, wherein: the resistance wire is made of iron-chromium-aluminum alloy.
3. The ultra-thin ultra-light high power resistor of claim 1, wherein: the thickness of each mica substrate was 1 mm.
4. The ultra-thin ultra-light high power resistor of claim 1, wherein: the insulating flame-retardant coating is an oxide film coating.
5. The ultra-thin ultra-light high power resistor of claim 1, wherein: the number of the eyelet rivets is 4, and each connecting terminal is fixed at one end of the pair of mica substrates through 2 eyelet rivets.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920817244.7U CN210073512U (en) | 2019-05-31 | 2019-05-31 | Ultrathin ultralight high-power resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920817244.7U CN210073512U (en) | 2019-05-31 | 2019-05-31 | Ultrathin ultralight high-power resistor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210073512U true CN210073512U (en) | 2020-02-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920817244.7U Expired - Fee Related CN210073512U (en) | 2019-05-31 | 2019-05-31 | Ultrathin ultralight high-power resistor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210073512U (en) |
-
2019
- 2019-05-31 CN CN201920817244.7U patent/CN210073512U/en not_active Expired - Fee Related
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200214 Termination date: 20210531 |
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| CF01 | Termination of patent right due to non-payment of annual fee |