CN210073499U - Chip type high-power resistance heat conduction structure - Google Patents
Chip type high-power resistance heat conduction structure Download PDFInfo
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- CN210073499U CN210073499U CN201920614061.5U CN201920614061U CN210073499U CN 210073499 U CN210073499 U CN 210073499U CN 201920614061 U CN201920614061 U CN 201920614061U CN 210073499 U CN210073499 U CN 210073499U
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- heat conduction
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- conducting component
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Abstract
The utility model belongs to the technical field of resistance, especially, be a high-power resistance heat conduction structure of chip, including connecting plate, protective housing, resistance card, heat-conducting component, welding cap, draw-in groove, fixed subassembly and bottom plate, the connecting plate outer wall is equipped with the draw-in groove, and connecting plate inner wall fixedly connected with welds the cap, it links to each other with the resistance card to weld cap one end, and is equipped with heat-conducting component in the middle of the resistance card, fixed subassembly is installed at the heat-conducting component both ends, resistance card externally mounted has protective housing, and the protective housing bottom is equipped with the bottom plate. The utility model discloses a heat-conducting component and fixed subassembly's setting is favorable to nimble use, and the heat conduction is convenient, and application scope is wider, and is fixed firm, improves work efficiency to perfect function diversity, be convenient for promote and practical.
Description
Technical Field
The utility model relates to the technical field of resistance, specifically be a high-power resistance heat conduction structure of chip.
Background
The resistance value of the resistance element is generally related to heat, material, length and cross-sectional area, the physical quantity for measuring the influence of heat on the resistance is heat coefficient, which is defined as the percentage of the change of the resistance value when the heat rises by 1 ℃, the main physical characteristic of the resistance is that the electric energy is changed into heat energy, namely, the resistance element is an energy consumption element, the current generates the internal energy when passing through the resistance element, and the resistance element usually has the functions of voltage division and shunt in the circuit. For signals, both ac and dc signals may pass through resistors.
However, the existing chip type high-power resistance heat conduction structure has the problems of incomplete function, complex structure, poor heat conduction effect, short service life and incapability of meeting the use requirement.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a high-power resistance heat conduction structure of chip formula to solve the function imperfection that current high-power resistance heat conduction structure of chip formula exists, the structure is complicated, and the heat conduction effect is poor, and life is short, and can't satisfy the problem of user demand.
In order to achieve the above purpose, the utility model adopts the following technical scheme: the utility model provides a high-power resistance heat conduction structure of chip, includes connecting plate, protective housing, resistance card, heat-conducting component, welds cap, draw-in groove, fixed subassembly and bottom plate, the connecting plate outer wall is equipped with the draw-in groove, and connecting plate inner wall fixedly connected with welds the cap, it links to each other with the resistance card to weld cap one end, and is equipped with the heat-conducting component in the middle of the resistance card, fixed subassembly is installed at the heat-conducting component both ends, resistance card externally mounted has protective housing, and the protective housing bottom is equipped with the bottom plate.
Further optimize this technical scheme, the heat conduction subassembly includes fixed plate, conducting strip, adjusting bolt, heat conduction circle and heat conduction section of thick bamboo, the fixed plate right side is provided with the conducting strip, and the conducting strip upper right corner is provided with adjusting bolt, the heat conduction section of thick bamboo is installed on the conducting strip right side, and the heat conduction section of thick bamboo outside is equipped with the heat conduction circle.
Further optimize this technical scheme, fixed subassembly includes the clamp sleeve, stopper, transmission pipe, horizontal pole, connecting pin, sealed chamber and calorimeter, the stopper is installed to the clamp sleeve inner wall, and clamp sleeve and transmission pipe through connection, transmission pipe outer wall and horizontal pole fixed connection, and horizontal pole and both sides and connecting pin through connection, transmission pipe top and sealed chamber through connection, and the thermometer is installed at the sealed chamber top.
Further optimize this technical scheme, heat conduction circle inside is equipped with the heat conduction silk, and the heat conduction circle encircles and sets up at heat conduction section of thick bamboo surface.
Further optimize this technical scheme, the screw hole is installed to the connecting plate inner wall, and the connecting plate surface scribbles insulating paint.
Compared with the prior art, the beneficial effects of the utility model are that: the utility model discloses a fixed plate can fix the heat-conducting component on the body, heat conduction through the conducting strip, adjusting bolt can adjust, strengthen the heat conduction effect under the cooperation of heat conduction circle and heat conduction section of thick bamboo, can press from both sides the junction tightly through the clutch collar, utilize the stopper to fix in the junction, prevent sliding, transmit the heat to sealed chamber through the transmission pipe, finally measure the heat degree through the thermometer, the nimble use, the setting of heat-conducting component and fixed subassembly, be favorable to nimble use, heat conduction is convenient, application scope is wider, it is fixed firm, improve work efficiency, thereby perfect function diversity, and is convenient for popularize and practical.
Drawings
Fig. 1 is a schematic diagram of a chip-type high-power resistance heat conduction structure provided by the present invention;
fig. 2 is a schematic structural view of the heat conducting assembly according to the present invention;
fig. 3 is a schematic structural view of the fixing assembly according to the present invention.
In the figure: the device comprises a connecting plate 1, a protective shell 2, a resistance card 3, a heat conducting assembly 4, a fixing plate 41, a heat conducting sheet 42, an adjusting bolt 43, a heat conducting ring 44, a heat conducting cylinder 45, a welding cap 5, a clamping groove 6, a fixing assembly 7, a clamping sleeve 71, a limiting block 72, a transmission pipe 73, a cross rod 74, a connecting pin 75, a sealing cavity 76, a thermometer 77 and a bottom plate 8.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-3, the present invention provides a technical solution: a chip type high-power resistance heat conduction structure comprises a connecting plate 1, a protective shell 2, a resistor disc 3, a heat conduction assembly 4, a welding cap 5, a clamping groove 6, a fixing assembly 7 and a bottom plate 8, wherein the clamping groove 6 is formed in the outer wall of the connecting plate 1, the welding cap 5 is fixedly connected to the inner wall of the connecting plate 1, one end of the welding cap 5 is connected with the resistor disc 3, the heat conduction assembly 4 is arranged in the middle of the resistor disc 3, the fixing assembly 7 is installed at two ends of the heat conduction assembly 4, the protective shell 2 is installed outside the resistor disc 3, the bottom of the protective shell 2 is provided with the bottom plate 8, the heat conduction assembly 4 comprises a fixing plate 41, a heat conduction sheet 42, an adjusting bolt 43, a heat conduction ring 44 and a heat conduction cylinder 45, the heat conduction sheet 42 is arranged on the right side of the fixing plate 41, the adjusting bolt 43 is arranged on the upper right corner of the heat conduction sheet, the heat is conducted through the heat conducting sheet 42, the adjusting bolt 43 can be adjusted, the heat conducting effect is enhanced under the matching of the heat conducting ring 44 and the heat conducting cylinder 45, the fixing assembly 7 comprises a clamping sleeve 71, a limiting block 72, a transmission pipe 73, a cross rod 74, a connecting pin 75, a sealing cavity 76 and a heat meter 77, the limiting block 72 is installed on the inner wall of the clamping sleeve 71, the clamping sleeve 71 is connected with the transmission pipe 73 in a penetrating manner, the outer wall of the transmission pipe 73 is fixedly connected with the cross rod 74, the cross rod 74 is connected with the connecting pin 75 in a penetrating manner, the top of the transmission pipe 73 is connected with the sealing cavity 76 in a penetrating manner, the heat meter 7 is installed on the top of the sealing cavity 76, the joint is clamped through the clamping sleeve 71, the limiting block 2 is used for fixing at the joint to prevent sliding, the heat is transmitted to the sealing cavity 76 through the transmission pipe 73, the transmission pipe 73 is supported and fixed through the matching of, the inside heat conduction silk that is equipped with of heat conduction circle 44, and heat conduction circle 44 encircle to set up at heat conduction section of thick bamboo 45 surfaces, are favorable to further improving heat conduction effect, facilitate work, and the screw hole is installed to 1 inner wall of connecting plate, and 1 surface of connecting plate scribbles insulating varnish.
The working principle is as follows:
the utility model discloses at the during operation, utilize fixed plate 41 to fix heat-conducting component 4 on the body, heat conduction through conducting strip 42, adjusting bolt 43 can adjust, strengthen the heat conduction effect under the cooperation of heat conduction circle 44 and heat conduction section of thick bamboo 45, press from both sides tightly the junction through clamp sleeve 71, utilize stopper 2 to fix at the junction, prevent sliding, transmit the heat to seal chamber 76 through transmission pipe 73, support fixedly to transmission pipe 73 through the cooperation of horizontal pole 74 and connecting pin 75, finally measure the heat degree through calorimeter 77, be favorable to nimble use under the mutually supporting of heat-conducting component 4 and fixed subassembly 7, heat conduction is convenient, application scope is wider, it is firm to fix, improve work efficiency, thereby perfect function diversity, be convenient for promote and practical, solved the function imperfection that current piece formula high-power resistance heat conduction structure exists, the structure is complicated, poor heat conduction effect, short service life, and the unable problem that satisfies the user demand.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (5)
1. The utility model provides a high-power resistance heat conduction structure of chip, its characterized in that: it includes connecting plate (1), protective housing (2), resistance card (3), heat-conducting component (4), welds cap (5), draw-in groove (6), fixed subassembly (7) and bottom plate (8), connecting plate (1) outer wall is equipped with draw-in groove (6), and connecting plate (1) inner wall fixedly connected with welds cap (5), it links to each other with resistance card (3) to weld cap (5) one end, and is equipped with heat-conducting component (4) in the middle of resistance card (3), fixed subassembly (7) are installed at heat-conducting component (4) both ends, resistance card (3) externally mounted has protective housing (2), and protective housing (2) bottom is equipped with bottom plate (8).
2. The chip type high-power resistance heat conduction structure according to claim 1, wherein the heat conduction assembly (4) comprises a fixing plate (41), a heat conduction sheet (42), an adjusting bolt (43), a heat conduction ring (44) and a heat conduction cylinder (45), the heat conduction sheet (42) is arranged on the right side of the fixing plate (41), the adjusting bolt (43) is arranged on the upper right corner of the heat conduction sheet (42), the heat conduction cylinder (45) is installed on the right side of the heat conduction sheet (42), and the heat conduction ring (44) is arranged outside the heat conduction cylinder (45).
3. The chip type high-power resistance heat conduction structure according to claim 1, wherein the fixing assembly (7) comprises a clamping sleeve (71), a limiting block (72), a transmission pipe (73), a cross rod (74), a connecting pin (75), a sealing cavity (76) and a heat meter (77), the limiting block (72) is installed on the inner wall of the clamping sleeve (71), the clamping sleeve (71) is connected with the transmission pipe (73) in a penetrating manner, the outer wall of the transmission pipe (73) is fixedly connected with the cross rod (74), the cross rod (74) is connected with the connecting pin (75) in a penetrating manner, the top of the transmission pipe (73) is connected with the sealing cavity (76) in a penetrating manner, and the heat meter (77) is installed on the top of the sealing cavity (76).
4. The chip type high-power resistance heat conduction structure according to claim 2, wherein the heat conduction ring (44) is internally provided with heat conduction wires, and the heat conduction ring (44) is arranged around the outer surface of the heat conduction cylinder (45).
5. The chip type high-power resistance heat conduction structure according to claim 1, wherein the inner wall of the connection plate (1) is provided with a threaded hole, and the outer surface of the connection plate (1) is coated with insulating paint.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920614061.5U CN210073499U (en) | 2019-04-30 | 2019-04-30 | Chip type high-power resistance heat conduction structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920614061.5U CN210073499U (en) | 2019-04-30 | 2019-04-30 | Chip type high-power resistance heat conduction structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210073499U true CN210073499U (en) | 2020-02-14 |
Family
ID=69449891
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920614061.5U Expired - Fee Related CN210073499U (en) | 2019-04-30 | 2019-04-30 | Chip type high-power resistance heat conduction structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210073499U (en) |
-
2019
- 2019-04-30 CN CN201920614061.5U patent/CN210073499U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200214 |
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| CF01 | Termination of patent right due to non-payment of annual fee |