CN210069912U

CN210069912U - Electronic equipment embeds piezoceramics component heat dissipation mounting structure

Info

Publication number: CN210069912U
Application number: CN201920663193.7U
Authority: CN
Inventors: 陈林
Original assignee: Fujian Fukang Electronic Co Ltd
Current assignee: Fujian Fukang Electronic Co Ltd
Priority date: 2019-05-09
Filing date: 2019-05-09
Publication date: 2020-02-14
Anticipated expiration: 2029-05-09

Abstract

The utility model discloses a built-in piezoceramics component heat dissipation mounting structure of electronic equipment, including device body and connecting block, the one end of device body is provided with the extruded article, and installs the other end of device body and install the piezoceramics body, the end department of piezoceramics body is fixed with the fixed block, and the outside of fixed block is provided with the spacing groove, and the top of piezoceramics body is provided with the clamp plate simultaneously, the avris of clamp plate is fixed with the dead lever, and the outside of dead lever has seted up the draw-in groove, and the avris of dead lever passes through spring and device body interconnect simultaneously, the intermediate position at the device body is installed to the connecting block, and the outside of connecting block is fixed with the limiting plate, and the end department of limiting plate. This built-in piezoceramics component heat dissipation mounting structure of electronic equipment is convenient for dismantle the product, has reduced recycle's the degree of difficulty to in-process using can dispel the heat, reduces the probability of damaging.

Description

Electronic equipment embeds piezoceramics component heat dissipation mounting structure

Technical Field

The utility model relates to a piezoceramics product technical field specifically is a built-in piezoceramics component heat dissipation mounting structure of electronic equipment.

Background

The disposable lighter needs to be electrically ignited during use, so that the piezoelectric ceramic element is used to compress the ignition unit, the movable pin leaves the fixed groove after compression, and the contact of the piezoelectric ceramic is impacted, so as to complete the ignition operation, however, the conventional piezoelectric ceramic has the following problems during use:

1. after the lighter gasoline is used, the piezoelectric ceramic can be recycled, so that the piezoelectric ceramic is inconvenient to disassemble, and the recycling difficulty is increased;

2. the high temperature condition appears easily in the use, and the piezoelectric ceramic product is easy to damage after the high temperature, influences the striking sparks.

In order to solve the above problems, innovative design based on the original piezoelectric ceramic element is urgently needed.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a built-in piezoceramics component heat dissipation mounting structure of electronic equipment to propose current piezoceramics component in solving above-mentioned background art, be not convenient for recycle after the use, and the in-process of using appears the condition that high temperature damaged easily, influences the problem of using.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides an electronic equipment embeds piezoceramics component heat dissipation mounting structure, includes device body and connecting block, the one end of device body is provided with the extruded article, and the other end of device body installs piezoceramics body, the end department of piezoceramics body is fixed with the fixed block, and the outside of fixed block is provided with the spacing groove, and the top of piezoceramics body is provided with the clamp plate simultaneously, the avris of clamp plate is fixed with the dead lever, and the outside of dead lever has seted up the draw-in groove, and the avris of dead lever passes through spring and device body interconnect simultaneously, the intermediate position at the device body is installed to the connecting block, and the outside of connecting block is fixed with the limiting plate, and the end department of limiting plate passes through limiting block and device body interconnect simultaneously to the.

Preferably, the piezoelectric ceramic body and the device body are connected in a clamping manner, and the piezoelectric ceramic body is symmetrically arranged relative to the axis of the device body.

Preferably, the limiting groove is arranged in an L shape, and the inner diameter of the limiting groove is the same as the outer diameter of the fixing block.

Preferably, the pressing plate and the device body form a lifting installation structure, and the bottom of the pressing plate is attached to the upper surface of the piezoelectric ceramic body.

Preferably, the lateral sides of the pressing plate are symmetrically provided with fixing rods, and the end heads of the fixing rods penetrate through the clamping grooves.

Preferably, the end of the limiting plate is arranged in an inclined manner, 2 limiting plates are symmetrically arranged on the axis of the pressing plate, and the 2 pressing plates are magnetic.

Compared with the prior art, the beneficial effects of the utility model are that: the heat dissipation mounting structure of the piezoelectric ceramic element arranged in the electronic equipment is convenient for dismounting a product, reduces the recycling difficulty, can dissipate heat in the using process and reduces the damage probability;

1. the piezoelectric ceramic body is installed with the device body in a clamping mode, the fixed block fixed on the side of the piezoelectric ceramic body coincides with the bottom of the limiting groove, the piezoelectric ceramic body is extruded upwards and rotates, the piezoelectric ceramic body falls under gravity at the moment, the limiting plate extrudes the pressing plate, the pressing plate moves downwards under the stress influence, the piezoelectric ceramic body can be fixed, the falling condition in the using process is avoided, the limiting plate is stretched outwards, the pressing plate is driven to reset by the resilience force of the spring, the piezoelectric ceramic body can be disassembled at the moment, and the difficulty in recycling the piezoelectric ceramic body is reduced;

2. the bottom of device body has seted up the ventilative mouth of netted setting, and at the in-process that uses, can play radiating effect, avoids the high temperature influence, and the condition of damage appears in the piezoceramics body, consequently can improve the stability that the piezoceramics body used.

Drawings

FIG. 1 is a schematic view of the overall front structure of the present invention;

FIG. 2 is a schematic view of the overall structure of the present invention;

FIG. 3 is a schematic side view of the limiting groove of the present invention;

FIG. 4 is a schematic view of the connection structure between the pressing plate and the device body;

fig. 5 is a schematic view of the connection structure between the spring and the device body according to the present invention.

In the figure: 1. a device body; 2. an extrusion; 3. a piezoelectric ceramic body; 4. a fixed block; 5. a limiting groove; 6. pressing a plate; 7. fixing the rod; 8. a card slot; 9. a spring; 10. connecting blocks; 11. a limiting plate; 12. a limiting block; 13. and (4) ventilating openings.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-5, the present invention provides a technical solution: a heat dissipation mounting structure for a built-in piezoelectric ceramic element of electronic equipment comprises a device body 1, an extrusion part 2, a piezoelectric ceramic body 3, a fixed block 4, a limiting groove 5, a pressing plate 6, a fixed rod 7, a clamping groove 8, a spring 9, a connecting block 10, a limiting plate 11, a limiting block 12 and a ventilation port 13, wherein the extrusion part 2 is arranged at one end of the device body 1, the piezoelectric ceramic body 3 is arranged at the other end of the device body 1, the fixed block 4 is fixed at the end of the piezoelectric ceramic body 3, the limiting groove 5 is arranged at the outer side of the fixed block 4, the pressing plate 6 is arranged above the piezoelectric ceramic body 3, the fixed rod 7 is fixed at the lateral side of the pressing plate 6, the clamping groove 8 is arranged at the outer side of the fixed rod 7, the lateral side of the fixed rod 7 is mutually connected with the device body 1 through the spring 9, the connecting block, meanwhile, the end of the limiting plate 11 is connected with the device body 1 through a limiting block 12, and a ventilation opening 13 is reserved at the bottom of the device body 1;

the piezoelectric ceramic body 3 and the device body 1 are in clamping connection, the piezoelectric ceramic body 3 is symmetrically arranged about the axis of the device body 1, the piezoelectric ceramic body 3 is convenient to disassemble due to the clamping connection, so that the recovery difficulty of the piezoelectric ceramic body 3 can be reduced, and the difficulty of installation can be reduced by the fact that the fixing block 4 enters the limiting groove 5 due to the symmetrical arrangement of the axis;

the limiting groove 5 is arranged in an L shape, the inner diameter of the limiting groove 5 is the same as the outer diameter of the fixing block 4, when the fixing block 4 enters the limiting groove 5, the piezoelectric ceramic body 3 is extruded, when the piezoelectric ceramic body 3 enters the deepest part of the limiting groove 5, the piezoelectric ceramic body 3 is rotated, then the thrust on the piezoelectric ceramic body 3 is removed, and at the moment, the piezoelectric ceramic body 3 falls down under the gravity, so that the installation is completed;

the pressing plate 6 and the device body 1 form a lifting installation structure, the bottom of the pressing plate 6 is attached to the upper surface of the piezoelectric ceramic body 3, fixing rods 7 are symmetrically arranged on the lateral sides of the pressing plate 6, the end parts of the fixing rods 7 penetrate into the clamping grooves 8, when the pressing plate 6 is located at an initial position, the connecting blocks 10 are extruded, and when the connecting blocks 10 are extruded, the limiting plates 11 can be driven to move outwards, so that pressure can be generated at the end parts of the pressing plate 6 through the limiting plates 11, the pressing plate 6 can move downwards under the pressure at the moment, the end parts of the piezoelectric ceramic body 3 can be extruded, and unstable installation is avoided;

the end department of limiting plate 11 adopts the slope form to set up, and limiting plate 11 is provided with 2 about the axis symmetry of

clamp plate

6, and 2 clamp plates 6 all have magnetism simultaneously, have magnetism and set up and to make both adsorb, avoid appearing gliding the condition.

The working principle is as follows: when the heat dissipation mounting structure of the piezoelectric ceramic element built in the electronic device is used, as shown in fig. 1-5, when the piezoelectric ceramic body 3 and the device body 1 are mounted, the fixing block 4 is overlapped with the bottom of the limiting groove 5, then the piezoelectric ceramic body 3 is pushed upwards, the fixing block 4 is contacted with the end of the limiting groove 5 after being pushed, when the piezoelectric ceramic body 3 is pushed to the deepest position, the piezoelectric ceramic body 3 is rotated, the fixing block 4 moves to the other end of the limiting groove 5, the pressure on the piezoelectric ceramic body 3 is removed, the piezoelectric ceramic body 3 falls under the influence of gravity, then the connecting block 10 is pushed, when the connecting block 10 is pushed, the limiting plate 11 causes the pressure on the end of the pressing plate 6, because the end of the limiting plate 11 is arranged in an inclined shape, when the limiting plate moves, the pressing plate 6 can be driven to continuously move downwards, and the end of the piezoelectric ceramic body 3 is pressed, the stability of 3 installations of improvement piezoceramics bodies, the bottom of device body 1 adopts netted setting, therefore device body 1 can improve radiating efficiency at the in-process that uses, avoids appearing the condition of high temperature, influences the normal use of device.

It should be finally noted that the above only serves to illustrate the technical solution of the present invention, and not to limit the scope of the present invention, and that simple modifications or equivalent replacements performed by those skilled in the art to the technical solution of the present invention do not depart from the spirit and scope of the technical solution of the present invention.

Claims

1. The utility model provides a built-in piezoceramics component heat dissipation mounting structure of electronic equipment, includes device body (1) and connecting block (10), its characterized in that: the device is characterized in that an extrusion part (2) is arranged at one end of the device body (1), a piezoelectric ceramic body (3) is installed at the other end of the device body (1), a fixed block (4) is fixed at the end of the piezoelectric ceramic body (3), a limiting groove (5) is formed in the outer side of the fixed block (4), a pressing plate (6) is arranged above the piezoelectric ceramic body (3), a fixed rod (7) is fixed on the lateral side of the pressing plate (6), a clamping groove (8) is formed in the outer side of the fixed rod (7), the lateral side of the fixed rod (7) is connected with the device body (1) through a spring (9), the connecting block (10) is installed at the middle position of the device body (1), a limiting plate (11) is fixed on the outer side of the connecting block (10), and the end of the limiting plate (11) is connected with the device body (1) through, and a ventilation opening (13) is reserved at the bottom of the device body (1).

2. The heat dissipation mounting structure for a built-in piezoelectric ceramic element of an electronic device according to claim 1, wherein: the piezoelectric ceramic body (3) and the device body (1) are connected in a clamping mode, and the piezoelectric ceramic body (3) is symmetrically arranged relative to the axis of the device body (1).

3. The heat dissipation mounting structure for a built-in piezoelectric ceramic element of an electronic device according to claim 1, wherein: the limiting groove (5) is arranged in an L shape, and the inner diameter of the limiting groove (5) is the same as the outer diameter of the fixing block (4).

4. The heat dissipation mounting structure for a built-in piezoelectric ceramic element of an electronic device according to claim 1, wherein: the pressing plate (6) and the device body (1) form a lifting installation structure, and the bottom of the pressing plate (6) is attached to the upper surface of the piezoelectric ceramic body (3).

5. The heat dissipation mounting structure for a built-in piezoelectric ceramic element of an electronic device according to claim 1, wherein: the lateral sides of the pressing plates (6) are symmetrically provided with fixing rods (7), and the end heads of the fixing rods (7) penetrate through the clamping grooves (8).

6. The heat dissipation mounting structure for a built-in piezoelectric ceramic element of an electronic device according to claim 1, wherein: the end of the limiting plate (11) is arranged in an inclined manner, 2 limiting plates (11) are symmetrically arranged around the axis of the pressing plate (6), and the 2 pressing plates (6) are magnetic.