CN210052734U

CN210052734U - Chip packaging structure and electronic equipment

Info

Publication number: CN210052734U
Application number: CN201920905414.7U
Authority: CN
Inventors: 董昊翔
Original assignee: Shenzhen Huiding Technology Co Ltd
Current assignee: Shenzhen Goodix Technology Co Ltd
Priority date: 2019-06-14
Filing date: 2019-06-14
Publication date: 2020-02-11
Anticipated expiration: 2029-06-14

Abstract

A chip packaging structure and an electronic device can reduce the thickness of chip packaging and realize ultra-thinning of the chip packaging. The chip packaging structure comprises: the chip, the substrate, the leads and the lead protection glue; the lead is used for electrically connecting the chip and the substrate; the lead protection glue is used for supporting the lead, wherein the highest point of the lead protection glue is not higher than the highest point of the upper edge of the lead.

Description

Chip packaging structure and electronic equipment

Technical Field

The present application relates to the field of optical fingerprint technology, and more particularly, to a chip packaging structure and an electronic device.

Background

At present, in the packaging process of an electronic chip, two methods are generally adopted for lead packaging: injection Molding (Molding) packaging and dispensing packaging. The common method for dispensing and packaging comprises the following steps: and completely wrapping the first welding point and the second welding point of the lead and the lead by using protective glue to play a role of protection. Therefore, in the dispensing packaging mode, the height of the protective glue needs to be higher than that of the lead, so that the whole thickness space of a packaged product is occupied, and the ultrathin development of the product is not facilitated.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application provides a chip packaging structure and electronic equipment, which can reduce the thickness of chip packaging and realize ultra-thinning of the chip packaging.

In a first aspect, a chip package structure is provided, including: the chip, the substrate, the leads and the lead protection glue;

the lead is used for electrically connecting the chip and the substrate;

the lead protection glue is used for supporting the lead, wherein the highest point of the lead protection glue is not higher than the highest point of the upper edge of the lead.

According to the scheme of the embodiment of the application, the highest point of the lead protection adhesive is not higher than that of the lead and can support the lead by controlling the height of the lead protection adhesive, so that the lead protection adhesive can guarantee the mechanical reliability of the lead, the extra thickness of a chip packaging product is prevented from being increased, and the product is ultrathin.

In a possible implementation manner, the highest point of the lead protection glue is not lower than the highest point of the lower edge of the lead.

In one possible implementation, the lead protection paste covers the lower edge of the lead.

In a possible implementation manner, the chip is an optical fingerprint sensor chip, and is configured to receive a fingerprint detection signal returned by reflection or scattering of a human finger, and detect fingerprint information of the finger based on the fingerprint detection signal.

In one possible implementation, the chip includes a pin pad, and the substrate includes a substrate pad;

the lead is specifically used for electrically connecting the pin pad and the substrate pad.

In a possible implementation manner, the lead protection glue covers a first solder joint formed by the lead on the substrate pad and a second solder joint formed by the lead on the pin pad, and is used for protecting the first solder joint and the second solder joint.

In one possible implementation, the leads are connected to the pin pads by metal balls.

In one possible implementation, the lead and the metal ball are of an integrally molded structure.

The first section of the leads is located above the chip, and the distance between the lowest point of the first section of leads and the surface of the chip can be any value, and in a possible implementation mode, the distance between the lowest point of the first section of leads and the surface of the chip is not more than 10 μm.

In one possible implementation, the lowest point of the first length of wire is in contact with the upper surface of the chip.

The distance between the highest point of the wire and the chip surface may be any value, and in one possible implementation, the distance between the highest point of the wire and the chip surface is not more than 35 μm.

In one possible implementation, the chip further includes: testing the metal unit;

the test metal unit is arranged in the edge area of the chip which is not under the lead.

In one possible implementation, the pin pad is located on one side of the chip, and the test metal unit is located on at least one of the other three sides of the chip.

In a possible implementation manner, the lead is a lead prepared from the substrate pad to the pin pad by using a reverse routing process.

In one possible implementation manner, the lead is a gold wire, a silver wire or a copper wire; and/or the presence of a gas in the gas,

the wire diameter of the lead is 15.2-25.4 μm.

In one possible implementation, the chip is disposed on an upper surface of the substrate.

In another possible implementation manner, a first groove is formed in the upper surface of the substrate in a downward extending manner, and at least a portion of the chip is disposed in the first groove.

In one possible implementation, the size of the first recess is larger than the size of the chip, so that a gap for accommodating the lead exists between the side wall of the chip and the side wall of the first recess.

In one possible implementation, the depth of the first groove includes a thickness of a cover film of the substrate and a thickness of a conductive layer located below the cover film.

In a second aspect, an electronic device is provided, which includes the chip packaging structure as in the first aspect or any possible implementation manner of the first aspect.

Drawings

Fig. 1 is a schematic structural diagram of a terminal device to which the embodiment of the present application is applied.

Fig. 2 is a schematic diagram of a chip package structure according to an embodiment of the present application.

FIG. 3 is a schematic diagram of another chip package structure according to an embodiment of the present application

Fig. 4 is a schematic plan view of a chip package structure according to an embodiment of the present application.

Fig. 5 is a schematic structural diagram of another chip package structure according to an embodiment of the present application.

Fig. 6 is a schematic structural diagram of another chip package structure according to an embodiment of the present application.

Fig. 7 is a schematic structural diagram of another chip package structure according to an embodiment of the present application.

Fig. 8 is a schematic structural diagram of another chip package structure according to an embodiment of the present application.

Fig. 9 is a schematic structural diagram of another chip package structure according to an embodiment of the present application.

Fig. 10 is a schematic structural diagram of another chip package structure according to an embodiment of the present application.

Fig. 11 is a schematic plan view of a chip in a chip package structure according to an embodiment of the present application.

Fig. 12 is a schematic plan view of another chip in a chip package structure according to an embodiment of the present application.

Fig. 13 is a module structure diagram of a chip package structure according to an embodiment of the present application.

FIG. 14 is a schematic block diagram of an electronic device according to an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be described below with reference to the accompanying drawings.

The embodiments of the present application can be applied to various chips (microchips), also called Integrated Circuits (ICs) or microcircuits (microcircuits), which are a circuit structure generally manufactured on a semiconductor wafer, and a plurality of semiconductor devices are fabricated on the silicon wafer through semiconductor integrated circuit processes, and through film deposition, doping, photolithography, etching, and other steps. Including but not limited to sensor chips, power chips, signal processing chips, logic control chips, memory chips, and the like.

In this application embodiment, the chip can be fingerprint sensor chip for fingerprint signals such as light wave signal, sound wave signal or pressure signal that carry fingerprint information are received to convert this fingerprint signal into corresponding signal of telecommunication, thereby can detect the fingerprint information of finger. The fingerprint sensor chip includes, but is not limited to, an optical fingerprint sensor chip, an ultrasonic fingerprint sensor chip, or a capacitive fingerprint sensor chip, etc. For convenience of explanation, the optical fingerprint sensor chip is taken as an example for explanation.

As a common application scenario, the optical fingerprint sensor chip provided by the embodiment of the application can be applied to smart phones, tablet computers and other mobile terminals or other terminal devices with display screens; more specifically, in the above terminal device, the optical fingerprint sensor chip may be specifically disposed in an optical fingerprint device, and the optical fingerprint device may be disposed in a partial area or an entire area below the display screen, thereby forming an Under-screen (display) optical fingerprint system. Or, the optical fingerprint identification device may also be partially or completely integrated inside a display screen of the terminal device, so as to form an In-display (In-display) optical fingerprint system.

As shown in fig. 1, which is a schematic structural diagram of a terminal device to which the embodiment of the present application is applicable, the terminal device 10 includes a display screen 120 and an optical fingerprint device 130, where the optical fingerprint device 130 is disposed in a local area below the display screen 120. The optical fingerprint device 130 includes a fingerprint detection area 103, and an optical signal reflected or scattered by a finger area within the fingerprint detection area 103 may be received and detected by the optical fingerprint device 130. As shown in fig. 1, the fingerprint detection area 103 is located in a display area of the display screen 120. In an alternative embodiment, the optical fingerprint device 130 may be disposed at other positions, such as the side of the display screen 120 or the edge opaque area of the terminal device 10, and the optical signal of at least a part of the display area of the display screen 120 is guided to the optical fingerprint device 130 through the optical path design, so that the fingerprint detection area 103 is actually located in the display area of the display screen 120.

It should be appreciated that the area of the fingerprint sensing area 103 may be different from the area of the sensing array of the optical fingerprint device 130, for example, by the design of optical path such as lens imaging, reflective folded optical path design or other optical path design such as light converging or reflecting, the area of the fingerprint sensing area 103 of the optical fingerprint device 130 may be larger than the area of the sensing array of the optical fingerprint device 130. In other alternative implementations, the fingerprint sensing area 103 of the optical fingerprint device 130 may be designed to substantially coincide with the area of the sensing array of the optical fingerprint device 130 if optical path guidance is performed, for example, by light collimation.

Therefore, when the user needs to unlock the terminal device or perform other fingerprint verification, the user only needs to press a finger on the fingerprint detection area 103 of the display screen 120, so as to realize fingerprint input. Since fingerprint detection can be implemented in the screen, the terminal device 10 with the above structure does not need to reserve a special space on the front surface thereof to set a fingerprint key (such as a Home key), so that a full-screen scheme can be adopted, that is, the display area of the display screen 120 can be basically extended to the front surface of the whole terminal device 10.

As an alternative implementation, as shown in fig. 1, the optical fingerprint device 130 includes a light detection portion 134 and an optical component 132, where the light detection portion 134 includes the sensing array and a reading circuit and other auxiliary circuits electrically connected to the sensing array, which can be fabricated on an optical fingerprint sensor chip by a semiconductor process, and the sensing array is specifically a Photo detector (photodetector) array including a plurality of photodetectors distributed in an array, and the photodetectors can be used as the optical sensing units as described above; the optical assembly 132 may be disposed above the sensing array of the light detecting portion 134, and may specifically include a Filter layer (Filter) for filtering out ambient light penetrating through the finger, a light guiding layer or a light path guiding structure for guiding reflected light reflected from the surface of the finger to the sensing array for optical detection, and other optical elements.

In particular implementations, the optical assembly 132 may be packaged with the same optical fingerprint component as the light detection portion 134. For example, the optical component 132 may be packaged in the same optical fingerprint chip as the optical detection portion 134, or the optical component 132 may be disposed outside the chip where the optical detection portion 134 is located, for example, the optical component 132 is attached to the chip, or some components of the optical component 132 are integrated into the chip.

For example, the light guide layer may specifically be a Collimator (collimater) layer manufactured on a semiconductor silicon wafer, and the collimater unit may specifically be a small hole, and in reflected light reflected from a finger, light perpendicularly incident to the collimater unit may pass through and be received by an optical sensing unit below the collimater unit, and light with an excessively large incident angle is attenuated by multiple reflections inside the collimater unit, so that each optical sensing unit can basically only receive reflected light reflected from a fingerprint pattern directly above the optical sensing unit, and the sensing array can detect a fingerprint image of the finger.

In another embodiment, the light guiding layer or the light path guiding structure may also be an optical Lens (Lens) layer, which has one or more Lens units, such as a Lens group composed of one or more aspheric lenses, and is used to focus the reflected light reflected from the finger to the sensing array of the light detecting portion 134 therebelow, so that the sensing array can perform imaging based on the reflected light, thereby obtaining the fingerprint image of the finger. Optionally, the optical lens layer may further form a pinhole in the optical path of the lens unit, and the pinhole may cooperate with the optical lens layer to enlarge the field of view of the optical fingerprint device, so as to improve the fingerprint imaging effect of the optical fingerprint device 130.

In other embodiments, the light guide layer or the light path guiding structure may also specifically adopt a Micro-Lens (Micro-Lens) layer, the Micro-Lens layer has a Micro-Lens array formed by a plurality of Micro-lenses, which may be formed above the sensing array of the light detecting portion 134 through a semiconductor growth process or other processes, and each Micro-Lens may respectively correspond to one of the sensing units of the sensing array. And another optical film layer, such as a dielectric layer or a passivation layer, may be further formed between the microlens layer and the sensing unit, and more specifically, a light blocking layer having micro holes may be further included between the microlens layer and the sensing unit, where the micro holes are formed between the corresponding microlenses and the sensing unit, and the light blocking layer may block optical interference between adjacent microlenses and the sensing unit, and enable light corresponding to the sensing unit to be converged inside the micro holes through the microlenses and transmitted to the sensing unit through the micro holes for optical fingerprint imaging. It should be understood that several implementations of the above-mentioned optical path guiding structure may be used alone or in combination, for example, a microlens layer may be further disposed below the collimator layer or the optical lens layer. Of course, when the collimator layer or the optical lens layer is used in combination with the microlens layer, the specific lamination structure or optical path thereof may need to be adjusted according to actual needs.

It should be understood that in a specific implementation, the terminal device 10 further includes a transparent protective cover plate, which may be a glass cover plate or a sapphire cover plate, positioned above the display screen 120 and covering the front surface of the terminal device 10. Because, in the present embodiment, the pressing of the finger on the display screen 120 actually means pressing on the cover plate above the display screen 120 or the surface of the protective layer covering the cover plate.

As an alternative embodiment, the display screen 120 may adopt a display screen having a self-Light Emitting display unit, such as an Organic Light-Emitting Diode (OLED) display screen or a Micro-LED (Micro-LED) display screen. Taking an OLED display screen as an example, the optical fingerprint device 130 may use the display unit (i.e., OLED light source) of the OLED display screen 120 located in the fingerprint detection area 103 as an excitation light source for optical fingerprint detection. When the finger 140 presses the fingerprint detection area 103, the display 120 emits a beam of light 111 toward the target finger 140 above the fingerprint detection area 103, and the light 111 reflects on the upper surface of the cover 110 to form reflected light, wherein the ridge (ridge) of the finger can be in close contact with the cover 110 without a gap, and the valley (valley) of the finger has a certain air gap with the cover 110, so that the reflectivity of the light 111 at the ridge and the cover contact area is 0, and the reflectivity of the light 111 at the valley and the cover contact area is about 4%, therefore, the intensity of the reflected light 151 formed by the light 111 reflecting at the ridge and the cover contact area is less than that of the reflected light 152 formed by the light 111 reflecting at the valley and the cover contact area. After passing through the optical assembly 132, the reflected light is received by the sensing array 134 in the optical fingerprint device 130 and converted into a corresponding electrical signal, i.e., a fingerprint detection signal; fingerprint image data can be obtained based on the fingerprint detection signal, and fingerprint matching verification can be further performed, so that an optical fingerprint identification function is realized in the terminal device 10.

In other embodiments, the optical fingerprint device 130 may also use an internal light source or an external light source to provide an optical signal for fingerprint detection. In this case, the optical fingerprint device 130 may be adapted for use with a non-self-emissive display such as a liquid crystal display or other passively emissive display. Taking an application to a liquid crystal display having a backlight module and a liquid crystal panel as an example, to support the underscreen fingerprint detection of the liquid crystal display, the optical fingerprint system of the terminal device 10 may further include an excitation light source for optical fingerprint detection, where the excitation light source may specifically be an infrared light source or a light source of non-visible light with a specific wavelength, and may be disposed below the backlight module of the liquid crystal display or in an edge area below a protective cover of the terminal device 10, and the optical fingerprint device 130 may be disposed below the edge area of the liquid crystal panel or the protective cover and guided through a light path so that the fingerprint detection light may reach the optical fingerprint device 130; alternatively, the optical fingerprint device 130 may be disposed below the backlight module, and the backlight module may be perforated or otherwise optically designed to allow the fingerprint detection light to pass through the liquid crystal panel and the backlight module and reach the optical fingerprint device 130. When the optical fingerprint device 130 is used to provide an optical signal for fingerprint detection by using an internal light source or an external light source, the detection principle is consistent with the above description.

On the other hand, in some embodiments, the optical fingerprint device 130 may only include one optical fingerprint sensor chip, where the area of the fingerprint detection area 103 of the optical fingerprint device 130 is small and the location is fixed, so that the user needs to press a finger to a specific location of the fingerprint detection area 103 when performing a fingerprint input, otherwise the optical fingerprint device 130 may not acquire a fingerprint image and the user experience is poor. In other alternative embodiments, the optical fingerprint device 130 may specifically include a plurality of optical fingerprint sensor chips; the plurality of optical fingerprint sensor chips may be disposed side by side below the display screen 120 in a splicing manner, and sensing areas of the plurality of optical fingerprint sensor chips jointly constitute the fingerprint detection area 103 of the optical fingerprint device 130. That is, the fingerprint detection area 103 of the optical fingerprint device 130 may include a plurality of sub-areas, each of which corresponds to a sensing area of one of the optical fingerprint sensor chips, so that the fingerprint collection area 103 of the optical fingerprint device 130 may be extended to a main area of a lower half portion of the display screen, that is, to a finger-pressing area, thereby implementing a blind-touch fingerprint input operation. Alternatively, when the number of optical fingerprint sensor chips is sufficient, the fingerprint detection area 103 may also be extended to half or even the entire display area, thereby enabling half-screen or full-screen fingerprint detection.

It should also be understood that in the embodiments of the present application, the sensing array in the optical fingerprint device may also be referred to as a pixel array, and the optical sensing unit or the sensing unit in the sensing array may also be referred to as a pixel unit.

It should be noted that, optical fingerprint device in this application embodiment also can be called optical fingerprint identification module, fingerprint identification device, fingerprint identification module, fingerprint collection device etc. but above-mentioned term mutual replacement.

Generally, the optical component 132 and the optical detection portion 134 may be packaged together as an optical fingerprint sensor chip 210 or the optical detection portion 134 may be packaged separately as an optical fingerprint sensor chip, which may also be referred to simply as a chip hereinafter for convenience of description.

Generally, after a chip unit is prepared on a wafer, the chip unit is packaged on a circuit board to perform the functions of placing, fixing, sealing, protecting the chip and enhancing the electric heating performance, and is connected with an external circuit through the package.

Fig. 2 is a schematic diagram of a chip package structure 20. As shown in fig. 2, the chip 210 is fixed on the substrate 220 by a die attach adhesive 240, the chip 210 is formed with a pin pad 212, the substrate 220 is formed with a substrate pad 222, and the lead 230 connects the pin pad 212 and the substrate pad 222 to electrically connect the chip 210 and the substrate 220, specifically, in the process of forming the lead 230 by soldering, the lead 230 forms a first solder point on the pin pad 212 and a second solder point on the substrate pad 222.

In the conventional package method, as shown in fig. 2, after the lead 230 is prepared, a dispensing process is performed on the lead 230 and the first and second solder joints formed by soldering, so as to form a sealing protection adhesive 260 completely covering the lead 230, the first solder joint, and the second solder joint. The protective adhesive 260 has a larger dispensing amount and a height generally much higher than the height of the leads 230 to ensure complete coverage and protection of the leads. However, the dispensing method increases the thickness of the chip package structure 20, which is not conducive to the realization of the ultra-thinness of the chip package structure.

Based on this, the embodiment of the application controls the height of the protective adhesive to enable the highest point of the protective adhesive not to be higher than the highest point of the lead but to support the lead, thereby avoiding increasing the thickness of an extra chip packaging product while ensuring the mechanical reliability of the lead by the protective adhesive, realizing the ultra-thinness of the product,

hereinafter, the chip package structure according to the embodiment of the present application will be described in detail with reference to fig. 3 to 13.

It should be noted that, for the sake of understanding, the same structures are denoted by the same reference numerals in the embodiments shown below, and detailed descriptions of the same structures are omitted for the sake of brevity.

Fig. 3 is a schematic structural diagram of a chip package structure 30 provided in an embodiment of the present application, where the chip package structure 30 includes: chip 310, substrate 320, leads 330 and lead protection paste 360;

the leads 330 are used for electrically connecting the chip 310 and the substrate 320;

the lead protection adhesive 360 is used for supporting the lead 330, wherein the highest point of the lead protection adhesive 360 is not higher than the highest point of the upper edge 331 of the lead.

Specifically, in the embodiment of the present application, the lead protection paste 360 is dispensed on the lead 330 by a semiconductor dispensing process. As shown in fig. 3, the lead protection paste 360 is disposed under the leads 330 to support the leads 330. And the highest point of the lead protection adhesive 360 is not higher than the highest point of the upper edge 331 of the lead 330, wherein the upper edge 331 of the lead 330 is the upper edge of the lead in the radial direction, that is, the upper edge of the maximum radial cross section of the lead 330.

As shown in fig. 3, the height of the highest point C of the lead protecting adhesive 360 can be represented as a distance H1 between the plane of the highest point C and the upper surface of the chip 310. The highest point a of the upper edge 331 of the lead 330 can also be represented as a distance H2 between the plane of the highest point a and the upper surface of the chip 310. When the highest point C of the lead protection adhesive 360 is not higher than the highest point a of the lead upper edge 331, i.e., H1 is smaller than H2, the thickness of the chip package structure 30 is not additionally increased by the lead protection adhesive 360, and the chip package structure 30 can be thinned.

In the embodiment of the present application, the chip 310 may be the same as the chip 210 in fig. 2. The chip 310 is an integrated circuit manufactured on a semiconductor wafer through a semiconductor integrated circuit process, and includes a circuit region 301 and a non-circuit region 302, wherein the circuit region 301 is located at the center of the chip 310, and the non-circuit region 302 is located at the periphery of the chip 310.

Optionally, the chip 310 is a fingerprint sensor chip, and is configured to receive a light wave signal, a sound wave signal, or a pressure signal carrying fingerprint information, and convert the fingerprint signal into a corresponding electrical signal, so as to detect the fingerprint information of a finger. The chip 310 includes, but is not limited to, an optical chip, an ultrasonic chip, or a capacitive chip.

Specifically, when the chip 310 is an optical fingerprint sensor chip, it is configured to receive a fingerprint detection signal returned by reflection or scattering of a human finger, and detect fingerprint information of the finger based on the fingerprint detection signal. Alternatively, the chip 310 may include the light detecting portion 134 of fig. 1, or include the light detecting portion 134 and the optical assembly 132. For example, when the optical component 132 is a microlens array and an aperture array, the microlens array and the aperture array may be directly grown on the surface of the light detection portion 134, and the optical component 132 and the light detection portion 134 may be packaged together as a chip. It should be understood that when the chip 310 is an optical fingerprint sensor chip, the chip package structure 30 may be a fingerprint recognition device.

Alternatively, as shown in fig. 3, the chip 310 is adhered to the upper surface of the substrate 320 by a chip adhesive 340.

Optionally, fig. 4 is a schematic plan view of a chip package structure according to an embodiment of the present application. As shown in fig. 4, the chip 310 includes a detection circuit 311, the detection circuit 311 includes a photo detector array 3111 and a function circuit 3112, the photo detector array 3111 is configured to receive a fingerprint detection optical signal reflected or scattered by a finger and obtain a fingerprint detection electrical signal of the finger based on the fingerprint detection optical signal;

optionally, the light detecting array 3111 comprises a plurality of pixel units, one pixel unit for converting the light signal to form a fingerprint detecting electrical signal, and one fingerprint detecting electrical signal corresponds to one pixel value in the fingerprint image. The pixel unit may be a photodiode (photo diode), a Metal Oxide Semiconductor Field Effect Transistor (MOSFET), or other devices, and has high optical sensitivity and quantum efficiency for light of a target wavelength, so as to detect an optical signal of a corresponding wavelength. In a possible implementation manner, the target wavelength belongs to an infrared light band, and the light detection array is used for receiving fingerprint infrared light signals reflected by a finger to form corresponding fingerprint electric signals.

Optionally, the functional circuit 3112 includes, but is not limited to, a driving control circuit, a signal output circuit, etc. for controlling the operation of the plurality of pixel units in the light detecting array and outputting the electric signals generated by the plurality of pixel units.

Specifically, the pin pad 312 is used for outputting the fingerprint electrical signal generated by the detection circuit 311 to the substrate 320 through the lead 330, so as to transmit the fingerprint electrical signal to other processing circuit units on the substrate, where the processing circuit units include but are not limited to: logic control circuit, analog-to-digital conversion circuit, signal processing circuit, digital processing circuit, etc.

Optionally, the pin pad 312 is also used for receiving a control signal generated by other control processing circuits on the substrate 320, and optionally, the control signal may be generated by a control unit on the substrate 320, such as a microcontroller.

Optionally, in this embodiment of the application, the substrate 320 includes, but is not limited to, a Printed Circuit Board (PCB), a Flexible Printed Circuit (FPC), or a rigid-flex Circuit, and is used to bear and connect various electronic components and chips, and the chip package structure 30 packaged with the substrate 320 may implement functions of fingerprint identification of a fingerprint sensor chip and processing a fingerprint image.

Optionally, as shown in fig. 5, in a case that the highest point C of the lead protection adhesive 360 is not higher than the highest point a in the upper edge of the lead 330, the highest point C of the lead protection adhesive 360 is not higher than the highest point B in the lower edge 332 of the lead 330, where the lower edge 332 of the lead 330 is a lower edge of a radial direction of the lead, that is, a lower edge of a maximum radial cross section of the lead 330. At this time, the lead protection paste 360 has a small paste dispensing amount but a low height, and can also support the leads.

Preferably, as shown in fig. 6, under the condition that the highest point C of the lead protection adhesive 360 is not higher than the highest point a in the upper edge of the lead 330, the highest point C of the lead protection adhesive 360 is not lower than the highest point B in the lower edge 332 of the lead 330, so that the lead protection adhesive 360 can sufficiently support the lead 330, and the lead 330 is guaranteed not to be broken due to the influence of external pressure, and has good mechanical reliability.

Preferably, as shown in fig. 6, the lead protection adhesive 360 covers the lower edge of the lead 330, but does not cover the upper edge of the lead 330, that is, the lower edge of the lead 330 is completely in the lead protection adhesive 360, but the upper edge of the lead 330 is partially exposed outside the lead protection adhesive 360. At this time, the lead 330 can be completely supported by the lead protection adhesive 360, and the height of the lead protection adhesive 360 is not higher than that of the lead 330, so that the thickness of the chip packaging structure 30 can be reduced on the premise of ensuring good mechanical reliability of the lead.

Specifically, the chip 310 includes at least one pin pad 312 and the substrate includes at least one substrate pad 322. Hereinafter, the lead pad 312 may be a single lead pad or a plurality of lead pads, and the substrate pad 322 may be a single substrate pad or a plurality of substrate pads.

One lead wire 330 is correspondingly connected to one pin pad 312, and a plurality of lead wires 330 are correspondingly connected to the plurality of pin pads 312. The leads 330 electrically connect the chip 310 and the substrate 320, particularly by connecting the pin pads 312 and the substrate pads 322.

Alternatively, the pin pad 312 may be a metal pad, such as a circular or square pad formed of copper metal. The substrate pad 332 may be a metal copper pad on a substrate, or a substrate gold finger (connecting finger). The lead 330 may be a gold (Au) wire, a copper (Cu) wire, a silver (Ag) wire, or other metal wires and alloy wires. The wire diameter of the lead 330 may be between 15.2 μm and 25.4 μm. The embodiment of the present application does not limit this.

Optionally, the lead protection adhesive 360 completely covers the first solder joint formed by the lead 330 on the substrate solder pad 322 and the second solder joint formed by the lead on the pin solder pad 312, so as to protect the first solder joint and the second solder joint, prevent the first solder joint and the second solder joint from being corroded by water vapor or other external environmental factors, and ensure good environmental reliability.

Optionally, in the dispensing process, dispensing is performed at the line arc of the lead 330, and the dispensing amount is controlled, so that the lead protection glue 360 flows to the first solder point on the pin pad 312 and the second solder point on the substrate pad 322 through the fluidity of the glue, and completely covers and protects the two solder points.

Optionally, wires 330 are prepared using Wire Bonding (Wire Bonding) technology to connect the lead pads 312 and the substrate pads 322.

Alternatively, in the embodiment of the present application, the arc height H of the wire 330 prepared by using the wire bonding technology may be any value, that is, the distance H between the plane where the highest point of the wire 330 is located and the surface of the chip 310 may be any value. Specifically, the arc height H is related to the process parameters of wire bonding.

The wire bonding technology includes two forms: ball Bonding (Ball Bonding) and wedge Bonding (WedgeBonding), the basic steps of both Bonding techniques include: and forming a first welding point, forming a lead and finally forming a second welding point. The embodiment of the application can adopt ball bonding or wedge bonding for welding, the two bonding technologies are different in the modes of a welding head and a guide metal wire, the specific welding steps are approximately the same, and the ball bonding is exemplified as follows.

Specifically, the step of connecting the first welding point and the second welding point by adopting a ball bonding method comprises the following steps:

(1) igniting or discharging on the metal wire to form a metal ball;

(2) placing a metal ball on a first bonding pad, applying certain pressure on the first bonding pad, and forming a first welding point on the first bonding pad through thermosonic;

(3) the guide metal wire extends upwards to form a longitudinal wire neck of the lead;

(4) the guide lead is bent and transversely extends to the second bonding pad to form a wire arc of the lead;

(5) forming a second welding point at the second welding pad through thermal ultrasonic;

(6) the metal wire is lifted and broken off, and the metal ball is re-ignited or discharged to form a new metal ball.

When the first bonding pad is a lead bonding pad 312 on a chip and the second bonding pad is a substrate bonding pad 322 on a substrate, the process of connecting the first bonding pad and the second bonding pad by ball bonding is generally called forward routing (forward loop); when the first bonding pad is a substrate bonding pad 322 on the substrate and the second bonding pad is a lead bonding pad 312 on the chip, it is generally called reverse loop (reverse loop). Because the first pad is required to extend upwards to form a wire neck and bend to form a wire arc, the wire arc is limited by the arc height above the first pad, and if the arc height is reduced, excessive bending is caused to break the wire neck, so that the reliability is low.

Typically, the chip 310 is disposed over the substrate 320 such that the upper surface of the pin pad 312 is higher than the upper surface of the substrate pad 322. When the forward wire bonding is adopted, as shown in fig. 7, the lead pad 312 is the first pad, so the upper side of the lead pad 312 has the limitation of the arc height H, which causes the limitation and the thickening of the thickness of the chip packaging structure. When reverse routing is adopted, as shown in fig. 8, the substrate pad 322 is a first pad, and the lead needs to be drawn upwards to extend to the pin pad, so that bending of radian is realized in the drawing process, and design of ultra-low arc height can be realized.

It should be understood that the solution of the embodiment of the present application can be applied to the lead 330 formed by forward routing, and can also be applied to the lead 330 formed by reverse routing, which is not limited in the embodiment of the present application.

Optionally, in an ultra-low wire loop implementation, the loop height H of the wire 330 is not greater than 35 μm, i.e., the distance H between the plane where the highest point of the wire 330 is located and the surface of the chip 310 is not greater than 35 μm.

Alternatively, in one possible embodiment, a reverse wire Bond electrical connection is made using a Stand-off bump Bond (SSB) method. Specifically, the process flow of the SSB is as follows:

(1) firing or discharging on the gold wire to form a gold ball 350;

(2) placing a gold ball 350 on the pin pad 312;

(3) lifting and breaking the gold wire, and striking fire or discharging on the gold wire again to form a new gold ball;

(4) placing the gold balls on the substrate bonding pads 322, applying certain pressure on the substrate bonding pads 322, and forming first welding points on the substrate bonding pads 322 through thermosonic;

(5) the guide gold wire extends upwards to form a longitudinal wire neck;

(6) the gold wire is guided to bend and transversely extend to the pin pad 312 to form a wire arc;

(7) applying a certain pressure on the gold ball 350, and forming a second welding point on the pin bonding pad 312 through thermosonic;

(8) the lead is lifted and broken, and the gold wire is ignited or discharged again to form a new gold ball.

As shown in fig. 9, the pin pad 312 and the substrate pad 322 are electrically connected by using an SSB method, and gold balls are formed on both the pin pad 312 and the substrate pad 322, and particularly, the gold balls 350 on the pin pad 312 can protect the pin pad 312 from being damaged when the pin pad 312 is pressed and a solder joint is formed by thermosonic, and can improve the strength of the solder joint at the pin pad 312, which is beneficial to improving reliability.

Specifically, during package bonding, the leads 330 and the gold balls 350 are formed as a unitary structure by ultrasonic heat or other bonding means.

Optionally, as shown in fig. 9, when the above-mentioned reverse bonding method is used to realize the ultra-low wire loop, a first segment of the leads 330 is located above the chip 310, and a distance D between a plane where a lowest point of the first segment of the leads is located and the surface of the chip is not greater than 10 μm.

In particular, as shown in fig. 10, when the distance D between the lowest point of the first lead and the chip surface is 0, the lead 330 may contact the upper surface of the chip 310.

Optionally, the chip 310 further includes a test metal unit 313, and the test metal unit 313 is disposed in an edge region of the chip not under the lead. Hereinafter, the test metal unit 313 may be one test metal unit or a plurality of test metal units.

Specifically, in the embodiment of the present application, in the process of manufacturing chips on a wafer (wafer), one chip 310 includes a circuit area 301 and a non-circuit area 302, where the circuit area 301 includes all circuit structures of the chip, pin pads and other areas with electrical characteristics that need to be actually used. The non-circuit area 302 is a blocking channel between chips, and does not include a device or structure electrically connected to the chips. Between the circuit area and the circuit area of the chip, that is, on the non-circuit area of the chip, a plurality of metal test units 313(test key) are placed, the plurality of metal test units are used for monitoring the pattern of the semiconductor process, the structure of the plurality of metal test units can be the same as that of the transistor or other semiconductor devices in the chip circuit, and the metal test units comprise a metal layer, a dielectric layer, a passivation layer and other device laminated structures.

It should be understood that, in the embodiment of the present application, the test metal unit 313 may also be a metal region or a conductive region for other functional purposes, for example, a mark or a line made of a metal material or other conductive materials, which is not limited in the embodiment of the present application.

Specifically, as shown in fig. 11, a plurality of pin pads 312 are located at the edge of the circuit area 301, so as to facilitate connection with other electronic components through a plurality of leads 330. A plurality of test metal units 313 are located in the non-circuit area 302, i.e., the peripheral area of the chip 310, and are located in the area under the plurality of leads 330.

Preferably, in one possible implementation, the pin pad 312 is located on one side of the chip 310, and the test metal units 313 are located on the other three sides of the chip 310. It should be understood that when the pin pad 312 is located at one side position in the chip 310, the test metal unit 313 may be located at any one or more of the other three side positions in the chip 310. For example, as shown in fig. 11, the pin pad 312 is located at the right position of the chip 310, and the test metal unit 313 is located at the upper and lower positions of the chip 310. Alternatively, the test metal unit 313 may be located at only one position of the upper, lower, or left positions of the chip 310, or at any two or three positions of the upper, lower, and left positions of the chip 310.

Optionally, the pin pads 312 may also be located at two or three sides of the chip 310, and the test metal units 313 are located at other sides of the chip 310.

Optionally, in another possible embodiment, the test metal unit 313 may also be located at the same side position as the pin pad 312. For example, as shown in fig. 12, the pin pad 312 and the test metal unit 313 are both located at the right side of the chip 310, wherein a lead 330 is connected to the pin pad 312, and the test metal unit 313 is disposed in the lower region between the two leads 330, in other words, the projection of the lead 330 on the chip 310 is not located in the test metal unit 313, but is located in the region between the two test metal units 313.

Through the scheme of the embodiment of the application, the testing metal unit 313 is arranged at the position of the edge area of the chip 310 below the non-lead 330, so that when the pin pad 312 is electrically connected, the ultra-low lead 330 is in contact with the testing metal unit 313, the pin pad 312 is in short circuit connection with the testing metal unit 313, and the pin pad 312 and the chip 310 are damaged.

In the above, as shown in fig. 2 to 10, the chip 310 is disposed above the substrate 320, and the chip 310 is directly adhered to the upper surface of the substrate 320 by the chip adhesive 340, so that the thickness of the chip package structure 30 can be reduced by optimizing the height of the lead protection adhesive 360.

Further, the thickness of the chip package structure 30 may be further reduced by improving the position relationship between the substrate 320 and the chip 310.

Optionally, as shown in fig. 13, a first groove 3201 is formed extending downward on the upper surface of the substrate 320, and at least a portion of the chip 310 is disposed in the first groove 3201 and electrically connected to the substrate 320; for example, the lower surface of the chip 310 is fixedly connected to the bottom of the first groove 3201, and is electrically connected to the substrate 320 through the wires 330.

Optionally, the chip 310 is disposed below a display screen, for example, the display screen 120 in fig. 1, through the substrate 320, and when the chip 310 is an optical fingerprint sensor chip, the chip 310 is configured to receive a fingerprint detection signal returned by reflection or scattering of a human finger above the display screen 120, and detect fingerprint information of the finger based on the fingerprint detection signal.

By disposing at least a portion of the chip 310 in the first groove 3201, the thickness of the chip package structure 30 can be effectively reduced, and by disposing the chip 310 under the display screen 120 through the substrate 320, the use of an adhesive for fixedly connecting the chip 310 and the display screen 120 can be avoided, so as to reduce the cost and complexity of the electronic device. For example, the substrate 320 is fixed to a middle frame of an electronic device in which the chip package structure 30 is located.

In some embodiments, the chip 310 may include a plurality of chips or a chip, for example, the chip 310 may include a plurality of optical fingerprint sensor chips, and the plurality of optical fingerprint sensor chips are disposed side by side in the first groove to be spliced into an optical fingerprint sensor chip assembly. Optical fingerprint sensor chip subassembly can be used for acquireing many fingerprint images simultaneously, can carry out fingerprint identification as a fingerprint image after many fingerprint image concatenations. With continued reference to fig. 13, the chip 310 may be a sensor chip having a photodetection array 3111. Here, the light detection array 3111 may include a plurality of optical sensing units, and each optical sensing unit may specifically include a photodetector or a photosensor. Alternatively, the chip 310 may include a Photo detector array (or referred to as a Photo detector array or a Photo sensor array), which includes a plurality of Photo detectors distributed in an array.

With continued reference to fig. 13, the size of the first groove 3201 may be larger than the size of the chip 310 such that a gap exists between the sidewalls of the chip 310 and the sidewalls of the first groove 3201 for receiving the wire 330. In addition, the size of the first groove 3201 is larger than that of the chip 310, which also reduces the mounting complexity and the dismounting complexity of the chip 310.

The depth of the first groove 3201 may include a thickness of a cover film of the substrate 320 and a thickness of a conductive layer located under the cover film. The coverlay film of the substrate 320 may be an insulating layer for protecting and insulating the conductive layer under the coverlay film. The conductive layer under the cover film is a circuit layer or a wiring layer of the substrate 320, and the chip 310 can be electrically connected to an external device through the circuit layer or the wiring layer of the substrate.

For example, the substrate 320 may include at least two conductive layers, in which case, the depth of the first groove 3201 includes a first conductive layer under the cover film of the substrate 320, and the chip 310 may be electrically connected to a second conductive layer under an insulating layer through a conductive via (e.g., a via penetrating through the insulating layer under the first conductive layer), thereby enabling the chip 310 to be electrically connected to the substrate 320.

With continued reference to fig. 13, the chip 310 may be fixed in the first groove 3201 by the chip bonding adhesive 340 of the chip 310.

It should be understood that the chip 310 may also be fixedly connected to the side wall of the first groove 3201, and may also be fixed in the first groove 3201 by other manners, for example, the chip 310 may be fixed in the first groove 3201 by a snap or a screw, which is not particularly limited in this embodiment.

With continued reference to fig. 13, the lower surface of the substrate 320 may be further provided with a double-sided tape 3203, so as to adhere the substrate 320 to the bottom of the groove of the middle frame of the electronic device 3.

It should be understood that the substrate 320 may also be fixedly connected to the side wall of the groove of the middle frame, or the substrate 320 may also be fixedly disposed in the groove of the middle frame 40 by other means (for example, a snap or a screw), which is not particularly limited in the embodiment of the present invention.

With continued reference to fig. 13, the top surface of the substrate 320 may form a gold finger 3202 of the substrate 320 on one side of the first groove 3201. In other words, the upper surface of the substrate 320 may form a protruding structure of the conductive layer of the substrate 320 at one side of the first groove 3201 to form the gold finger 3202 of the substrate 320.

It should be understood that the present application is not limited to the specific structure of the gold finger 3202 of the substrate 320. As an example, as shown in fig. 13, a second groove is formed on the upper surface of the substrate 320 in a downward extending manner in a first region, a second step is formed on the upper surface of the substrate 320 and the upper surface of the gold finger of the substrate 320 in a second region, the first region is a region where the side of the gold finger of the substrate 320 close to the first groove 3201 is located, and the second region is a region where the side of the gold finger of the substrate 320 far from the first groove 3201 is located. Further, the depth of the second groove may include thicknesses of the cover layer of the substrate 320 and the conductive layer below the cover layer, and the thickness of the first step is equal to the thickness of the conductive layer below the cover layer of the substrate 320, so that a part of the conductive layer of the substrate 320 forms a convex structure with an upward convex surface, thereby forming the gold finger 3202 of the substrate 320.

With continued reference to fig. 13, the chip package structure 30 may further include a flexible circuit board 370 and an anisotropic conductive adhesive film 391. Wherein the flexible circuit board 370 is formed with a gold finger 3701 of the flexible circuit board 370; the gold finger 3701 of the flexible circuit board 370 is electrically connected to the gold finger 3202 of the substrate 320 through the anisotropic conductive adhesive film 391.

For example, the gold finger 3701 of the flexible circuit board 370 may be located at one end of the flexible circuit board 370. That is, one end of the flexible circuit board 370 may be electrically connected to one end of the substrate 320 by pressing the anisotropic conductive adhesive film 391.

The substrate 320 and the flexible circuit board 370 are electrically connected through the gold fingers, so that not only can the insulation between the contact pieces be ensured, but also the conductivity between the substrate 320 and the flexible circuit board 370 can be ensured, particularly, under the condition that the chip 310 comprises a plurality of chips, the plurality of chips on the substrate 320 can be quickly and electrically connected to the flexible circuit board 370 through the gold fingers, and further, the installation complexity and the disassembly complexity can be reduced.

It should be understood that the present application does not limit the specific structure of the gold finger 3701 of the flexible circuit board 370. As an example, as shown in fig. 13, a third groove may be formed in a third region extending upward from the lower surface of the flexible circuit board 370, a third step may be formed between the lower surface of the flexible circuit board 370 and the lower surface of the gold finger of the flexible circuit board 370 in a second region, where the side of the gold finger 3701 of the flexible circuit board 370 away from the first groove 3201 is located, and the side of the gold finger 3701 of the flexible circuit board 370 close to the first groove 3201 is located in the second region.

With reference to fig. 13, the chip package structure 30 may further include a protection adhesive 392 of the anisotropic conductive adhesive film 391, and the protection adhesive 392 may be located at two ends of the anisotropic conductive adhesive film 391 to protect the anisotropic conductive adhesive film 391 and further protect the gold fingers 3701 of the substrate 320 and the gold fingers 3701 of the flexible circuit board 370.

With continued reference to fig. 13, the chip package structure 30 may further include a support 380 and a first foam layer 390, the first foam layer 390 is disposed above the support 380, the first foam layer 390 is disposed with an opening penetrating through the first foam layer 390, and the chip 310 may receive the fingerprint detection signal reflected or scattered by the finger through the opening of the first foam layer 390.

Optionally, the first foam layer 390 may be a foam layer of the chip package structure 30, or may be a foam layer of an electronic device located between the display screen 120 and the middle frame, which is not specifically limited in this application. In other words, when the first foam layer 390 is a foam layer of the chip package structure 30, the first foam layer 390 may directly contact the display screen 120, and further, the first foam layer 390 may be in a compressed state; when the first foam layer 390 is a foam layer of an electronic device between the display screen 120 and the middle frame, it indicates that the chip packaging structure 30 is directly attached to the lower surface of the foam layer below the display screen 120.

It should be appreciated that the bracket 380 may be formed of any material that can be used to fixedly attach the substrate 320 to the first foam layer 390. For example, the bracket 380 may be a bracket formed of double-sided tape.

With continued reference to fig. 13, the side walls of the support 380 near the chip 310 may be aligned with the side walls of the first groove 3201 such that a gap exists between the support 380 and the chip 310 for receiving the leads 330.

Through the gap between the support 380 and the chip 310, the lead 330 can be accommodated, and the lead protection adhesive 360 can be accommodated, so that the conductivity of the lead 330 and the performance of the chip packaging structure 30 are ensured. Moreover, the substrate 320 may be fixed below the display screen 120 through the flexible circuit board 370, so that the chip 310 is fixed below the display screen 120.

For example, as shown in fig. 13, the space for accommodating the lead protecting adhesive 360 includes, but is not limited to, a gap formed between a sidewall of the chip 310 and a sidewall of the first groove 3201, a gap formed between the chip 310 and the support 380, and a gap formed between the chip 310 and the first foam layer 390.

With continued reference to fig. 13, the chip package structure 30 may further include a light path layer 314, wherein the light path layer 314 is used for transmitting the fingerprint detection signal returned by the reflection or scattering of the finger to the chip 310. The optical path layer 314 is disposed above the chip 310 and may be used to implement an optical path design, in this embodiment, the optical path design of the optical path layer 314 may refer to the foregoing optical path design, and the optical path design of the optical component 132 in the optical fingerprint device 130 is not described herein again, and only the optical path design using the microlens layer is selected as an exemplary description. As an alternative embodiment, the light path layer 314 includes a microlens layer, a light blocking layer, the microlens layer may have a microlens array formed by a plurality of microlenses, the light blocking layer has a plurality of micro holes and is disposed below the microlens layer, the micro holes correspond to the microlenses in a one-to-one manner, and the pixel units of the light detection array 3111 correspond to the microlenses in a one-to-one manner. Optionally, the optical path layer may further include other optical film layers, and other optical film layers, such as a dielectric layer or a passivation layer, may also be formed between the specific microlens layer and the chip 310. Optionally, the optical path layer 314 may further include a filter disposed above the microlens layer or in the optical path between the microlens layer and the chip 310, which is specifically referred to above and will not be repeated here.

In the present embodiment, the optical filter is used to reduce the undesired ambient light in the fingerprint sensing to improve the optical sensing of the chip 310 to the received light. The filter may specifically be used to filter out light of a particular wavelength, e.g., near infrared light and portions of red light, etc. For example, a human finger absorbs most of the energy of light with a wavelength below 580nm, and if one or more optical filters or optical filter layers are designed to filter light with a wavelength from 580nm to infrared, the effect of ambient light on the optical detection in fingerprint sensing can be greatly reduced.

For example, the optical filter may comprise one or more optical filters, which may be configured, for example, as a band pass filter, to allow transmission of light emitted by the OLED screen while blocking other light components, such as infrared light, in sunlight. Such optical filtering may effectively reduce background light caused by sunlight when the chip package structure 30 is used outdoors under a screen. The one or more optical filters may be implemented, for example, as optical filter coatings formed on one or more continuous interfaces, or may be implemented as one or more discrete interfaces. It should be understood that the optical filter may be fabricated on the surface of any optical component in the optical path layer 314, or along the optical path from the reflected light formed by finger reflection to the chip 310, which is not specifically limited in this embodiment.

In addition, the light inlet surface of the optical filter may be provided with an optical inorganic coating or an organic blackened coating, so that the reflectivity of the light inlet surface of the optical filter is lower than a first threshold value, for example, 1%, thereby ensuring that the chip 310 can receive sufficient optical signals, and further improving the fingerprint identification effect.

Take the example that the filter is fixed on the upper surface of the chip 310 by a fixing device. The optical filter and the chip 310 may be fixed by dispensing in a non-photosensitive region of the chip 310, and a gap exists between the optical filter and the photosensitive region of the chip 310. Or the lower surface of the filter is fixed on the upper surface of the chip 310 by glue with a refractive index lower than a preset refractive index, for example, the preset refractive index includes but is not limited to 1.3.

It should be noted that when the optical filter is attached to the upper surface of the chip 310 by filling the optical adhesive, if the thickness of the adhesive covered on the upper surface of the chip 310 is not uniform, a newton ring phenomenon may occur, thereby affecting the fingerprint identification effect.

Compared with the implementation mode that the optical filter is fixed above the chip 310 through the fixing device, when the optical filter is a coating film on the chip 310 or other optical film layers, the adoption of optical filters such as blue glass or white glass substrates is avoided, so that the Newton ring phenomenon can be avoided, the fingerprint identification effect is further improved, and the thickness of the chip packaging structure 30 can be effectively reduced.

With continued reference to fig. 13, the chip package structure 30 may further include an image processor 371, wherein the image processor 371 is electrically connected to the substrate 320. For example, the image processor 371 is disposed on the flexible circuit board 370, and is electrically connected to the substrate 320 through the flexible circuit board 370. For example, the image processor 371 may be a Microprocessor (MCU) for receiving a fingerprint detection signal (e.g., a fingerprint image) from the chip 310 via the flexible circuit board 370 and performing simple processing on the fingerprint detection signal.

With continued reference to fig. 13, the chip package structure 30 may further include at least one capacitor 372, the at least one capacitor 372 is electrically connected to the substrate 320, and the at least one capacitor 372 is used for optimizing the fingerprint detection signal collected by the chip 310. For example, the at least one capacitor 372 is disposed on the flexible circuit board 370 and electrically connected to the substrate 320 and thus the chip 310 through the flexible circuit board 370, and the at least one capacitor 372 may be used to optimize the fingerprint detection signal collected by the chip 310. For example, the at least one capacitor 372 is used for filtering the fingerprint detection signal collected by the chip 310. The chip 310 may correspond to one or more capacitors. For example, each of the chips 310 corresponds to one or more capacitors.

With continued reference to fig. 13, the chip package structure 30 may further include a connector 373, the connector 373 is electrically connected to the substrate 320, for example, the connector 373 may be electrically connected to the substrate 320 through the flexible circuit board 370. The connector 373 may be used to connect with an external device or other components of the electronic apparatus, so as to achieve communication with the external device or other components of the electronic apparatus. For example, the connector 373 may be used to connect to a processor of the electronic device, so that the processor of the electronic device receives the fingerprint detection signal processed by the image processor 373 and performs fingerprint identification based on the processed fingerprint detection signal.

It should be understood that fig. 13 is only an example of the present application and should not be construed as limiting the present application.

For example, in some alternative embodiments, the chip 310 may be provided with Through Silicon Vias (TSVs) and/or Redistribution layers (RDLs) for guiding the leads of the chip 310 from the top surface to the bottom surface. Through the TSV and/or RDL, a wiring layer may be formed on the lower surface of the chip 310. The wiring layer may be electrically connected to the wiring layer in the first groove 3201 of the substrate 320 through the wires 330, at this time, the outer wall of the chip 310 may be attached to the sidewall of the first groove 3201, and a gap for accommodating the wires 330 may be provided between the lower surface of the chip 310 and the bottom of the first groove 3201. Further, the chip 310 may further form a protection layer on the surface of the wiring layer for protecting and insulating the chip 310.

Alternatively, the bracket 380 may be a bracket formed of a material having an adhesive property, for example, the bracket 380 may be a bracket formed of a double-sided tape, but the embodiment of the present application is not limited thereto. For example, the bracket 380 may also be a bracket formed of a material without adhesive property, for example, the material of the bracket 380 includes, but is not limited to, metal, resin, glass fiber composite board, etc., and in this case, the bracket 380 needs to be fixed between the first foam layer 390 and the substrate 320.

It should be understood that when the support 380 is a support structure without adhesive property, the chip packaging structure 30 may further include a double-sided adhesive and a support fixing adhesive in addition to the support 380, wherein the lower surface of the support 380 is connected above the substrate 320 by the support fixing adhesive, and the upper surface of the support 380 is connected to the first foam layer 390 by the double-sided adhesive. As an alternative embodiment, the bracket 380 and the bracket fixing adhesive may also be an integrated structure, which serves as a bracket, for example, the bracket may be a bracket formed by a single-sided adhesive for connecting the substrate 320, and the upper surface of the bracket is connected to the first foam layer 390 through a double-sided adhesive.

As shown in fig. 14, the present application also provides an electronic device 3 including the chip packaging structure 30 of any of the above-mentioned embodiments.

Optionally, the electronic device may further include a display screen 120, and the chip package structure 30 is disposed below the display screen 120.

It should be understood that the specific examples in the embodiments of the present application are for the purpose of promoting a better understanding of the embodiments of the present application and are not intended to limit the scope of the embodiments of the present application.

It is to be understood that the terminology used in the embodiments of the present application and the appended claims is for the purpose of describing particular embodiments only and is not intended to be limiting of the embodiments of the present application. For example, as used in the examples of this application and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

Those of ordinary skill in the art will appreciate that the elements of the examples described in connection with the embodiments disclosed herein may be implemented as electronic hardware, computer software, or combinations of both, and that the components and steps of the examples have been described above generally in terms of their functionality in order to clearly illustrate the interchangeability of hardware and software. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the implementation. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present application.

In the several embodiments provided in the present application, it should be understood that the disclosed system and apparatus may be implemented in other manners. For example, the above-described apparatus embodiments are merely illustrative, and for example, the division of the units is only one logical division, and other divisions may be realized in practice, for example, a plurality of units or components may be combined or integrated into another system, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection through some interfaces, devices or units, and may also be an electric, mechanical or other form of connection.

The units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of the embodiments of the present application.

In addition, functional units in the embodiments of the present application may be integrated into one processing unit, or each unit may exist alone physically, or two or more units are integrated into one unit. The integrated unit can be realized in a form of hardware, and can also be realized in a form of a software functional unit.

The integrated unit, if implemented in the form of a software functional unit and sold or used as a stand-alone product, may be stored in a computer readable storage medium. Based on such understanding, the technical solution of the present application may be substantially or partially contributed by the prior art, or all or part of the technical solution may be embodied in a software product, which is stored in a storage medium and includes instructions for causing a computer device (which may be a personal computer, a server, or a network device) to execute all or part of the steps of the method according to the embodiments of the present application. And the aforementioned storage medium includes: various media capable of storing program codes, such as a usb disk, a removable hard disk, a Read Only Memory (ROM), a Random Access Memory (RAM), a magnetic disk, or an optical disk.

While the invention has been described with reference to specific embodiments, the scope of the invention is not limited thereto, and those skilled in the art can easily conceive various equivalent modifications or substitutions within the technical scope of the invention. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. A chip package structure, comprising: the chip, the substrate, the leads and the lead protection glue;

the lead is used for electrically connecting the chip and the substrate;

2. The chip package structure according to claim 1, wherein a highest point of the lead protection paste is not lower than a highest point of the lower edge of the lead.

3. The chip package structure according to claim 2, wherein the lead protection paste covers lower edges of the leads.

4. The chip package structure according to any one of claims 1 to 3, wherein the chip is an optical fingerprint sensor chip for receiving a fingerprint detection signal returned by reflection or scattering of a human finger and detecting fingerprint information of the finger based on the fingerprint detection signal.

5. The chip packaging structure according to any one of claims 1-3, wherein the chip comprises a pin pad, the substrate comprises a substrate pad;

6. The chip packaging structure according to claim 5, wherein the lead protection adhesive covers a first solder joint formed by the lead on the substrate pad and a second solder joint formed by the lead on the pin pad for protecting the first solder joint and the second solder joint.

7. The chip package structure according to claim 5, wherein the leads are connected to the pin pads by metal balls.

8. The chip package structure according to claim 7, wherein the leads and the metal balls are of an integrally molded structure.

9. The chip package structure according to claim 7, wherein a first one of the leads is located above the chip, and a distance between a lowest point of the first lead and the surface of the chip is not greater than 10 μm.

10. The chip package structure according to claim 9, wherein a lowest point of the first length of leads is in contact with an upper surface of the chip.

11. The chip package structure according to any one of claims 1 to 3, wherein a distance between a highest point of the leads and the chip surface is not more than 35 μm.

12. The chip package structure according to claim 5, wherein the chip further comprises: testing the metal unit;

13. The chip package structure according to claim 12, wherein the pin pad is located on one side of the chip and the test metal unit is located on at least one of the other three sides of the chip.

14. The chip package structure according to claim 5, wherein the leads are prepared from the substrate pads to the lead pads by a reverse wire bonding process.

15. The chip package structure according to any one of claims 1 to 3, wherein the leads are gold, silver or copper wires; and/or the presence of a gas in the gas,

the wire diameter of the lead is 15.2-25.4 μm.

16. The chip package structure according to any one of claims 1 to 3, wherein a first groove is formed extending downward from the upper surface of the substrate, and at least a portion of the chip is disposed in the first groove.

17. The chip package structure according to claim 16, wherein the size of the first recess is larger than the size of the chip, such that a gap exists between a sidewall of the chip and a sidewall of the first recess for accommodating the lead.

18. The chip packaging structure according to claim 16, wherein a depth of the first groove comprises a thickness of a cover film of the substrate and a thickness of a conductive layer located under the cover film.

19. An electronic device, comprising:

the chip packaging structure according to one of claims 1 to 18.