CN210051021U - Semiconductor refrigeration piece heat dissipation cooling system - Google Patents
Semiconductor refrigeration piece heat dissipation cooling system Download PDFInfo
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- CN210051021U CN210051021U CN201920872609.6U CN201920872609U CN210051021U CN 210051021 U CN210051021 U CN 210051021U CN 201920872609 U CN201920872609 U CN 201920872609U CN 210051021 U CN210051021 U CN 210051021U
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- connecting plate
- water
- fixedly connected
- cooling system
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Abstract
The utility model discloses a semiconductor refrigeration piece cooling system that dispels heat, connecting plate including relative setting, be provided with locking mechanism on the connecting plate, fixedly connected with absorbs water the fibre cooler on the connecting plate, it is provided with the semiconductor refrigeration piece to absorb water between fibre cooler and the locking mechanism, semiconductor refrigeration piece fixed connection is on the lateral wall of connecting plate, go back fixedly connected with fan on the lateral wall of connecting plate, fixedly connected with fibre imbibition core on the fibre cooler absorbs water, one side of connecting plate is provided with the water container, the one end that absorbs water the fibre cooler was kept away from to the fibre imbibition core is located the water container, the utility model discloses be convenient for will carry out radiating to dispel the heat by the tight back of heat dissipation object clamp, therefore easy operation.
Description
Technical Field
The utility model relates to a semiconductor cooling system specifically is a semiconductor refrigeration piece cooling system that dispels heat.
Background
Adopt semiconductor refrigeration technology to cool off the object, its itself also can produce great heat, if this part heat can't be discharged, then the unable normal work of semiconductor refrigeration piece, consequently the heat dissipation of semiconductor refrigeration piece is very crucial, and conventional radiating mode is directly to install the radiator additional at refrigeration piece hot junction, only takes away refrigeration piece heat through fan convection heat dissipation effect, and the radiating efficiency is low.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a semiconductor refrigeration piece heat dissipation cooling system to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme:
the utility model provides a semiconductor refrigeration piece cooling system that dispels heat, includes the relative connecting plate that sets up, be provided with locking mechanism on the connecting plate, fixedly connected with absorbs water the fibre cooler on the connecting plate, it is provided with the semiconductor refrigeration piece to absorb water between fibre cooler and the locking mechanism, semiconductor refrigeration piece fixed connection is on the lateral wall of connecting plate, go back fixedly connected with fan on the lateral wall of connecting plate, the last fixedly connected with fibre imbibition core of the fibre cooler that absorbs water, one side of connecting plate is provided with the water container, the one end that the fibre imbibition core was kept away from the fibre cooler that absorbs water is located the water container.
As a further aspect of the present invention: the water absorption fiber cooler comprises metal fins, the metal fins are fixedly connected to a connecting plate, water absorption fiber membranes are fixedly connected to the outer sides of the metal fins, and the water absorption fiber membranes are fixedly connected with a fiber liquid absorption core.
As a further aspect of the present invention: and a through hole for one end of the fiber liquid absorbing core to pass through is formed in the water container.
As a further aspect of the present invention: the top end of the water container is provided with a water filling port.
As a further aspect of the present invention: the locking mechanism comprises a locking plate, the locking plate is movably connected to the connecting plate through an adjusting mechanism, a baffle is fixedly connected to the connecting plate, and the baffle is arranged relative to the locking plate.
As a further aspect of the present invention: the locking mechanism comprises an adjusting bolt, the adjusting bolt is in threaded connection with the locking plate, and one end of the adjusting bolt is rotatably connected to the connecting plate.
As a further aspect of the present invention: a sliding groove used for sliding connection of the locking plate is formed in the side wall of the connecting plate, and one end of the adjusting bolt is rotatably connected to the side wall of the sliding groove.
Compared with the prior art, the beneficial effects of the utility model are that: the locking mechanism is arranged on the connecting plate, so that the object to be cooled can be clamped on the connecting plate conveniently; one end of the fiber liquid absorbing core, which is far away from the water absorbing fiber cooler, is positioned in the water container, so that the water in the water container is conveniently guided into the absorbing fiber cooler through the fiber liquid absorbing core; the fan and the semiconductor refrigerating sheet are arranged on one side of the connecting plate, so that heat dissipation of an object to be cooled is facilitated; the semiconductor cooling fin heat dissipation cooling system is convenient for heat dissipation after clamping a heat dissipation object needing heat dissipation, and therefore operation is simple.
Drawings
FIG. 1 is a schematic view of a semiconductor cooling plate heat dissipation cooling system;
FIG. 2 is a schematic diagram of a water absorbent fiber cooler in a semiconductor cooling fin heat dissipation cooling system;
in the figure: the device comprises a connecting plate 1, a water absorption fiber cooler 2, a semiconductor refrigerating sheet 3, a fan 4, a fiber liquid absorbing core 5, a water container 6, metal fins 7, a water absorption fiber membrane 8, a water filling opening 9, a locking plate 10, a baffle plate 11, an adjusting bolt 12 and a sliding groove 13.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Please refer to fig. 1-2, in the embodiment of the present invention, a semiconductor refrigeration fin heat dissipation cooling system, including the relative connecting plate 1 that sets up, be provided with locking mechanism on the connecting plate 1, fixedly connected with water absorption fiber cooler 2 on the connecting plate 1, be provided with semiconductor refrigeration fin 3 between water absorption fiber cooler 2 and the locking mechanism, semiconductor refrigeration fin 3 fixed connection is on the lateral wall of connecting plate 1, still fixedly connected with fan 4 on the lateral wall of connecting plate 1, fixedly connected with fibre wick 5 on the water absorption fiber cooler 2, one side of connecting plate 1 is provided with water container 6, the one end that fibre wick 5 kept away from water absorption fiber cooler 2 is located water container 6.
A through hole for one end of the fiber liquid absorption core 5 to pass through is formed in the water container 6, and one end of the fiber liquid absorption core 5 can conveniently pass through the water container 6 and is positioned on the inner side of the water container.
The top end of the water container 6 is provided with a water filling port 9, and the water filling port 9 is convenient for filling water into the water container 6.
Locking mechanism includes locking plate 10, and locking plate 10 passes through adjustment mechanism swing joint on connecting plate 1, fixedly connected with baffle 11 on connecting plate 1, and baffle 11 sets up relative locking plate 10.
The locking mechanism comprises an adjusting bolt 12, the adjusting bolt 12 is in threaded connection with the locking plate 10, one end of the adjusting bolt 12 is rotatably connected onto the connecting plate 1, when a heat-dissipating object 14 needs to be clamped through the locking mechanism, the heat-dissipating object is placed between the baffle 11 and the locking plate 10, an operator manually rotates the adjusting bolt 12, the adjusting bolt 12 is in threaded connection with the locking plate 10, so that the locking plate 10 is moved, and the heat-dissipating object is pressed tightly in the moving process of the locking plate 10.
The lateral wall of the connecting plate 1 is provided with a sliding groove 13 for the sliding connection of the locking plate 10, one end of the adjusting bolt 12 is rotatably connected to the lateral wall of the sliding groove 13, and the sliding groove 13 is convenient for the sliding connection of the locking plate 10 to the connecting plate 1.
The working principle and the structure of the semiconductor refrigerating sheet 3 and the fan 4 are known, so repeated description is omitted here, and the semiconductor refrigerating sheet 3 and the fan 4 are both electrically connected with the electricity storage device through wires and a control switch.
When the utility model is used, when a heat-radiated object 14 needs to be radiated, the heat-radiated object is placed between the baffle 11 and the locking plate 10, the worker manually rotates the adjusting bolt 12, the movement of the locking plate 10 is realized due to the threaded connection of the adjusting bolt 12 and the locking plate 10, the heat-radiated object is pressed tightly in the moving process of the locking plate 10, the moisture in the water container 6 is guided to the surface of the water-absorbing fiber membrane 8 outside the metal fins 7 by the fiber wick 5, the semiconductor refrigeration sheet 3 and the fan 4 work, the moisture in the water-absorbing fiber is evaporated and the air convection action is carried out under the action of the heat generated by the work of the semiconductor refrigeration sheet 3 and the fan 4, the heat of the semiconductor refrigeration sheet 3 is taken away, the moisture in the water-absorbing fiber on the surface of the metal fins 7 is evaporated, and the moisture in the water container 6 is continuously guided to the surface of the water-absorbing fiber membrane 8 by the fiber wick 5, thereby improving the heat dissipation effect.
Although the present description is described in terms of embodiments, not every embodiment includes only a single embodiment, and such description is for clarity only, and those skilled in the art should be able to integrate the description as a whole, and the embodiments can be appropriately combined to form other embodiments as will be understood by those skilled in the art.
Therefore, the above description is only a preferred embodiment of the present application, and is not intended to limit the scope of the present application; all changes which come within the meaning and range of equivalency of the claims are to be embraced within their scope.
Claims (7)
1. The utility model provides a semiconductor refrigeration piece cooling system that dispels heat which characterized in that: including relative connecting plate (1) that sets up, be provided with locking mechanism on connecting plate (1), fixedly connected with fiber cooler (2) that absorb water is gone up in connecting plate (1), be provided with semiconductor refrigeration piece (3) between fiber cooler (2) and the locking mechanism that absorb water, semiconductor refrigeration piece (3) fixed connection is on the lateral wall of connecting plate (1), still fixedly connected with fan (4) on the lateral wall of connecting plate (1), fixedly connected with fiber wick (5) is gone up in fiber cooler (2) that absorb water, one side of connecting plate (1) is provided with water container (6), the one end that fiber cooler (2) that absorb water were kept away from in fiber wick (5) is located water container (6).
2. The semiconductor chilling plate heat dissipation and cooling system according to claim 1, wherein the water absorption fiber cooler (2) comprises metal fins (7), the metal fins (7) are fixedly connected to the connecting plate (1), a water absorption fiber membrane (8) is fixedly connected to the outer sides of the metal fins (7), and the water absorption fiber membrane (8) is fixedly connected to the fiber liquid absorption core (5).
3. The semiconductor chilling plate heat dissipation and cooling system according to claim 1, wherein the water container (6) is provided with a through hole for one end of the fiber wick (5) to pass through.
4. The semiconductor chilling plate heat dissipation and cooling system according to claim 1, wherein a water filling port (9) is formed at the top end of the water container (6).
5. The semiconductor chilling plate heat dissipation and cooling system according to claim 1, wherein the locking mechanism comprises a locking plate (10), the locking plate (10) is movably connected to the connecting plate (1) through an adjusting mechanism, a baffle (11) is fixedly connected to the connecting plate (1), and the baffle (11) is arranged opposite to the locking plate (10).
6. The semiconductor chilling plate heat dissipation and cooling system according to claim 5, wherein the locking mechanism comprises an adjusting bolt (12), the adjusting bolt (12) is in threaded connection with the locking plate (10), and one end of the adjusting bolt (12) is rotatably connected to the connecting plate (1).
7. The semiconductor chilling plate heat dissipation and cooling system according to claim 6, wherein a sliding groove (13) for sliding connection of the locking plate (10) is formed in a side wall of the connecting plate (1), and one end of the adjusting bolt (12) is rotatably connected to the side wall of the sliding groove (13).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920872609.6U CN210051021U (en) | 2019-06-11 | 2019-06-11 | Semiconductor refrigeration piece heat dissipation cooling system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920872609.6U CN210051021U (en) | 2019-06-11 | 2019-06-11 | Semiconductor refrigeration piece heat dissipation cooling system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210051021U true CN210051021U (en) | 2020-02-11 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920872609.6U Active CN210051021U (en) | 2019-06-11 | 2019-06-11 | Semiconductor refrigeration piece heat dissipation cooling system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210051021U (en) |
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2019
- 2019-06-11 CN CN201920872609.6U patent/CN210051021U/en active Active
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