CN210042386U

CN210042386U - High-heat-dissipation double-sided circuit board

Info

Publication number: CN210042386U
Application number: CN201920883173.0U
Authority: CN
Inventors: 吴绍鑫
Original assignee: Meizhou Yuanfeng Technology Co Ltd
Current assignee: Meizhou Yuanfeng Technology Co Ltd
Priority date: 2019-06-12
Filing date: 2019-06-12
Publication date: 2020-02-07
Anticipated expiration: 2029-06-12

Abstract

The utility model discloses a high radiating double-sided circuit board, including frame and inside casing, the fan is installed to the inside upper end of frame, and the downside of fan is provided with the chute, the upper end in while chute is provided with the cushion collar, the inside of cushion collar is provided with buffer spring, and buffer spring's the inner is through buffer slot and buffer shaft interconnect, the lower extreme of buffer shaft is fixed with the connecting block simultaneously, the inside casing sets up the downside at the connecting block, and the inside upper end of inside frame has seted up the through-hole, the inside of inside frame is provided with puts the thing groove, and put both ends all be provided with the support frame about the thing groove, the outer end of support frame is fixed with the connecting axle simultaneously, the outer end of connecting axle passes through movable groove and adapter sleeve and holding tank interconnect, the inside of adapter sleeve is provided with connecting spring, the. This high radiating two-sided circuit board not only is convenient for dispel the heat to the circuit board body, and convenient to use person is to the dismantlement and the installation of device simultaneously.

Description

High-heat-dissipation double-sided circuit board

Technical Field

The utility model relates to a circuit board technical field specifically is a high radiating double-sided circuit board.

Background

The market competition degree of the printed circuit board industry in China is high, the scale of a single manufacturer is not large, the pricing capacity is limited, along with the expansion of the capacity of the downstream industry and the aggravation of competition, the price competition in the downstream industry is increasingly violent, and the control of the product cost is the focus of attention of a plurality of manufacturers.

In the current state, the versatility of the circuit board can increase the pin amount, but most of the double-sided circuit boards are inconvenient to dissipate heat inside the device, so that the abnormal work of the circuit board body caused by the rise of the heat of the device is caused. Aiming at the problems, the novel design is carried out on the basis of the original double-sided circuit board.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

Not enough to prior art, the utility model provides a high radiating double-sided circuit board has solved most double-sided circuit boards at present and has not been convenient for dispel the heat to the device is inside, leads to the unusual problem of work of the circuit board body that the thermal rising of device leads to.

(II) technical scheme

In order to achieve the above object, the utility model provides a following technical scheme: a high-heat-dissipation double-sided circuit board comprises an outer frame and an inner frame, wherein a fan is installed at the upper end of the inside of the outer frame, a flow groove is formed in the lower side of the fan, a buffer sleeve is arranged at the upper end of the flow groove, a buffer spring is arranged in the buffer sleeve, the inner end of the buffer spring is connected with the buffer shaft through the buffer groove, a connecting block is fixed at the lower end of the buffer shaft, the inner frame is arranged at the lower side of the connecting block, a through hole is formed in the upper end of the inside of the inner frame, ventilation openings are formed in the left end and the right end of the inner frame, a storage groove is formed in the inside of the inner frame, support frames are arranged at the left end and the right end of the storage groove, a connecting shaft is fixed at the outer end of each support frame, the outer end of the connecting shaft is connected with, and the inside of control block runs through there is the control post, the upper end of inside casing passes through spacing groove and stopper and frame interconnect, and the inside of inside casing is provided with the circuit board body.

Preferably, the buffer shaft and the buffer sleeve form a telescopic mechanism through the buffer groove, the buffer spring and the buffer sleeve, and the initial length of the buffer spring is equal to the depth of the buffer groove.

Preferably, the inner frame and the outer frame form a sliding mechanism through a limiting block and a limiting groove, and the sliding direction of the sliding mechanism is up-and-down sliding.

Preferably, the longitudinal section of the vent is in the shape of a right triangle, and the hypotenuse of the right triangle is arranged upwards.

Preferably, the longitudinal section of the support frame is of a concave structure, and two support frames are symmetrically distributed on the vertical axis of the inner frame.

Preferably, the connecting shaft and the connecting sleeve form a telescopic mechanism through the movable groove and the connecting spring, and the initial length of the connecting spring is equal to the depth of the movable groove.

Preferably, the control block and the outer frame form a sliding mechanism through a sliding groove, and the inner surface of the control block and the outer surface of the control column are both in thread structures.

(III) advantageous effects

The utility model provides a high radiating double-sided circuit board. The method has the following beneficial effects:

(1) this high radiating double-sided circuit board, the structure of buffering axle and cushion collar is convenient for cushion the removal of inside casing, avoids the inside collision of inside casing and frame, increases the stability of device, and the structure person of facilitating the use of inside casing and frame dismantles the device, and the person of facilitating the use cleans the chute is inside, and the structure of vent can reduce the hindrance to the air current, and the inside gas of the drive arrangement of being convenient for simultaneously is outwards wafted, increases the cooling efficiency of device.

(2) This high radiating double-sided circuit board, the structure of support frame is convenient for carry out the centre gripping to the circuit board body, avoids rocking in the circuit board body test process, and the structure of connecting axle and adapter sleeve is convenient for install the circuit board body of different width, improves the suitability of device, and the control block is through the fixed to the control block with the structure person of facilitating the use of frame, accomplishes the removal and the fixing to the inside casing.

Drawings

FIG. 1 is a schematic front view of the present invention;

FIG. 2 is a schematic side view of the present invention;

FIG. 3 is an enlarged schematic view of the structure at A of FIG. 1 according to the present invention;

fig. 4 is an enlarged schematic structural diagram of the point B in fig. 2 according to the present invention.

In the figure: 1. an outer frame; 2. a fan; 3. a launder; 4. a buffer sleeve; 5. a buffer spring; 6. a buffer tank; 7. a buffer shaft; 8. connecting blocks; 9. an inner frame; 10. a through hole; 11. a vent; 12. a storage groove; 13. a support frame; 14. accommodating grooves; 15. a connecting shaft; 16. connecting sleeves; 17. a movable groove; 18. a connecting spring; 19. a control block; 20. a chute; 21. a control column; 22. a limiting block; 23. a limiting groove; 24. the circuit board body.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

As shown in fig. 1-4, the utility model provides a technical solution: a high-heat-dissipation double-sided circuit board comprises an outer frame 1, a fan 2, a flow groove 3, a buffer sleeve 4, a buffer spring 5, a buffer groove 6, a buffer shaft 7, a connecting block 8, an inner frame 9, a through hole 10, a vent 11, a storage groove 12, a support frame 13, a storage groove 14, a connecting shaft 15, a connecting sleeve 16, a movable groove 17, a connecting spring 18, a control block 19, a sliding groove 20, a control column 21, a limiting block 22, a limiting groove 23 and a circuit board body 24, wherein the fan 2 is installed at the upper end inside the outer frame 1, the flow groove 3 is arranged on the lower side of the fan 2, the buffer sleeve 4 is arranged at the upper end of the flow groove 3, the buffer spring 5 is arranged inside the buffer sleeve 4, the inner end of the buffer spring 5 is connected with the buffer shaft 7 through the buffer groove 6, the connecting block 8 is fixed at the lower end of the buffer shaft 7, meanwhile, the left end and the right end of the inner frame 9 are both provided with ventilation openings 11, an article placing groove 12 is arranged in the inner frame 9, the left end and the right end of the article placing groove 12 are both provided with support frames 13, the outer end of each support frame 13 is fixed with a connecting shaft 15, the outer end of each connecting shaft 15 is mutually connected with an accommodating groove 14 through a movable groove 17 and a connecting sleeve 16, a connecting spring 18 is arranged in each connecting sleeve 16, the rear end of the inner frame 9 is mutually connected with the outer frame 1 through a control block 19 and a sliding groove 20, a control column 21 penetrates through the inside of the control block 19, the upper end of the inner frame 9 is mutually connected with the outer frame 1 through a limiting groove 23 and a limiting;

the buffer shaft 7 and the buffer sleeve 4 form a telescopic mechanism through the buffer groove 6 and the buffer spring 5, the initial length of the buffer spring 5 is equal to the depth of the buffer groove 6, and the buffer shaft 7 and the buffer sleeve 4 are convenient to buffer the movement of the inner frame 9, so that the collision between the inner frame 9 and the inner part of the outer frame 1 is avoided, and the stability of the device is improved;

the inner frame 9 and the outer frame 1 form a sliding mechanism through a limiting block 22 and a limiting groove 23, the sliding direction of the sliding mechanism is up and down sliding, the structure of the inner frame 9 and the outer frame 1 is convenient for a user to disassemble the device, and the user can clean the inside of the chute 3 conveniently;

the longitudinal section of the vent 11 is in the shape of a right triangle, and the bevel edge of the right triangle is arranged upwards, so that the structure of the vent 11 can reduce the obstruction to airflow, and meanwhile, the air in the device can be driven to float outwards, and the cooling efficiency of the device is increased;

the longitudinal section of the support frame 13 is of a concave structure, two support frames 13 are symmetrically distributed about the vertical axis of the inner frame 9, the structure of the support frame 13 is convenient for clamping the circuit board body 24, and the circuit board body 24 is prevented from shaking in the test process;

the connecting shaft 15 and the connecting sleeve 16 form a telescopic mechanism through the movable groove 17 and the connecting spring 18, the initial length of the connecting spring 18 is equal to the depth of the movable groove 17, and the connecting shaft 15 and the connecting sleeve 16 are convenient to mount circuit board bodies 24 with different widths, so that the applicability of the device is improved;

the control block 19 and the outer frame 1 form a sliding mechanism through the sliding groove 20, the inner surface of the control block 19 and the outer surface of the control column 21 are both in a thread structure, and the structure of the control block 19 and the outer frame 1 is convenient for a user to complete the movement and fixation of the inner frame 9 through the fixation of the control block 19.

When the circuit board clamping device is used, according to the figures 1 and 3, firstly, a user places a circuit board body 24 in a concave position in a support frame 13, the connecting spring 18 in a compressed state gives the connecting shaft 15 and the support frame 13 to move towards the circuit board body 24 to clamp the circuit board body 24, the user aligns a control block 19 with a sliding groove 20, a limiting block 22 aligns with the inside of a limiting groove 23, the control block 19 is intercepted by threads of a control column 21 and the control block 19, the inner frame 9 is pushed to push towards the inside of the sliding groove 3, when the inner frame 9 pushes the connecting block 8 to move backwards, the buffer spring 5 is in a compressed state, the buffer spring 5 gives downward pushing force to the buffer shaft 7 and the connecting block 8, the inner frame 9 is abutted against, collision between the inner frame 9 and the outer frame 1 is avoided, and the safety;

according to fig. 2 and 4, when the circuit board body 24 is in an operating state, a user can turn on the fan 2, so that the fan 2 blows air inside the chute 3 to move towards the lower end of the chute 3, and the air passing through the through hole 10 penetrates through the inside of the inner frame 9 and flows out downwards through the vent 11, the structure of the vent 11 can avoid causing obstruction to air flow, reduce the workload of the fan 2, and avoid the waste of working resources of the whole device, which is the working principle of the high-heat-dissipation double-sided circuit board, and the contents not described in detail in this specification belong to the prior art known by those skilled in the art.

In conclusion, the high-heat-dissipation double-sided circuit board has the advantages that the buffer shaft 7 and the buffer sleeve 4 are convenient to buffer the movement of the inner frame 9, the collision between the inner frame 9 and the inner frame 1 is avoided, the stability of the device is improved, the structure of the inner frame 9 and the outer frame 1 is convenient for a user to disassemble the device, the user can clean the inside of the chute 3 conveniently, the structure of the vent 11 can reduce the obstruction to the air flow, meanwhile, the air in the device can be driven to float outwards, the cooling efficiency of the device is improved, the structure of the support frame 13 is convenient to clamp the circuit board body 24, the shaking in the testing process of the circuit board body 24 is avoided, the structure of the connecting shaft 15 and the connecting sleeve 16 is convenient to install the circuit board bodies 24 with different widths, the applicability of the device is improved, and the control block 19 and the structure of the outer, the movement and fixation of the inner frame 9 are completed.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a high radiating double-sided circuit board, includes frame (1) and inside casing (9), its characterized in that: the fan (2) is installed at the upper end of the inner part of the outer frame (1), the flow groove (3) is arranged on the lower side of the fan (2), the buffer sleeve (4) is arranged at the upper end of the flow groove (3), the buffer spring (5) is arranged in the buffer sleeve (4), the inner end of the buffer spring (5) is connected with the buffer shaft (7) through the buffer groove (6), the connecting block (8) is fixed at the lower end of the buffer shaft (7), the inner frame (9) is arranged on the lower side of the connecting block (8), the through hole (10) is formed in the upper end of the inner frame (9), the ventilation openings (11) are formed in the left end and the right end of the inner frame (9), the object placing groove (12) is formed in the inner part of the inner frame (9), the supporting frames (13) are arranged at the left end and the right end of the object placing groove (12), the outer end of connecting axle (15) passes through activity groove (17) and adapter sleeve (16) and holding tank (14) interconnect, the inside of adapter sleeve (16) is provided with connecting spring (18), the rear end of inside casing (9) is through control block (19) and spout (20) and frame (1) interconnect, and the inside of control block (19) runs through there is control post (21), the upper end of inside casing (9) is through spacing groove (23) and stopper (22) and frame (1) interconnect, and the inside of inside casing (9) is provided with circuit board body (24).

2. The double-sided circuit board with high heat dissipation according to claim 1, wherein: buffer shaft (7) constitute telescopic machanism through buffer slot (6) and buffer spring (5) and cushion collar (4), and the initial length of buffer spring (5) equals the degree of depth of buffer slot (6).

3. The double-sided circuit board with high heat dissipation according to claim 1, wherein: the inner frame (9) and the outer frame (1) form a sliding mechanism through a limiting block (22) and a limiting groove (23), and the sliding direction of the sliding mechanism is up-down sliding.

4. The double-sided circuit board with high heat dissipation according to claim 1, wherein: the longitudinal section of the ventilation opening (11) is in the shape of a right triangle, and the hypotenuse of the right triangle is arranged upwards.

5. The double-sided circuit board with high heat dissipation according to claim 1, wherein: the longitudinal section of the support frame (13) is of a concave structure, and two support frames (13) are symmetrically distributed around the vertical axis of the inner frame (9).

6. The double-sided circuit board with high heat dissipation according to claim 1, wherein: the connecting shaft (15) and the connecting sleeve (16) form a telescopic mechanism through the movable groove (17) and the connecting spring (18), and the initial length of the connecting spring (18) is equal to the depth of the movable groove (17).

7. The double-sided circuit board with high heat dissipation according to claim 1, wherein: the control block (19) and the outer frame (1) form a sliding mechanism through the sliding groove (20), and the inner surface of the control block (19) and the outer surface of the control column (21) are both in thread structures.