CN210040160U - Wafer sealing ring - Google Patents
Wafer sealing ring Download PDFInfo
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- CN210040160U CN210040160U CN201921280634.1U CN201921280634U CN210040160U CN 210040160 U CN210040160 U CN 210040160U CN 201921280634 U CN201921280634 U CN 201921280634U CN 210040160 U CN210040160 U CN 210040160U
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- wafer
- sealing
- annular
- seal ring
- protrusions
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Abstract
The utility model provides a wafer seal for form sealedly with wafer surface limit portion, including annular seal base member and annular electrode piece, the annular electrode piece inlay in the annular seal base member, be equipped with a plurality of outside convex archs on the sealed face of annular seal base member. Compared with the prior art, the utility model has the advantages that the bulge deforms by shrinking inwards after being pressed, and effective sealing is formed between the wafer and the sealing surface; after the pressing force applied to the wafer is relieved, the bulge restores the original shape by means of the elastic force of the bulge, the wafer is jacked up from the sealing surface of the annular sealing base body, the wafer is not subjected to the adhesive force of the sealing surface any more, the wafer is greatly convenient to take out, and the wafer is stably and reliably transferred.
Description
Technical Field
The utility model relates to a wet processing procedure technical field of wafer encapsulation specifically is a wafer seal circle.
Background
In the wet process of wafer packaging, only the front surface of the wafer needs to be processed, and generally, the peripheral edge of the wafer needs to be sealed by an annular sealing ring to prevent the solution from penetrating into the back surface of the wafer. After the wafer is processed, the wafer needs to be taken out of the sealing ring, and because the surface of the wafer and the sealing surface of the sealing ring are smooth, a strong adhesive force is generated between the surface of the wafer and the sealing surface of the sealing ring, so that excessive ejection force is needed in the process of taking out the wafer, the wafer is easy to incline, the normal transfer of the wafer is influenced, and even wafer fragments are caused.
SUMMERY OF THE UTILITY MODEL
In order to overcome the defects of the prior art, the utility model aims to provide a wafer sealing ring.
In order to achieve the above object, the technical solution of the present invention is: a wafer sealing ring is used for forming sealing with the edge of the surface of a wafer and comprises an annular sealing base body and an annular electrode plate, wherein the annular electrode plate is embedded in the annular sealing base body, and a plurality of bulges protruding outwards are arranged on the sealing surface of the annular sealing base body.
Compared with the prior art, the utility model has the advantages that the bulge deforms by shrinking inwards after being pressed, and effective sealing is formed between the wafer and the sealing surface; after the pressing force applied to the wafer is relieved, the bulge restores the original shape by means of the elastic force of the bulge, the wafer is jacked up from the sealing surface of the annular sealing base body, the wafer is not subjected to the adhesive force of the sealing surface any more, the wafer is greatly convenient to take out, and the wafer is stably and reliably transferred.
Further, the protrusions are prismatic, cylindrical, pyramidal, conical, or hemispherical.
Further, the height of the protrusions is 0.1-1 mm.
Further, the number of the protrusions is 2-1000.
By adopting the preferable scheme, reasonable shapes, protrusion heights and protrusion layout quantity can be selected according to requirements, so that the sealing performance and the shape recovery capability of the protrusions are considered.
Further, the protrusions are distributed in a uniform array or irregularly distributed along the circumference.
By adopting the preferable scheme, the uniform and stable ejection force is provided for the wafer.
Furthermore, the annular sealing substrate is made of rubber or silica gel.
Furthermore, the annular electrode plate is made of copper, stainless steel, titanium and the like or metal-based alloy.
Adopt above-mentioned preferred scheme, rubber or silica gel material corrosion resistance is strong, and the leakproofness is good, and ageing resistance is strong, has improved life.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a schematic structural diagram of an embodiment of the present invention;
FIG. 2 is an enlarged view of a portion of FIG. 1 at A;
FIG. 3 is a cross-sectional view of a wafer seal ring;
FIG. 4 is a schematic view of a wafer compression seal;
FIG. 5 is a schematic view of the wafer after the wafer is released from pressure.
Names of corresponding parts represented by numerals and letters in the drawings:
11-annular sealing base; 111-a sealing face; 112-a bump; 12-an annular electrode plate; 121-a conductive contact surface; 2-wafer.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
As shown in fig. 1 to 3, an embodiment of the present invention is: a wafer sealing ring is used for forming sealing with the edge of the surface of a wafer and comprises an annular sealing base body 11 and an annular electrode plate 12, wherein the annular electrode plate 12 is embedded in the annular sealing base body 11, and a sealing surface 111 of the annular sealing base body 11 is provided with a plurality of protrusions 112 protruding outwards.
The beneficial effect of adopting above-mentioned technical scheme is: as shown in fig. 4, the protrusion 112 is compressed and deformed, so that an effective seal is formed between the wafer 2 and the sealing surface 111, and the wafer 2 is in contact conduction with the conductive contact surface 121 of the annular electrode sheet 12; as shown in fig. 5, after the pressing force applied to the wafer 2 is released, the protrusion 112 recovers its original shape by its own elastic force, and lifts the wafer 2 from the sealing surface 111 of the annular sealing substrate, so that the wafer no longer receives the adhesive force of the sealing surface, thereby greatly facilitating the removal of the wafer and realizing the stable and reliable transfer of the wafer.
In other embodiments of the present invention, the protrusions 112 are in the shape of a prism, cylinder, pyramid, cone, hemisphere, or other curved surface. The height of the protrusions 112 is 0.1-1 mm. The number of projections 112 is 2-1000. The beneficial effect of adopting above-mentioned technical scheme is: reasonable shapes, protrusion heights and protrusion layout quantity can be selected according to requirements, so that the sealing performance and the shape recovery capability of the protrusions are considered.
In other embodiments of the present invention, the protrusions 112 are distributed in a circumferentially uniform array or are distributed irregularly. The beneficial effect of adopting above-mentioned technical scheme is: ensuring that a uniform and stable ejection force is provided to the wafer.
In other embodiments of the present invention, the annular sealing base 11 is made of elastic material such as rubber or silica gel. The annular electrode plate 12 is made of copper, stainless steel, titanium or metal-based alloy. The beneficial effect of adopting above-mentioned technical scheme is: the rubber or silica gel material is strong in corrosion resistance, good in sealing performance and strong in ageing resistance, and the service life is prolonged.
The above embodiments are only for illustrating the technical conception and the features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement the present invention, and the protection scope of the present invention can not be limited thereby, and all equivalent changes or modifications made according to the spirit of the present invention should be covered in the protection scope of the present invention.
Claims (7)
1. A wafer sealing ring is used for forming sealing with the edge of the surface of a wafer and is characterized by comprising an annular sealing base body and an annular electrode plate, wherein the annular electrode plate is embedded in the annular sealing base body, and a plurality of bulges protruding outwards are arranged on the sealing surface of the annular sealing base body.
2. The wafer seal ring of claim 1, wherein the protrusions are prismatic, cylindrical, pyramidal, conical, or hemispherical.
3. The wafer seal ring of claim 1, wherein the height of the protrusion is 0.1-1 mm.
4. The wafer seal ring of claim 3 wherein the number of protrusions is 2-1000.
5. The wafer seal ring according to claim 4, wherein the protrusions are distributed in a circumferentially uniform array or irregularly.
6. The wafer seal ring according to claim 1, wherein the annular sealing substrate is made of rubber or silicone.
7. The wafer seal ring according to claim 1, wherein the annular electrode sheet is made of copper, stainless steel, titanium or a metal-based alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921280634.1U CN210040160U (en) | 2019-08-08 | 2019-08-08 | Wafer sealing ring |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921280634.1U CN210040160U (en) | 2019-08-08 | 2019-08-08 | Wafer sealing ring |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210040160U true CN210040160U (en) | 2020-02-07 |
Family
ID=69350919
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921280634.1U Active CN210040160U (en) | 2019-08-08 | 2019-08-08 | Wafer sealing ring |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210040160U (en) |
-
2019
- 2019-08-08 CN CN201921280634.1U patent/CN210040160U/en active Active
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