CN210036008U - Water-cooling heat dissipation device for improving heat exchange efficiency of cold end and hot end - Google Patents
Water-cooling heat dissipation device for improving heat exchange efficiency of cold end and hot end Download PDFInfo
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- CN210036008U CN210036008U CN201920667054.1U CN201920667054U CN210036008U CN 210036008 U CN210036008 U CN 210036008U CN 201920667054 U CN201920667054 U CN 201920667054U CN 210036008 U CN210036008 U CN 210036008U
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- water head
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- end water
- refrigeration
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- 238000001816 cooling Methods 0.000 title claims abstract description 19
- 230000017525 heat dissipation Effects 0.000 title claims description 20
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 128
- 238000005057 refrigeration Methods 0.000 claims abstract description 58
- 239000004065 semiconductor Substances 0.000 claims abstract description 42
- 239000012530 fluid Substances 0.000 claims description 63
- 229920002635 polyurethane Polymers 0.000 claims description 26
- 239000004814 polyurethane Substances 0.000 claims description 26
- 238000009304 pastoral farming Methods 0.000 claims description 13
- 238000009413 insulation Methods 0.000 claims description 9
- 229920000742 Cotton Polymers 0.000 claims description 8
- 238000005516 engineering process Methods 0.000 abstract description 7
- 230000015572 biosynthetic process Effects 0.000 abstract description 3
- 239000013529 heat transfer fluid Substances 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 238000009795 derivation Methods 0.000 abstract description 2
- 230000000694 effects Effects 0.000 description 14
- 238000000034 method Methods 0.000 description 10
- 229920001971 elastomer Polymers 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 230000007613 environmental effect Effects 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 239000003507 refrigerant Substances 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000002803 fossil fuel Substances 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
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Abstract
The utility model provides an improve cold, hot junction heat exchange efficiency's water-cooling heat abstractor, it relates to semiconductor refrigeration technology field, the utility model discloses a solve not to have a device at present and can effectively eliminate the thermal resistance between flood peak and the semiconductor refrigeration piece and then can influence the problem of the refrigeration performance of system and the stability of operation, the utility model discloses the device makes heat transfer fluid and semiconductor refrigeration piece direct contact water and refrigeration piece contact formation, and an enclosure space does not have air and clearance in the space, eliminates above-mentioned thermal resistance through designing a new flood peak structure. Traditional refrigeration district is in addition directly placed the cold junction of refrigeration piece in the refrigeration space, because the formation of surface frost makes heat transfer efficiency reduce attached to the refrigeration piece surface, makes the production efficiency of cold volume reduce, the utility model discloses the system is because the derivation efficiency of cold volume improves for refrigeration efficiency improves. The utility model discloses be applied to the semiconductor refrigeration field.
Description
Technical Field
The utility model relates to a semiconductor refrigeration technology field, especially an improve cold, hot junction heat exchange efficiency's water-cooling heat abstractor.
Background
The energy crisis and the environmental deterioration are the main problems in the 21 st century, the combustion and consumption of a large amount of fossil fuels, and the use of a large amount of refrigerants such as Freon and the like causes global warming and influences the normal production and life of people. Therefore, the method has great significance for the research of semiconductor refrigeration in the green environmental protection technology. Semiconductor refrigeration is also called thermoelectric refrigeration or thermoelectric refrigeration, is a new refrigeration technology developed in the late 60 s, is different from the conventional refrigeration technology, has no complicated mechanical structure and does not have a refrigerant required by a traditional refrigerator, and a cold end can be frosted within a few seconds by utilizing a p-n junction formed by a special semiconductor material and supplying direct current for refrigeration. However, the refrigeration efficiency of the semiconductor refrigeration technology is relatively low, the refrigeration efficiency of a common single-pole semiconductor refrigerator is between 0.2 and 0.6, and the improvement of the performance of the refrigerator is a main direction for widening the application range and the competitiveness of the semiconductor refrigeration technology. During the working process of the semiconductor refrigeration system, heat is continuously transferred from the cold end to the hot end, and researches show that: the heat at the hot side needs to be released efficiently and in time, otherwise the refrigeration performance is adversely affected. The thermal contact resistance between the thermopile and the radiator cooler should be reduced as much as possible to improve the cooling effect. The early semiconductor refrigeration system mainly adopts an air cooling heat dissipation mode, and the heat dissipation effect of the hot end of the semiconductor refrigeration system is influenced by the small heat exchange coefficient of gas; the heat dissipation effect of the hot end is improved to a certain extent due to the fact that a water-cooling heat dissipation semiconductor refrigeration system is arranged later, but air thermal resistance exists due to the fact that gaps are inevitably formed at the joint of factors such as roughness of the surfaces of a water-cooling head and a refrigeration piece, and material thermal resistance exists at the same time, so that heat dissipation efficiency is affected.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the problem that no device can effectively eliminate the thermal resistance between the water head and the semiconductor refrigeration piece and then the refrigeration performance of the influence system and the stability of operation at present, and providing a water-cooling heat dissipation device for improving the heat exchange efficiency of the cold end and the hot end.
The utility model provides a following solution: the better refrigeration efficiency is achieved by designing a novel water head structure and a system for heat dissipation and cold carrying. The technical problem of the utility model can be solved by taking the following measures:
the utility model discloses a water-cooling heat dissipation device for improving heat exchange efficiency of cold and hot ends, which comprises a hot end water head, a cold end water head, a hose, a semiconductor refrigeration sheet, heat insulation cotton, a double-layer diaphragm micro water pump and a polyurethane structure body;
a fluid outlet is arranged on one side of the hot end water head;
a fluid inlet is formed in one side of the cold-end water head;
the hot end water head and the cold end water head are connected together through a bolt; the semiconductor refrigeration sheet is arranged between the hot end water head and the cold end water head; the heat insulation cotton is arranged at the joint of the hot end water head and the cold end water head and is positioned on the semiconductor refrigerating sheet;
the polyurethane structure body is of a cuboid structure, and the interior of the polyurethane structure body is of a hollow structure; the hot end water head and the cold end water head are arranged in the hollow structure of the polyurethane structure; one side of the polyurethane structure body is provided with a hose access port;
the double-layer diaphragm micro water pump is arranged on one side of the polyurethane structure, a fluid outlet passes through a hose access opening formed in one side of the polyurethane structure through a hose and is communicated with a fluid inlet of the double-layer diaphragm micro water pump, and a fluid outlet of the double-layer diaphragm micro water pump passes through a hose access opening formed in one side of the polyurethane structure through a hose and is communicated with a fluid inlet of a cold-end water head;
the hot end water head consists of a fluid transverse grazing pipe I, a flow guide baffle I and a contact groove I; the hot end water head is a box body with an opening at the upper end; the fluid transverse grazing pipes are arranged in the hot end water head in a staggered mode; the first diversion baffle is arranged in the middle of the hot-end water head and is arranged in parallel with the hot-end water head; the first contact groove is arranged on the upper end face of the hot-end water head.
The utility model discloses the device makes heat transfer fluid and semiconductor refrigeration piece direct contact through designing a new flood peak structure, and heat transfer fluid and refrigeration piece contact form, and an enclosure space does not have air and clearance in the space, eliminates above-mentioned thermal resistance. Traditional refrigeration district is in addition directly placed the cold junction of refrigeration piece in the refrigeration space, because the formation of surface frost makes heat transfer efficiency reduce attached to the refrigeration piece surface, makes the production efficiency of cold volume reduce, the utility model discloses the system is because the derivation efficiency of cold volume improves for refrigeration efficiency improves.
The utility model discloses semiconductor refrigerating system's water-cooling heat abstractor, including heat dissipation part, year cold part, inlet tube, outlet pipe, double-deck diaphragm micro water pump. The water head is in direct contact with the semiconductor refrigerating sheet, and heat and cold are carried away by fluid heat exchange. The heat end water head, the opening end of the cold end water head and the semiconductor cold and hot effect surface form a closed space, a rubber sealing ring is arranged at the contact position, the purpose of the rubber sealing ring is to ensure that fluid flows in the system and does not leak, the whole part of the semiconductor and the water head is wrapped by polyurethane heat insulation materials, and the purpose of the rubber sealing ring is to prevent the refrigeration system from exchanging heat with the surrounding environment. When fluid flows through a water head, the flowing state of the fluid is changed from a laminar flow to a turbulent flow state due to the blocking effect of the fluid transverse grazing tube, and when the flowing layer of the fluid fluctuates, the section on one side of a wave crest is compressed, the flow speed is increased, and the pressure intensity is reduced; because the overflowing section is increased on one side of the trough, the flow speed is reduced, and the pressure is increased. The flow layer is thus subjected to a pressure difference. The wave motion will be further increased and eventually vortices will occur. After the vortex body is formed, because the rotating tangential speed of one side of the vortex body is consistent with the flowing direction, the flow velocity is larger, and the pressure intensity is smaller. And the rotating tangential velocity of the other side is opposite to the flowing direction, the flow velocity is small, and the pressure is large. Therefore, the vortex body is transferred from one layer to the other layer under the action of the pressure difference between the two sides of the vortex body, so that the turbulence is doped, the contact and mixing strength of the fluid on the cold and hot effect surface of the semiconductor is enhanced, and the heat exchange process can achieve sufficient effect in a short time. The arrangement of the guide plate ensures that the fluid flows according to the designed flow path. The fluid flows in from the inlet port of the water head, the tail part of the flow baffle is a gap space with the inner wall of the water head, and the fluid enters from the inlet end and flows from the gap at the tail part of the flow baffle to the water outlet end on the right side. So that the flow path and the flow rate reach a relative balance point to achieve better convection heat exchange effect. Compared with a semiconductor refrigeration system under the same working condition and current condition of a common water cooling head, the convection heat transfer coefficient is improved by about 10 percent.
It can know to synthesize above, the utility model relates to a design of semiconductor refrigerating system part has solved water-cooling head and has had material thermal resistance and air thermal resistance with refrigeration piece contact surface. Provides a new solution for improving the heat dissipation efficiency of the cold end and the hot end, the refrigeration effect of the refrigeration sheet and the increase of the refrigeration capacity.
Drawings
Fig. 1 is a schematic structural view of a semiconductor refrigeration device according to the present invention;
fig. 2 is a schematic structural view of the hot-end water head of the present invention;
fig. 3 is the structural schematic diagram of the cold end water head of the utility model.
Detailed Description
The first embodiment is as follows: the water-cooling heat dissipation device for improving the heat exchange efficiency of the cold end and the hot end comprises a hot end water head 1, a cold end water head 2, a hose 3, a semiconductor refrigerating sheet 4, heat insulation cotton 5, a double-layer diaphragm micro water pump 6 and a polyurethane structure body 7;
a fluid outlet 15 is arranged at one side of the hot end water head 1;
a fluid inlet 19 is formed in one side of the cold-end water head 2;
the hot end water head 1 and the cold end water head 2 are connected together through a bolt; the semiconductor refrigeration sheet 4 is arranged between the hot end water head 1 and the cold end water head 2; the heat insulation cotton 5 is arranged at the joint of the hot end water head 1 and the cold end water head 2 and is positioned on the semiconductor refrigeration sheet 4;
the polyurethane structure body 7 is of a cuboid structure, and the interior of the polyurethane structure body is of a hollow structure; the hot end water head 1 and the cold end water head 2 are arranged in the hollow structure of the polyurethane structure body 7; one side of the polyurethane structure body 7 is provided with a hose 3 access port;
the double-layer diaphragm micro water pump 6 is arranged on one side of the polyurethane structure body 7, the fluid outlet 15 is communicated with the fluid inlet of the double-layer diaphragm micro water pump 6 through the hose 3 penetrating through the hose 3 access opening arranged on one side of the polyurethane structure body 7, and the fluid outlet of the double-layer diaphragm micro water pump 6 is communicated with the fluid inlet 19 of the cold-end water head 2 through the hose 3 penetrating through the hose 3 access opening arranged on one side of the polyurethane structure body 7;
the hot-end water head 1 consists of a fluid transverse grazing pipe I11, a flow guide baffle I12 and a contact groove I13; the hot end water head 1 is a box body with an opening at the upper end; a plurality of fluid transverse grazing pipes I11 are arranged in the hot-end water head 1 in a staggered mode; the first diversion baffle 12 is arranged in the middle of the hot-end water head 1 and is parallel to the hot-end water head 1; the first contact groove 13 is arranged on the upper end face of the hot-end water head 1.
The second fluid inlet 14 is communicated with other parts of the semiconductor refrigeration system through the hose 3. The second fluid outlet 20 is communicated with other parts of the semiconductor refrigeration system through the hose 3.
The first fluid swept tube 11 in this embodiment is arranged in staggered rows. The first diversion baffle 12 aims to enable the fluid to flow according to the optimal design flow. The tail end is in a round corner structure, and the purpose of the tail end is to reduce local resistance. The first contact groove 13 is provided with a rubber sealing ring at the contact position of the refrigerating sheet, and the purpose of the first contact groove is to ensure that fluid flows in system components and does not leak. The water head 1 is provided with a second fluid inlet 14 and a second fluid outlet 15. The two water heads are connected by bolts through the connecting structures at the left side and the right side of the water heads. One complete heat exchange process is as follows: firstly, fluid flows into the hot end water head 1 from the fluid inlet II 14 at the hot end water head 1, and the flowing state is changed from a laminar flow to a turbulent flow state and is higher than the contact and mixing strength of a semiconductor cold and hot effect surface under the action of the staggered fluid transverse grazing tube I11 in the hot end water head 1, so that the heat exchange process can achieve a sufficient effect in a short time. Fluid flows into the hose 3 from the fluid outlet 15 under the action of the first flow guide baffle 12 according to a designed flow path and then enters the double-layer diaphragm micro water pump 6, and the fluid is sent into a heat dissipation area from the water pump outlet through the hose, wherein the heat dissipation area can be a heat radiator formed by a disc-shaped copper pipe. After heat in the radiating area is dissipated, the heat is returned to the second fluid inlet 14 of the connecting water head 1 through the hose 3, so that a complete hot-end circulation process is formed. Cold energy is carried out by cold end water head heat exchange, and the refrigerating system also comprises a cold end water head 2 which is tightly attached to the cold effect surface and in which fluid flows. The fluid exchanges heat in the water head to reduce the temperature of the fluid, the fluid flows into the cold end water head 2 from the fluid inlet 19 at the cold end water head 2, and the flowing state is changed from a laminar flow to a turbulent flow state and is greater than the contact and mixing strength of a semiconductor cold and hot effect surface under the action of the staggered fluid transverse grazing tube I16 in the cold end water head 2, so that the heat exchange process can achieve a sufficient effect in a short time. The fluid flows into the hose 3 from the fluid outlet II 20 and then enters the double-layer diaphragm micro water pump 6 from the water pump outlet through the hose to be sent into a cold energy utilization area under the action of the guide baffle I17 according to a designed flow, and the cold energy utilization area is arranged in the refrigerating space. After cold energy is utilized, the cold energy is returned to the fluid inlet 19 of the connecting water head 2 through the hose 3, so that a complete cold end circulation process is formed. The left end and the right end of the double-layer diaphragm micro water pump are respectively provided with two ports, and the two processes work independently. The double-layer diaphragm micro water pump 6 is arranged outside the polyurethane layer. The heat insulation cotton 5 is arranged at the contact part of the two water heads, and the purpose of the heat insulation cotton is to reduce heat conduction and heat exchange between the two water heads. Because the two processes are carried out in the heat insulation layer and are carried out under the heat conduction component with higher heat exchange effect, better refrigeration efficiency is achieved.
The second embodiment is as follows: the first difference between the present embodiment and the specific embodiment is: the cold-end water head 2 consists of a fluid transverse grazing pipe II 16, a flow guide baffle II 17 and a contact groove II 18; the cold end water head 2 is a box body with an opening at the upper end; the plurality of fluid transverse grazing tubes II 16 are arranged in the cold end water head 2 in a staggered mode; the second diversion baffle 17 is arranged in the middle of the cold-end water head 2 and is parallel to the cold-end water head 2; and the second contact groove 18 is arranged on the upper end surface of the cold-end water head 2. The rest is the same as the first embodiment.
The third concrete implementation mode: the first difference between the present embodiment and the specific embodiment is: the hot end water head 1 is the same as the cold end water head 2 in volume, and the hot end water head 1 and the cold end water head 2 can just be buckled together. The rest is the same as the first embodiment.
The fourth concrete implementation mode: the first difference between the present embodiment and the specific embodiment is: the semiconductor refrigerating plate 4 is a semiconductor refrigerating plate with the same size as the hot-end water head 1. The rest is the same as the first embodiment.
Claims (5)
1. A water-cooling heat dissipation device for improving heat exchange efficiency of a cold end and a hot end is characterized by comprising a hot end water head (1), a cold end water head (2), a hose (3), a semiconductor refrigeration sheet (4), heat insulation cotton (5), a double-layer diaphragm micro water pump (6) and a polyurethane structure body (7);
a fluid outlet (15) is arranged on one side of the hot end water head (1);
a fluid inlet (19) is formed in one side of the cold-end water head (2);
the hot end water head (1) and the cold end water head (2) are connected together through a bolt; the semiconductor refrigeration sheet (4) is arranged between the hot-end water head (1) and the cold-end water head (2); the heat insulation cotton (5) is arranged at the joint of the hot end water head (1) and the cold end water head (2) and is positioned on the semiconductor refrigeration sheet (4);
the polyurethane structure body (7) is of a cuboid structure, and the interior of the polyurethane structure body is of a hollow structure; the hot end water head (1) and the cold end water head (2) are arranged in a hollow structure of the polyurethane structure body (7); one side of the polyurethane structure body (7) is provided with a hose (3) access port;
the double-layer diaphragm micro water pump (6) is arranged on one side of the polyurethane structure body (7), a fluid outlet (15) penetrates through a hose (3) access opening formed in one side of the polyurethane structure body (7) through a hose (3) and is communicated with a fluid inlet of the double-layer diaphragm micro water pump (6), and a fluid outlet of the double-layer diaphragm micro water pump (6) penetrates through a hose (3) access opening formed in one side of the polyurethane structure body (7) through a hose (3) and is communicated with a fluid inlet (19) of a cold-end water head (2);
the hot-end water head (1) consists of a fluid transverse grazing tube I (11), a flow guide baffle I (12) and a contact groove I (13); the hot end water head (1) is a box body with an opening at the upper end; a plurality of fluid transverse grazing tubes I (11) are arranged in the hot end water head (1) in a staggered mode; the first diversion baffle (12) is arranged in the middle of the hot-end water head (1) and is parallel to the hot-end water head (1); the first contact groove (13) is arranged on the upper end face of the hot-end water head (1).
2. The water-cooling heat dissipation device for improving the heat exchange efficiency of the cold end and the hot end of claim 1 is characterized in that the cold end water head (2) consists of a second fluid transverse grazing tube (16), a second flow guide baffle (17) and a second contact groove (18); the cold end water head (2) is a box body with an opening at the upper end; a plurality of fluid transverse grazing tubes II (16) are arranged in the cold end water head (2) in a staggered mode; the second diversion baffle (17) is arranged in the middle of the cold-end water head (2) and is parallel to the cold-end water head (2); and the second contact groove (18) is arranged on the upper end surface of the cold-end water head (2).
3. The water-cooling heat dissipation device for improving the heat exchange efficiency between the cold end and the hot end as claimed in claim 1, wherein the volume of the hot end water head (1) is the same as that of the cold end water head (2).
4. The water-cooling heat dissipation device for improving the heat exchange efficiency between the cold end and the hot end as claimed in claim 1 or 3, wherein the semiconductor refrigeration sheet (4) is a semiconductor refrigeration plate with the same size as the hot end water head (1).
5. The water-cooling heat dissipation device for improving the heat exchange efficiency between the cold end and the hot end as claimed in claim 1, wherein a second fluid inlet (14) is arranged at one side of the hot end water head (1); and a second fluid outlet (20) is arranged on one side of the cold-end water head (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920667054.1U CN210036008U (en) | 2019-05-10 | 2019-05-10 | Water-cooling heat dissipation device for improving heat exchange efficiency of cold end and hot end |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920667054.1U CN210036008U (en) | 2019-05-10 | 2019-05-10 | Water-cooling heat dissipation device for improving heat exchange efficiency of cold end and hot end |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210036008U true CN210036008U (en) | 2020-02-07 |
Family
ID=69364611
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920667054.1U Expired - Fee Related CN210036008U (en) | 2019-05-10 | 2019-05-10 | Water-cooling heat dissipation device for improving heat exchange efficiency of cold end and hot end |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210036008U (en) |
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2019
- 2019-05-10 CN CN201920667054.1U patent/CN210036008U/en not_active Expired - Fee Related
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200207 |
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| CF01 | Termination of patent right due to non-payment of annual fee |