CN210035345U

CN210035345U - Ceramic packaging module of car headlight

Info

Publication number: CN210035345U
Application number: CN201920773436.2U
Authority: CN
Inventors: 陆壮树; 张洪亮
Original assignee: Shenzhen Bright Au Optronics Co
Current assignee: Shenzhen Bright Au Optronics Co
Priority date: 2019-05-27
Filing date: 2019-05-27
Publication date: 2020-02-07
Anticipated expiration: 2029-05-27

Abstract

The utility model discloses a ceramic package module of car headlight, including ceramic casing, protection piece and protection machanism, the inside lens that is provided with in ceramic casing's top, and the inboard of lens installs the fluorescent screen, the protection piece is located ceramic casing's surface, the bottom of luminous chip is connected with the basic unit, and the luminous chip is located the inboard of fluorescent screen, the surface of basic unit is provided with heat dissipation mechanism, and the bottom of basic unit is connected with the bottom plate, protection machanism is located the surface of bottom plate. This ceramic package module of car headlight compares with the ceramic package module of current ordinary car headlight, can cushion the impact that this module received, has improved the shock resistance of this encapsulation module, reduces the damage degree of this module to the life of this encapsulation module has been prolonged, and can accelerate the thermal divergence that produces in this module internal work process, maintains the relatively stable of this module internal temperature.

Description

Ceramic packaging module of car headlight

Technical Field

The utility model relates to a car headlight specifically is a ceramic package module of car headlight with encapsulating technical field.

Background

The headlamp is also called as a headlamp LED daytime running lamp, and is a lighting device which can illuminate the automobile when the automobile runs at night and is beneficial to the safe running of the automobile, while the headlamp packaging module is an electronic component for packaging and protecting elements inside the headlamp, and the electronic technology is promoted to be continuously developed along with the development of the society and the wide application of the automobile.

When the ceramic package module of current car headlight is using, the heat that produces in its inside working process gathers easily, influences the normal use of this module internals to the shock resistance of this module is relatively poor, leads to this module to receive the damage easily, thereby has shortened the life of this module, can not be fine satisfy people's user demand, to above-mentioned condition, carries out technical innovation on the ceramic package module basis of current car headlight.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a ceramic package module of car headlight to the ceramic package module who provides general car headlight among the solution above-mentioned background art is when using, and the heat that produces in its inside working process gathers easily, influences the normal use of this module internals, and the shock resistance of this module is relatively poor, leads to this module to receive the damage easily, thereby has shortened the life of this module, the user demand problem of satisfying people that can not be fine.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a ceramic package module of car headlight, includes ceramic package, protection piece, protection machanism and luminous chip, the inside lens that is provided with in ceramic package's top, and the inboard of lens installs the fluorescent screen, the protection piece is located ceramic package's surface, the bottom of luminous chip is connected with the basic unit, and the inboard that the luminous chip is located the fluorescent screen, the surface of basic unit is provided with heat dissipation mechanism, and the bottom of basic unit is connected with the bottom plate, protection machanism is located the surface of bottom plate.

Preferably, the heat dissipation mechanism comprises a heat dissipation sheet, an air hole and a limiting groove, the limiting groove is connected to the inner side surface of the heat dissipation sheet, and the air hole is located inside the bottom plate.

Preferably, the inner surface structure of the radiating fin is matched with the inner side surface structure of the limiting groove, the radiating fin and the base layer form an integrated structure through the limiting groove, a permeable structure is formed between the radiating fin and the air hole, and the bottom end surface edge of the radiating fin is attached to the inner surface edge of the air hole.

Preferably, the protection mechanism comprises a protection sleeve, a rubber layer and a lead, the rubber layer is arranged in the protection sleeve, and the lead is arranged on the inner side of the rubber layer.

Preferably, the inner surface of the rubber layer is attached to the inner surface of the lead, and the lead penetrates through the protective sleeve.

Preferably, an integrated structure is formed between the protection blocks and the ceramic shell, and the protection blocks are annularly distributed by taking the center of the ceramic shell as a circle center.

Compared with the prior art, the beneficial effects of the utility model are as follows:

1. the utility model can radiate the inside of the packaging module through the arrangement of the radiating fins, the air holes and the limiting grooves, so as to accelerate the radiation of heat generated inside the packaging module in the working process, so as to be convenient for the use of the parts inside the packaging module, and can also limit and fix the base layer, maintain the stability of the base layer in the using process, avoid the shaking of the base layer and influence the normal use of the packaging module;

2. the utility model protects the lead wire inside the encapsulation module by arranging the protective sleeve, the rubber layer and the lead wire, thereby being beneficial to bending the lead wire for use, further improving the firmness of the encapsulation module in the use process, preventing the encapsulation module from being broken in the use process and causing the circuit inside the module to be broken, and further influencing the normal use of the parts inside the encapsulation module;

3. the utility model discloses a setting of protection piece and ceramic casing can protect this encapsulation module, improves the shock resistance of this encapsulation module, makes it when receiving external impact, can protect ceramic casing, reduces the damage that ceramic casing received to be convenient for the normal use of its inside part.

Drawings

FIG. 1 is a schematic sectional view of the present invention;

FIG. 2 is a schematic view of the structure of the present invention;

fig. 3 is a schematic view of the bottom view of the present invention.

In the figure: 1. a ceramic housing; 2. a lens; 3. a protection block; 4. a fluorescent plate; 5. a heat dissipation mechanism; 501. A heat sink; 502. air holes; 503. a limiting groove; 6. a protection mechanism; 601. a protective sleeve; 602. a rubber layer; 603. a lead wire; 7. a light emitting chip; 8. a base layer; 9. a base plate.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-3, the present invention provides a technical solution: a ceramic packaging module of a vehicle headlamp comprises a ceramic shell 1, a protection block 3, a protection mechanism 6 and a light emitting chip 7, wherein a lens 2 is arranged inside the top end of the ceramic shell 1, a fluorescent plate 4 is arranged on the inner side of the lens 2, the protection block 3 is positioned on the outer surface of the ceramic shell 1, an integrated structure is formed between the protection block 3 and the ceramic shell 1, and the protection blocks 3 are annularly distributed by taking the center of the ceramic shell 1 as the center of a circle, so that the packaging module can be protected, the impact resistance of the packaging module is improved, when the packaging module is impacted by the outside, the ceramic shell 1 can be protected, the damage to the ceramic shell 1 is reduced, and the normal use of parts inside the ceramic shell is facilitated;

the bottom end of the light-emitting chip 7 is connected with a base layer 8, the light-emitting chip 7 is positioned on the inner side of the fluorescent plate 4, the outer surface of the base layer 8 is provided with a heat dissipation mechanism 5, the bottom end of the base layer 8 is connected with a bottom plate 9, the heat dissipation mechanism 5 comprises a heat dissipation sheet 501, an air hole 502 and a limiting groove 503, the inner side surface of the heat dissipation sheet 501 is connected with the limiting groove 503, the air hole 502 is positioned inside the bottom plate 9, the inner surface structure of the heat dissipation sheet 501 is matched with the inner side surface structure of the limiting groove 503, the heat dissipation sheet 501 and the base layer 8 form an integrated structure through the limiting groove 503, a through structure is formed between the heat dissipation sheet 501 and the air hole 502, the bottom end surface edge of the heat dissipation sheet 501 is attached to the inner surface edge of the air hole 502, the heat dissipation can be, the base layer 8 can be limited and fixed, the stability of the base layer 8 in the using process is maintained, and the situation that the base layer shakes to influence the normal use of the packaging module is avoided;

protection machanism 6 is located the surface of bottom plate 9, protection machanism 6 includes protective sheath 601, rubber layer 602 and lead wire 603, and the internally mounted of protective sheath 601 has rubber layer 602, the inboard of rubber layer 602 is provided with lead wire 603, laminate mutually between the internal surface of rubber layer 602 and the internal surface of lead wire 603, and lead wire 603 runs through the inside of protective sheath 601, can protect the inside lead wire 603 of this encapsulation module, be favorable to lead wire 603 to buckle the use, and then improved the firmness of this encapsulation module in the use, prevent that it from appearing the rupture in the use, and lead to the inside circuit of this module to open circuit, thereby influence the normal use of the inside part of this encapsulation module.

The working principle is as follows: when the ceramic package module of the headlamp is used, firstly, current is introduced into the package module through the lead 603 at the bottom end of the package module, so that a circuit path inside the package module is formed, the package module enters a working state, in the use process of the lead 603, the protective sleeve 601 on the surface of the lower end of the module bottom plate 9 limits the lead 603 penetrating through the protective sleeve, the lead 603 is prevented from being broken and damaged, the path inside the module is prevented from being influenced, meanwhile, the rubber layer 602 on the inner side of the protective sleeve 601 protects the lead 603 from abrasion, and the abrasion on the surface of the lead 603 is reduced;

when the module is used, the light-emitting chip 7 on the top surface of the base layer 8 emits light, and the fluorescent plate 4 on the outer side above the base layer enhances and enlarges light so as to be convenient for the headlight to use for illumination, and when the packaging module is used, the heat radiating fin 501 on the outer side surface of the base layer 8 is connected with the base layer 8 through adhesion, so that heat generated in the working process of the base layer 8 is transferred to the heat radiating fin 501, and then the heat radiating fin 501 diffuses the heat to the outside through the air hole 502 on the bottom edge of the heat radiating fin, thereby achieving the heat radiating effect inside the module, maintaining the relative stability of the internal temperature of the headlight packaging module in the use process, further being beneficial to the normal use of the internal parts of the headlight packaging module, and when the module is impacted by the outside, the protective block 3 on the outer surface edge of the ceramic shell 1 buffers impact force, and reduces the impact on the ceramic shell 1, therefore, damage to the ceramic shell 1 is reduced, and normal use of parts inside the ceramic shell 1 is facilitated, which is the working principle of the ceramic packaging module of the vehicle headlamp.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a ceramic package module of car headlight, includes ceramic casing (1), protection piece (3), protection machanism (6) and luminescence chip (7), its characterized in that: the utility model discloses a ceramic electronic device, including ceramic casing (1), the inside lens (2) that is provided with in top of ceramic casing (1), and the inboard of lens (2) installs fluorescent screen (4), protection piece (3) are located the surface of ceramic casing (1), the bottom of luminous chip (7) is connected with basic unit (8), and luminous chip (7) are located the inboard of fluorescent screen (4), the surface of basic unit (8) is provided with heat dissipation mechanism (5), and the bottom of basic unit (8) is connected with bottom plate (9), protection machanism (6) are located the surface of bottom plate (9).

2. The ceramic package module of the headlamp as claimed in claim 1, wherein: the heat dissipation mechanism (5) comprises a heat dissipation fin (501), an air hole (502) and a limiting groove (503), the limiting groove (503) is connected to the inner side surface of the heat dissipation fin (501), and the air hole (502) is located inside the bottom plate (9).

3. The ceramic package module of the headlamp as claimed in claim 2, wherein: the inner surface structure of the radiating fin (501) is matched with the inner side surface structure of the limiting groove (503), the radiating fin (501) and the base layer (8) form an integrated structure through the limiting groove (503), a through structure is formed between the radiating fin (501) and the air hole (502), and meanwhile the bottom end surface edge of the radiating fin (501) is attached to the inner surface edge of the air hole (502).

4. The ceramic package module of the headlamp as claimed in claim 1, wherein: the protection mechanism (6) comprises a protective sleeve (601), a rubber layer (602) and a lead (603), the rubber layer (602) is installed inside the protective sleeve (601), and the lead (603) is arranged on the inner side of the rubber layer (602).

5. The ceramic package module of the headlamp as defined in claim 4, wherein: the inner surface of the rubber layer (602) is attached to the inner surface of the lead wire (603), and the lead wire (603) penetrates through the protective sleeve (601).

6. The ceramic package module of the headlamp as claimed in claim 1, wherein: an integrated structure is formed between the protection blocks (3) and the ceramic shell (1), and the protection blocks (3) are annularly distributed by taking the center of the ceramic shell (1) as a circle center.