CN210026077U - Injection mold suitable for electronic components switches on bottom plate - Google Patents
Injection mold suitable for electronic components switches on bottom plate Download PDFInfo
- Publication number
- CN210026077U CN210026077U CN201920316958.XU CN201920316958U CN210026077U CN 210026077 U CN210026077 U CN 210026077U CN 201920316958 U CN201920316958 U CN 201920316958U CN 210026077 U CN210026077 U CN 210026077U
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- CN
- China
- Prior art keywords
- plate
- upper die
- bottom plate
- die base
- injection mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000002347 injection Methods 0.000 title claims abstract description 33
- 239000007924 injection Substances 0.000 title claims abstract description 33
- 238000001816 cooling Methods 0.000 claims abstract description 9
- 229920003023 plastic Polymers 0.000 claims abstract description 8
- 239000004033 plastic Substances 0.000 claims abstract description 8
- 238000001746 injection moulding Methods 0.000 claims description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 7
- 238000000465 moulding Methods 0.000 abstract description 5
- 230000000694 effects Effects 0.000 abstract description 3
- 239000011120 plywood Substances 0.000 abstract 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000243 solution Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000009466 transformation Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000001354 calcination Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
Images
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- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The utility model discloses an injection mold suitable for electronic components switches on bottom plate, including the bottom plate, be provided with the die holder on the bottom plate, install on the die holder and take off the flitch, take off the flitch in installing on the flitch, it has the upper die base to distribute on the interior flitch, install the plywood on the upper die base, the plywood is provided with the hole of moulding plastics with the upper die base, the outside of taking off the flitch and interior flitch is provided with the water route and pours into channel interface into, the outside of plywood is provided with articulates the structure, the bottom plate, the die holder, the upper die base, all be provided with the spread groove that the position corresponds on the plywood. Therefore, a layered structure is adopted, the lower die holder, the upper die holder and other components can be independently replaced by conducting the bottom plate for different types of electronic components, the overall implementation cost is reduced, and the die opening of the overall die is not needed. Be provided with independent water route injection channel interface, possess the cooling effect of preferred, shorten drawing of patterns latency.
Description
Technical Field
The utility model relates to an electronic components switches on processing utensil of bottom plate especially relates to an injection mold suitable for electronic components switches on bottom plate, belongs to the injection mold field.
Background
With the development of production and processing technology, at present, the processing technology of parts has also made remarkable progress, and in the process of needing heating, calcining, and the like, the parts are fixed on a die for batch processing to improve the processing efficiency of workpieces, and at this time, the collection of the parts becomes a concern.
In the production process of electronic components, a plurality of electronic components are arranged on a die to be processed in batches, and in the prior art, in particular, in the processing period of electronic component conducting bottom plates, demolding white marks or demolding fracture easily occur, so that the quality of final products is influenced.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the deficiencies of the prior art, provide an injection mold suitable for electronic components switches on bottom plate.
Be applicable to the injection mold that electronic components switched on the bottom plate in order to reach above-mentioned purpose, the utility model discloses the technical scheme who adopts does:
injection mold suitable for electronic components switches on bottom plate, including the bottom plate, wherein: the improved structure of the plastic injection molding machine is characterized in that a lower die base is arranged on the lower supporting plate, a stripper plate is arranged on the lower die base, an inner stripper plate is arranged on the stripper plate, an upper die base is distributed on the inner stripper plate, a laminated plate is arranged on the upper die base, injection molding holes are formed in the laminated plate and the upper die base, waterway injection channel interfaces are arranged on the outer sides of the stripper plate and the inner stripper plate, hanging and connecting structures are arranged on the outer side of the laminated plate, connecting grooves corresponding to the positions of the lower supporting plate, the lower die base, the upper die base and the laminated plate are formed in the.
Further, the injection mold suitable for the electronic component conduction bottom plate is characterized in that the lower die base is provided with a main injection molding groove, the edge of the main injection molding groove is connected with an auxiliary splitter box, and the depth of the auxiliary splitter box is deeper than that of the main injection molding groove.
Furthermore, the injection mold suitable for the electronic component conduction base plate is characterized in that the top corners of the main injection molding grooves are distributed with arc-shaped demolding grooves.
Furthermore, the injection mold suitable for the electronic component conduction bottom plate is described above, wherein the water path injection channel interface comprises a plug, and a cooling channel is connected in the plug in a conduction manner.
Furthermore, the injection mold suitable for the electronic component conduction base plate is characterized in that the hanging structure comprises a threaded hole, and an auxiliary bolt is connected in the threaded hole.
Still further, the injection mold suitable for the electronic component conduction bottom plate is characterized in that the outer edges of the lower die holder and the upper die holder are provided with arc chamfers.
The beneficial effects of the utility model are mainly embodied in that:
1. by adopting a layered structure, the lower die holder, the upper die holder and other parts can be independently replaced aiming at the conduction bottom plates of different types of electronic components, the cost of integral implementation is reduced, and the die opening of the integral die is not needed.
2. Be provided with independent water route injection channel interface, possess the cooling effect of preferred, shorten drawing of patterns latency.
3. Adopt and articulate the structure, can realize stable transportation of articulating.
4. And the arc chamfer angle is adopted, so that operators cannot be cut.
Drawings
FIG. 1 is a schematic side view of the injection mold.
FIG. 2 is a schematic view of the injection mold.
FIG. 3 is a schematic view of the structure of the lower die holder.
Detailed Description
The utility model provides an injection mold suitable for electronic components switches on bottom plate. The technical solution of the present invention will be described in detail below with reference to the accompanying drawings so as to be easier to understand and grasp.
As shown in fig. 1 to 3, the injection mold suitable for the electronic component conduction base plate includes a bottom plate 1, and is characterized in that: a lower die holder 2 is arranged on the lower supporting plate 1. Considering the follow-up realization of integrated demoulding and avoiding the occurrence of white marks or tearing caused by local stress of a product during demoulding, the lower die holder 2 is provided with the stripper plate 3, and the stripper plate 3 is provided with the inner stripper plate 4. Meanwhile, an upper die base 5 is distributed on the inner stripping plate. In order to meet the manufacturing requirements of bottom plates with different specifications and thicknesses, effective binding force can be applied, bubbles are prevented from being formed after air flows in, the upper die holder 5 is provided with the laminated plate 6, and the laminated plate 6 and the upper die holder 5 are provided with injection molding holes. In view of practical implementation, considering to shorten the waiting time of demoulding and cooling, the quick water cooling is realized by matching with the conventional water-cooling injection equipment, and the outer sides of the stripper plate 3 and the inner stripper plate 4 are provided with waterway injection channel interfaces. Moreover, in consideration of the transfer and transportation requirements of each station during batch quantitative production, the outer side of the laminated board 6 is provided with a hanging structure. Furthermore, in order to possess the structure of integration during moulding plastics, can not influence final off-the-shelf goodness because of appearing unnecessary fit-up gap, the utility model discloses a lower plate 1, die holder 2, upper die base 5, the laminated board 6 on all be provided with the spread groove that the position corresponds, be provided with connecting bolt 7 in the spread groove.
Combine the utility model relates to an embodiment of preferred sees, and the runner overall arrangement during considering moulding plastics is convenient, does not influence the edge forming that electronic components switched on the bottom plate, avoids follow-up deburring, and it has the owner to mould plastics groove 8 to distribute on die holder 2, and the main border of moulding plastics groove 8 is connected with supplementary splitter box 9, and the degree of depth of supplementary splitter box 9 is dark in the main groove 8 of moulding plastics. Meanwhile, arc-shaped demoulding grooves 10 are distributed at the vertex angle of the main injection moulding groove 8. Therefore, during subsequent demoulding, rapid separation can be realized, the fracture of the vertex angle of the electronic component conduction bottom plate can not be caused, and the excellent rate of finished products is improved.
Further, in order to ensure the correct connection of the external water pipe and meet the sealing requirements of practical use, the adopted waterway injection channel interface comprises a plug 11, and a cooling channel 12 is connected in the plug 11 in a conduction manner. Combine the in-service use to see, in order to cooperate with all kinds of displacement transportation structures of predetermineeing, realize firm connection, can not appear inclining or rock during the transport, the shaping transportation of being convenient for, the utility model discloses the structure that articulates that adopts is including threaded hole, and threaded hole in-connection has auxiliary bolt 13.
Furthermore, in order to eliminate the sharp part as much as possible and not scratch workers or other external instruments during operation and use, the outer edges of the lower die holder 2 and the upper die holder 5 are provided with circular arc chamfers.
As can be seen from the above description, the utility model has the following advantages:
1. by adopting a layered structure, the lower die holder, the upper die holder and other parts can be independently replaced aiming at the conduction bottom plates of different types of electronic components, the cost of integral implementation is reduced, and the die opening of the integral die is not needed.
2. Be provided with independent water route injection channel interface, possess the cooling effect of preferred, shorten drawing of patterns latency.
3. Adopt and articulate the structure, can realize stable transportation of articulating.
4. And the arc chamfer angle is adopted, so that operators cannot be cut.
The above technical solutions of the present invention have been fully described, and it should be noted that the present invention is not limited by the above description, and all technical solutions formed by equivalent transformation or equivalent transformation adopted by the spirit of the present invention in the aspects of structure, method or function by those of ordinary skill in the art all fall within the protection scope of the present invention.
Claims (6)
1. Injection mold suitable for electronic components switches on bottom plate, including the bottom plate, its characterized in that: the improved structure of the plastic injection molding machine is characterized in that a lower die base is arranged on the lower supporting plate, a stripper plate is arranged on the lower die base, an inner stripper plate is arranged on the stripper plate, an upper die base is distributed on the inner stripper plate, a laminated plate is arranged on the upper die base, injection molding holes are formed in the laminated plate and the upper die base, waterway injection channel interfaces are arranged on the outer sides of the stripper plate and the inner stripper plate, hanging and connecting structures are arranged on the outer side of the laminated plate, connecting grooves corresponding to the positions of the lower supporting plate, the lower die base, the upper die base and the laminated plate are formed in the.
2. The injection mold for the electronic component conduction base plate according to claim 1, wherein: the injection molding machine is characterized in that main injection molding grooves are distributed on the lower die base, auxiliary splitter grooves are connected to the edges of the main injection molding grooves, and the depth of each auxiliary splitter groove is deeper than that of each main injection molding groove.
3. The injection mold for the electronic component conduction base plate according to claim 2, wherein: and arc demolding grooves are distributed at the vertex angle of the main injection molding groove.
4. The injection mold for the electronic component conduction base plate according to claim 1, wherein: the waterway injection channel interface comprises a plug, and a cooling channel is connected in the plug in a conduction manner.
5. The injection mold for the electronic component conduction base plate according to claim 1, wherein: the hanging structure comprises a threaded hole, and an auxiliary bolt is connected in the threaded hole.
6. The injection mold for the electronic component conduction base plate according to claim 1, wherein: and arc chamfers are arranged at the outer edges of the lower die holder and the upper die holder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920316958.XU CN210026077U (en) | 2019-03-13 | 2019-03-13 | Injection mold suitable for electronic components switches on bottom plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920316958.XU CN210026077U (en) | 2019-03-13 | 2019-03-13 | Injection mold suitable for electronic components switches on bottom plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210026077U true CN210026077U (en) | 2020-02-07 |
Family
ID=69354893
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920316958.XU Expired - Fee Related CN210026077U (en) | 2019-03-13 | 2019-03-13 | Injection mold suitable for electronic components switches on bottom plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210026077U (en) |
-
2019
- 2019-03-13 CN CN201920316958.XU patent/CN210026077U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20220413 Address after: 523000 Dongxing Industrial Park, Shanghe village, Wangniudun Town, Dongguan City, Guangdong Province Patentee after: Dongguan Dongfang mould Co.,Ltd. Address before: 215300 plant 3, 456 Jinrong Road, Jinxi Town, Kunshan City, Suzhou City, Jiangsu Province Patentee before: KUNSHAN SHANGDONGFANG METAL PRODUCT Co.,Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200207 |