CN210006706U - advanced wafer placing device - Google Patents

advanced wafer placing device Download PDF

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Publication number
CN210006706U
CN210006706U CN201921308067.6U CN201921308067U CN210006706U CN 210006706 U CN210006706 U CN 210006706U CN 201921308067 U CN201921308067 U CN 201921308067U CN 210006706 U CN210006706 U CN 210006706U
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CN
China
Prior art keywords
container
strip
material taking
shaped
splendid attire
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CN201921308067.6U
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Chinese (zh)
Inventor
郭祖福
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Xiangneng Hualei Optoelectrical Co Ltd
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Xiangneng Hualei Optoelectrical Co Ltd
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Priority to CN201921308067.6U priority Critical patent/CN210006706U/en
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Abstract

The utility model discloses an advanced wafer placer belongs to product placer field, including being the open splendid attire container of long tube type and up end, set up the bar mouth of vertical setting along its border equidistant on the lateral wall of splendid attire container, all be equipped with in every bar mouth by the horizontal pressure slat that sets up that the splendid attire container inboard extends to the outside, all ends that press the slat to be located the splendid attire container are fixed and are played and constitute and bulldoze the board, splendid attire container bottom side is seted up and is the curved material of getting of horizontal setting, the central angle that the material of getting corresponds is not less than 180, the end of getting the material mouth articulates through the articulated shaft of vertical setting has the open close board that can the shutoff get the material mouth, get the locking son spare and the locking mother spare that are equipped with the looks adaptation between ends in addition of material and the free end of open board.

Description

advanced wafer placing device
Technical Field
The utility model relates to a product splendid attire device field, specificly relate to advanced wafer placers.
Background
The wafer (wafer) is which is the most important raw material of the LED, is the luminous component of the LED, the most core part of the LED, and the quality of the wafer directly determines the performance of the LED, the wafer is composed of III and V group compound semiconductor substances, when the LED is packaged, the wafer materials are arranged on a wafer film in order, the wafer needs to be contained after being produced, then a placing device is communicated to be transferred to an application for taking.
SUMMERY OF THE UTILITY MODEL
1. Technical problem to be solved
The to-be-solved technical problem of the utility model is to provide kinds of first-in wafer placer, it holds that the material is convenient and neat, and the material is taken conveniently, and has realized FIFO, and the operation first in production can in time discover the unusual of wafer production.
2. Technical scheme
In order to solve the above problem, the utility model adopts the following technical scheme:
advanced wafer placer, including being long cylinder type and the uncovered splendid attire container of up end, set up on the lateral wall of the interior chamber bottom side of splendid attire container and be the curved material taking mouth that transversely sets up, and the central angle that material taking mouth corresponds is not less than 180, end of material taking mouth articulates through the articulated shaft that sets up vertically has the open-close plate that can shutoff material taking mouth, open-close plate is the arc structure with material taking mouth looks adaptation, open-close plate's free end is fixed with the locking sub, material taking mouth's another end is fixed with the locking parent member that matches with the locking sub, top side articulates through transversely set up articulated shaft two has the lid with splendid attire container up end looks adaptation, be equipped with the latch fitting of looks adaptation between lid and the splendid attire container top surface, set up two at least vertical bar mouths along its circumference on the lateral wall of splendid attire container, the top of bar mouth runs through to extend to the top of splendid attire container, the bottom and strip top of material taking mouth is equipped with root edge, and all lateral extension pressing plate is located the lateral pressing board and is located the pressing board and is pressed to constitute.
And , the height of the material taking port is not less than the thickness of wafers and less than the thickness of two wafers, so that the arrangement can ensure that only wafers can be taken out at a time.
, the locking element comprises a magnet and an iron plate fixed on the top of the cover and the container respectively, the cover can be stably covered on the container by the magnetic attraction of the magnet to the iron plate.
, the pushing plate is formed, a connecting rod extending upwards along a vertical line is fixed at the center of the upper surface of the pushing plate, the length of the connecting rod is larger than the height of the container, and the pushing plate can be driven to move up and down by hand conveniently by the connecting rod.
the top of the connecting rod is vertically fixed with a handle, through which the connecting rod and the pushing plate can be more conveniently driven to move up and down.
3. Advantageous effects
The utility model discloses set up the bar mouth of vertical setting along its periphery equidistant on the lateral wall of splendid attire container, all be equipped with in every bar mouth by the inboard pressure slat that extends to the horizontal setting in the outside of splendid attire container, all ends that press the slat to be located the splendid attire container are fixed and are played the constitution at and bulldoze the board, push away the wafer of putting into with bulldozing the board many times in the placing process of wafer, each pressure slat evenly acts on the wafer, can ensure the level and smooth of wafer and place, prevent effectively that the wafer from taking the slope, based on the impetus who bulldozes the board, the splendid attire container can erect the application and also can transversely put the application, the utility model discloses it has curved material taking openings that are horizontal setting to open to be equipped with in splendid attire container bottom side, the articulated shaft that the end of material taking opening has the opening plate that can the shutoff was got the material opening, when the wafer is taken, only need open the opening plate, can take the wafer from the material taking of splendid attire container bottom, realized the FIFO then the convenience, and put things convenient, and realized the first-.
Drawings
FIG. 1 is a schematic view of the present invention;
fig. 2 is an expanded view of the side wall of the container 1.
The reference numbers are 1-container, 2-material taking port, 3-articulated shaft , 4-opening plate, 5-locking sub-part, 6-locking mother part, 7-articulated shaft II, 8-cover body, 9-magnet, 10-iron sheet, 11-strip-shaped port, 12-batten plate, 13-connecting rod and 14-handle.
Detailed Description
The present invention will be described in further detail in with reference to the following drawings and examples.
Examples
The advanced wafer placing device shown in fig. 1 comprises a long cylindrical container 1 with an open upper end face, transversely-arranged arc-shaped material taking ports 2 are formed in the side wall of the bottom side of an inner cavity of the container 1, a central angle corresponding to each material taking port 2 is not less than 180 degrees, an end of each material taking port 2 is hinged to an opening plate 4 capable of plugging each material taking port 2 through a vertically-arranged hinge shaft , the opening plate 4 is of an arc-shaped structure matched with each material taking port 2, a locking sub-part 5 is fixed to the free end of each opening plate 4, a locking main part 6 matched with the locking sub-part 5 is fixed to the other end of each material taking port 2 and can enable the opening plate 4 to plug each material taking port 2 stably, a top side is hinged to a cover body 8 matched with the upper end face of the container 1 through a transversely-arranged hinge shaft II 7, a locking part 8 matched with the top face of the cover body 8 is arranged between the top face of the container 1 and the top face of the container 1, at least two longitudinally-arranged hinge shafts are arranged on the side wall of the locking part 1 along the circumference of the groove, at least two longitudinal-arranged hinge shafts, the top ends of the strip-shaped material taking ports 3511, the strip-shaped container 1, all strip-shaped material taking ports are arranged in the container 1, the top of the container 1, the.
In the embodiment, the height of the material taking port 2 is not less than the thickness of wafers and less than the thickness of two wafers, so that only wafers can be taken out at a time.
In this embodiment, the locking member includes a magnet 9 and an iron piece 10 fixed to the lid body 8 and the top surface of the container 1, respectively. The lid 8 can be stably covered on the container 1 by the magnetic attraction of the magnet 9 to the iron piece 10.
In this embodiment, the pushing plate is formed integrally, a connecting rod 13 extending upward along a vertical line is fixed at the center of the upper surface of the pushing plate, the length of the connecting rod 13 is greater than the height of the container 1, and the connecting rod 13 can be used to drive the pushing plate to move up and down manually.
In this embodiment, a handle 14 is vertically fixed to the top of the link 13. The connecting rod 13 and the pushing plate can be more conveniently driven to move up and down through the handle 14.
The specific application process of the advanced wafer placing device is as follows:
after the cover body 8 is opened, the push plate is taken out, the wafer can be placed into the container 1, the placed wafer is pushed and squeezed by the push plate for many times in the placing process, the specific operation is that the pressing strip plates 12 are correspondingly placed in the strip-shaped openings 11, then the push plate moves towards the container 1, the wafer in the container 1 can be pushed to the bottom of the container 1, the strip-shaped openings 11 are arranged at equal intervals along the circumference of the side wall of the container, the pressing strip plates 12 move along the length direction of the strip-shaped openings 11, namely, the state that the pressing strip plates 12 are equally divided into the circular cross sections of the container 1 is presented, each pressing strip plate 12 uniformly acts on the wafer in the pushing and squeezing process of the push plate, the smooth placement of the wafer can be guaranteed, the wafer is effectively prevented from inclining, the container 1 can be vertically applied or horizontally applied based on the pushing action of the push plate, after the placement of the cover body 8 is finished, when the wafer is required to be taken, the locking female member 6 and the male member 5 are loosened, the wafer can be timely produced by first-in a first-out operation, and the container can be produced by first-taking operation, the wafer can be realized.
According to the content, the utility model discloses it is convenient and neat to hold the material, and the material is taken conveniently, and has realized first-in first-out, produces earlier operation earlier, can in time discover the abnormity of wafer production.
It will be appreciated by those skilled in the art that the above embodiments are only for illustrating the present invention and are not to be used as limitations of the present invention, and that changes and modifications to the above described embodiments will fall within the scope of the claims of the present invention as long as they are within the spirit and scope of the present invention.

Claims (5)

  1. The advanced wafer placing device comprises a long-cylinder-shaped containing container (1) with an open upper end face, and is characterized in that arc-shaped material taking ports (2) which are transversely arranged are formed in the side wall of the bottom side of an inner cavity of the containing container (1), the central angle corresponding to each material taking port (2) is not smaller than 180 degrees, an opening plate (4) capable of plugging each material taking port (2) is hinged to the end of each material taking port (2) through a vertically arranged hinge shaft (3), the opening plate (4) is of an arc-shaped structure matched with each material taking port (2), a locking sub-piece (5) is fixed to the free end of each opening plate (4), a locking parent piece (6) matched with the locking sub-piece (5) is fixed to the other end of each material taking port (2) through a transversely arranged hinge shaft in the side of the top portion, a cover body (8) matched with the upper end face of the containing container (1) is hinged to the upper end face of the top of the containing container (1) through a transversely arranged hinge shaft II (7), the top end of each strip-shaped container (3511) is provided with a pressing port (11), and at least one strip-shaped container (11) which penetrates through the top of the strip-shaped containing container (11) and extends along the strip-shaped container, and the strip-shaped container (11) and the strip-shaped container, and the strip-shaped container (11) which is arranged in the strip-shaped container, and the strip-shaped container (11) which is arranged.
  2. 2. The advanced wafer placing device as claimed in claim 1, wherein the height of the material taking port (2) is not less than the thickness of wafers and less than the thickness of two wafers.
  3. 3. advanced wafer placement device, as claimed in claim 1, wherein said locking member comprises a magnet (9) and a piece of iron (10) fixed to the top surface of the lid (8) and the container (1), respectively.
  4. 4. The advanced wafer placing device as claimed in claim 1, wherein the pushing plate is formed integrally, a link (13) extending upward from a vertical line is fixed at the center of the upper surface of the pushing plate, and the length of the link (13) is greater than the height of the container (1).
  5. 5. advanced wafer placing device, as claimed in claim 4, wherein the top of the connecting rod (13) is fixed vertically with a handle (14).
CN201921308067.6U 2019-08-13 2019-08-13 advanced wafer placing device Active CN210006706U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201921308067.6U CN210006706U (en) 2019-08-13 2019-08-13 advanced wafer placing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201921308067.6U CN210006706U (en) 2019-08-13 2019-08-13 advanced wafer placing device

Publications (1)

Publication Number Publication Date
CN210006706U true CN210006706U (en) 2020-01-31

Family

ID=69311373

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201921308067.6U Active CN210006706U (en) 2019-08-13 2019-08-13 advanced wafer placing device

Country Status (1)

Country Link
CN (1) CN210006706U (en)

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