CN210005654U - Integrated battery management system - Google Patents
Integrated battery management system Download PDFInfo
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- CN210005654U CN210005654U CN201920404790.8U CN201920404790U CN210005654U CN 210005654 U CN210005654 U CN 210005654U CN 201920404790 U CN201920404790 U CN 201920404790U CN 210005654 U CN210005654 U CN 210005654U
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Abstract
The utility model provides an integrated form battery management system, including power chip, MCU, voltage temperature acquisition chip and second voltage temperature acquisition chip, MCU respectively with power chip voltage temperature acquisition chip and second voltage temperature acquisition chip communication connection, power chip be used for the MCU power supply, voltage temperature acquisition chip has 14 voltage acquisition channels, second voltage temperature acquisition chip has 6 voltage acquisition channels, and every voltage acquisition channel all is used for gathering string electric core voltage, voltage temperature acquisition chip with second voltage temperature acquisition chip is used for transmitting the electric core voltage who gathers to MCU the collection requirement of the 19 string electric core voltage of 48V lithium titanate battery can be satisfied to the integrated form battery management system of the utility model, need not high-pressure safety isolation device, has saved the cost, and interference immunity is better.
Description
Technical Field
The utility model relates to a battery management system, in particular to integrated form battery management systems.
Background
Most of 48V battery cells in the current market are lithium iron phosphate or ternary batteries, generally comprises 14 strings of battery cells, 19 strings of battery cells are needed if lithium titanate battery cells are needed, and the current Battery Management System (BMS) is difficult to meet the voltage acquisition requirement of the 19 strings of battery cells.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model is to provide kinds of integrated form battery management systems in order to overcome prior art's battery management system and be difficult to satisfy 19 cluster electric core voltage acquisition requirement defects.
The utility model discloses an above-mentioned technical problem is solved through following technical scheme:
the utility model provides an integrated battery management systems, which comprises a power chip, a MCU (micro control unit), a voltage and temperature acquisition chip and a second voltage and temperature acquisition chip;
the MCU is respectively in communication connection with the power supply chip, the th voltage and temperature acquisition chip and the second voltage and temperature acquisition chip;
the power supply chip is used for supplying power to the MCU;
the th voltage and temperature acquisition chip is provided with 14 voltage acquisition channels, the second voltage and temperature acquisition chip is provided with 6 voltage acquisition channels, and each voltage acquisition channel is used for acquiring string electric core voltages;
the th voltage and temperature acquisition chip and the second voltage and temperature acquisition chip are used for transmitting the acquired cell voltage to the MCU.
Preferably, the MCU is in communication connection with the power chip, the th voltage and temperature acquisition chip and the second voltage and temperature acquisition chip through SPI (serial peripheral interface) buses, respectively.
Preferably, an th CAN (controller area network) transceiver is integrated in the power chip for CAN communication with an external ECU (electronic control unit).
Preferably, the integrated battery management system further comprises a second CAN transceiver for CAN communication with the MCU.
Preferably, the th voltage and temperature acquisition chip is further used for acquiring an on-board temperature and transmitting the on-board temperature to the MCU, and the second voltage and temperature acquisition chip is further used for acquiring and transmitting an NTC (i.e., NTC thermistor temperature sensor, NTC refers to thermistor phenomenon and material with negative temperature coefficient and resistance decreasing exponentially with temperature rise) temperature to the MCU.
Preferably, the th voltage and temperature acquisition chip is further used for acquiring the high voltage of the battery pack, and the voltage value range of the high voltage of the battery pack is 15-60V.
Preferably, the th voltage temperature acquisition chip and the second voltage temperature acquisition chip are both provided with analog-to-digital converters for performing analog-to-digital conversion on acquired data.
Preferably, the integrated battery management system further comprises a hall sensor and/or a shunt for current collection.
Preferably, the integrated battery management system further includes a PWM (pulse width modulation) wave driving circuit for PWM wave driving of the electrical components.
Preferably, the integrated battery management system further comprises a high-side driving circuit and a low-side driving circuit, which are respectively used for high-side driving and low-side driving of the electrical components.
The utility model discloses an actively advance the effect and lie in: the utility model discloses an integrated form battery management system can satisfy the collection requirement of the 19 electricity core voltages of cluster of 48V lithium titanate battery to need not high-pressure safety isolation device, saved the cost, collection voltage range and precision are higher, and interference immunity is better.
Drawings
Fig. 1 is a schematic block diagram of an integrated battery management system according to a preferred embodiment of the present invention.
Detailed Description
The present invention will be more clearly and completely described below with reference to the accompanying drawings.
As shown in fig. 1, the integrated battery management system of the present invention includes a power chip 1, a MCU2, a th voltage and temperature acquisition chip 3, and a second voltage and temperature acquisition chip 4;
MCU2 respectively with power chip 1, voltage temperature gather chip 3 and second voltage temperature gather chip 4 communication connection, specifically, can connect through the SPI bus respectively to communicate through the SPI mode.
The power chip 1 is used for supplying power to the MCU 2;
voltage temperature gathers chip 3 and has 14 voltage acquisition passageways, second voltage temperature gathers chip 4 and has 6 voltage acquisition passageways, and every voltage acquisition passageway all is used for gathering cluster electric core voltage, consequently, the utility model discloses can pass through voltage temperature gathers chip 3 with second voltage temperature gathers chip 4 and realizes the voltage acquisition to 19 cluster electric cores.
The th voltage and temperature acquisition chip 3 and the second voltage and temperature acquisition chip 4 are used for transmitting the acquired cell voltage to the MCU 2;
the power chip 1 is integrated with an CAN transceiver 11 for CAN communication with an external ECU, wherein the external ECU is used for communicating with the integrated battery management system, controlling the integrated battery management system to execute certain actions through commands and receiving data collected by the integrated battery management system, the external ECU CAN be a whole vehicle controller, the integrated battery management system further comprises a second CAN transceiver 5 for CAN communication with the MCU2, the second CAN transceiver 5 is CAN communication reserved by the integrated battery management system, and CAN communicate with an additional slave plate when needed.
The CAN transceiver 11 preferably also has a CAN wakeup function, which is based on the principle that under the condition of power supply, when a CAN message is available, a specific pin is given with high level to enable the MCU to start working.
voltage temperature gathers chip 3 and still is used for gathering board temperature and transmits to MCU2, specifically, board temperature means the temperature of the board of integration MCU through detecting the board temperature in order to prevent that the board is overheated, specifically can be through arranging thermistor on the board, carry out temperature detection through thermistor, and, in the utility model discloses a concrete implementation in-process, voltage temperature gathers chip 3 and can set up the collection passageway of 4 board temperatures, second voltage temperature gathers chip 4 and still is used for gathering the NTC temperature and transmits to MCU2, wherein, NTC thermistor temperature sensor specifically can arrange on the temperature point that the battery package needs to detect, in the utility model discloses a concrete implementation, second voltage temperature gathers chip 4 and can set up 5 NTC temperature collection passageways.
voltage temperature gathers chip 3 and still is used for gathering battery package high pressure the utility model discloses an in the concrete implementation process, voltage temperature gathers chip 3 and can set up 3 battery package high pressure collection passageways, the highly compressed voltage value range of battery package is 15V-60V.
The th voltage temperature acquisition chip 3 and the second voltage temperature acquisition chip 4 are both provided with analog-to-digital converters for carrying out analog-to-digital conversion on acquired data (including voltage and temperature), so that the storage and data processing are easy, and the embedded balance transistor and rich diagnosis function are provided, thereby simplifying the application.
The utility model discloses an among the concrete implementation, power chip 1 CAN adopt the english flying TLE9260 chip, and it CAN provide 3.3V supply voltage, and possesses two kinds of communication modes of SPI and CAN, possesses reset (reset) function simultaneously, and reset function specifically indicates through sending the specific interface signal of hardware, makes the operation of inside software resume specific program section operation to CAN deal with the program and run the problem of flying and jumping. The chip has a pin function, mainly collects high and low levels, and realizes corresponding functions through analog-to-digital conversion (AD conversion).
The MCU2 may specifically adopt an english flying TC234L, the voltage temperature acquisition chip 3 and the second voltage temperature acquisition chip 4 may respectively adopt two sampling chips of englizpu MC33771 and MC33772, each of which has 14 and 6 voltage acquisition channels (including a differential battery voltage acquisition channel and a stack voltage acquisition channel), and has a higher voltage acquisition range and precision, so that the voltage acquisition requirements of 6-19 strings of electric cells can be satisfied by the two sampling chips, and since the voltage acquisition range of the MC33771 chip is 9.6V-61.6V, the MC33771 chip may be used to acquire the high voltage of the battery pack, thereby saving cost.
The integrated battery management system further comprises a Hall sensor 6 and a shunt 7, wherein the Hall sensor 6 and the shunt 7 are used for collecting current, specifically, the total current of the battery pack is collected, voltages ranging from-75 mV to 75mV are provided when the current flows through the shunt 7 when the current is collected by the shunt 7, the current can be known by detecting the voltage, voltages ranging from 0.5V to 4.5V are provided when the current flows through the Hall sensor 6 when the current is collected by the Hall sensor 6, and the current can be known by detecting the voltage.
The Hall sensor 6 specifically comprises two channels, so that the acquisition range is wider than , the accuracy is higher, and the shunt 7 is integrated in the integrated battery management system, so that external welding is avoided, and the stability and the accuracy are higher.
In the specific implementation process of the present invention, the integrated battery management system further includes a PWM wave driving circuit 8 for performing PWM wave driving on the electrical components, and specifically driving an external fan or a water pump; the integrated battery management system further comprises a high-side driving circuit 9 and a low-side driving circuit 10, which are respectively used for high-side driving and low-side driving of electrical elements, and specifically can drive external relays, fans and the like.
When MCU2 adopted the TC234L chip, it still had high-pressure interlocking function, can make autonomous control when falling the electricity to IGN (ignition switch) to, it can also have IGN awakens up the function, can reserve two kinds and awaken up, can deal with multiple battery type, specifically, can be under the condition that has the power, connect through drawing high MCU 2's IGN pin level makes MCU2 begins to work.
Although particular embodiments of the present invention have been described above, it will be appreciated by those skilled in the art that these are examples only and that the scope of the present invention is defined by the appended claims. Various changes and modifications to these embodiments may be made by those skilled in the art without departing from the spirit and scope of the invention, and these changes and modifications are all within the scope of the invention.
Claims (10)
- The integrated battery management system is characterized by comprising a power supply chip, an MCU, a voltage and temperature acquisition chip and a second voltage and temperature acquisition chip;the MCU is respectively in communication connection with the power supply chip, the th voltage and temperature acquisition chip and the second voltage and temperature acquisition chip;the power supply chip is used for supplying power to the MCU;the th voltage and temperature acquisition chip is provided with 14 voltage acquisition channels, the second voltage and temperature acquisition chip is provided with 6 voltage acquisition channels, and each voltage acquisition channel is used for acquiring string electric core voltages;the th voltage and temperature acquisition chip and the second voltage and temperature acquisition chip are used for transmitting the acquired cell voltage to the MCU.
- 2. The integrated battery management system of claim 1, wherein the MCU is in communication connection with the power chip, the th voltage temperature acquisition chip and the second voltage temperature acquisition chip through SPI buses, respectively.
- 3. The integrated battery management system of claim 1, wherein the power chip has an th CAN transceiver integrated therein for CAN communication with an external ECU.
- 4. The integrated battery management system of claim 1, further comprising a second CAN transceiver for CAN communication with the MCU.
- 5. The integrated battery management system of claim 1 wherein the th voltage temperature acquisition chip is further configured to acquire an onboard temperature and transmit to the MCU, and the second voltage temperature acquisition chip is further configured to acquire an NTC temperature and transmit to the MCU.
- 6. The integrated battery management system of claim 1, wherein the th voltage and temperature acquisition chip is further configured to acquire a battery pack high voltage, and the voltage of the battery pack high voltage ranges from 15V to 60V.
- 7. The integrated battery management system of claim 1, 5 or 6, wherein the th voltage and temperature acquisition chip and the second voltage and temperature acquisition chip are provided with analog-to-digital converters for analog-to-digital conversion of the acquired data.
- 8. The integrated battery management system of claim 1, further comprising a hall sensor and/or a shunt for current collection.
- 9. The integrated battery management system of claim 1, further comprising a PWM wave driving circuit for PWM wave driving the electrical components.
- 10. The integrated battery management system of claim 1, further comprising a high side driver circuit and a low side driver circuit for high side driving and low side driving of electrical components, respectively.
Priority Applications (1)
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CN201920404790.8U CN210005654U (en) | 2019-03-27 | 2019-03-27 | Integrated battery management system |
Applications Claiming Priority (1)
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CN201920404790.8U CN210005654U (en) | 2019-03-27 | 2019-03-27 | Integrated battery management system |
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