CN209993596U

CN209993596U - LED chip light-emitting device, display device and electronic equipment

Info

Publication number: CN209993596U
Application number: CN201920982031.XU
Authority: CN
Inventors: 韩婷婷; 朱剑飞
Original assignee: SHENZHEN RUIFENG OPTOELECTRONICS CO Ltd
Current assignee: SHENZHEN RUIFENG OPTOELECTRONICS CO Ltd; Shenzhen Refond Optoelectronics Co Ltd
Priority date: 2019-06-26
Filing date: 2019-06-26
Publication date: 2020-01-24
Anticipated expiration: 2029-06-26

Abstract

The utility model relates to the technical field of electric appliance display, in particular to an LED chip light-emitting device, a display device and an electronic device, the LED chip light-emitting device provides a removable carrier, one side of the light-emitting surface of a plurality of LED chips is detachably arranged on the carrier, one side of the LED chips provided with electrodes is opposite to the carrier, insulating layers are arranged between the LED chips and between the electrodes of the LED chips, a circuit structure electrically connected with the LED chips is arranged on one side of the insulating layers away from the LED chips, a carrier is arranged and is used as a device for temporarily bearing the LED chips, one side of the light-emitting surface of the LED chips is contacted with the carrier, one side provided with the electrodes is opposite to the carrier, thus, other electric connection structures are added on the LED chips when the LED chips are fixedly borne by the carrier, the LED chips are not required to be connected and conducted by other complicated means such as hole forming or, the preparation process is simplified, and the manufacturing cost is reduced.

Description

LED chip light-emitting device, display device and electronic equipment

[ technical field ] A method for producing a semiconductor device

The utility model relates to an electrical apparatus shows technical field, especially relates to a LED chip luminescent device, display device and electronic equipment.

[ background of the invention ]

An led (light Emitting diode) is a common solid light source, and has the characteristics of long service life, high stability, energy saving, environmental protection, and the like. In the existing LED display device, an LED chip is generally arranged on a substrate, a circuit structure is arranged on the substrate, a plurality of communicated conductive holes are often required to be arranged in the process of preparation and assembly, and the LED chip and the substrate are electrically connected by penetrating a lead or conductive adhesive, so that the structure is often complicated, the assembly process is also troublesome, and a large amount of labor cost and capital cost are required to be consumed.

[ Utility model ] content

For overcoming the complicated trouble defect of equipment of the complicated structure of current LED display device, the utility model provides a display module and electronic equipment.

The utility model provides a solve above-mentioned technical problem and provide a LED chip luminescent device, provide a carrier that can remove, it is a plurality of the play plain noodles one side detachable of LED chip sets up on the carrier, the LED chip be provided with one side of electrode with the carrier is relative, between the LED chip and be provided with the insulating layer between the electrode of LED chip, keep away from at the insulating layer be equipped with the circuit structure who is connected with LED chip electricity on one side of LED chip.

Preferably, a plurality of electric connecting wires are arranged in the insulating layer, one end of each electric connecting wire is connected with the electrode of the LED chip, and the other end of each electric connecting wire extends to the surface, far away from the LED chip, of the insulating layer.

Preferably, the electrical connection line includes any one of a silver line, a gold line, or a copper line; the insulating layer is made of any one of epoxy resin, phenolic resin, urea resin, polyvinyl alcohol, polyvinyl chloride, polymethyl methacrylate and polyamide.

Preferably, the circuit structure is provided with a conductive contact electrically connected to an electrode of the LED chip.

Preferably, after the LED chip is separated from the carrier, a functional layer is disposed on a light emitting surface of the LED chip.

Preferably, the functional layer comprises a fluorescent layer.

Preferably, the functional layer further includes one or more of a prism sheet, a diffusion sheet, a reflection film, an antireflection film, a light filter film, or a protection film disposed on the fluorescent layer.

Preferably, a meltable adhesive layer is arranged between the LED chip and the carrier, and the LED chip and the carrier are bonded and fixed through the adhesive layer.

The present invention further provides a display device to solve the above technical problems, which includes the LED chip light emitting device and the display module, wherein the display module is disposed above the light emitting direction of the LED chip light emitting device, and the LED chip light emitting device provides a backlight source for the display module; or

The display device comprises the LED chip light-emitting device, wherein the LED chip light-emitting device comprises a plurality of pixel units, and each pixel unit comprises LED components of at least three colors.

The utility model provides a solve above-mentioned technical problem and still provide an electronic equipment, electronic equipment still reaches as above including the protection apron LED chip luminescent device, the protection apron sets up one side of LED chip luminescent device light-emitting direction, electronic equipment includes at least one LED chip luminescent device, display module locates on LED chip luminescent device's the luminous direction, LED chip luminescent device does display module provides the backlight.

Compared with the prior art, the carrier is arranged and used as a device for temporarily bearing the LED chip, one side of the light emitting surface of the LED chip is contacted with the carrier, and one side provided with the electrode is arranged opposite to the carrier, so that the carrier is convenient to add other electric connection structures on the LED chip when the LED chip is fixedly borne, and the LED chip is not required to be connected and conducted through other complicated means such as hole forming or lead wires on the substrate, the preparation process is simplified, and the manufacturing cost is reduced.

Through setting up the electric connecting wire, thereby the length of electric connecting wire is adjustable improves convenience and the flexibility of connecting, and the convenience is to the equipment of LED chip luminescent device.

A meltable adhesive layer is arranged between the LED chip and the carrier, so that the LED chip and the carrier can be conveniently separated in the process of preparing the LED chip light-emitting device.

The utility model provides a display device and electronic equipment have with LED chip light emitting device's same beneficial effect.

[ description of the drawings ]

Fig. 1 is a schematic front view of an LED chip light emitting device according to a first embodiment of the present invention;

fig. 2 is a schematic structural view of a light emitting surface of an LED chip according to a first embodiment of the present invention;

fig. 3 is a schematic structural view of the LED chip light emitting device according to the first embodiment of the present invention including an adhesive layer;

fig. 4 is a schematic structural view of the LED chip light emitting device according to the first embodiment of the present invention when an insulating layer is disposed thereon;

fig. 5 is a schematic structural view of the LED chip light emitting device according to the first embodiment of the present invention when an electrical connection line is provided thereon;

fig. 6 is a schematic structural view illustrating a first embodiment of the present invention in which an electrical connection structure is provided on an LED chip light-emitting device;

fig. 7 is a schematic structural view of the LED chip light emitting device according to the first embodiment of the present invention when a fluorescent layer is disposed thereon;

fig. 8 is a schematic structural view of the LED chip light emitting device according to the first embodiment of the present invention when a prism sheet is disposed thereon;

fig. 9 is a schematic diagram of the size of an LED chip according to a first embodiment of the present invention;

fig. 10 is a schematic cross-sectional view of a display device according to a second embodiment of the present invention;

fig. 11A is a schematic block diagram of a display device according to a second embodiment of the present invention;

fig. 11B is a schematic diagram illustrating an arrangement of pixel units in a display device according to a second embodiment of the present invention;

fig. 11C is a schematic structural diagram of an electronic device according to a third embodiment of the present invention;

description of reference numerals:

10. an LED chip light emitting device; 101. a carrier; 102. an insulating layer; 103. a circuit structure; 1031. a conductive contact; 104. an electrical connection wire; 1041. a conductive contact; 105. a fluorescent layer; 106. a prism sheet; 107. an adhesive layer; 108. an LED chip; 1081. an electrode; 100. a display device; 110. a display component; 191. a drive assembly; 192. a power supply component; 40. an electronic device; 41. a support body; 42. a protective cover plate; 411. a protrusion; 199. a flexible circuit board.

[ detailed description ] embodiments

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and the embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

Referring to fig. 1 and fig. 2, a first embodiment of the present invention provides an LED chip light emitting device 10, which includes a carrier 101 and a plurality of LED chips 108, wherein the plurality of LED chips 108 are detachably disposed on the carrier 101. The LED chip 108 includes a light emitting surface a, and one side of the light emitting surface a of the LED chip 108 is in contact with the carrier 101 and is detachably connected to the carrier 101. An electrode 1081 is disposed on a side of the LED chip 108 opposite to the light emitting surface a, and a surface of the LED chip 108 provided with the electrode 1081 is away from the carrier 101. The electrode 1081 is used for connecting with an external circuit, so that the LED chip 108 is turned on.

It can be understood that, in the utility model discloses in, LED chip 108 can be blue light chip or purple light chip, also can be RGB three-colour light chip. When the LED chip light emitting device 10 includes RGB three-color light chips, it can be considered that the LED chip light emitting device 10 includes a plurality of pixel units formed by RGB corresponding chips.

Referring to fig. 3, optionally, in some embodiments, an adhesive layer 107 is disposed between the LED chip 108 and the carrier 101, and the two are adhered and fixed by the adhesive layer 107. Specifically, the adhesive layer 107 may be made of an adhesive material that is soluble in chemical solvents, a hot melt adhesive, or other soluble materials. This facilitates a good separation of the LED chip 108 from the carrier 101 when the LED chip 108 needs to be separated from the carrier 101.

Referring to fig. 4, the insulating layers 102 are disposed between the LED chips 108 and between the electrodes 1081 of the LED chips 108. That is, the insulating layer 102 is provided between the gap between any adjacent two LED chips 108 and between the two electrodes 1081 of each LED chip 108. In particular, the insulating layer 102 disposed in the gap between the electrodes 1081 of the LED chip 108 can prevent the LED chip 108 from being short-circuited when the electrodes 1081 of the LED chip 108 are connected by using the circuit connection structure to turn on the LED chip 108.

Referring to fig. 5, a plurality of electrical connection wires 104 are disposed in the insulating layer 102, each electrical connection wire 104 is electrically connected to an electrode 1081 of each LED chip 108, and the other end of the electrical connection wire 104 extends to a surface of the insulating layer 102 away from the LED chip 108, so as to be conveniently connected to an external circuit structure through the electrical connection wire 104. Optionally, one end of the electrical connection wire 104, which is far away from the LED chip 108, is exposed out of the insulating layer 102 by a length, so that the connection of the electrical connection wire 104 with an external circuit structure is facilitated.

Optionally, the electrical connection line 104 includes any one of a silver line, a gold line, or a copper line. The insulating layer 102 is made of resin: such as epoxy resins, phenolic resins, urea-formaldehyde resins, polyvinyl alcohol, or medium-frequency polymers such as polyvinyl chloride, polymethyl methacrylate, and polyamide.

Referring to fig. 6, the LED chip light emitting device 10 further includes a circuit structure 103 disposed on a side of the insulating layer 102 away from the LED chip 108. The circuit structure 103 is provided with a conductive contact 1031, and is electrically connected to the electrode 1081 of the LED chip 108 through the conductive contact 1031. Optionally, the electrical connection between the two is realized by the electrical connection wire 104.

Referring to fig. 7, after the LED chip 108 is separated from the carrier 101, a functional layer is disposed on a light emitting surface of the LED chip 108. Optionally, in some embodiments, the functional layer comprises a fluorescent layer 105.

Referring to fig. 8, in some other embodiments, the functional layer further includes a prism sheet 106 disposed on the fluorescent layer 105. Optionally, the prism sheet 106 may also be one or more of a diffusion sheet, a reflection film, an antireflection film, a light filter film, or a protection film.

It is also understood that, in some other embodiments, after the LED chip 108 is separated from the carrier 101, no functional layer is disposed on the light emitting surface of the LED chip 108. The light emitting surface of the LED chip 108 emits light directly.

It is understood that the LED chip light emitting device 10 provided in the present invention may include the carrier 101 or may not include the carrier 101. In some embodiments, the LED chip light emitting device 10 can be prepared by the following steps: s1, disposing the light emitting surface of the LED chip 108 on the carrier 101, sequentially disposing the insulating layer 102, the electrical connection wire 104 and the circuit structure 103 on the electrode 1081 of the LED chip 108, determining whether to peel off the carrier 101 and the LED chip 108 first according to the actual use requirement, in this embodiment, peeling off the carrier 101 and the LED chip 108, and disposing other optical structures such as the fluorescent layer 105 and/or the prism sheet 106 on one side of the light emitting surface of the LED chip 108, thereby obtaining the LED chip light emitting device 10.

Referring to fig. 9, in the present invention, the length direction and the width direction of an LED chip 108 are defined. The dimension L of the LED chip 108 in the length direction is 10 to 900 μ M, and the dimension M in the width direction is: 10-700 μm. Preferably, the length dimension L of the LED chip 108 is 20-210 μm, 21-220 μm, 22-230 μm, 23-250 μm, 25-350 μm, 35-480 μm, 48-650 μm, 65-850 μm, 85-900 μm, and the length dimension L of the LED chip 108 may also be: 20 μm, 25 μm, 21 μm, 29 μm, 22 μm, 250 μm, 265 μm, 275 μm, 295 μm, 380 μm, 450 μm, 600 μm, 750 μm, 900 μm. The width dimension M of the LED chip 108 is 10-105 μ M, 15-110 μ M, 16-130 μ M, 130-. Preferably, the width dimension M of the LED chip 108 may be: 101 μm, 106 μm, 108 μm, 109 μm, 113 μm, 118 μm, 121 μm, 125 μm, 129 μm, 190 μm, 280 μm, 350 μm, 460 μm, 560 μm, 650 μm, 730 μm. Preferably, the LED chip 108 has an aspect ratio of 3:2, 2:1, 2.5:1, 2.4:1, 2.2:1, or 1: 1. Referring to fig. 10, a second embodiment of the present invention provides a display device 100, where the display device 100 includes the LED chip light emitting device 10 and the display module 110 provided in the first embodiment, the display module 110 is disposed in the light emitting direction of the LED chip light emitter 10, and the LED chip light emitting device 10 provides a backlight source for the display module 110. The light emitting surface of the LED chip light emitting device 10 is attached to the display module 110 without a gap.

In some preferred embodiments of the invention, the side of the fluorescent layer 105 away from the insulating layer 102 is a light emitting surface of the LED chip light emitting device 10. The light emitting surface of the fluorescent layer 105 is attached to the display assembly 110 without a gap.

As shown in fig. 11A, the display device 100 preferably further includes a power module 192 and a driving module 191, where the driving module 191 is configured to provide a control signal to the LED chip light emitting device 10 to enable the LED chip light emitting device 10 to illuminate in different areas; the power supply module 192 is used for providing electric energy for driving the LED chip light emitting device 10, and the driving module 191 may further control the power supply module 192 to be turned on or off, and may further control the output power of the power supply module 192.

Specifically, in some preferred embodiments of the present invention, the driving component 191 drives the plurality of LED chips 108 in the LED chip light emitting device 10 in a dynamic backlight driving mode.

In the present disclosure, the display assembly 110 may be a display device that needs to provide a backlight source, which includes but is not limited to: DSTN-LCD Display (Dual Scan Tortosis Nomograph-Liquid Crystal Display, double-layer super twisted nematic Liquid Crystal Display), TFT-LCD Display (thin film transistor-Liquid Crystal Display), and the like. It should be noted that the above listed kinds of the display module 110 are only for illustration and are not meant to limit the kind of the display module 110 in the present invention.

The frame of the LED chip light emitting device 10 is aligned with the edge of the display area of the display assembly 110. Furthermore, the ratio between the area of the display region of the display module 110 and the area of the light emitting surface of the fluorescent layer 105 is 1 (0.9-1.1). Preferably, the ratio between the area of the display region of the display assembly 110 and the area of the light emitting surface of the fluorescent layer 105 is further 1 (0.95-1.05). More preferably, the ratio of the area of the display region of the display assembly 110 to the area of the light emitting surface of the fluorescent layer 105 is 1: 1.

The LED chip light emitting device 10 included in the display device 100 of the present invention has all the technical features as described in the first embodiment and the modified embodiments thereof, and the description thereof is omitted here.

Referring to fig. 11B, the display device 100 includes the LED chip light emitting device 10 provided in the first embodiment, the LED chips 108 in the LED chip light emitting device 10 form a plurality of light emitting members 53, the light emitting members 53 further include a plurality of pixel units 533 uniformly distributed, and each pixel unit 533 includes LED components 531 of at least three light emitting colors. The number of pixel units 533 can be set according to the size of the display device 100 to be manufactured and the resolution of the display device 100.

Specifically, as shown in FIG. 11B, each pixel unit 533 may include an R-LED chip, a G-LED chip, and a B-LED chip. In other embodiments of this embodiment, each pixel unit 533 may include three, five or more LED assemblies 531, and at least three LED assemblies 531 are arranged in a line, an L, a delta or a square.

It is understood that the LED assembly 531 results from disposing a light conversion layer on the LED chip 108 on the LED chip light emitting device 10. The R-LED chip includes a blue LED chip 108 and a first quantum dot layer (not shown) disposed on the blue LED chip 108, and the blue LED chip 108 excites the first quantum dot layer to emit red light. The B-LED chip includes only the blue LED chip 108, which can emit blue light. The G-LED chip includes a blue LED chip 108 and a second quantum dot layer (not shown) disposed on the blue LED chip 108, and the blue LED chip 108 excites the second quantum dot layer to emit green light. The first quantum dot layer and the second quantum dot layer have different wavelengths.

Referring to fig. 11C, a third embodiment of the present invention provides an electronic device 40, wherein the electronic device 40 includes a supporting body 41, and the supporting body 41 has a cavity for accommodating the display device 100 of the second embodiment. A protective cover 42 is also provided on the side of the display device 100 facing the user.

The supporting body 41 further includes protrusions 411 symmetrically disposed on the sidewalls of the supporting body 41, and the protrusions 411 may provide support for the display device 100. The protrusion 411 further forms an inner space in the display device 100. In order to make full use of the internal space of the electronic device 40 and to avoid an excessive volume of the electronic device 40 and thereby reduce the portability of the electronic device 40, internal devices such as the power supply module 192 and the drive module 191 may be provided in the internal space.

As shown in fig. 11C, in order to further increase the screen ratio of the display area in the electronic device 40, the display module 110 in the display apparatus 100 is electrically connected to the driving module 191 through a flexible circuit board 199, and since the flexible circuit board 199 has better flexibility, the distance P between the sidewall of the supporting body 41 and the side surface of the display apparatus 100 is negligible.

Different with current electronic equipment lies in: the utility model provides a among the electronic equipment 40 display device 100 with independent each other in the display function between the supporter 41, consequently, supporter 41 only plays the support circuit structure 103's effect, and can not be right display device 100's display effect causes the influence, supporter 41 also can not be right LED chip luminescent device 10's luminous effect causes the influence.

In order to maintain a good light emitting effect of the LED chip light emitting device 10 after being locally bent, the LED chip light emitting device 10 needs to satisfy the above distribution density requirement.

In the present embodiment, the electronic device 40 includes the LED chip light emitting device 10 in any of the embodiments described above. The utility model provides a side light-emitting formula light source or direct light-emitting formula light source commonly used among LED chip luminescent device 10 and the prior art compare, can not show that the subassembly border region produces the dark space at electronic equipment 40, consequently, can make the electronic equipment 40 of no frame or narrow frame.

Furthermore, in some other embodiments of the present invention, the electronic device 40 may not have a frame for accommodating the display device 100, and the driving component 191 and the power component 192 may be disposed at the side of the display device 100, so as to obtain an electronic device with a thinner thickness.

Further, in some particular embodiments of the present invention, the electronic device 40 may be an electronic device 40a of a flexible display assembly. By selecting the above-mentioned bendable, foldable or curled circuit structure 103, the LED chip light emitting device 10a having a bendable property can be obtained, and thus an electronic device having a flexible display module can be manufactured.

The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the invention, and all modifications, equivalents and improvements made within the principles of the present invention are intended to be included within the scope of the present invention.

Claims

1. An LED chip light emitting device, characterized in that: providing a removable carrier, wherein one side of the light emitting surface of the LED chips is detachably arranged on the carrier, one side of the LED chips, which is provided with electrodes, is opposite to the carrier, insulating layers are arranged between the LED chips and between the electrodes of the LED chips, and a circuit structure which is electrically connected with the LED chips is arranged on one side, which is far away from the LED chips, of the insulating layers.

2. The LED chip light emitting device of claim 1, wherein: the LED chip is characterized in that a plurality of electric connecting wires are arranged in the insulating layer, one ends of the electric connecting wires are connected with the electrodes of the LED chip, and the other ends of the electric connecting wires extend to the surface, far away from the LED chip, of the insulating layer.

3. The LED chip light emitting device of claim 2, wherein: the electric connection wire comprises any one of a silver wire, a gold wire, a copper wire or a wire made of alloy material; the insulating layer is made of any one of epoxy resin, phenolic resin, urea resin, polyvinyl alcohol, polyvinyl chloride, polymethyl methacrylate and polyamide.

4. The LED chip light emitting device of claim 1, wherein: and the circuit structure is provided with a conductive contact electrically connected with the electrode of the LED chip.

5. The LED chip light emitting device of any one of claims 1-4, wherein: and after the LED chip is separated from the carrier, a functional layer is arranged on the light-emitting surface of the LED chip.

6. The LED chip light emitting device of claim 5, wherein: the functional layer includes a fluorescent layer.

7. The LED chip light emitting device of claim 6, wherein: the functional layer further comprises one or more of a prism sheet, a diffusion sheet, a reflection film, an antireflection film, a light filtering film or a protective film arranged on the fluorescent layer.

8. The LED chip light emitting device of claim 1, wherein: the LED chip and be provided with the viscose layer that can melt between the carrier, bond fixedly through the viscose layer between the two.

9. A display device, characterized in that: comprising the LED chip light emitting device of any one of claims 1-8 and a display assembly disposed over the light emitting direction of the LED chip light emitting device, the LED chip light emitting device providing a backlight for the display assembly; or

The display device includes the LED chip light emitting device according to any one of claims 1 to 8, which includes a plurality of pixel units each including LED components of at least three colors.

10. An electronic device, characterized in that: the electronic equipment further comprises a protective cover plate and the LED chip light-emitting device as claimed in any one of claims 1 to 8, wherein the protective cover plate is arranged on one side of the light-emitting direction of the LED chip light-emitting device, and the electronic equipment comprises at least one LED chip light-emitting device.