CN209992945U

CN209992945U - Computer motherboard heat abstractor

Info

Publication number: CN209992945U
Application number: CN201921173606.XU
Authority: CN
Inventors: 解亚萍
Original assignee: Lanzhou Resources and Environment Voc Tech College
Current assignee: Lanzhou Resources and Environment Voc Tech College
Priority date: 2019-07-24
Filing date: 2019-07-24
Publication date: 2020-01-24
Anticipated expiration: 2029-07-24

Abstract

The utility model discloses a computer motherboard heat abstractor, including casing, mainboard protection architecture, heat radiation structure and air feed structure, the casing is including closing last casing and lower casing that sets up, and mainboard protection architecture includes box body and lower box body, goes up the box body and closes each other down between the box body, goes up the box body and sets for the location board with lower box body both sides, goes up the box body and establishes the through-hole with lower box body, goes up the casing top and establishes the air feed structure, and heat radiation structure is established to casing bottom down. The utility model discloses an go up box body and box body protection mainboard down, the mainboard cooling or constant temperature are guaranteed to the through-hole, can also regard as the plug passageway of other interfaces, the fan can carry the heat to the motion of heat dissipation stick direction when blowing through the mainboard, when meetting the heat dissipation stick, the heat dissipation stick of array arrangement can change the direction of motion of hot-blast, form the turbulent flow in disorder with it, thereby make hot-blast and a plurality of heat dissipation stick's the surperficial abundant contact cooling, hot-blast still can be through the louvre by the eduction gear outside, thereby reach the purpose of mainboard cooling.

Description

Computer motherboard heat abstractor

Technical Field

The utility model belongs to the technical field of the computer, concretely relates to computer motherboard heat abstractor.

Background

A computer case motherboard, also called a motherboard, a system board or a motherboard (motherboard); it is divided into two types, namely a commercial mainboard and an industrial mainboard. It is installed in the cabinet, and is one of the most basic and important parts of the microcomputer. The motherboard is generally a rectangular circuit board on which the main circuitry that makes up the computer is mounted, typically having a BIOS chip, an I/O control chip, and keys and a panel control switch interface. The radiating effect of the computer mainboard on the existing market is poor, the protection effect on the mainboard is not good, and the installation is cumbersome, so that the computer mainboard is not beneficial to popularization.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a computer motherboard heat abstractor to solve the heat dissipation problem of current mainboard.

In order to achieve the above object, the utility model discloses a technical scheme be:

the utility model provides a computer motherboard heat abstractor, mainboard protection architecture, heat radiation structure and the air feed structure that sets up including casing and the casing, the casing is including closing last casing and lower casing that sets up, mainboard protection architecture is including setting up box body and lower box body in last casing and inferior valve body respectively, go up the box body and closing each other down between the box body, the both sides of going up the box body and box body down set up the locating plate of being connected with shells inner wall respectively, go up and set up a plurality of through-holes on the outer wall of box body and lower box body, the top of going up the casing sets up the air feed structure, set up a plurality of wire holes on the roof of going up the casing, the bottom of casing sets up heat radiation structure.

The heat dissipation structure comprises a plurality of heat dissipation rods vertically arranged on the bottom plate of the lower shell, and the heat dissipation rods are arranged in an array.

The air supply structure is a fan.

The outer walls of the upper shell and the lower shell are respectively provided with a plurality of connecting plates, the connecting plates of the upper shell and the connecting plates of the lower shell are arranged in pairs, and the connecting plates are provided with corresponding screw holes for penetrating through fixing bolts. The quick dismantlement and the installation of casing can be guaranteed in the setting of connecting plate and fixing bolt.

The height of the heat dissipation rod is lower than the bottom surface of the main board protection device.

A plurality of heat dissipation holes are arranged on the outer wall of the shell in a penetrating mode, and dust screens are arranged in the heat dissipation holes.

The locating plates are symmetrically arranged on two sides of the upper box body and the lower box body respectively.

At least one positioning column extending downwards is arranged on each of the two positioning plates of the upper box body, and at least one positioning hole used for penetrating the positioning column is arranged on each of the two positioning plates of the lower box body. When the upper shell and the lower shell are installed in a closing mode, the positioning holes and the positioning columns are matched with each other, the effect of rapid positioning can be achieved, closing of the upper box body and the lower box body is guaranteed, and installation accuracy is improved.

The upper/lower surfaces of the upper shell, the lower shell, the upper box body and the lower box body, the connecting plate and the positioning plate are all parallel to each other.

The utility model discloses compare in prior art's beneficial effect do:

the utility model is provided with the upper box body and the lower box body which are mutually involutory to provide protection for the mainboard, and the outer walls of the upper box body and the lower box body are provided with a plurality of through holes which can ensure that the mainboard is quickly cooled or kept at constant temperature under the blowing of the wind power of the fan, prevent the mainboard from burning due to overhigh temperature, the through holes and the wire holes can be used for the penetration of various wires and electric wires, the through holes can also be used as the plugging channels of other interfaces, because the fan and the heat dissipation rod are respectively arranged in the upper shell and the lower shell, the fan can carry heat to move towards the heat dissipation rod when blowing through the mainboard, when meeting the heat dissipation rods, the heat dissipation rods arranged in array can change the moving direction of hot air to disturb the hot air to form turbulent flow, thereby make hot-blast and a plurality of radiating rod's surface fully contact cooling, hot-blast still can be through the louvre by the eduction gear outside, thereby reach the purpose of mainboard cooling.

Drawings

Fig. 1 is a schematic longitudinal sectional view of the present invention;

FIG. 2 is a cross-sectional view taken along line A-A of FIG. 1;

fig. 3 is a top view of the present invention;

the reference numerals have the following meanings: 1. a housing; 2. a heat dissipation structure; 3. a wind supply structure; 4. an upper housing; 5. a lower housing; 6. an upper box body; 7. a lower box body; 8. positioning a plate; 9. a through hole; 10. a wire guide hole; 11. a heat dissipation rod; 12. a connecting plate; 13. a screw hole; 14. fixing the bolt; 15. heat dissipation holes; 16. a dust screen; 17. a positioning column; 18. positioning holes; 19. a main board.

Detailed Description

The present invention will be further described with reference to the accompanying drawings and the following detailed description.

As shown in fig. 1-3, a computer motherboard heat abstractor, mainboard protection architecture, heat radiation structure 2 and air feed structure 3 that set up including casing 1 and casing 1, casing 1 is including closing last casing 4 and lower casing 5 that sets up, and mainboard protection architecture is including setting up last box 6 and lower box 7 in last casing 4 and lower casing 5 respectively, and it is closing each other between last box 6 and the lower box 7, and the both sides of going up box 6 and lower box 7 set up respectively with casing 1 inner wall connection's locating plate 8, set up a plurality of through-holes 9 on the outer wall of going up box 6 and lower box 7, and the top of going up casing 4 sets up air feed structure 3, sets up a plurality of wire holes 10 on the roof of going up casing 4, and the bottom of lower casing 5 sets up heat radiation structure 2.

The heat dissipation structure 2 comprises a plurality of heat dissipation rods 11 vertically arranged on a bottom plate of the lower shell 5, and the heat dissipation rods 11 are arranged in an array.

The air supply structure 3 is a fan.

A plurality of connecting plates 12 are respectively arranged on the outer walls of the upper shell 4 and the lower shell 5, the connecting plates 12 of the upper shell 4 and the connecting plates 12 of the lower shell 5 are arranged in pairs, and corresponding screw holes 13 are formed in the connecting plates 12 and used for penetrating through fixing bolts 14.

The height of the heat dissipation bar 11 is lower than the bottom surface of the mainboard protection device.

A plurality of heat dissipation holes 15 are arranged on the outer wall of the shell 1 in a penetrating mode, and dust screens 16 are arranged in the heat dissipation holes 15.

The positioning plates 8 are respectively and symmetrically arranged on two sides of the upper box body 6 and the lower box body 7.

Two positioning plates 8 of the upper box body 6 are respectively provided with at least one positioning column 17 extending downwards, and two positioning plates 8 of the lower box body 7 are respectively provided with at least one positioning hole 18 used for penetrating through the positioning column 17.

The upper/lower surfaces of the upper shell 4, the lower shell 5, the upper box body 6 and the lower box body 7, the connecting plate 12 and the positioning plate 8 are all parallel to each other.

When in use, the fixing bolt 14 is screwed off from the screw hole 13, the upper shell 4 is separated from the lower shell 5, thereby the positioning column 17 is drawn out from the positioning hole 18, the upper box body 6 is separated from the lower box body 7, one end of the connecting line which needs to be connected with the lower surface of the mainboard 19 is firstly connected with the lower surface of the mainboard 19 through a clamp or other methods, then the other end of the connecting line penetrates out of the through hole 9 of the lower box body 7, then the mainboard 19 is put into the lower box body 7, one end of the connecting line which needs to be connected with the upper surface of the mainboard 19 is connected with the upper surface of the mainboard 19 through a clamp or other methods, then the other end of the connecting line penetrates out of the through hole 9 of the upper box body 6, the penetrating end of the connecting line penetrates out of the wire guiding hole 10, the upper shell 4 is placed towards the lower shell 5, two positioning columns 17 are respectively penetrated into the corresponding positioning holes 18 when the connecting plates 12 of the upper, therefore, the upper shell 4 and the lower shell 5, and the upper box body 6 and the lower box body 7 are quickly and accurately jointed, and the fixing bolt 14 is inserted into the screw hole 13 and is screwed down to finish the assembly.

The through ends of the connecting wires are respectively communicated with equipment or other components to be connected, after the power supply is started, the fan is started and supplies air to the direction of the mainboard 19, the heat generated by the mainboard enables the air to become hot air, the hot air reaches the heat dissipation structure 2 after passing through the upper box body 6 and the lower box body 7 and is disturbed by the heat dissipation rod 11 to form turbulent flow, the turbulent flow is fully contacted with the surface of the heat dissipation rod 11 made of metal with good heat dissipation effect such as copper and the like, so that the hot air is cooled, and the hot air can also pass through the dust screen 16 and is discharged from the heat dissipation hole 15, so that the heat dissipation effect is achieved.

Claims

1. A computer motherboard heat abstractor which characterized in that: including mainboard protection architecture, heat radiation structure (2) and the air feed structure (3) that set up in casing (1) and casing (1), casing (1) is including closing last casing (4) and casing (5) down that sets up, mainboard protection architecture is including setting up last box body (6) and lower box body (7) in last casing (4) and casing (5) down respectively, go up box body (6) and closing each other down between box body (7), the both sides of going up box body (6) and lower box body (7) set up locating plate (8) with casing (1) inner wall connection respectively, set up a plurality of through-holes (9) on the outer wall of going up box body (6) and lower box body (7), the top of going up casing (4) sets up air feed structure (3), set up a plurality of wire guide (10) on the roof of going up casing (4), the bottom of casing (5) sets up heat radiation structure (2) down.

2. The computer motherboard heat sink of claim 1, wherein: the heat dissipation structure (2) comprises a plurality of heat dissipation rods (11) vertically arranged on a bottom plate of the lower shell (5), and the heat dissipation rods (11) are arranged in an array.

3. The computer motherboard heat sink of claim 2, wherein: the air supply structure (3) is a fan.

4. The computer motherboard heat sink of claim 3, wherein: go up and set up a plurality of connecting plates (12) on the outer wall of casing (4) and casing (5) down respectively, go up connecting plate (12) of casing (4) and connecting plate (12) of casing (5) down and set up in pairs, be equipped with corresponding screw (13) on connecting plate (12) and be used for wearing to establish fixing bolt (14).

5. The computer motherboard heat sink of claim 4, wherein: the height of the heat dissipation rod (11) is lower than the bottom surface of the mainboard protection device.

6. The computer motherboard heat sink of claim 5, wherein: a plurality of heat dissipation holes (15) are formed in the outer wall of the shell (1) in a penetrating mode, and dust screens (16) are arranged in the heat dissipation holes (15).

7. The computer motherboard heat sink of claim 6, wherein: the positioning plates (8) are respectively and symmetrically arranged on two sides of the upper box body (6) and the lower box body (7).

8. The computer motherboard heat sink of claim 7, wherein: two locating plates (8) of the upper box body (6) are respectively provided with at least one locating column (17) extending downwards, and two locating plates (8) of the lower box body (7) are respectively provided with at least one locating hole (18) used for penetrating through the locating column (17).

9. The computer motherboard heat sink of claim 8, wherein: the upper and lower surfaces of the upper shell (4), the lower shell (5), the upper box body (6) and the lower box body (7), the connecting plate (12) and the positioning plate (8) are all parallel to each other.