CN209992637U

CN209992637U - Voltage temperature acquisition circuit board of battery pack

Info

Publication number: CN209992637U
Application number: CN201920297670.2U
Authority: CN
Inventors: 胡安建; 许玉林; 王刚
Original assignee: Suzhou Ankao Energy Co Ltd
Current assignee: Shanghai Qike Network Technology Co ltd
Priority date: 2019-03-08
Filing date: 2019-03-08
Publication date: 2020-01-24
Anticipated expiration: 2029-03-08

Abstract

The application discloses voltage temperature acquisition circuit board of group battery, which comprises a plate body, be provided with temperature acquisition chip, voltage acquisition chip and docking plug on the plate body, still be provided with on the plate body and both be in docking plug with on the connecting circuit of temperature acquisition chip, be in again docking plug with jumper socket on the connecting circuit of voltage acquisition chip, jumper socket includes that a plurality of upper reaches of mutual isolation are participated in and a plurality of low reaches are participated in, the upper reaches are participated in through locating circuit on the plate body with the docking plug electricity is connected, low reaches are participated in through locating circuit on the plate body with the temperature acquisition chip or the voltage acquisition chip electricity is connected, the last cartridge of dismantling of jumper socket will the upper reaches are participated in and the low reaches are participated in the jumper plug of. The battery pack temperature acquisition device is suitable for voltage and temperature acquisition of battery packs of various specifications, is convenient to use and is not easy to burn.

Description

Voltage temperature acquisition circuit board of battery pack

Technical Field

The application relates to a voltage temperature acquisition circuit board of group battery.

Background

When cylindrical lithium ion batteries are grouped, the consistency of voltage and temperature of each battery needs to be checked. The existing voltage and temperature acquisition technology comprises the following steps: the voltage acquisition chip, the temperature acquisition chip and the butt plug are arranged on the board body of the circuit board, so that the voltage and temperature acquisition circuit board is formed.

In practical application, the temperature probes and the voltage collecting points are required to be arranged in the battery pack in advance, the temperature probes and the voltage collecting points are led to an outgoing plug in a centralized manner by using a lead or/and a transition plate, and then the butt joint plug on the circuit board body is connected with the outgoing plug in a butt joint manner, so that the connection between each temperature probe and the temperature collecting chip and the connection between the voltage collecting points and the voltage collecting chip are realized.

Temperature acquisition chips, voltage acquisition chips and docking plugs can be purchased in the market at present, and during manufacturing, the purchased temperature acquisition chips, voltage acquisition chips and docking plugs need to be assembled on the circuit board body.

After the temperature acquisition chip and the voltage acquisition chip are installed, the circuit board body is provided with a plurality of welding spots (or welding holes) connected with the temperature acquisition chip and the voltage acquisition chip, and when the butt plug is installed, a plurality of tail pins at the tail end of the butt plug are required to be correspondingly welded with the plurality of welding spots. However, in practical applications, if each tail pin is soldered to a corresponding solder joint (or solder hole), the voltage and temperature acquisition circuit board can only be used for acquiring the temperature and voltage of a battery pack with a fixed specification, otherwise the circuit board would be burnt. Therefore, for battery packs of different specifications (different numbers of temperature probes and voltage acquisition points in different battery packs), a plurality of corresponding tail pins on the butt joint connector and a plurality of corresponding welding points on the initial circuit board need to be welded in a one-to-one correspondence manner, and as long as one tail pin is welded incorrectly, the circuit board is burnt in the using process. In addition, once the installation of the butt plug is completed, the manufactured voltage and temperature acquisition circuit board can only be used for acquiring the voltage and the temperature value of the battery pack with fixed specification, and the application range is narrow.

Disclosure of Invention

The purpose of the application is: in order to solve the problems, the voltage and temperature acquisition circuit board of the battery pack is provided, is suitable for acquiring the voltage and temperature of the battery packs with various specifications, is convenient to use and is not easy to burn.

The technical scheme of the application is as follows:

the utility model provides a voltage temperature acquisition circuit board of group battery, the package rubbing board body, be provided with temperature acquisition chip, voltage acquisition chip and docking plug on the plate body, still be provided with on the plate body and both be in docking plug with on the connecting circuit of temperature acquisition chip, also be in docking plug with jumper socket on the connecting circuit of voltage acquisition chip, jumper socket includes that a plurality of upper reaches of mutual isolation are participated in and a plurality of low reaches are participated in, the upper reaches are participated in through locating circuit on the plate body with the docking plug electricity is connected, low reaches are participated in through locating circuit on the plate body with the temperature acquisition chip or the voltage acquisition chip electricity is connected, the last cartridge of dismantling of jumper socket will the upper reaches are participated in and the low reaches are participated.

All of the upstream pins are electrically connected to the docking plug.

And one part of the downstream pins are electrically connected with the temperature acquisition chip, and the other part of the downstream pins are electrically connected with the voltage acquisition chip.

The jumper socket comprises a first insulating shell and a second insulating shell which are arranged at intervals, wherein the upstream pin is arranged in the first insulating shell, and the downstream pin is arranged in the second insulating shell.

The first insulating shell and the second insulating shell are made of plastic materials.

The application has the advantages that:

1. when the acquisition board is used for acquiring the temperature and voltage signals of the battery packs with different specifications, the jumper plug socket with the corresponding specification is selected on the jumper socket of the acquisition board according to the specification of the battery packs, so that the corresponding upstream pin and the downstream pin are in conductive connection, the operation is very convenient, and the adaptability is wide.

2. All the upstream pins in the jumper socket are in conductive connection with the butt plug, and even if the number of temperature and voltage acquisition points in a certain battery pack is large, the voltage and the temperature of the battery pack can be acquired by using the acquisition board as long as the total number of the upstream pins in the acquisition board is not exceeded.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required to be used in the description of the embodiments are briefly introduced below, the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.

FIG. 1 is a schematic structural diagram of a voltage temperature acquisition circuit board according to an embodiment of the present application, in which a jumper plug is removed;

fig. 2 is a schematic structural diagram of the embodiment of the present application after the jumper socket and the jumper plug are plugged.

Wherein: 1-board body, 2-temperature acquisition chip, 3-voltage acquisition chip, 4-butt plug, 5-jumper socket, 6-jumper plug, 501-upstream pin, 502-downstream pin, 503-first insulating shell and 504-second insulating shell.

Detailed Description

The present application will be described in further detail below with reference to the accompanying drawings by way of specific embodiments. The present application may be embodied in many different forms and is not limited to the embodiments described in the present embodiment. The following detailed description is provided to facilitate a more thorough understanding of the present disclosure, and the words used to indicate orientation, top, bottom, left, right, etc. are used solely to describe the illustrated structure in connection with the accompanying figures.

One skilled in the relevant art will recognize, however, that one or more of the specific details can be omitted, or other methods, components, or materials can be used. In some instances, some embodiments are not described or not described in detail.

Furthermore, the technical features, aspects or characteristics described herein may be combined in any suitable manner in one or more embodiments. It will be readily appreciated by those of skill in the art that the order of the steps or operations of the methods associated with the embodiments provided herein may be varied. Thus, any sequence in the figures and examples is for illustrative purposes only and does not imply a requirement in a certain order unless explicitly stated to require a certain order.

The numbering of the components as such, e.g., "first", "second", etc., is used herein only to distinguish the objects as described, and does not have any sequential or technical meaning. The term "connected" and "coupled" when used in this application, unless otherwise indicated, includes both direct and indirect connections (couplings).

Fig. 1 and 2 show a preferred embodiment of the voltage and temperature acquisition circuit board of the present application, and as with the conventional structure, the circuit board also includes a board body 1, a temperature acquisition chip 2, a voltage acquisition chip 3 and a docking plug 4 are disposed on the board body 1, and the docking plug 4 is used for docking a plug led out from a battery pack, so as to correspondingly connect a temperature probe and a voltage acquisition point disposed in the battery pack with the temperature acquisition chip 2 and the voltage acquisition chip 3.

The key improvement of the embodiment is as follows: a jumper socket 5 is also arranged on the plate body 1, and the jumper socket 5 is positioned on the connecting circuit of the butt plug 4 and the temperature acquisition chip 2 and the connecting circuit of the butt plug 4 and the voltage acquisition chip 3. That is, the electrical signal introduced from the mating plug 4 must pass through the aforementioned jumper socket 5 to reach the temperature-collecting chip 2 and the voltage-collecting chip 3. The jumper socket 5 comprises a plurality of upstream pins 501 and a plurality of downstream pins 502 which are arranged in an isolated manner, wherein the upstream pins 501 are electrically connected with the docking plug 4 through a circuit arranged on the board body 1, the downstream pins 502 are electrically connected with the temperature acquisition chip 2 or the voltage acquisition chip 3 through a circuit arranged on the board body 1, and a jumper plug (not shown in the figure) is detachably inserted into the jumper socket 5 so as to electrically connect the upstream pins 501 and the downstream pins 502 by means of electric conductors in the jumper plug, thereby realizing the electrical connection between the docking plug 4 and the temperature acquisition chip 2 and the voltage acquisition chip 3.

In practical application, the butt plug 4 is connected with a leading-out plug led out from a tested battery pack in a butt-plug manner, then a jumper plug with a corresponding specification is selected to be plugged into the jumper socket 5 according to the number of temperature probes and voltage acquisition points in the tested battery pack, so that a corresponding part of upstream pins 501 and a corresponding part of downstream pins 502 on the jumper socket 5 are in conductive connection, original data acquired by each temperature probe and each voltage acquisition point in the battery pack are transmitted to the temperature acquisition chip 2 and the voltage acquisition chip 3 sequentially through the leading-out plug, the butt plug 3, the upstream pins 501 and the downstream pins 502 in conductive connection, and the temperature acquisition chip 2 and the voltage acquisition chip 3 process the original data to obtain corresponding temperature values and voltage values. The other part of the upstream pins and the downstream pins which are not connected by the jumper plug are not connected with the acquisition circuit and are in an idle state.

If the circuit board is used for collecting the temperature and the voltage of a battery pack of another specification, the jumper plug of another specification needs to be replaced by a corresponding jumper plug of another specification to be inserted into the jumper socket 5 because the number of temperature probes and voltage collecting points in the battery pack is changed, so that another group of the upstream pins 501 and the downstream pins 502 are in conductive connection. According to the different of group battery specification, select the jumper plug of corresponding specification can, easy operation, adaptability is wide.

And, still be provided with the bluetooth chip with aforementioned temperature acquisition chip 2 and 3 circuit connection's of voltage acquisition chip on the plate body 1 to obtain temperature signal and voltage signal with the help of this bluetooth chip with temperature acquisition chip 2 and 3 with voltage acquisition chips and convey to downstream equipment with wireless bluetooth mode.

In order to allow the acquisition circuit board to acquire as many temperature points and voltage points as possible, all the upstream pins 501 of the jumper socket 5 are electrically connected to the mating plug 3.

Further, among all the downstream pins 502 described above, a part of the downstream pins 502 is electrically connected to the temperature-collecting chip 2, and the remaining part of the downstream pins 502 is electrically connected to the voltage-collecting chip 3.

In order to prevent the upstream pin 501 and the downstream pin 502 from being bent and overlapped together due to the touch of foreign objects, which may result in the burning of the circuit board, the jumper socket 5 of the present embodiment includes a first insulating housing 503 and a second insulating housing 504 arranged at a distance from each other, wherein the upstream pin 501 is arranged in the first insulating housing 503, and the downstream pin 502 is arranged in the second insulating housing 504. The upstream pin and the downstream pin are separated by the two insulating housings.

The first insulating housing 503 and the second insulating housing 504 are made of plastic.

The temperature acquisition chip 2, the voltage acquisition chip 3 and the Bluetooth chip 6 are all outsourced commodities, wherein the model of the temperature acquisition chip 2 is CY8C4247LQI-BL483, and the model of the voltage acquisition chip 3 is ML 5238.

The above embodiments are only for illustrating the technical concepts and features of the present application, and the purpose of the embodiments is to enable people to understand the content of the present application and implement the present application, and not to limit the protection scope of the present application. All equivalent changes and modifications made according to the spirit of the main technical scheme of the application are covered in the protection scope of the application.

Claims

1. A voltage and temperature acquisition circuit board of a battery pack comprises a board body (1), wherein a temperature acquisition chip (2), a voltage acquisition chip (3) and a butt plug (4) are arranged on the board body (1),

it is characterized in that the board body (1) is also provided with a jumper socket (5) which is positioned on a connecting circuit of the butt plug (4) and the temperature acquisition chip (2) and a connecting circuit of the butt plug (4) and the voltage acquisition chip (3), the jumper socket (5) comprises a plurality of upstream pins (501) and a plurality of downstream pins (502) which are mutually isolated, the upstream pin (501) is electrically connected with the butt plug (4) through a circuit arranged on the plate body (1), the downstream pin (502) is electrically connected with the temperature acquisition chip (2) or the voltage acquisition chip (3) through a circuit arranged on the plate body (1), the jumper plug (6) which electrically connects the upstream pin (501) and the downstream pin (502) is detachably inserted into the jumper socket (5).

2. The battery pack voltage temperature acquisition circuit board according to claim 1, wherein all of the upstream pins (501) are electrically connected to the docking plug (4).

3. The battery pack voltage temperature acquisition circuit board according to claim 1, wherein a portion of the downstream pins (502) are electrically connected to the temperature acquisition chip (2), and another portion of the downstream pins (502) are electrically connected to the voltage acquisition chip (3).

4. The battery pack voltage temperature acquisition circuit board according to claim 1, wherein a portion of the downstream pins (502) are electrically connected to the temperature acquisition chip (2), and the remaining portion of the downstream pins (502) are electrically connected to the voltage acquisition chip (3).

5. The battery pack voltage temperature acquisition circuit board according to claim 1, wherein the jumper socket (5) comprises a first insulating housing (503) and a second insulating housing (504) arranged at a distance from each other, the upstream pin (501) being arranged in the first insulating housing (503), and the downstream pin (502) being arranged in the second insulating housing (504).

6. The battery pack voltage temperature acquisition circuit board according to claim 5, wherein the first insulating housing (503) and the second insulating housing (504) are both made of plastic.

7. The battery pack voltage and temperature acquisition circuit board according to claim 1, wherein the board body (1) is provided with a bluetooth chip electrically connected with the temperature acquisition chip (2) and the voltage acquisition chip (3).