CN209986185U

CN209986185U - Notebook heat dissipation copper pipe mould

Info

Publication number: CN209986185U
Application number: CN201920299619.5U
Authority: CN
Inventors: 高善广; 付春华
Original assignee: Chongqing Juheng Electronic Technology Co Ltd
Current assignee: Chongqing Juheng Electronic Technology Co Ltd
Priority date: 2019-03-11
Filing date: 2019-03-11
Publication date: 2020-01-24
Anticipated expiration: 2029-03-11

Abstract

The utility model discloses a notebook computer heat dissipation copper pipe mould, which relates to the technical field of moulds and comprises a mould frame, wherein the top of the mould frame is provided with a limit post, the outer part of the limit post is penetrated with a bottom mould, and the outer part of the limit post is provided with a top mould near the top position of the bottom mould, the inner part of the bottom mould is provided with a copper pipe groove, the top part of the top mould is provided with a liquid injection groove, the inner part of the mould frame is provided with a diversion groove, and one end of the mould frame is provided with a water inlet pipe near one side position of the diversion groove, the utility model discloses a sleeve pipe, a fixed seat and a clamping groove, after the sleeve pipe with different lengths is fixed with the fixed seat, the length of the copper pipe formed outside the clamping pipe can be further controlled, so that the mould can simultaneously process a plurality of copper pipes with different lengths at one time, and the problem that the, so that the processing process of the copper pipe is inconvenient.

Description

Notebook heat dissipation copper pipe mould

Technical Field

The utility model belongs to the technical field of the mould, concretely relates to notebook heat dissipation copper pipe mould.

Background

Dies, various moulds and tools for obtaining the desired products by injection, blow, extrusion, die-casting or forging, smelting, stamping, etc. in industrial production, in short, a die is a tool for making shaped articles, which tool is composed of various parts, and different dies are composed of different parts.

However, the notebook computer heat dissipation copper pipe mold in the current market still has defects when in use, for example, because the inside of the notebook computer needs to utilize a plurality of heat dissipation copper pipes with different lengths for heat conduction, and the traditional mold is difficult to process a plurality of copper pipes with different lengths at one time, the copper pipes need to be cut again after the copper pipes are processed, and then the copper pipe processing process is inconvenient, and in addition, after the copper melt is injected into the traditional mold, the mold is difficult to rapidly cool and mold the copper melt inside the mold, so that the mold production efficiency is low.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a notebook heat dissipation copper pipe mould to the mould that proposes is difficult to the copper pipe of a plurality of different length of disposable processing in solving above-mentioned background art, and the inside copper melt of mould is difficult to the fashioned problem of quick cooling.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a notebook heat dissipation copper pipe mould, includes the die carrier, the top of die carrier is provided with spacing post, the outside of spacing post is run through there is the die block, and the outside of spacing post is close to the top position department of die block and is provided with the top mould, the copper pipe groove has been seted up to the inside of die block, the liquid injection groove has been seted up at the top of top mould, the guiding gutter has been seted up to the inside of die carrier, and one side position department that the one end of die carrier is close to the guiding gutter is provided with the inlet tube, the die carrier is provided with the outlet pipe for the one end of inlet tube, the inside position department that the top of die carrier is located the copper pipe groove is provided with the card pipe, the outside bottom of card pipe is provided with the fixing base.

Preferably, the two sides of the outer portion of the top die are both provided with connecting blocks, and round holes are formed in the connecting blocks.

Preferably, a partition plate is arranged inside the clamping pipe, and the bottom end of the partition plate is connected with the die carrier.

Preferably, a limiting ring is arranged at one side of the top die close to the liquid injection groove, and a funnel-shaped slotted hole is formed in the limiting ring.

Preferably, the top die is provided with an exhaust hole at a position close to the upper part of the clamping pipe, and a metal screen is arranged in the exhaust hole.

Compared with the prior art, the beneficial effects of the utility model are that:

(1) the utility model discloses set up sleeve pipe, fixing base and draw-in groove, with the fixed back of sleeve pipe and fixing base of different length, can change the relative length between card pipe and the copper pipe groove, and then can control the fashioned copper pipe length in outside the card pipe to make the mould once only process the copper pipe of a plurality of different lengths simultaneously, solved the copper pipe that the processing of traditional device finishes and need cut once more, cause the inconvenient problem of copper pipe course of working.

(2) The utility model discloses set up card pipe, guiding gutter, inlet tube and outlet pipe, can make guiding gutter and the inside rivers circulation flow of card pipe through inlet tube and outlet pipe, and then rivers can take away the heat on the card pipe to can let the outside copper melt of card pipe cool off fast, thereby accelerate the formation of copper pipe, solved traditional mould and be difficult to fast to its inside copper melt cooling, lead to the problem that mould production efficiency is low.

Drawings

Fig. 1 is a schematic structural view of the present invention;

fig. 2 is a side view of the fixing base of the present invention;

fig. 3 is a sectional view of the slot of the present invention;

in the figure: the method comprises the following steps of 1-a mould frame, 2-a diversion trench, 3-a water inlet pipe, 4-a limiting column, 5-a top mould, 6-an exhaust hole, 7-a fixed seat, 8-a liquid injection trench, 9-a bottom mould, 10-a copper pipe trench, 11-a partition plate, 12-a clamping pipe, 13-a connecting block, 14-a sleeve, 15-a water outlet pipe, 16-a limiting ring and 17-a clamping groove.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-3, the present invention provides a technical solution: a notebook computer heat dissipation copper pipe mold comprises a mold frame 1, wherein a limit column 4 is arranged at the top of the mold frame 1, a bottom mold 9 penetrates through the outside of the limit column 4, a top mold 5 is arranged at the position, close to the top of the bottom mold 9, of the outside of the limit column 4, a copper pipe groove 10 is arranged inside the bottom mold 9, a liquid injection groove 8 is arranged at the top of the top mold 5, a diversion groove 2 is arranged inside the mold frame 1, a water inlet pipe 3 is arranged at the position, close to one side of the diversion groove 2, of one end of the mold frame 1, a water outlet pipe 15 is arranged at the end, opposite to the water inlet pipe 3, of the mold frame 1, a clamp pipe 12 is arranged at the position, located inside the copper pipe groove 10, the relative length between the clamp pipe 12 and the copper pipe groove 10 can be changed after a sleeve pipe 14 with different lengths is fixed with a fixing seat 7, so as to adjust the, the outside of fixing base 7 is provided with sleeve pipe 14, and sleeve pipe 14's inside has been seted up with card pipe 12 assorted draw-in groove 17, and rivers can carry out the circulation through inlet tube 3 and outlet pipe 15 in guiding gutter 2 and the inside of card pipe 12 and flow, and then can take away the heat on the card pipe 12 fast to accelerate the forming process of copper pipe.

Further, the outside both sides of top mould 5 all are provided with connecting block 13, and the round hole has been seted up to connecting block 13's inside.

Further, a partition plate 11 is arranged inside the clamping pipe 12, and the bottom end of the partition plate 11 is connected with the die carrier 1, so that the speed of water flow inside the clamping pipe 12 during circulating flow is increased.

Specifically, a position of one side of the top mold 5 close to the liquid injection groove 8 is provided with a limiting ring 16, and a funnel-shaped groove hole is formed in the limiting ring 16.

Specifically, the inside of the top die 5 is provided with an exhaust hole 6 at a position above the clamping pipe 12, and a metal screen is arranged inside the exhaust hole 6.

The utility model discloses a theory of operation and use flow: the utility model discloses a before using, can be fixed with sleeve pipe 14 of different length and fixing base 7, so that adjust the relative length between card pipe 12 and the copper pipe groove 10, and then can control the copper pipe length of the outside shaping of card pipe 12, thereby make the mould can once only process the copper pipe of a plurality of different lengths simultaneously, accelerate work efficiency, later again pass through the molten copper into to the inside of notes cistern 8 through spacing ring 16, then the molten copper can enter into in the copper pipe groove 10, can make the molten copper of copper pipe groove 10 inside form the tubulose under the effect of card pipe 12, then pour into the cooling water into to the inside of inlet tube 3, can make guiding gutter 2 and the inside rivers circulation flow of card pipe 12 through inlet tube 3 and outlet pipe 15, and then the heat on the card pipe 12 can be taken away to rivers, so that can let the outside molten copper of card pipe 12 cool off fast, thereby accelerate the formation of copper pipe.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a notebook heat dissipation copper pipe mould, includes die carrier (1), the top of die carrier (1) is provided with spacing post (4), the outside of spacing post (4) is run through there is die block (9), and the outside of spacing post (4) is close to top position department of die block (9) and is provided with top mould (5), copper pipe casing (10) have been seted up to the inside of die block (9), notes cistern (8), its characterized in that have been seted up at the top of top mould (5): guiding gutter (2) have been seted up to the inside of die carrier (1), and one side position department that the one end of die carrier (1) is close to guiding gutter (2) is provided with inlet tube (3), die carrier (1) is provided with outlet pipe (15) for the one end of inlet tube (3), the inside position department that the top of die carrier (1) is located copper pipe groove (10) is provided with card pipe (12), the outside bottom of card pipe (12) is provided with fixing base (7), the outside of fixing base (7) is provided with sleeve pipe (14), sleeve pipe (14) inside seted up with card pipe (12) assorted draw-in groove (17).

2. The notebook computer heat dissipation copper pipe mold of claim 1, wherein: the outer two sides of the top die (5) are provided with connecting blocks (13), and round holes are formed in the connecting blocks (13).

3. The notebook computer heat dissipation copper pipe mold of claim 1, wherein: the inside of card pipe (12) is provided with baffle (11), the bottom of baffle (11) is connected with die carrier (1).

4. The notebook computer heat dissipation copper pipe mold of claim 1, wherein: a limiting ring (16) is arranged at one side position of the top die (5) close to the liquid injection groove (8), and a funnel-shaped groove hole is formed in the limiting ring (16).

5. The notebook computer heat dissipation copper pipe mold of claim 1, wherein: exhaust holes (6) are formed in the position, close to the upper portion of the clamping pipe (12), in the top die (5), and a metal screen is arranged in the exhaust holes (6).