CN209986145U - MOS pipe presser foot device - Google Patents

MOS pipe presser foot device Download PDF

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Publication number
CN209986145U
CN209986145U CN201920579423.1U CN201920579423U CN209986145U CN 209986145 U CN209986145 U CN 209986145U CN 201920579423 U CN201920579423 U CN 201920579423U CN 209986145 U CN209986145 U CN 209986145U
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China
Prior art keywords
sleeve
bending
rack
pressing plate
fixed mounting
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CN201920579423.1U
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Chinese (zh)
Inventor
李宏图
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Nanjing Pulian Microelectronics Technology Co Ltd
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Nanjing Pulian Microelectronics Technology Co Ltd
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Priority to CN201920579423.1U priority Critical patent/CN209986145U/en
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Abstract

The utility model discloses a MOS pipe presser foot device, including the installation base, installation base upper surface center fixed mounting has lower mould subassembly, and installs base upper surface both sides center fixed mounting and have the installation roof beam, installation roof beam top surface center fixed mounting has hydraulic lifting cylinder, hydraulic lifting cylinder installs last mould subassembly in the output. The utility model has the advantages that the fixed pressing plate which is connected with the bending pressing plate in a sliding way can be arranged to press the MOS tube while bending the pins, thereby avoiding the influence on the bending effect of the pins due to the deviation of the MOS tube, and providing a certain buffering effect for the fixed pressing plate by arranging the spring which is sleeved on the round shaft; the utility model discloses a but be provided with free angle regulation's baffle, the cooperation is bent the effect of clamp plate, can realize the processing to the different angle of bending of MOS pipe pin, and it is effectual to bend, easy operation, and the old this cheap of equipment, and the practicality is strong.

Description

MOS pipe presser foot device
Technical Field
The utility model relates to an electrical components processing equipment technical field specifically is a MOS pipe presser foot device.
Background
The MOS transistor is a metal-insulator semiconductor, and is a component commonly used in the electronic industry. The pins of the MOS tube need to be bent before use.
When the pins of the MOS tube are bent, the pins are usually bent manually, and manual bending is not only low in efficiency, but also poor in bending effect; most equipment applied to the MOS tube pin pressing device at present is heavy and single in function, and can not well meet the selection of various bending angles. Accordingly, a MOS transistor pin device is provided by those skilled in the art to solve the above problems in the background art.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a MOS pipe presser foot device to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme:
the utility model provides a MOS pipe presser foot device, includes the installation base, installation base upper surface center fixed mounting has lower module, and installs base upper surface both sides center fixed mounting and have the installation roof beam, installation roof beam top surface center fixed mounting has hydraulic lift jar, last module is installed to hydraulic lift jar output.
As a further aspect of the present invention: the upper die assembly comprises a bending pressing plate, a fixing pressing plate, a round shaft and a spring, the upper surface of the bending pressing plate is fixedly provided with a first sleeve, the round shaft is slidably arranged in the first sleeve, the fixing pressing plate is fixedly arranged on the bottom surface of the round shaft, and the spring is sleeved on the outer surface of the round shaft in the first sleeve.
As a further aspect of the present invention: lower mould subassembly includes backup pad, recess, baffle, rack, rotation handle, gear, second sleeve and latch, the backup pad upper surface is seted up flutedly, and backup pad upper end both sides all rotate and install the baffle, the equal fixed mounting in backup pad lower extreme both sides has the second sleeve, the second sleeve surface rotates installs the rotation handle, and the inside slidable mounting of second sleeve has the rack, it has the gear to rotate handle front end fixed mounting, wheel and rack toothing, second sleeve front surface is pegged graft and is had the latch.
As a further aspect of the present invention: the first sleeves are two, and the centers of the two first sleeves are symmetrically distributed on two sides of the upper surface of the bending pressing plate.
As a further aspect of the present invention: and a soft rubber layer is laid on the lower surface of the fixed pressing plate.
As a further aspect of the present invention: tooth grooves are formed in the upper surface and the lower surface of the rack, and the front end of the rack is rotatably connected to the bottom of the side face of the baffle.
Compared with the prior art, the beneficial effects of the utility model are that:
1. the utility model discloses a be provided with the fixed pressing plate of sliding connection on the clamp plate of bending, can compress tightly the MOS pipe when carrying out the pin and bend, avoided producing the effect of bending that the skew influences the pin because of the MOS pipe, through being provided with and cup joint at the epaxial spring of circle, provide certain buffering effect for fixed pressing plate.
2. The utility model discloses a but be provided with free angle regulation's baffle, the cooperation is bent the effect of clamp plate, can realize the processing to the different angle of bending of MOS pipe pin, and it is effectual to bend, easy operation, and the old this cheap of equipment, and the practicality is strong.
Drawings
FIG. 1 is a schematic diagram of a MOS transistor pin pressing device;
FIG. 2 is a schematic diagram of a top mold assembly of a MOS transistor pin pressing device;
FIG. 3 is a schematic diagram of a lower mold assembly of a MOS transistor pin pressing device;
fig. 4 is a schematic cross-sectional view of a MOS transistor pin device at a.
In the figure: 1. installing a base; 2. mounting a beam; 3. a hydraulic lift cylinder; 4. an upper die assembly; 5. a lower die assembly; 401. bending the pressing plate; 402. fixing the pressing plate; 403. a circular shaft; 404. a spring; 405. a first sleeve; 501. a support plate; 502. a groove; 503. a baffle plate; 504. a rack; 505. rotating the handle; 506. a gear; 507. a second sleeve; 508. and (4) clamping teeth.
Detailed Description
Please refer to fig. 1-4, in the embodiment of the utility model, an MOS pipe presser foot device, including installation base 1, installation base 1 upper surface center fixed mounting has lower mould subassembly 5, and installation base 1 upper surface both sides center fixed mounting has installation roof beam 2, 2 top surface center fixed mounting of installation roof beam have hydraulic lift jar 3, hydraulic lift jar 3's model does, and last mould subassembly 4 is installed to 3 outputs of hydraulic lift jar, through driving hydraulic lift jar 3, can realize going up module 4's lift, realizes the process of MOS pipe presser foot.
In fig. 2: go up mould subassembly 4 including the clamp plate 401 of bending, fixed clamp plate 402, circle axle 403 and spring 404, the fixed surface installs first sleeve 405 on the clamp plate 401 of bending, first sleeve 405 has two, and two first sleeve 405 central symmetry distribute in clamp plate 401 upper surface both sides of bending, the inside slidable mounting of first sleeve 405 has circle axle 403, circle axle 403 bottom surface fixed mounting has fixed clamp plate 402, soft rubber layer has been laid to fixed clamp plate 402 lower surface, circle axle 403 is located the inside surface cup joints spring 404 of first sleeve 405, through setting up clamp plate 401 of bending, can realize bending to the MOS pipe pin, through setting up fixed clamp plate 402, can guarantee the stable clamp of in-process MOS pipe of bending, through setting up soft rubber layer and spring 404, can effectively reduce the damage that the MOS pipe caused because of pressure in the clamping process.
In fig. 3 and 4: the lower die component 5 comprises a supporting plate 501, a groove 502, a baffle 503, a rack 504, a rotating handle 505, a gear 506, a second sleeve 507 and a latch 508, wherein the groove 502 is formed in the upper surface of the supporting plate 501, the baffle 503 is rotatably mounted on two sides of the upper end of the supporting plate 501, the second sleeve 507 is fixedly mounted on two sides of the lower end of the supporting plate 501, the rotating handle 505 is rotatably mounted on the outer surface of the second sleeve 507, the rack 504 is slidably mounted in the second sleeve 507, tooth grooves are formed in the upper surface and the lower surface of the rack 504, the front end of the rack 504 is rotatably connected to the bottom of the side surface of the baffle 503, the gear 506 is fixedly mounted at the front end of the rotating handle 505, the gear 506 is meshed with the rack 504, the latch 508 is inserted in the front surface of the second sleeve 507, the groove 502 is arranged, placement and clamping of MOS tubes are facilitated, the angle, with the demand of realizing different presser foot angles, through setting up rack 504, rotating handle 505 and with rack 504 intermeshing's gear 506, made things convenient for people to adjust the angle of baffle 503, through setting up latch 508, can accomplish the back at baffle 503 angle modulation, carry out effectual lock to rack 504 and die, guaranteed the stability of presser foot in-process.
The utility model discloses a theory of operation is: when people press the pins of the MOS tube, firstly, the MOS tube is stably placed in the groove 502 on the supporting plate 501, the latch 508 is shifted to be separated from the tooth space on the upper surface of the rack 504, at the moment, the rack 504 is in a movable state, the rotating handle 505 is shaken to drive the gear 506 to rotate, the gear 506 rotates due to the engagement of the gear 506 and the rack 504, the rack 504 can be driven to slide in the second sleeve 507, so as to drive the baffle 503 to rotate, thereby realizing the adjustment of the angle of the baffle 503, after the proper angle is adjusted, the latch 508 is shifted down to the tooth space on the upper surface of the rack 504, so as to realize the locking of the rack 504, after the adjustment of the angle of the baffle 503 is completed, then the output shaft of the hydraulic lifting cylinder 3 is driven to move downwards, the bending pressing plate 401 is in contact with the pins of the MOS tube, the pins of the MOS tube are pressed down, MOS is stable throughout at the in-process of whole presser foot and fixes on backup pad 501, has avoided presser foot in-process MOS pipe to take place the skew and influence the presser foot process, because the existence of spring 404, has played certain cushioning effect at the in-process of pushing down, has effectively reduced the damage that pressure caused to the MOS pipe, accomplishes behind the MOS pipe presser foot, 3 output shafts of last control hydraulic lifting jar rise, take out the MOS pipe that presses well, put into the MOS pipe that does not press, repeat above-mentioned operation can, the utility model is simple in operation, the presser foot is effectual, and can realize the MOS presser foot that different angles required, and the practicality is strong.
The above-mentioned, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

Claims (6)

1. The utility model provides a MOS pipe presser foot device, includes installation base (1), its characterized in that, installation base (1) upper surface center fixed mounting has lower module (5), and installs base (1) upper surface both sides center fixed mounting has installation roof beam (2), installation roof beam (2) top surface center fixed mounting has hydraulic lifting cylinder (3), last module (4) are installed to hydraulic lifting cylinder (3) output.
2. The MOS tube pin pressing device according to claim 1, wherein the upper die assembly (4) comprises a bending pressing plate (401), a fixed pressing plate (402), a round shaft (403) and a spring (404), a first sleeve (405) is fixedly installed on the upper surface of the bending pressing plate (401), the round shaft (403) is slidably installed inside the first sleeve (405), the fixed pressing plate (402) is fixedly installed on the bottom surface of the round shaft (403), and the spring (404) is sleeved on the outer surface of the round shaft (403) inside the first sleeve (405).
3. The MOS tube pin pressing device according to claim 1, wherein the lower die assembly (5) comprises a support plate (501), a groove (502), a baffle (503), a rack (504), a rotating handle (505), a gear (506), a second sleeve (507) and a latch (508), the groove (502) is formed on the upper surface of the support plate (501), and the two sides of the upper end of the supporting plate (501) are both rotatably provided with a baffle plate (503), the two sides of the lower end of the supporting plate (501) are both fixedly provided with a second sleeve (507), a rotating handle (505) is rotatably arranged on the outer surface of the second sleeve (507), a rack (504) is arranged in the second sleeve (507) in a sliding way, a gear (506) is fixedly arranged at the front end of the rotating handle (505), the gear (506) is meshed with the rack (504), and the front surface of the second sleeve (507) is inserted with a latch (508).
4. A MOS tube pin apparatus according to claim 2, wherein there are two first sleeves (405), and the two first sleeves (405) are arranged on both sides of the upper surface of the bending platen (401) with central symmetry.
5. A MOS tube pin press apparatus according to claim 2, wherein a soft rubber layer is applied to a lower surface of the fixed platen (402).
6. A MOS tube press pin device according to claim 3, wherein the rack (504) is notched on both the upper and lower surfaces thereof, and the front end of the rack (504) is rotatably connected to the bottom of the side surface of the baffle (503).
CN201920579423.1U 2019-04-25 2019-04-25 MOS pipe presser foot device Active CN209986145U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201920579423.1U CN209986145U (en) 2019-04-25 2019-04-25 MOS pipe presser foot device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201920579423.1U CN209986145U (en) 2019-04-25 2019-04-25 MOS pipe presser foot device

Publications (1)

Publication Number Publication Date
CN209986145U true CN209986145U (en) 2020-01-24

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201920579423.1U Active CN209986145U (en) 2019-04-25 2019-04-25 MOS pipe presser foot device

Country Status (1)

Country Link
CN (1) CN209986145U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112355173A (en) * 2020-10-21 2021-02-12 江西世星科技有限公司 Chip bending die with angle compensation
CN112872232A (en) * 2021-01-12 2021-06-01 陈运美 Bending equipment for pins of single chip microcomputer
CN113020479A (en) * 2021-02-08 2021-06-25 张香爱 Resistor pin bending device with adjusting function

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112355173A (en) * 2020-10-21 2021-02-12 江西世星科技有限公司 Chip bending die with angle compensation
CN112872232A (en) * 2021-01-12 2021-06-01 陈运美 Bending equipment for pins of single chip microcomputer
CN113020479A (en) * 2021-02-08 2021-06-25 张香爱 Resistor pin bending device with adjusting function

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