CN209980791U - Temperature test box - Google Patents

Temperature test box Download PDF

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Publication number
CN209980791U
CN209980791U CN201920748952.XU CN201920748952U CN209980791U CN 209980791 U CN209980791 U CN 209980791U CN 201920748952 U CN201920748952 U CN 201920748952U CN 209980791 U CN209980791 U CN 209980791U
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China
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temperature
assembly
cavity
test
evaporator
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CN201920748952.XU
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Chinese (zh)
Inventor
赵丹
蒋湘涛
马瑞欢
徐磊
单嘉成
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HUNAN RUNCORE INNOVATION TECHNOLOGY Co Ltd
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HUNAN RUNCORE INNOVATION TECHNOLOGY Co Ltd
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Abstract

The utility model discloses a temperature test box, include: the solid state disk testing device comprises a box body, a testing module and a testing module, wherein a cavity is defined in the box body and used for placing a solid state disk to be tested; the door body is used for sealing the cavity; the temperature detection assembly is arranged in the cavity; the temperature adjusting assembly comprises a refrigerating assembly and a heating assembly; and the control assembly is respectively connected with the temperature detection assembly, the refrigeration assembly and the heating assembly and is used for controlling the refrigeration assembly or the heating assembly according to the detection temperature of the temperature detection assembly so as to adjust the temperature of the air in the cavity. This temperature control box can cool down the air temperature in the cavity and adjust and the regulation that heaies up, helps solving temperature control's nonlinear control problem, provides more reliable test environment for the solid state hard drives test.

Description

Temperature test box
Technical Field
The utility model relates to a test technical field especially relates to a temperature test box.
Background
At present, a common temperature control box is mostly adopted in a test system of the solid state disk, the temperature control box is nonlinear temperature control, the temperature control range, the uniformity, the precision, the linear temperature change and the speed performance of the temperature control box do not reach the military standard precision requirement, and a stable and reliable test environment cannot be guaranteed.
SUMMERY OF THE UTILITY MODEL
The present invention aims at solving at least one of the technical problems in the related art to a certain extent. Therefore, the utility model aims to provide a temperature test box to realize cooling down or intensification regulation, provide more reliable test environment for the test of solid state hard drives.
In order to achieve the above object, the utility model discloses a first aspect provides a temperature test box, include: the solid state disk testing device comprises a box body, a testing module and a testing module, wherein a cavity is defined in the box body and used for placing a solid state disk to be tested; the door body is used for sealing the cavity; the temperature detection assembly is arranged in the cavity; the temperature adjusting assembly comprises a refrigerating assembly and a heating assembly; and the control assembly is respectively connected with the temperature detection assembly, the refrigeration assembly and the heating assembly and is used for controlling the refrigeration assembly or the heating assembly according to the detection temperature of the temperature detection assembly so as to adjust the temperature of the air in the cavity.
The utility model discloses a temperature control box controls the refrigeration subassembly through the air temperature in the control assembly according to the cavity that detects, can cool down the air temperature in the cavity and adjust, controls heating element through the air temperature in the control assembly according to the cavity that detects, can heat up the regulation to the air temperature in the cavity, helps solving temperature control's nonlinear control problem, provides more reliable test environment for the test of solid state hard drives.
Additionally, the utility model discloses a temperature test case can also have following additional technical characterstic:
specifically, the refrigeration assembly employs a binary cascade refrigeration cycle system, which includes: the high-temperature refrigeration cycle system comprises a first compressor, a first condenser, a first expansion valve, a first condensation evaporator, a first drying filter and a first electromagnetic valve, wherein a refrigerant outlet of the first compressor, the first condenser, the first drying filter, the first electromagnetic valve, the first expansion valve, a pipe side inlet of the first evaporator, a pipe side outlet of the first evaporator and a refrigerant inlet of the first compressor are sequentially connected, and a refrigerant in the high-temperature refrigeration cycle system is R404A; a low-temperature refrigeration cycle system, which includes a second compressor, an oil separator, a second expansion valve, a second evaporator, an expansion container, a second dry filter, and a second solenoid valve, wherein a refrigerant outlet of the second compressor, the oil separator, a shell-side inlet of the first evaporator, a shell-side outlet of the first evaporator, the second dry filter, the second solenoid valve, the second expansion valve, the second evaporator, and a refrigerant inlet of the compressor are sequentially connected, a refrigerant in the low-temperature refrigeration cycle system is R23, wherein a liquid R404A refrigerant enters the first evaporator to absorb heat of a gaseous R23 refrigerant and vaporize the liquid R23 refrigerant enters the second evaporator to absorb heat of air in the cavity and vaporize the refrigerant; the control assembly is connected with the first expansion valve and the second expansion valve respectively and used for controlling the first expansion valve and the second expansion valve according to the detection temperature of the temperature detection assembly so as to cool and regulate the air temperature in the cavity.
Specifically, the heating assembly comprises a heater and a solid-state relay connected with the heater, wherein the control assembly is connected with the solid-state relay and used for driving the heater to work according to the detection temperature of the temperature detection assembly through the solid-state relay so as to heat and regulate the air temperature in the cavity.
Specifically, the control assembly includes: the input end of the PID controller is connected with the temperature detection component; and the input end of the PWM controller is connected with the output end of the PID controller, and the output end of the PWM controller is respectively connected with the refrigerating assembly and the heating assembly.
Optionally, the temperature test chamber further comprises: the test main board is arranged in the box body; coupling assembling, coupling assembling sets up in the cavity, coupling assembling is connected with test mainboard and the solid state hard disk that awaits measuring respectively, in order to incite somebody to action the solid state hard disk that awaits measuring is connected to the test mainboard is in order to test.
The test mainboard is further connected with an upper computer through a gigabit network switch to receive the test command sent by the upper computer, send the test command to the solid state disk to be tested and feed back the test information of the solid state disk to the upper computer for display.
Optionally, the temperature test chamber further comprises: an operation panel, operation panel sets up on the box, and with control assembly connects for send user input's settlement temperature to control assembly, so that control assembly passes through temperature regulation assembly will the temperature regulation of air in the cavity extremely the settlement temperature.
The box body is provided with a plurality of insertion ports for connecting the test mainboard to the gigabit network switch and connecting the control assembly to the upper computer.
Optionally, the temperature detection assembly employs PT100 armored platinum thermal resistor.
In some examples, the cavity is disposed at a left portion of the tank, and the first compressor, the second compressor, and the control assembly are disposed at a right portion and/or a bottom portion of the tank.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic structural diagram of a temperature test chamber according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a temperature test chamber according to an example of the present invention.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present invention, and should not be construed as limiting the present invention.
The temperature test chamber according to the embodiment of the present invention is described below with reference to the drawings.
Example 1
Fig. 1 is a schematic structural diagram of a temperature test chamber according to an embodiment of the present invention.
As shown in fig. 1, the temperature test chamber 100 includes: the refrigerator comprises a box body 110, a door body 120, a temperature detection assembly 130, a temperature adjusting assembly 140 and a control assembly 150.
The casing 110 defines a cavity 1 therein, and the cavity 1 is used for placing a solid state disk SSD to be tested; the door body 120 is used for sealing the cavity 1; the temperature detection assembly 130 is disposed within the cavity; the temperature adjusting assembly 140 includes a cooling assembly 141 and a heating assembly 142; the control component 150 is respectively connected to the temperature detecting component 130, the refrigerating component 141 and the heating component 142, and is used for controlling the refrigerating component 141 or the heating component 142 according to the detected temperature of the temperature detecting component 130, so as to adjust the temperature of the air in the cavity 1. Wherein, the temperature detecting component 130 can adopt PT100 armored platinum thermal resistor.
Alternatively, the temperature test chamber 100 may be integrally movable, and the bottom of the temperature test chamber 100 is provided with 6 sets of high-strength movable casters, which can be adjustably fixed when the temperature test chamber 100 is moved to a certain position.
In one example, the refrigeration assembly 141 employs a binary cascade refrigeration cycle system comprising: a high temperature refrigeration cycle system and a low temperature refrigeration cycle system.
The high-temperature refrigeration cycle system comprises a first compressor, a first condenser, a first expansion valve, a first condensation evaporator, a first drying filter and a first electromagnetic valve, wherein a refrigerant outlet of the first compressor, the first condenser, the first drying filter, the first electromagnetic valve, the first expansion valve, a pipe side inlet of the first evaporator, a pipe side outlet of the first evaporator and a refrigerant inlet of the first compressor are sequentially connected, and a refrigerant in the high-temperature refrigeration cycle system is R404A; the low-temperature refrigeration cycle system comprises a second compressor, an oil separator, a second expansion valve, a second evaporator, an expansion container, a second drying filter and a second electromagnetic valve, wherein a refrigerant outlet of the second compressor, the oil separator, a shell-side inlet of the first evaporator, a shell-side outlet of the first evaporator, the second drying filter, the second electromagnetic valve, the second expansion valve, the second evaporator and a refrigerant inlet of the compressor are sequentially connected, and the refrigerant in the low-temperature refrigeration cycle system is R23, wherein the liquid R404A refrigerant enters the first evaporator and absorbs heat of the gaseous R23 refrigerant to be vaporized, and the liquid R23 refrigerant enters the second evaporator and absorbs heat of air in the cavity to be vaporized.
In this example, the control component 150 is respectively connected to the first expansion valve and the second expansion valve, and is used for controlling the first expansion valve and the second expansion valve according to the detected temperature of the temperature detection component 130, so as to perform cooling regulation on the air temperature in the cavity 1. Therefore, the temperature reduction rate of the temperature test box and the set temperature can be guaranteed.
Alternatively, the chamber 1 may be disposed at the left portion of the cabinet 110, and the first compressor, the second compressor, and the control assembly 150 may be disposed at the right portion and/or the bottom portion of the cabinet.
Specifically, for the high-temperature refrigeration cycle, the liquid R404A refrigerant passing through the throttling device (i.e., the first expansion valve) enters the first evaporator to absorb the heat released by the gaseous R23 refrigerant and vaporize (at the same time, the R23 gas is condensed into liquid), the vaporized R404A refrigerant is sucked by the first compressor, compressed into high-temperature and high-pressure gas, enters the first condenser, cooled and condensed into the liquid R404A refrigerant, passes through the first drying filter and the first electromagnetic valve, is throttled by the first expansion valve, enters the first evaporator again to absorb heat and vaporize, and is sucked by the first compressor, thus the cycle is operated.
In the low-temperature refrigeration cycle, the liquid R23 refrigerant throttled by the second expansion valve enters the second evaporator to absorb the heat of the air in the cavity 1 and vaporize, so that the temperature of the air in the cavity 1 is reduced. The vaporized R23 refrigerant is sucked into the second compressor, compressed into a high-temperature, high-pressure gas, and then introduced into the first evaporator through the oil separator. In the meantime, the R23 refrigerant of high-temperature and high-pressure gas is condensed into liquid by the first evaporator, then enters the second solenoid valve through the second dry filter, and finally enters the second evaporator again after being throttled by the second expansion valve to absorb heat and vaporize, and then is sucked by the second compressor, thus cyclically operating.
Optionally, the first compressor and the second compressor can adopt a staggered starting mode, so that the starting current can be reduced to the maximum extent, and the interference to a power grid is reduced.
Optionally, in order to prevent the pressure of the R23 refrigerant from being too high due to too high temperature of the low-temperature refrigeration cycle after shutdown, a set of safety devices consisting of a pressure regulating device, an expansion container and a capillary tube may be provided in the low-temperature refrigeration cycle.
Further, the heating assembly 142 may include a heater and a solid-state relay connected to the heater, wherein the control assembly 150 is connected to the solid-state relay, and is configured to drive the heater to operate through the solid-state relay according to the detected temperature of the temperature detecting assembly 130, so as to perform temperature rise adjustment on the air temperature in the chamber 1.
Further, as shown in fig. 2, the control assembly 150 may include a PID controller 151 and a PWM controller 152.
Wherein, the input end of the PID controller 151 is connected to the temperature detection assembly 130; an input end of the PWM controller 152 is connected to an output end of the PID controller 151, and an output end of the PWM controller 152 is connected to the cooling module 141 and the heating module 142, respectively.
Specifically, for the refrigeration component 141, PID (Proportion-Integral-Differential) + PWM (Pulse Width Modulation) may be adopted to control the first expansion valve and the second expansion valve to control the refrigerant flow, so as to implement low-temperature energy-saving operation. For the heating component 142, a PID + PWM + SSR (Solid State Relay) can be used to control the heater, wherein the Solid State Relay performs contactless zero-crossing triggering to drive the heater to work, and has no contact spark and noise, and long service life.
Optionally, the control module 150 further has a self-detection and self-diagnosis function. Further, a set of warning alarm device can be installed on the top of the box body 110, the warning alarm device works when the temperature test box is started to work, the warning alarm device is closed when the equipment stops working, and when the self-checking or the self-diagnosis is abnormal, the alarm device can automatically give an alarm.
In one example, the temperature test chamber 100 may further include: test mainboard and coupling assembling.
Wherein, the test mainboard is arranged in the box body 110; the connecting assembly is arranged in the cavity 1 and is respectively connected with the test mainboard and the solid state disk SSD to be tested so as to connect the solid state disk SSD to be tested to the test mainboard for testing.
Furthermore, the test mainboard is connected with the upper computer through the gigabit network switch to receive the test command sent by the upper computer, send the test command to the solid state disk SSD to be tested, and feed back the test information of the solid state disk SSD to the upper computer for display.
Specifically, the box 110 may have a plurality of sockets formed thereon for connecting the test motherboard to the gigabit network switch and for connecting the control module 150 to the upper computer. The upper computer and the control component 150 can be connected through an RS232 serial port, and the test mainboard can be communicated with the upper computer through a TCP/IP protocol, so that the management of the upper computer can be facilitated, and the setting, modification and programming of various parameters and the storage, printing and the like of test data can be realized on the upper computer.
In one example, the temperature test chamber 100 may further include an operation panel disposed on the case 110 and connected to the control module 150 for transmitting the set temperature input by the user to the control module 150, so that the control module 150 adjusts the temperature of the air in the chamber 1 to the set temperature through the temperature adjusting module 140.
The operating panel can adopt a Korean 'ternary' TEMI880 (produced by Guangzhou China) Chinese color touch display screen, adopts LCD color liquid crystal display, utilizes a man-machine conversation mode, has an automatic, intelligent and humanized design, and can display set test parameters, set temperature control parameters, program curves, working time and working states of the temperature adjusting components.
In one example, a set of computer host box can be installed at the lower part of the inner side of the right part of the box body 110, and the door body 120 can be a transparent organic glass door for a tester to observe whether the computer host is started to operate; a set of computer small keyboard moving box can be arranged below the operation interface, and the box can be drawn out and drawn in a sliding way; a set of computer display rotating bracket can be arranged on the upright post on the right side surface in front of the right part of the box body 110 and can be arranged according to the vision of a human body; two sets of air draft systems can be arranged at the top of the right part of the box body 110, so that heat in the cavity 1 is guaranteed to be exhausted, and a set of illuminating lamp is arranged; two sets of 16A three-hole sockets can be arranged near the computer host box to provide power for the test mainboard; at least 15 sets of 16A three-jack sockets can be respectively arranged on the left and the right of the bottom of the box body 110 to provide power for a test mainboard.
In this embodiment, the inner wall of the box 110 can be made of international SUS304# stainless steel plate t ≥ 1.2, the outer shell of the box 110 is made of cold rolled steel plate with t ≥ 1.5mm, and the surface is acid-washed and phosphated and then electrostatically sprayed with plastics (ivory white in color). The thermal insulation material of the box body 110 is made of 100 mm hard flame-retardant polyurethane foam and glass fiber cotton, so that the thermal insulation effect is good, and the outer surface of the temperature test box is free from frosting and condensation. The middle part of the upper right side surface of the box body 110 can be provided with a phi 50 test hole; the solid state disk power supply device (facing to a gate) is used for a user to detect a data line and a power supply line for the solid state disk to be detected to penetrate in or out, and is provided with a high-strength heat-preservation sponge plug.
Tank 110 may have a condensate drain opening at the bottom thereof, and temperature test chamber 100 may be placed adjacent to a waste drain or sewer to facilitate drainage of condensate and compressor-associated condensate to the waste drain or sewer. The door 120 can be a single-opening hinge door, the hinge is arranged on the left side of the box body 110, and is opened from right to left (facing the door 120), and the size of the hinge is 760mm multiplied by 1200mm (width multiplied by height); the door body 120 is sealed by an environment-friendly silicon rubber strip, and has high and low temperature resistance, ageing resistance and good sealing performance. In order to prevent the condensation or frosting of the edges of the door frame and the door body 120 in the low-temperature test, the edges of the door frame and the door body 120 can be provided with an electric heating defrosting device; in order to observe the state of the solid state disk SSD to be detected in the cavity 1, a set of hollow resistive film heating and frost-proof observation window with the size of 450 mm wide and 800 mm high is arranged on the door body 120, the observation window is made of a hollow glass observation window formed by multiple layers of toughened glass, and the electrothermal coating film moistureproof and heat-insulation observation window is formed; the observation window is composed of five layers of hollow glass, and a hollow electric heating film heater is arranged to prevent condensation and defrost. When the high-temperature test is carried out, the observation window heating device is automatically turned on, and when the compressor is stopped and is not started, the observation window heating device is automatically turned off.
In addition, when the Solid State Disk (SSD) to be tested is tested, if the following protection devices (parts) are detected to act, the power can be automatically cut off to cut off the whole machine to work, and sound and light alarm prompt is carried out.
1) A safe and reliable ground protection device;
2) overvoltage, undervoltage, open-phase and phase sequence protection of a three-phase power supply;
3) leakage/open circuit protection;
4) the cavity overtemperature protection audible and visual alarm is carried out;
5) short-circuit protection of the heater;
6) first/second compressor overpressure protection;
7) first/second compressor overload protection.
To sum up, the utility model discloses a temperature test box adopts PID + PWM control mode to control the flow or the solid state relay of refrigerant, has solved temperature control's nonlinear control problem, has realized linear temperature change, and the temperature control precision is less than or equal to 1 ℃, provides more reliable test environment for the test of solid state hard drives.
Although embodiments of the present invention have been shown and described, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that variations, modifications, substitutions and alterations can be made to the above embodiments by those of ordinary skill in the art without departing from the scope of the present invention.

Claims (10)

1. A temperature test chamber, comprising:
the solid state disk testing device comprises a box body, a testing module and a testing module, wherein a cavity is defined in the box body and used for placing a solid state disk to be tested;
the door body is used for sealing the cavity;
the temperature detection assembly is arranged in the cavity;
the temperature adjusting assembly comprises a refrigerating assembly and a heating assembly;
and the control assembly is respectively connected with the temperature detection assembly, the refrigeration assembly and the heating assembly and is used for controlling the refrigeration assembly or the heating assembly according to the detection temperature of the temperature detection assembly so as to adjust the temperature of the air in the cavity.
2. A temperature test chamber as claimed in claim 1, wherein the refrigeration assembly employs a binary cascade refrigeration cycle system comprising:
the high-temperature refrigeration cycle system comprises a first compressor, a first condenser, a first expansion valve, a first condensation evaporator, a first drying filter and a first electromagnetic valve, wherein a refrigerant outlet of the first compressor, the first condenser, the first drying filter, the first electromagnetic valve, the first expansion valve, a pipe side inlet of the first evaporator, a pipe side outlet of the first evaporator and a refrigerant inlet of the first compressor are sequentially connected, and a refrigerant in the high-temperature refrigeration cycle system is R404A;
a low-temperature refrigeration cycle system, which includes a second compressor, an oil separator, a second expansion valve, a second evaporator, an expansion container, a second dry filter, and a second solenoid valve, wherein a refrigerant outlet of the second compressor, the oil separator, a shell-side inlet of the first evaporator, a shell-side outlet of the first evaporator, the second dry filter, the second solenoid valve, the second expansion valve, the second evaporator, and a refrigerant inlet of the compressor are sequentially connected, a refrigerant in the low-temperature refrigeration cycle system is R23, wherein a liquid R404A refrigerant enters the first evaporator to absorb heat of a gaseous R23 refrigerant and vaporize the liquid R23 refrigerant enters the second evaporator to absorb heat of air in the cavity and vaporize the refrigerant;
the control assembly is connected with the first expansion valve and the second expansion valve respectively and used for controlling the first expansion valve and the second expansion valve according to the detection temperature of the temperature detection assembly so as to cool and regulate the air temperature in the cavity.
3. The temperature test chamber as claimed in claim 1, wherein the heating assembly comprises a heater and a solid-state relay connected with the heater, and the control assembly is connected with the solid-state relay and is used for driving the heater to work through the solid-state relay according to the detected temperature of the temperature detection assembly so as to perform temperature rise regulation on the air temperature in the cavity.
4. A temperature test chamber as claimed in claim 1, wherein the control assembly comprises:
the input end of the PID controller is connected with the temperature detection component;
and the input end of the PWM controller is connected with the output end of the PID controller, and the output end of the PWM controller is respectively connected with the refrigerating assembly and the heating assembly.
5. A temperature test chamber as claimed in claim 1, further comprising:
the test main board is arranged in the box body;
coupling assembling, coupling assembling sets up in the cavity, coupling assembling is connected with test mainboard and the solid state hard disk that awaits measuring respectively, in order to incite somebody to action the solid state hard disk that awaits measuring is connected to the test mainboard is in order to test.
6. The temperature test chamber according to claim 5, wherein the test mainboard is further connected with an upper computer through a gigabit network switch to receive a test command sent by the upper computer, send the test command to the solid state disk to be tested, and feed back test information of the solid state disk to the upper computer for display.
7. A temperature test chamber as claimed in claim 1, further comprising:
an operation panel, operation panel sets up on the box, and with control assembly connects for send user input's settlement temperature to control assembly, so that control assembly passes through temperature regulation assembly will the temperature regulation of air in the cavity extremely the settlement temperature.
8. The temperature test chamber as claimed in claim 6, wherein the chamber body is formed with a plurality of sockets for connecting the test motherboard to the gigabit ethernet switch and for connecting the control module to the upper computer.
9. A temperature test chamber as claimed in claim 1, wherein the temperature sensing assembly employs PT100 armored platinum thermal resistors.
10. A temperature test chamber as claimed in claim 2, wherein the cavity is provided in a left portion of the chamber, and the first compressor, the second compressor and the control assembly are provided in a right portion and/or a bottom portion of the chamber.
CN201920748952.XU 2019-05-22 2019-05-22 Temperature test box Active CN209980791U (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111550941A (en) * 2020-05-19 2020-08-18 夏乔麦 System for observing temperature change
CN111613263A (en) * 2020-05-25 2020-09-01 成都思科瑞微电子股份有限公司 SRAM function testing device for random static memory chip

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111550941A (en) * 2020-05-19 2020-08-18 夏乔麦 System for observing temperature change
CN111613263A (en) * 2020-05-25 2020-09-01 成都思科瑞微电子股份有限公司 SRAM function testing device for random static memory chip

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