CN209980105U - Semiconductor temperature control stability maintaining vibration damper for inner edge of high-speed rotating disc - Google Patents
Semiconductor temperature control stability maintaining vibration damper for inner edge of high-speed rotating disc Download PDFInfo
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- CN209980105U CN209980105U CN201921043311.0U CN201921043311U CN209980105U CN 209980105 U CN209980105 U CN 209980105U CN 201921043311 U CN201921043311 U CN 201921043311U CN 209980105 U CN209980105 U CN 209980105U
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- disc
- temperature
- temperature control
- semiconductor
- inner edge
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 58
- 230000017525 heat dissipation Effects 0.000 claims abstract description 17
- 230000005540 biological transmission Effects 0.000 claims abstract description 13
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 10
- 238000013016 damping Methods 0.000 claims abstract description 9
- 238000009413 insulation Methods 0.000 claims abstract description 7
- 238000009529 body temperature measurement Methods 0.000 claims abstract description 6
- 238000000926 separation method Methods 0.000 claims abstract 3
- 235000017166 Bambusa arundinacea Nutrition 0.000 claims abstract 2
- 235000017491 Bambusa tulda Nutrition 0.000 claims abstract 2
- 241001330002 Bambuseae Species 0.000 claims abstract 2
- 235000015334 Phyllostachys viridis Nutrition 0.000 claims abstract 2
- 239000011425 bamboo Substances 0.000 claims abstract 2
- 230000007246 mechanism Effects 0.000 claims description 25
- 230000009467 reduction Effects 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 5
- 238000001816 cooling Methods 0.000 claims description 4
- 238000009434 installation Methods 0.000 claims description 4
- 230000008569 process Effects 0.000 claims description 4
- 238000012546 transfer Methods 0.000 claims description 4
- 230000033228 biological regulation Effects 0.000 claims description 2
- 230000004044 response Effects 0.000 claims description 2
- 239000004411 aluminium Substances 0.000 claims 2
- 230000000903 blocking effect Effects 0.000 claims 1
- 238000012856 packing Methods 0.000 claims 1
- 230000008646 thermal stress Effects 0.000 abstract description 4
- 230000000694 effects Effects 0.000 abstract description 3
- 238000005057 refrigeration Methods 0.000 abstract description 2
- 239000000463 material Substances 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 3
- 238000011160 research Methods 0.000 description 2
- 230000005679 Peltier effect Effects 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
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Abstract
The utility model discloses a high-speed rotating disc inner edge semiconductor temperature control dimension steady vibration damper mainly comprises semiconductor temperature control piece, temperature sensor, adjusting washer and heat dissipation fin section of thick bamboo etc.. The device controls the inner edge boundary temperature of the rotating disc through the thermoelectric refrigeration effect of the semiconductor thermocouple, so that the inner edge part of the disc generates thermal stress to further improve the overall rigidity of the disc, and then the critical rotating speed of the disc is improved to realize the stability maintaining and vibration reducing functions of the device. In the device, a disc is arranged on a separation temperature control structure and is fixed on a transmission shaft after being sleeved into a heat insulation sleeve through an aluminum joint, the temperature of the inner boundary of the disc is controlled by a semiconductor temperature control sheet, and the temperature measurement of the inner boundary of the disc is completed by a temperature sensor. The device can achieve the stability maintaining and vibration damping functions of discs of different materials and different thicknesses by controlling the boundary temperature, and the whole device has the advantages of compact structure, convenience in operation, high reliability and lower cost.
Description
Technical Field
The utility model relates to a high-speed rotatory disc damping field especially relates to and suppresses high-speed rotatory disc's parameter unstability, gas bomb unstability and thermal bomb unstability to utilizing disc inner edge semiconductor control temperature, promotes disc rigidity through applying thermal stress to the disc inner edge to realize the steady damping of dimension of high-speed rotatory disc.
Background
Disc structures, which are the most typical structure form in rotary machines, are widely used in daily life, such as woodworking circular saw blades, disc brakes, computer hard disk drives, aircraft engines, and elastic connection discs between engines and torque converters. In the above mechanisms, the disc structure is a core part of the mechanical structure. In the research process of the characteristics of the disc sheet mechanism, the problem of vibration of a high-speed rotating disc in a normal working state or a braking force action process is a problem to be solved urgently at present. The generation of vibration can reduce the stability of the whole machine, and has important influence on the working performance and the service life of the disc, even causes the instability of the system and further causes accidents.
In practical conditions, the thin disc is usually controlled at a lower rotation speed, because the disc is driven at a critical rotation speed or a supercritical rotation speed to generate three unavoidable instability conditions: the instability of parameters (restrained by fixed slide block mechanisms), the air-spring instability (lifted by air) and the thermal-spring instability (friction heat of fixed slide block mechanisms) seriously restrict the rotating speed of a disc and the stability of a disc system. At present, a reliable high-speed rotating disc instability suppression (stability maintenance) and vibration and noise reduction application technology is urgently needed to be provided.
The boundary temperature of the disc is controlled by utilizing the semiconductor component, so that radial thermal stress is generated on the inner edge of the disc, the lateral deformation rigidity of the disc is further improved, the critical rotating speed of the high-speed rotating disc is improved, namely the overall dynamic stability of the disc system is improved, and the method is a novel and reliable means. The semiconductor temperature control boundary stability-maintaining vibration reduction device for the inner edge of the high-speed rotating disc is designed by utilizing the technology, is used for popularizing the engineering application of the semiconductor temperature control boundary vibration reduction technology, solves the technical problem of improving the critical rotating speed of the high-speed disc, reduces the application cost of vibration reduction and noise reduction, and has important theoretical research significance and engineering application value.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a high-speed rotatory disc inner edge semiconductor control by temperature change dimension steady vibration damper.
In order to solve the technical problem, the utility model discloses a following technical scheme:
a semiconductor temperature control and stability maintaining vibration damper for the inner edge of a high-speed rotating disc mainly comprises a semiconductor temperature control sheet, an aluminum joint, a temperature sensor, a heat dissipation mounting sleeve, a heat dissipation fin cylinder and the like. In the device, an aluminum joint of a semiconductor temperature control mechanism is sleeved into a heat insulation sleeve and then fixed on a transmission shaft, heat transfer between the temperature control mechanism and the transmission shaft is blocked, a disc is installed on the temperature control mechanism after being adjusted by an adjusting washer, the semiconductor temperature control sheet controls the temperature of the inner boundary of the disc, and a temperature sensor is used for measuring the temperature of the inner boundary of the disc. The thermoelectric refrigeration effect of the semiconductor thermocouple controls the temperature of the inner edge boundary of the rotating disc, so that the inner edge boundary part of the disc generates thermal stress to further improve the integral rigidity of the disc, and then the critical rotating speed of the disc is improved to realize the stability maintaining and vibration reducing functions of the device.
The disk is arranged on the semiconductor temperature control mechanism after the position of the disk is adjusted by the front and rear adjusting washers and is used for installing and adjusting the rotating disk. And a semiconductor temperature control sheet is arranged on the other side of the adjusting washer and the connecting disc, and the temperature of the inner edge boundary of the rotating disc is controlled in two modes of temperature reduction and temperature rise by controlling the direction of input current of the temperature control sheet. A semiconductor temperature control plate made by using the peltier effect of semiconductors has a temperature drop and absorbs heat due to a current flowing from an N-type semiconductor to a P-type semiconductor in one direction after power is applied, and has a temperature rise and releases heat due to a current flowing from a P-type semiconductor to an N-type semiconductor in the other direction, and cold and hot ends are formed at both ends of the semiconductor temperature control plate, respectively. In addition, after the current directions of the two joints of the semiconductor temperature control sheet are reversed, the cold end and the hot end are reversed. So that the temperature of the inner edge of the disk is controlled by the effect of the semiconductor temperature control sheet.
The temperature sensor is installed between the disk and the connecting disk, and heat-conducting medium is filled around the sensor to improve the accuracy of temperature measurement. The aluminum joint end of the semiconductor temperature control mechanism is sleeved into the heat insulation sleeve and then fixed on the transmission shaft, so that heat transfer between the temperature control mechanism and the transmission shaft is blocked, and the accuracy of temperature measurement is improved. After signal wires of the semiconductor temperature control sheet and the temperature sensor are installed in a wire groove of the heat dissipation installation sleeve, electric control signals are transmitted through the conductive slip ring, wherein the semiconductor temperature control sheet and the temperature sensor adopt a common ground end to reduce required slip ring joints, and further the cost of the device is reduced. The heat dissipation mounting sleeve adopts the heat dissipation finned tube to accelerate cooling, and applies reverse current to the semiconductor temperature control sheet to exchange the cold end and the hot end in the cooling process so as to improve the response speed of temperature regulation and control.
Drawings
Fig. 1 is a schematic structural diagram of a temperature control stability maintaining vibration damping device.
Fig. 2 is a perspective assembly view of the semiconductor temperature control mechanism.
In the figure: the temperature control device comprises a sliding ring groove mounting frame 1, a screw 2, a sliding ring groove 3, a conductive sliding ring 4, a disc 5, a semiconductor temperature control mechanism 6, a screw 7, a transmission shaft 8, a heat insulation pipe barrel 9, an aluminum joint 10, a rear adjusting washer 11, a front adjusting washer 12, a temperature sensor 13, a connecting disc 14, a bolt 15, a semiconductor temperature control sheet 16, a heat dissipation mounting sleeve 17, a bolt 18, a heat dissipation fin barrel 19, a flat washer 20 and a bolt 21.
Detailed Description
The invention is described in detail below with reference to the accompanying drawings:
referring to fig. 1, the device is a semiconductor temperature control and stability maintaining vibration damper for the inner edge of a high-speed rotating disc. A clamping disc (5) is arranged in a semiconductor temperature control mechanism (6), the motion and the power of the clamping disc are input by a transmission shaft (8), and an electric control signal of the clamping disc is input through a conductive slip ring (4). The motion and power input end of the semiconductor temperature control mechanism (6) is fixed on the transmission shaft (8) by a screw (7), one end of a conductive slip ring (4) of the signal input end of the semiconductor temperature control mechanism is arranged in the semiconductor temperature control mechanism (6), and the other end of the conductive slip ring is arranged in the slip ring groove (3). The sliding ring groove (3) is arranged on the sliding ring groove mounting frame (3) through a screw (2).
Referring to fig. 1 and 2, the fixed ends of the semiconductor temperature control mechanism (6) and the transmission shaft (8) use the heat insulation pipe sleeve (9) to prevent heat exchange between the temperature control mechanism and other components, the heat insulation pipe sleeve (9) is sleeved into the aluminum joint (10), meanwhile, the other end of the aluminum joint (10) is provided with the rear adjusting washer (11), the front adjusting washer (12) is added after the disc (5) is installed, the semiconductor temperature control mechanism is fixed by the bolts (15) through the connecting disc (14), and meanwhile, the temperature sensor (13) is installed between the disc (5) and the connecting disc (14) and is filled with enough heat conducting medium to complete installation of the disc (5). And then clamping the semiconductor temperature control sheet (16) between the connecting disc (14) and a flange plate of the heat dissipation mounting sleeve (17), fixing by a bolt (18), then installing the semiconductor temperature control sheet (16) and a lead of the temperature sensor (13) into a lead groove of the heat dissipation mounting sleeve (17), sleeving the heat dissipation fin cylinder (19) into the heat dissipation mounting sleeve (17), and axially fixing by a flat washer (20) and a bolt (21) to finish the mounting of the semiconductor temperature control mechanism (6).
The above examples are only for illustrating the technical conception and the characteristics of the present invention, and the purpose thereof is to enable the scientific researchers and the engineers familiar with the art to understand the contents of the present invention and to implement the present invention accordingly, which cannot limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered within the protection scope of the present invention.
Claims (6)
1. A semiconductor temperature control stability maintaining vibration damper for the inner edge of a high-speed rotating disc is characterized in that: mainly by semiconductor temperature control piece (16), aluminium connects (10), temperature sensor (13), heat dissipation installation sleeve (17) and heat dissipation fin section of thick bamboo (19) etc. constitute, wherein, aluminium of semiconductor temperature control mechanism (6) connects (10) and embolias on insulating sleeve (9) after-fixing in transmission shaft (8), the heat transfer of separation temperature control mechanism (6) and transmission shaft (8), install on separation temperature control mechanism after adjusting the packing ring adjustment disc (5), control the inner boundary temperature of disc by semiconductor temperature control piece (16), accomplish the boundary temperature measurement to the disc by temperature sensor (13).
2. The semiconductor temperature-control stability-maintaining vibration damping device for the inner edge of the high-speed rotating disc as claimed in claim 1, wherein: the semiconductor temperature control sheet (16) is arranged on the other side of the connecting disc (14) used for clamping the front adjusting washer (12), the rear adjusting washer (11) and the disc (5), and the temperature of the inner edge of the rotating disc is controlled in two modes of temperature reduction and temperature rise by controlling the direction of input current.
3. The semiconductor temperature-control stability-maintaining vibration damping device for the inner edge of the high-speed rotating disc as claimed in claim 1, wherein: the temperature sensor (13) is installed between the disc (5) and the connecting disc (14), and the heat conducting medium is filled around the temperature sensor (13) to improve the accuracy of temperature measurement.
4. The semiconductor temperature-control stability-maintaining vibration damping device for the inner edge of the high-speed rotating disc as claimed in claim 1, wherein: the aluminum joint (10) end of the semiconductor temperature control mechanism (6) is sleeved in the heat insulation sleeve (9) and then fixed on the transmission shaft (8) for blocking heat transfer between the temperature control mechanism (6) and the transmission shaft and improving the accuracy of temperature measurement.
5. The semiconductor temperature-control stability-maintaining vibration damping device for the inner edge of the high-speed rotating disc as claimed in claim 1, wherein: after signal wires of the semiconductor temperature control sheet (16) and the temperature sensor (13) are installed in a wire guide groove of the heat dissipation installation sleeve (17), the electric control signals are transmitted through the conductive slip ring (4), and the semiconductor temperature control sheet (16) and the temperature sensor (13) share one ground end to reduce the required joints of the conductive slip ring (4) and reduce the device cost.
6. The semiconductor temperature-control stability-maintaining vibration damping device for the inner edge of the high-speed rotating disc as claimed in claim 1, wherein: the heat dissipation mounting sleeve (17) adopts a heat dissipation fin cylinder (19) to accelerate cooling, and applies reverse current to the semiconductor temperature control sheet (16) to exchange the cold end and the hot end in the cooling process so as to improve the response speed of temperature regulation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921043311.0U CN209980105U (en) | 2019-07-05 | 2019-07-05 | Semiconductor temperature control stability maintaining vibration damper for inner edge of high-speed rotating disc |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921043311.0U CN209980105U (en) | 2019-07-05 | 2019-07-05 | Semiconductor temperature control stability maintaining vibration damper for inner edge of high-speed rotating disc |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209980105U true CN209980105U (en) | 2020-01-21 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921043311.0U Withdrawn - After Issue CN209980105U (en) | 2019-07-05 | 2019-07-05 | Semiconductor temperature control stability maintaining vibration damper for inner edge of high-speed rotating disc |
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| CN (1) | CN209980105U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110209212A (en) * | 2019-07-05 | 2019-09-06 | 吉林大学 | A kind of High Speed Rotating Disks At Elevated inner edge semiconductor temperature-control stability maintenance vibration absorber |
-
2019
- 2019-07-05 CN CN201921043311.0U patent/CN209980105U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110209212A (en) * | 2019-07-05 | 2019-09-06 | 吉林大学 | A kind of High Speed Rotating Disks At Elevated inner edge semiconductor temperature-control stability maintenance vibration absorber |
| CN110209212B (en) * | 2019-07-05 | 2024-05-17 | 吉林大学 | Semiconductor temperature control maintenance vibration damper for inner edge of high-speed rotating disc |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
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| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20200121 Effective date of abandoning: 20240517 |
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| AV01 | Patent right actively abandoned |
Granted publication date: 20200121 Effective date of abandoning: 20240517 |