CN209946414U - High-sensitivity integrated radiation and metal detection equipment - Google Patents

High-sensitivity integrated radiation and metal detection equipment Download PDF

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Publication number
CN209946414U
CN209946414U CN201920830945.4U CN201920830945U CN209946414U CN 209946414 U CN209946414 U CN 209946414U CN 201920830945 U CN201920830945 U CN 201920830945U CN 209946414 U CN209946414 U CN 209946414U
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sipm
radiation
circuit
probe
metal detection
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屈春蕾
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Wuxi Transparent Photoelectric Technology Co Ltd
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Wuxi Transparent Photoelectric Technology Co Ltd
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Abstract

The utility model discloses a high-sensitivity integrated radiation and metal detection device, which comprises a scintillation crystal, a No. 1 SiPM probe, a No. 2 SiPM probe, a radiation detection mainboard, a metal detection circuit, the scintillation crystal is in a flat cuboid structure, the No. 1 SiPM probe and the No. 2 SiPM probe are respectively bonded with light outlets on two side end faces of the scintillation crystal, a summation amplification circuit of the radiation detection mainboard is connected with a comparator circuit, the comparator circuit is in signal transmission with an MCU processor, the MCU processor is respectively in signal transmission with a radiation detection alarm circuit and a metal detection alarm circuit, the No. 1 SiPM probe and the No. 2 SiPM probe are connected with the summation amplification circuit of the radiation detection mainboard through FPC cables of an FPC connector, the MCU processor of the radiation detection mainboard is in signal transmission with the metal detection circuit, the detection device effectively improves the geometric efficiency and the light output uniformity of the radiation detector, the detection sensitivity is greatly improved, and effective signals are prevented from being lost.

Description

High-sensitivity integrated radiation and metal detection equipment
Technical Field
The utility model belongs to the security installations photoelectric detection field especially relates to a high sensitivity integration radiation and metal detection equipment.
Background
Safety inspection, for preventing and punishing the crime and the illegal action that harm civilian aviation safety, guarantee aircraft and passenger's security of lives and property, carry out mandatory inspection, including technical instrument inspection and manual inspection to passenger and luggage article according to law. The tasks of the security check are: firearms, ammunition, various types of knives, flammable, highly toxic, radioactive or other items that may be hazardous to aircraft and passenger lives and properties are strictly prohibited from being carried on the aircraft.
In the application number: CN201710994661.4, having the filing date of 20171023 names: in the patent of a hand-held personnel identity sensing and metal detecting device, a personnel identity sensing and metal detecting device is disclosed, which comprises a main control module, a metal detecting module and an identity sensing module, wherein the main control module is integrated with the metal detecting module and the identity sensing module; the metal detection module comprises a low-frequency carrier module, a power amplification circuit, an amplitude stabilizing unit, a metal detection antenna, a Q value detection circuit, a detection state output module, a transmitting antenna and a receiving antenna; the low-frequency carrier module, the power amplifying circuit, the amplitude stabilizing unit and the transmitting antenna are sequentially connected, and the receiving antenna, the Q value detection circuit and the detection state output module are sequentially connected; the identity sensing module comprises an MCU, a radio frequency card reading chip, another power amplifying circuit, a high-frequency antenna and a 13.56MHz carrier module, wherein the MCU, the radio frequency card reading chip, the another power amplifying circuit and the high-frequency antenna are sequentially connected, and the 13.56MHz carrier module is connected with the radio frequency card reading chip; MCU and detection state output module all connect in the master controller, and master controller communication is connected in wireless communication module. The invention realizes the fusion application of the radio frequency identification and metal detection technology.
Disclosure of Invention
The utility model aims at providing a whether be used for detecting the passenger at station or airport and have integrated radiation and metal detection equipment who carries metal or radiation source.
The purpose of the utility model can be realized through the following technical scheme:
a high-sensitivity integrated radiation and metal detection device comprises a scintillation crystal, a No. 1 SiPM probe, a No. 2 SiPM probe, a radiation detection mainboard and a metal detection circuit;
the scintillation crystal is of a flat cuboid structure, SiPM chips are respectively attached to the No. 1 SiPM probe and the No. 2 SiPM probe, light outlets with the same size as the SiPM chips are formed in the center positions of the end faces on the two sides of the scintillation crystal, and the No. 1 SiPM probe and the No. 2 SiPM probe are respectively bonded with the light outlets on the end faces on the two sides of the scintillation crystal;
the radiation detection main board comprises a summing amplifying circuit, a comparator circuit, an MCU (microprogrammed control unit) processor, a radiation detection alarm circuit and a metal detection alarm circuit, wherein the summing amplifying circuit is connected with the comparator circuit, the comparator circuit is in signal transmission with the MCU processor, and the MCU processor is in signal transmission with the radiation detection alarm circuit and the metal detection alarm circuit respectively;
the number 1 SiPM probe and the number 2 SiPM probe are connected with a summing amplifying circuit of the radiation detection mainboard through an FPC cable of an FPC connector, and an MCU processor of the radiation detection mainboard is in signal transmission with the metal detection circuit.
Preferably, the single-point SiPM chip is pasted on the front surfaces of the No. 1 SiPM probe and the No. 2 SiPM probe, and the PCB circuit board provided with the FPC connector is pasted on the back surface of the probe.
More preferably, the single-point SiPM chip has an effective detection area of 3mm by 3 mm.
More preferably, the scintillation crystal is externally wrapped with a reflective material, and the reflective material is barium sulfate, teflon or ESR reflective film.
More preferably, the number 1 SiPM probe and the number 2 SiPM probe are bonded to the two light outlets at the two ends of the scintillation crystal through optical glue.
More preferably, a light-shielding black adhesive tape is attached to the bonding positions of the No. 1 SiPM probe and the No. 2 SiPM probe and the light outlet.
Preferably, the radiation detection main board further comprises a power management circuit.
The utility model has the advantages that:
the geometric efficiency of the radiation detector is effectively improved by using a large-area flat cuboid scintillation crystal; through reading out the signal and then summing in both ends, can effectively promote light output homogeneity, can promote detectivity by a wide margin, avoid losing effectual signal, this equipment is safe, light, but simultaneous test radiation signal and metal signal to can work under various complicated electromagnetic environment.
Drawings
Fig. 1 is a schematic structural diagram of a high-sensitivity integrated radiation and metal detection device.
FIG. 2 is a schematic view of the structure of scintillation crystal, SiPM probe No. 1, SiPM probe No. 2, in which the SiPM probes No. 1-1; 2-scintillation crystals; SiPM probe No. 3-2.
Detailed Description
The technical scheme of the utility model is further described with the attached drawings:
a high-sensitivity integrated radiation and metal detection device comprises a scintillation crystal, a No. 1 SiPM probe, a No. 2 SiPM probe, a radiation detection mainboard and a metal detection circuit;
the scintillation crystal is of a flat cuboid structure, SiPM chips are respectively attached to the No. 1 SiPM probe and the No. 2 SiPM probe, light outlets with the same size as the SiPM chips are formed in the center positions of the end faces on the two sides of the scintillation crystal, and the No. 1 SiPM probe and the No. 2 SiPM probe are respectively bonded with the light outlets on the end faces on the two sides of the scintillation crystal;
the radiation detection main board comprises a summing amplifying circuit, a comparator circuit, an MCU (microprogrammed control unit) processor, a radiation detection alarm circuit and a metal detection alarm circuit, wherein the summing amplifying circuit is connected with the comparator circuit, the comparator circuit is in signal transmission with the MCU processor, and the MCU processor is in signal transmission with the radiation detection alarm circuit and the metal detection alarm circuit respectively;
the number 1 SiPM probe and the number 2 SiPM probe are connected with a summing amplifying circuit of the radiation detection mainboard through an FPC cable of an FPC connector, and an MCU processor of the radiation detection mainboard is in signal transmission with the metal detection circuit.
In this embodiment, preferably, the single-point SiPM chip is attached to the front surface of the No. 1 SiPM probe and the No. 2 SiPM probe, and the PCB circuit board provided with the FPC connector is attached to the back surface of the probe.
In this embodiment, it is more preferable that the effective detection area of the single-point SiPM chip is 3mm by 3 mm.
In this embodiment, it is more preferable that the scintillation crystal is externally wrapped with a reflective material, and the reflective material is barium sulfate, teflon or ESR reflective film.
In this embodiment, it is more preferable that the No. 1 SiPM probe and the No. 2 SiPM probe are bonded to the two light outlets at the two ends of the scintillation crystal through optical glue.
In this embodiment, it is more preferable that a light-shielding black tape is attached to the bonding positions of the No. 1 SiPM probe and the No. 2 SiPM probe and the light outlet.
In this embodiment, preferably, the radiation detection main board further includes a power management circuit.
A high-sensitivity integrated radiation and metal detection device is mainly used for detecting whether passengers carry metal or radioactive sources at stations or airports. The device consists of a SiPM probe No. 1, a SiPM probe No. 2, a radiation detection main board, a flat cuboid scintillation crystal (YSO or BGO) 1 and a metal detection circuit. The number 1 SiPM probe and the number 2 SiPM probe are both a PCB (printed circuit board) with a single-point SiPM chip (the effective detection area is 3mm x 3mm) attached to the front side and an FPC connector attached to the back side (the size is consistent with the end face area on two sides of the flat cuboid scintillation crystal). The flat cuboid scintillation crystal is wrapped by a reflecting material (barium sulfate, Teflon or ESR reflecting film), and the center of the two side end faces is provided with a light outlet with the same size as the SiPM chip. The No. 1 SiPM probe and the No. 2 SiPM probe are bonded with two light outlets of the flat cuboid scintillation crystal through optical glue, and then light-shielding treatment is carried out through a black adhesive tape.
The SiPM probe No. 1 and the SiPM probe No. 2 are connected with the radiation detection mainboard through an FPC cable on an FPC connector, the working bias voltage of the SiPM provided on the radiation detection mainboard is obtained, and meanwhile, the original signal of the SiPM is output to the radiation detection mainboard. The radiation detection main board mainly comprises an SiPM signal summation and amplification circuit, a comparator circuit, an MCU processor, a power management circuit, a radiation detection alarm circuit and a metal detection alarm circuit. The radiation detection mainboard can provide the required various voltages of 1 # SiPM probe and 2 # SiPM probe and metal detection circuit, and the radiation detection mainboard can receive the warning trigger signal who comes from metal detection circuit under operating condition, through MCU treater control metal detection alarm circuit, and the comparator circuit on the radiation detection mainboard and SiPM signal summation amplifier circuit combined action will trigger radiation detection alarm circuit when detecting that the radiation exceeds the standard simultaneously.
According to the using scene of the device (whether a worker needs to hold the device to scan whether a passenger carries metal or a radioactive source), the large-area flat cuboid scintillation crystal is used for replacing a cube scintillation crystal in a traditional radiation detector, so that the geometric efficiency of the radiation detector is effectively improved; in order to overcome the defect that the light output at different positions of the cuboid scintillation crystal is not uniform, the light output uniformity can be effectively improved by reading out signals at two ends and then summing the signals, and compared with a single-end reading method, the detection sensitivity can be greatly improved, and the effective signals are prevented from being lost; the No. 1 SiPM probe and the No. 2 SiPM probe used in the device have the advantages of low working voltage, small volume, good electromagnetic field compatibility and the like, so that the device is safer and more portable and can work in various complex electromagnetic environments.
Finally, it should be noted that:
the skilled person can, with reference to the present disclosure, carry out the method and carry out its application, it being expressly noted that all similar substitutes and modifications apparent to the skilled person are deemed to be included within the present invention. The method and application of the present invention have been described in terms of preferred embodiments, and it will be apparent to those skilled in the art that the techniques of the present invention may be practiced and used without departing from the spirit and scope of the present invention by modifying or otherwise appropriately changing or combining the various methods and applications of the present invention.
The above embodiments are only used for illustrating but not limiting the technical solutions of the present invention, and although the present invention is described in detail with reference to the above embodiments, those of ordinary skill in the art should understand that: modifications and equivalents may be made thereto without departing from the spirit and scope of the invention, and the appended claims are intended to cover such modifications and equivalents as fall within the spirit and scope of the invention.

Claims (7)

1. The utility model provides a high sensitivity integration radiation and metal detection equipment which characterized in that:
the detector comprises a scintillation crystal, a No. 1 SiPM probe, a No. 2 SiPM probe, a radiation detection mainboard and a metal detection circuit;
the scintillation crystal is of a flat cuboid structure, SiPM chips are respectively attached to the No. 1 SiPM probe and the No. 2 SiPM probe, light outlets with the same size as the SiPM chips are formed in the center positions of the end faces on the two sides of the scintillation crystal, and the No. 1 SiPM probe and the No. 2 SiPM probe are respectively bonded with the light outlets on the end faces on the two sides of the scintillation crystal;
the radiation detection main board comprises a summing amplifying circuit, a comparator circuit, an MCU (microprogrammed control unit) processor, a radiation detection alarm circuit and a metal detection alarm circuit, wherein the summing amplifying circuit is connected with the comparator circuit, the comparator circuit is in signal transmission with the MCU processor, and the MCU processor is in signal transmission with the radiation detection alarm circuit and the metal detection alarm circuit respectively;
the number 1 SiPM probe and the number 2 SiPM probe are connected with a summing amplifying circuit of the radiation detection mainboard through an FPC cable of an FPC connector, and an MCU processor of the radiation detection mainboard is in signal transmission with the metal detection circuit.
2. A high sensitivity integrated radiation and metal detection device according to claim 1, wherein: the front of No. 1 SiPM probe and No. 2 SiPM probe is pasted with single-point SiPM chip, and the reverse side is pasted with the PCB circuit board that is equipped with the FPC connector.
3. A high sensitivity integrated radiation and metal detection device according to claim 2, wherein: the effective detection area of the single-point SiPM chip is 3mm by 3 mm.
4. A high sensitivity integrated radiation and metal detection device according to claim 3, wherein: the scintillation crystal is wrapped by a reflecting material, and the reflecting material is barium sulfate, Teflon or an ESR reflecting film.
5. A high sensitivity integrated radiation and metal detection device according to claim 4, wherein: the No. 1 SiPM probe and the No. 2 SiPM probe are bonded with two light outlets at two ends of the scintillation crystal through optical glue.
6. A high sensitivity integrated radiation and metal detection device according to claim 5, wherein: and dark adhesive tapes are adhered to the joints of the No. 1 SiPM probe and the No. 2 SiPM probe and the light outlet.
7. A high sensitivity integrated radiation and metal detection device according to claim 1, wherein: the radiation detection mainboard further comprises a power management circuit.
CN201920830945.4U 2019-06-04 2019-06-04 High-sensitivity integrated radiation and metal detection equipment Active CN209946414U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201920830945.4U CN209946414U (en) 2019-06-04 2019-06-04 High-sensitivity integrated radiation and metal detection equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201920830945.4U CN209946414U (en) 2019-06-04 2019-06-04 High-sensitivity integrated radiation and metal detection equipment

Publications (1)

Publication Number Publication Date
CN209946414U true CN209946414U (en) 2020-01-14

Family

ID=69135190

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201920830945.4U Active CN209946414U (en) 2019-06-04 2019-06-04 High-sensitivity integrated radiation and metal detection equipment

Country Status (1)

Country Link
CN (1) CN209946414U (en)

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