CN209944267U - Novel high-efficient heat dissipation single face pcb glass fiber board - Google Patents
Novel high-efficient heat dissipation single face pcb glass fiber board Download PDFInfo
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- CN209944267U CN209944267U CN201921258962.1U CN201921258962U CN209944267U CN 209944267 U CN209944267 U CN 209944267U CN 201921258962 U CN201921258962 U CN 201921258962U CN 209944267 U CN209944267 U CN 209944267U
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- heat dissipation
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- heat
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Abstract
The utility model discloses a novel high-efficiency heat-dissipation single-face pcb glass fiber board, which comprises a board body, wherein the top surface of the board body is provided with a plurality of LED lamp sources, the top edge of the board body is provided with a plurality of fixing holes at equal intervals, the central position of the board body is provided with communicating holes, the edge of the board body is provided with a plurality of splicing clamping grooves at equal intervals, the bottom of the board body is provided with a supporting filler strip corresponding to the four splicing clamping grooves respectively, a plurality of heat dissipation grooves are added at the back of the board body in the utility model, and the heat dissipation grooves are internally provided with heat dissipation strips with heat-conducting silica gel layers, so that the heat on the board body can be quickly transmitted to the heat dissipation strips, the supporting filler strips which can be flexibly installed and disassembled are also designed on the board body, the supporting filler strips are clamped with the splicing clamping grooves on the board body through the splicing buckles at the end parts, so that the, the clearance between increase plate body and the lamp housing makes things convenient for the heat on the heat dissipation strip can dispel the heat fast.
Description
Technical Field
The utility model belongs to the technical field of the fine board of pcb glass, concretely relates to novel high-efficient heat dissipation single face fine board of pcb glass.
Background
Glass fiber board is named as follows: the glass fiber thermal insulation board, the glass fiber board (FR-4) and the glass fiber composite board are synthesized by glass fiber materials and high-heat-resistance composite materials, and do not contain asbestos components harmful to human bodies. The glass fiber board has high mechanical property and dielectric property, good heat resistance and moisture resistance and good processability, the existing glass fiber board is widely applied to a pcb circuit board, a new pcb glass fiber board has good insulating property and fire resistance, the existing pcb glass fiber board can move widely on various electronic devices, for example, various lamps and lanterns, when the existing pcb glass fiber board is applied to the lamps and lanterns, the lamps and lanterns work for a long time, the pcb glass fiber board can be caused to generate high temperature, rapid emission cannot be realized, and the service life of an upper electronic element of the pcb glass fiber board can be influenced.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a novel high-efficient heat dissipation single face pcb glass fiber board to solve the problem of proposing among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: a novel high-efficiency heat-dissipation single-face pcb glass fiber board comprises a board body, wherein a plurality of LED light sources are arranged on the top surface of the board body, a plurality of fixing holes are formed in the top edge of the board body at equal intervals, communication holes are formed in the central position of the board body, a plurality of splicing clamping grooves are formed in the edge of the board body at equal intervals, a supporting filler strip is arranged at the bottom of the board body relative to the corresponding positions of the four splicing clamping grooves, one end of each supporting filler strip extends to the corresponding position of the corresponding splicing clamping groove, a splicing buckle is arranged at the joint of one end of each supporting filler strip and the corresponding splicing clamping groove, the splicing buckles are connected with the corresponding splicing clamping grooves in a clamping mode, a plurality of heat dissipation grooves are formed in the bottom of the board body at equal intervals, a connecting sleeve is arranged on the inner side of each communication hole, a connecting, the bottom edge of intercommunicating pore is provided with a plurality of heat dissipation strips, the heat dissipation strips extend into the heat dissipation groove, and a heat conduction silica gel layer is arranged between the heat dissipation strips and the heat dissipation groove.
Preferably, the shape of the splicing buckle is a hook-shaped structure, and the size of the splicing buckle is matched with that of the splicing clamping groove.
Preferably, the connecting sleeve and the heat dissipation strip are of an integrated structure, and the size of the heat dissipation strip is consistent with that of the heat dissipation groove.
Preferably, the two end surfaces of the connecting sleeve and the surfaces of the top and the bottom of the plate body are respectively on the same plane.
Preferably, the thickness of supporting the filler strip is 8mm, the bottom surface of plate body is provided with the recess that the degree of depth is 1mm with supporting the filler strip laminating position department.
Compared with the prior art, the beneficial effects of the utility model are that:
the utility model provides a plate body back has increased a plurality of radiating grooves, and the radiating strip that has the heat conduction silica gel layer has been designed in the radiating groove, make on the heat can the fast transmission radiating strip on the plate body, still designed the support filler strip that can install and dismantle in a flexible way on the plate body, support the concatenation draw-in groove block on the concatenation buckle that the filler strip passes through the tip and the plate body, make the plate body when the installation, the back can not laminate completely on lamp housing, the clearance between plate body rear surface and the lamp housing has been increased, the heat on the convenient radiating strip can dispel the heat fast.
Drawings
Fig. 1 is a schematic top view of the present invention;
fig. 2 is a schematic bottom view of the present invention;
FIG. 3 is a front view of the cross-sectional structure of the present invention;
FIG. 4 is a schematic view of the present invention in a partial cross-sectional structure;
in the figure: 1. a plate body; 2. a fixing hole; 3. an LED light source; 4. connecting sleeves; 5. a communicating hole; 6. splicing the clamping grooves; 7. a support backing strip; 8. a heat dissipating strip; 9. splicing buckles; 10. connecting grooves; 11. a connecting projection; 12. a heat conductive silica gel layer; 13. a heat dissipation groove.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-4, the present invention provides a technical solution: a novel high-efficiency heat-dissipation single-side pcb glass fiber board comprises a board body 1, wherein a plurality of LED light sources 3 are arranged on the top surface of the board body 1, a plurality of fixing holes 2 are equidistantly arranged on the top edge of the board body 1 for facilitating lighting, a communication hole 5 is arranged at the central position of the board body 1, a plurality of splicing clamping grooves 6 are equidistantly arranged on the edge of the board body 1 for facilitating bolt fixing, a supporting filler strip 7 is respectively arranged at the corresponding positions of the bottom of the board body 1 relative to the four splicing clamping grooves 6, in order to increase the gap between the board body 1 and a lamp shell and increase the air circulation, one end of the supporting filler strip 7 extends to the splicing clamping grooves 6, a splicing buckle 9 is arranged at the joint of one end of the supporting filler strip 7 and the splicing clamping grooves 6, the splicing buckle 9 is connected with the splicing clamping grooves 6 in a clamping manner, in order to facilitate flexible installation and disassembly of the supporting filler, the inboard of intercommunicating pore 5 is provided with adapter sleeve 4, the side surface of adapter sleeve 4 is provided with spread groove 10, the inboard surface of intercommunicating pore 5 is provided with connection arch 11 with spread groove 10 block junction, the bottom edge of intercommunicating pore 5 is provided with a plurality of heat dissipation strips 8, in heat dissipation strip 8 extended to heat dissipation groove 13, for the speed up the heat dissipation, and be provided with heat conduction silica gel layer 12 between heat dissipation strip 8 and the heat dissipation groove 13, for speed up heat-conduction.
In this embodiment, preferably, the shape of the splicing buckle 9 is a hook-shaped structure, and the size of the splicing buckle 9 is matched with the size of the splicing clamping groove 6, so that the clamping is firm for convenience.
In this embodiment, preferably, the connection sleeve 4 and the heat dissipation strip 8 are of an integral structure, and the size of the heat dissipation strip 8 is consistent with that of the heat dissipation groove 13, so as to prevent the heat dissipation strip 8 from falling off.
In this embodiment, preferably, the two end surfaces of the connecting sleeve 4 and the top and bottom surfaces of the plate body 1 are located on the same plane, respectively, so as to facilitate installation.
In this embodiment, it is preferred, the thickness of supporting filler strip 7 is 8mm, and in order to guarantee to have sufficient space, the bottom surface of plate body 1 is provided with the recess that the degree of depth is 1mm with supporting filler strip 7 laminating position department, for convenient fixed supporting filler strip 7.
The utility model discloses a theory of operation and use flow: during the installation, it is firm to block into four concatenation draw-in grooves 6 interior joints with the concatenation buckle 9 of four support filler strips 7 ends respectively, then pass fixed orifices 2 through fixing bolt again, fix on the lamp body for there is the space at the back of plate body 1 and lamp body, when using, plate body 1 produces a large amount of heats, heat accessible heat conduction silica gel layer 12 transmits on heat dissipation strip 8, heat dissipation strip 8 can be dispersed the heat along with the air of the flow in the space, thereby reduce plate body 1's temperature.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. The utility model provides a novel fine board of high-efficient heat dissipation single face pcb glass, includes plate body (1), the top surface of plate body (1) is provided with a plurality of LED lamp sources (3), its characterized in that: the plate comprises a plate body (1), wherein a plurality of fixing holes (2) are formed in the top edge of the plate body (1) at equal intervals, communication holes (5) are formed in the center position of the plate body (1), a plurality of splicing clamping grooves (6) are formed in the edge of the plate body (1) at equal intervals, a supporting filler strip (7) is arranged at the bottom of the plate body (1) corresponding to the four splicing clamping grooves (6) respectively, one end of the supporting filler strip (7) extends to the splicing clamping grooves (6), a splicing buckle (9) is arranged at the joint of one end of the supporting filler strip (7) and the splicing clamping grooves (6), the splicing buckle (9) is connected with the splicing clamping grooves (6) in a clamping mode, a plurality of radiating grooves (13) are formed in the bottom of the plate body (1) at equal intervals, a connecting sleeve (4) is arranged on the inner side of the communication holes (, the connection structure is characterized in that a connection protrusion (11) is arranged at the clamping connection position of the inner side surface of the communication hole (5) and the connection groove (10), a plurality of heat dissipation strips (8) are arranged at the edge of the bottom of the communication hole (5), the heat dissipation strips (8) extend into the heat dissipation grooves (13), and a heat conduction silica gel layer (12) is arranged between the heat dissipation strips (8) and the heat dissipation grooves (13).
2. The novel efficient heat dissipation single-sided pcb glass fiber board of claim 1, wherein: the splicing buckle (9) is in a hook-shaped structure, and the size of the splicing buckle (9) is matched with that of the splicing clamping groove (6).
3. The novel efficient heat dissipation single-sided pcb glass fiber board of claim 1, wherein: the connecting sleeve (4) and the heat dissipation strip (8) are of an integrated structure, and the size of the heat dissipation strip (8) is consistent with that of the heat dissipation groove (13).
4. The novel efficient heat dissipation single-sided pcb glass fiber board of claim 1, wherein: the two end surfaces of the connecting sleeve (4) and the surfaces of the top and the bottom of the plate body (1) are respectively positioned on the same plane.
5. The novel efficient heat dissipation single-sided pcb glass fiber board of claim 1, wherein: the thickness of supporting filler strip (7) is 8mm, the bottom surface of plate body (1) is provided with the recess that the degree of depth is 1mm with supporting filler strip (7) laminating position department.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921258962.1U CN209944267U (en) | 2019-08-06 | 2019-08-06 | Novel high-efficient heat dissipation single face pcb glass fiber board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921258962.1U CN209944267U (en) | 2019-08-06 | 2019-08-06 | Novel high-efficient heat dissipation single face pcb glass fiber board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209944267U true CN209944267U (en) | 2020-01-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921258962.1U Active CN209944267U (en) | 2019-08-06 | 2019-08-06 | Novel high-efficient heat dissipation single face pcb glass fiber board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209944267U (en) |
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2019
- 2019-08-06 CN CN201921258962.1U patent/CN209944267U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A new type of high efficient heat dissipation single side PCB glass fiber board Effective date of registration: 20200916 Granted publication date: 20200114 Pledgee: Meizhou enterprise credit financing guarantee investment Co.,Ltd. Pledgor: MEIZHOU ZHIKE CIRCUIT BOARD Co.,Ltd. Registration number: Y2020440000284 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20230919 Granted publication date: 20200114 Pledgee: Meizhou enterprise credit financing guarantee investment Co.,Ltd. Pledgor: MEIZHOU ZHIKE CIRCUIT BOARD CO.,LTD. Registration number: Y2020440000284 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A New Efficient Heat Dissipation Single sided PCB Fiberglass Board Effective date of registration: 20230927 Granted publication date: 20200114 Pledgee: Meizhou Rural Commercial Bank Co.,Ltd. Pledgor: MEIZHOU ZHIKE CIRCUIT BOARD CO.,LTD. Registration number: Y2023980059698 |