CN209936652U

CN209936652U - Adjusting device for grinding silicon wafer

Info

Publication number: CN209936652U
Application number: CN201721795881.6U
Authority: CN
Inventors: 胡林宝
Original assignee: Zhejiang Star Electronic Technology Co Ltd
Current assignee: Zhejiang Star Electronic Technology Co Ltd
Priority date: 2017-12-21
Filing date: 2017-12-21
Publication date: 2020-01-14
Anticipated expiration: 2027-12-21

Abstract

The utility model discloses a grind silicon chip adjusting device, including the alignment jig, the roof is installed on the alignment jig top, roof lower extreme internally mounted has the dovetail, dovetail internally mounted has the guide block, the guide block middle part is connected in first lead screw through the screw hole, drive handle is installed to first lead screw right-hand member, the guide block lower extreme articulates there is the lifter, the lifter lower extreme articulates there is the lifter plate, the stop collar is installed to the lifter plate lower extreme, the stopper is installed to stop collar internally mounted, stopper internally mounted has the second lead screw, second lead screw left end is connected with driving motor, the fixed plate is installed to the stopper lower extreme. The utility model discloses, the change of height about realizing the lifter plate is mutually supported through the second lead screw that is equipped with and between the stopper simultaneously, is realizing the removal to the stationary plate left and right sides, and then is satisfying the silicon chip and is grinding the adjustment about the in-process grinding miller about, easy operation, and the reliability is high, and the practicality is strong.

Description

Adjusting device for grinding silicon wafer

Technical Field

The utility model relates to a silicon chip grinds technical field, specifically is a grind silicon chip adjusting device.

Background

Silicon wafers are important materials for manufacturing integrated circuits, and various semiconductor devices can be manufactured by means of photolithography, ion implantation and the like. Chips made from silicon wafers have a surprising computing power. The development of semiconductors is continuously driven by the development of scientific technology. The development of automation and computers has reduced the cost of high technology products such as silicon wafers (integrated circuits) to a very low level. This has led to the widespread use of silicon wafers in aerospace, industry, agriculture, and defense, and even to the slightest of every family.

In the silicon wafer processing process, after the silicon rod is processed into the silicon wafer, an irregular shape can be generated on the silicon wafer, in order to not influence the quality of subsequent processing, the irregular edge needs to be removed, the silicon wafer needs to be ground, in the grinding process, the vertical height and the horizontal distance of a grinding wheel need to be adjusted, so that grinding at different positions on the silicon wafer is realized, in the existing adjusting mode, the grinding wheel is manually held by a worker to move at different positions, the adjusting mode not only increases the labor intensity of workers, but also is low in adjusting precision, and the grinding requirement of the silicon wafer is difficult to meet.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a grind silicon chip adjusting device to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme:

the utility model provides a grind silicon chip adjusting device, includes the alignment jig, the roof is installed on the alignment jig top, and roof lower extreme internally mounted has the dovetail, and dovetail internally mounted has the guide block, the guide block middle part is connected in first lead screw through the screw hole, and driving handle is installed to first lead screw right-hand member, the guide block lower extreme articulates there is the lifter, and the lifter lower extreme articulates there is the lifter plate, and the stop collar is installed to the lifter plate lower extreme, and the stopper is internally installed to the stop collar, and stopper internally mounted has the second lead screw, and second lead screw left end is connected with driving motor, the fixed plate is installed to.

As a further aspect of the present invention: the inner side of the adjusting frame is provided with a guide groove matched with the lifting plate.

As a further aspect of the present invention: the guide block comprises a trapezoidal block and a sliding block, and the trapezoidal block is located inside the dovetail groove.

As a further aspect of the present invention: the outer side of the left end of the first screw rod is provided with a right-handed thread, and the outer side of the right end of the first screw rod is provided with a left-handed thread.

As a further aspect of the present invention: and both ends of the first screw rod are connected with adjusting frames through bearings.

As a further aspect of the present invention: the driving motor is a double-steering stepping motor.

Compared with the prior art, the beneficial effects of the utility model are that:

the grinding silicon wafer adjusting device is reasonable in structure and novel in design, changes of the height of the lifting plate are achieved through the mutual matching between the guide block and the first lead screw, meanwhile, the movement of the left and right sides of the fixing plate is achieved through the mutual matching between the second lead screw and the limiting block, the adjustment of the silicon wafer in the grinding process of the grinding wheel in the vertical and horizontal directions is further met, and the grinding silicon wafer adjusting device is simple in operation, high in reliability and high in practicability.

Drawings

Fig. 1 is a schematic structural diagram of an adjusting apparatus for grinding a silicon wafer.

FIG. 2 is a schematic structural diagram of a guide block in an adjusting device for grinding silicon wafers.

FIG. 3 is a schematic structural diagram of a first lead screw in an adjusting apparatus for polishing a silicon wafer.

Detailed Description

It should be noted that, in the present invention, the embodiments and features of the embodiments may be combined with each other without conflict.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are used merely for convenience of description and for simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention. Furthermore, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art through specific situations.

The present invention will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.

Referring to fig. 1 to 3, in the embodiment of the present invention, an adjusting device for grinding silicon wafers comprises an adjusting frame 1, a guide groove 12 matched with a lifting plate 20 is arranged on the inner side of the adjusting frame 1, and is used for guiding the up-and-down movement of the lifting plate 20, a top plate 2 is installed at the top end of the adjusting frame 1, a dovetail groove 19 is installed inside the lower end of the top plate 2, a guide block 3 is installed inside the dovetail groove 19, the guide block 3 can move along the inside of the dovetail groove 19, the guide block 3 comprises a trapezoidal block 16 and a slider 17, the trapezoidal block 16 is located inside the dovetail groove 19, the middle part of the guide block 3 is connected to a first lead screw 4 through a threaded hole 18, the threaded hole 18 is used for converting the rotary motion of the first lead screw 4 into the linear motion of the guide block 3, a right-handed thread 14 is arranged on the outer side of the left end of, and then make first lead screw 4 realize the removal of the relative direction of two guide blocks 3 when rotating, 4 both ends of first lead screw all are connected with alignment jig 1 through bearing 15, and actuating handle 5 is installed to 4 right-hand members of first lead screw for driving actuating handle 5 and rotating, 3 lower extremes of guide block are articulated to have

lifter

6, and 6 lower extremes of lifter articulate has lifter plate 20, and stop collar 10 is installed to lifter plate 20 lower extreme, and stop collar 10 internally mounted has stopper 7, and 7 internally mounted of stopper has second lead screw 9, and the second lead screw 9 left end is connected with driving motor 11, driving motor 11 is two steering step motor, and then realizes the bi-directional rotation to second lead screw 9, fixed plate 8 is installed to 7 lower extremes of stopper, grinding device is being installed to 8 lower extremes of fixed plate.

The utility model provides a grind silicon chip adjusting device, when needs reciprocate the grinder of 8 lower extremes of fixed plate, then rotate driving handle 5, driving handle 5 is driving first lead screw 4 and is rotating, and then make guide block 3 remove toward opposite direction, then through the effect of lifter 6, make lifter plate 20 reciprocate along guide way 12, when needs remove when removing the grinder of 8 lower extremes of fixed plate, then start driving motor 11, driving motor 11 drives second lead screw 9 and rotates, make stopper 7 remove about, thereby realize removing about of fixed plate 8. The utility model discloses, rational in infrastructure, the modern design through the guide block 3 that is equipped with and mutually supporting between the first lead screw 4, realizes the change of height about the lifter plate, simultaneously through mutually supporting between second lead screw 7 and the stopper 7 that are equipped with, realizes the removal about fixed plate 8, and then satisfies the silicon chip in the adjustment about grinding process grinding miller about, easy operation, the reliability is high, and the practicality is strong.

It should be particularly noted that, in the present application, the connection relationship between the dovetail groove 19 and the trapezoid block 16 is an application of the prior art, and the mutual cooperation between the first lead screw 4 and the guide block 3, and between the second lead screw 9 and the limit block 7 are respectively utilized to realize the up-down left-right movement of the grinding device facing the lower end of the fixed plate 8, which is an innovative point of the present application, and the present grinding device effectively solves the technical problem that the grinding wheel is adjusted by holding by hand.

The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A grinding silicon wafer adjusting device comprises an adjusting frame (1) and is characterized in that a top plate (2) is installed at the top end of the adjusting frame (1), a dovetail groove (19) is installed inside the lower end of the top plate (2), a guide block (3) is installed inside the dovetail groove (19), the middle part of the guide block (3) is connected with the first screw rod (4) through a threaded hole (18), the right end of the first screw rod (4) is provided with a driving handle (5), guide block (3) lower extreme articulates there is lifter (6), and lifter (6) lower extreme articulates there is lifter plate (20), and stop collar (10) are installed to lifter plate (20) lower extreme, and stop collar (10) internally mounted has stopper (7), and stopper (7) internally mounted has second lead screw (9), and second lead screw (9) left end is connected with driving motor (11), fixed plate (8) are installed to stopper (7) lower extreme.

2. The adjusting device for the grinding silicon wafers as claimed in claim 1, characterized in that the adjusting bracket (1) is provided on the inside with guide grooves (12) which cooperate with the lifting plate (20).

3. The adjusting device for the grinding silicon wafer according to claim 1, characterized in that the guide block (3) comprises a trapezoidal block (16) and a slide block (17), and the trapezoidal block (16) is positioned inside the dovetail groove (19).

4. The silicon wafer grinding adjustment device as claimed in claim 1, wherein the first lead screw (4) is provided with a right-handed thread (14) on the outer side of the left end, and the first lead screw (4) is provided with a left-handed thread (13) on the outer side of the right end.

5. The adjusting device for the grinding silicon wafers as claimed in claim 1, characterized in that the two ends of the first lead screw (4) are connected with the adjusting frame (1) through bearings (15).

6. The device for conditioning the ground silicon wafer as claimed in claim 1, wherein the driving motor (11) is a double-steering stepping motor.