CN209930647U

CN209930647U - Heat dissipation device for pressing multilayer circuit board

Info

Publication number: CN209930647U
Application number: CN201920654668.6U
Authority: CN
Inventors: 刘胜贤; 朱怀德; 方蕾; 林勇刚; 孙志刚
Original assignee: Putian Hanjiang Yd Pcb Co Ltd
Current assignee: Putian Hanjiang Yd Pcb Co Ltd
Priority date: 2019-05-08
Filing date: 2019-05-08
Publication date: 2020-01-10
Anticipated expiration: 2029-05-08

Abstract

The utility model relates to a heat abstractor for multilayer circuit board suppression, it includes two guide rails, two guide rails are respectively along the front and back both sides of locating the pressfitting machine objective table that X axle direction extends, two installing frames of sliding connection between two guide rails, two installing frames make the U type form by the grid plate, two installing frame openings are relative locate the left and right sides of pressfitting machine objective table, two installing frames are close to in opposite directions or keep away from mutually the back mutually by two first telescopic cylinder drives respectively along X axle direction, a plurality of radiator fan that are used for cooling to the multilayer circuit board are installed respectively to two installing frame inboards.

Description

Heat dissipation device for pressing multilayer circuit board

Technical Field

The utility model relates to a circuit board production facility technical field especially relates to a heat abstractor for multilayer circuit board suppression.

Background

At present, most of the multilayer circuit boards are formed by hot pressing by a pressing machine. Among the prior art, the pressfitting machine includes hydraulic press and voltmeter, and the voltmeter has and is used for placing the objective table of treating the suppression multilayer circuit board and liftable installs the electric hot pressing head that is used for suppressing multilayer circuit board above the objective table. Before pressing, respectively placing a plurality of pressing plates on a plurality of circuit board core boards, and passing copper foil between each pressing plate and the circuit board core board so as to superpose and form a multi-layer circuit board to be pressed, wherein the pressing plates are usually aluminum mirror plates or steel plates, and the surface of the circuit board core board is provided with hot melt resin; during pressing, the stacked multilayer circuit board to be pressed is placed on an objective table, an electric heating pressure head descends and presses on a pressing plate, the surface of copper foil is electrified to generate heat, hot-melt resin on the surface of a circuit board core plate is melted by the heat when the pressing plate presses downwards, so that the copper foil is coated on the surface of the circuit board core plate, finally, the power is cut off, and the hot-melt resin after being melted is cooled to form the integrated multilayer circuit board.

Disclosure of Invention

An object of the utility model is to provide a heat abstractor for multilayer circuit board suppression that reasonable in design, the cooling is fast, and suppression stability is good.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

the utility model provides a heat abstractor for multilayer circuit board suppression, its includes two guide rails, two guide rails are along the front and back both sides of locating the pressfitting machine objective table that X axle direction extends respectively, sliding connection has two installing frames between two guide rails, U type form is made by the grid plate to two installing frames, the left and right sides of pressfitting machine objective table is located to two installing frame openings are relative, two installing frames are close to in opposite directions or carry on mutually the back away from along X axle direction by two first telescopic cylinder drives respectively, a plurality of radiator fan that are used for cooling to the multilayer circuit board are installed respectively to two installing frame inboards.

Furthermore, two lateral plates used for fixing the left side and the right side of the multilayer circuit board are respectively connected to the inner sides of the two mounting frames through two supporting rods.

Preferably, both side panels are formed from a mesh panel.

Furthermore, the inner sides of the two ends of each mounting frame are respectively connected with two end plates used for fixing the front side and the rear side of the multilayer circuit board through two second telescopic cylinders, and the two end plates on the same mounting frame are driven by the two second telescopic cylinders to be close to each other or be away from each other in the Z-axis direction. This design makes it can extend respectively through controlling two second telescoping cylinders on the same installing frame, drives two end plates on the same installing frame and is close to in opposite directions along the Z axle direction, compresses tightly multilayer circuit board front and back both sides respectively until the inboard of two end plates to it takes place the front and back direction relative slip to avoid hot melt type resin to melt.

Further, the telescopic device further comprises a controller, and the controller is in signal connection with the two first telescopic cylinders, all the second telescopic cylinders and all the cooling fans respectively. The design enables the first telescopic cylinder and the second telescopic cylinder to be controlled to stretch and contract through the controller, and the cooling fans are controlled to start and stop, so that automatic control of the device is achieved.

Preferably, the first telescopic cylinder and the second telescopic cylinder are both air cylinders or hydraulic cylinders.

Preferably, all of the end plates are formed from a mesh plate.

Preferably, the two guide rails are both formed of angle steel material.

Furthermore, two ends of the two guide rails are provided with limit blocks.

Preferably, the lower edges of both side plates and all end plates are higher than the upper surface of the laminating machine stage in the Y-axis direction. The design enables it to be used to secure multi-layer circuit boards of different specifications.

Preferably, the upper edges of both side plates and all end plates are slightly lower than the upper surface of the multilayer wiring board in the Y-axis direction.

The utility model adopts the technical proposal that when in use, all the first telescopic cylinders and the second telescopic cylinders are controlled to contract to drive each cooling fan, the side plates and the end plates to be far away from the object stage of the pressing machine, so that the multilayer circuit board to be pressed is placed on the object stage from the front side of the object stage of the pressing machine, then the two first telescopic cylinders are controlled to extend respectively to drive the two installation frames to approach each other along the X-axis direction until the inner sides of the two side plates respectively press the left side and the right side of the multilayer circuit board, and then the two installation frames are synchronously controlled to ensure that the two second telescopic cylinders on the same installation frame extend respectively to drive the two end plates to approach each other along the Z-axis direction until the inner sides of the two end plates respectively press the front side and the rear side of the multilayer circuit board, thereby the peripheral sides of the multilayer circuit board can be pressed and fixed, then the, the hot-melt resin is melted to enable the copper foil to be coated on the surface of the core plate of the circuit board to form a whole, the electric heating pressure head is powered off after pressing, and the cooling fans are controlled to be started so as to rapidly cool the peripheral side of the multi-layer circuit board after pressing.

The utility model discloses an effective effect is: the two first telescopic cylinders are controlled to be telescopic, so that the two mounting frames can be driven to be close to or away from each other in the opposite direction along the X-axis direction, and a plurality of cooling fans on the inner sides of the two mounting frames are driven to be close to or away from the peripheral side of the multilayer circuit board, so that after the hot-melt resin is melted, the multilayer circuit board can be rapidly cooled, the condensation of the hot-melt resin is accelerated, and the risk of deformation caused by relative sliding of a pressing plate of the multilayer circuit board and a core plate of the circuit board is; meanwhile, the left side and the right side of the multilayer circuit board can be respectively compressed by the two side plates, so that the phenomenon that the pressing plate and the circuit board core plate are easy to slide in the left-right direction due to the fact that the hot-melt resin melts is effectively avoided, the front side and the rear side of the multilayer circuit board can be respectively compressed by the two end plates of each mounting frame, and the phenomenon that the pressing plate and the circuit board core plate of the multilayer circuit board are easy to slide in the left-right direction due to the fact that the hot.

Drawings

The present invention will now be further elucidated with reference to the accompanying drawings:

fig. 1 is a schematic structural view of a heat dissipation device for pressing a multilayer circuit board according to an embodiment 1 of the present invention;

fig. 2 is a schematic structural diagram of an embodiment 2 of the heat dissipation device for pressing a multilayer circuit board according to the present invention;

fig. 3 is a schematic view of the usage state of embodiment 2 of the heat dissipation device for pressing multilayer circuit board of the present invention.

Detailed Description

Example 1

As shown in fig. 1, the utility model discloses a heat abstractor 1 for multilayer circuit board suppression, it includes two guide rails 11, two guide rails 11 extend along the X axle direction respectively locate the front and back both sides of pressfitting machine objective table 2, sliding connection has two installing frames 12 between two guide rails 11, two installing frames 12 are made the U type form by the grid plate, two installing frames 12 open-ended relative left and right sides of locating pressfitting machine objective table 2, two installing frames 12 are close to in opposite directions or carry on the back mutually and keep away from by two first telescoping cylinder 13 drives respectively along the X axle direction, a plurality of radiator fan 14 that are used for cooling to the multilayer circuit board are installed respectively to two installing frame 12 inboards.

Preferably, the two guide rails 11 are both formed of angle steel material.

Preferably, the two guide rails 11 are mounted on the machine base or the machine frame on the front and rear sides of the laminating machine stage 2.

Furthermore, two ends of the two guide rails 11 can be provided with limit blocks 15.

Example 2

As shown in fig. 2 or fig. 3, in embodiment 1, two side plates 17 for fixing the left and right sides of the multilayer wiring board 3 are connected to the inner sides of the two mounting frames 12 via two support rods 16.

Preferably, both side panels 17 are formed from mesh panels.

Preferably, two end plates 19 for fixing the front and rear sides of the multilayer circuit board 3 may be connected to the inner sides of the two ends of each mounting frame 12 through two second telescopic cylinders 18, and the two end plates 19 on the same mounting frame 12 are driven by the two second telescopic cylinders 18 to approach each other or to be away from each other in the Z-axis direction. The design enables the two second telescopic cylinders 18 on the same mounting frame 12 to be controlled to extend respectively to drive the two end plates 19 on the same mounting frame 12 to approach towards each other along the Z-axis direction until the inner sides of the two end plates 19 respectively compress the front side and the rear side of the multilayer circuit board 3, so that relative sliding in the front-rear direction after the hot-melt resin is melted is avoided.

Preferably, all of the end plates 19 are formed from a mesh sheet.

Preferably, the first telescopic cylinder 13 and the second telescopic cylinder 18 are both air cylinders or hydraulic cylinders.

Preferably, the lower edges of both side plates 17 and all end plates 19 are higher than the upper surface of the laminator table 2 in the Y-axis direction. This design enables it to be used for fixing multilayer wiring boards 3 of different specifications.

Preferably, the upper edges of both side plates 17 and all end plates 19 are slightly lower than the upper surface of the multilayer wiring board 3 in the Y-axis direction.

Example 3

On the basis of embodiment 1 or embodiment 2, the heat dissipation device for pressing the multilayer circuit board 3 of the present invention further includes a controller (not shown in the figure), and the controller is in signal connection with the two first telescopic cylinders 13, all the second telescopic cylinders 18, and all the heat dissipation fans 14, respectively. The design enables the controller to control the first telescopic cylinder 13 and the second telescopic cylinder 18 to be telescopic, and control the cooling fans 14 to be started and stopped, thereby realizing the automatic control of the device.

The utility model adopts the technical proposal that when in use, all the first telescopic cylinders 13 and the second telescopic cylinders 18 are controlled to contract to drive the cooling fans 14, the side plates 17 and the end plates 19 to be far away from the pressing machine objective table 2, so that the multilayer circuit board 3 to be pressed is placed on the objective table 2 from the front side of the pressing machine objective table 2, then the two first telescopic cylinders 13 are controlled to extend respectively to drive the two installation frames 12 to approach each other along the X-axis direction until the inner sides of the two side plates 17 compress the left side and the right side of the multilayer circuit board 3 respectively, and then the two second telescopic cylinders 18 on the same installation frame 12 are controlled to extend respectively through synchronously controlling the two installation frames 12 to drive the two end plates 19 to approach each other along the Z-axis direction until the inner sides of the two end plates 19 compress the front side and the back side of the multilayer circuit board 3 respectively, thereby compressing the peripheral sides of the multilayer circuit board 3 fixedly, then the head of, the surface of the copper foil is electrified to generate heat, so that the hot-melt resin is melted, the copper foil is coated on the surface of the core plate of the circuit board to form a whole, the electric heating pressure head is powered off after pressing, and the cooling fans 14 are controlled to be turned on, so that the peripheral side of the multi-layer circuit board 3 after pressing is cooled rapidly.

The above description should not be taken as limiting the scope of the invention in any way.

Claims

1. A heat abstractor for multilayer circuit board suppression which characterized in that: it includes two guide rails, two guide rails are along the front and back both sides of locating the pressfitting machine objective table that the X axle direction extends respectively, sliding connection has two installing frames between two guide rails, U type form is made by the net board to two installing frames, the left and right sides of locating the pressfitting machine objective table that two installing frame openings are relative, two installing frames are close to in opposite directions or keep away from mutually by two first telescopic cylinder drives respectively along the X axle direction, a plurality of radiator fan that are used for cooling to the multilayer circuit board are installed respectively to two installing frame inboards.

2. The heat sink device for multilayer circuit board pressing according to claim 1, wherein: the inner sides of the two mounting frames are respectively connected with two side plates for fixing the left side and the right side of the multilayer circuit board through two support rods.

3. The heat sink device for multilayer circuit board pressing according to claim 2, wherein: and the two side plates are both formed by grid plates.

4. The heat sink device for multilayer circuit board pressing according to claim 1, wherein: the inner sides of the two ends of each mounting frame are respectively connected with two end plates used for fixing the front side and the rear side of the multilayer circuit board through two second telescopic cylinders, and the two end plates on the same mounting frame are driven by the two second telescopic cylinders to be close to or away from each other in the Z-axis direction in the opposite direction.

5. The heat sink device for multilayer circuit board pressing according to claim 4, wherein: the heat dissipation device further comprises a controller, and the controller is in signal connection with the two first telescopic cylinders, all the second telescopic cylinders and all the heat dissipation fans respectively.

6. The heat sink device for multilayer circuit board pressing according to claim 4, wherein: the first telescopic cylinder and the second telescopic cylinder are both air cylinders or hydraulic cylinders.

7. The heat sink device for multilayer circuit board pressing according to claim 4, wherein: all end plates are formed from a mesh plate.

8. The heat sink device for multilayer circuit board pressing according to claim 1, wherein: the two guide rails are both formed by angle steel materials.

9. The heat sink device for multilayer circuit board pressing according to claim 1, wherein: two ends of the two guide rails are provided with limiting blocks.