CN209930459U - Wired earphone pad with external sound amplifying unit - Google Patents

Abstract

The utility model relates to a wired earphone pad with outside public address unit, including wired earphone, wired earphone is equipped with the earphone pad, the earphone pad is including filling up body, switch, puigging, audio chip, power amplifier unit, the cladding has the puigging between the earphone casing of filling up the body and wired earphone, fill up the body outer fringe and be equipped with the switch, the power amplifier unit is located between the puigging and the pad body, the puigging outside is located to the audio chip to link to each other with wired earphone through the circuit, just the pad body has seted up the broadcast hole corresponding to the power amplifier unit, the beneficial effects of the utility model reside in that, on the basis of original wired earphone pad, make it add controllable public address original paper, can switch into little audio amplifier mode, reach a tractor serves several purposes's effect.

Description

Wired earphone pad with external sound amplifying unit

Technical Field

The utility model belongs to the technical field of earphone equipment, concretely relates to wired earphone pad with outside public address unit.

Background

Wired earphone has the advantage that immersive experience is good, especially earmuff formula earphone, but this type of earphone if wear for a long time can let the ear sultry, take off and use the broadcast effect not good again to under specific conditions, the user need let around people hear what the content of oneself listening, the accent volume also can not necessarily let the people hear, it is more troublesome again to pull out the direct power amplifier of earphone cord, still probably brings the influence to earphone or equipment.

SUMMERY OF THE UTILITY MODEL

To the technical defect who exists among the background art, the utility model provides a wired earphone pad with outside public address unit has effectively solved above-mentioned technical problem, and concrete technical scheme is as follows:

wired earphone pad with outside public address unit, including wired earphone, wired earphone is equipped with the earphone pad, the earphone pad is including filling up body, switch, puigging, audio chip, power amplifier unit, the cladding has the puigging between the earphone casing of filling up the body and wired earphone, fill up the body outer fringe and be equipped with the switch, the power amplifier unit is located between puigging and the body of filling up, the puigging outside is located to the audio chip to link to each other with wired earphone through the circuit, just the body of filling up has seted up the broadcast hole corresponding to the power amplifier unit.

As a further technical scheme of the utility model, the puigging accompanies liquid rubber layer for in the PVC shell body, just the PVC shell body is porous structure, be equipped with the sealing layer of organic material between PVC shell body and the liquid rubber layer.

As a further technical proposal of the utility model, the switch is a push switch and is arranged at the middle part of the outside of the cushion body.

As a further technical scheme of the utility model, the audio chip model is RTL 8763B.

As a further technical scheme of the utility model, the power amplifier unit is RSX 2508.

The beneficial effects of the utility model reside in that, on the basis of original wired headphone mat, make it add controllable public address original paper, can switch into little audio amplifier mode, reach the effect of a tractor serves several purposes.

Drawings

Figure 1 is a schematic structural diagram of the present invention,

fig. 2 is a layered view of the soundproof layer 3.

Wherein: the pad body 1, the switch 2, the sound insulation layer 3, the PVC outer shell 30, the liquid rubber layer 31, the sealing layer 32, the audio chip 4, the power amplifier unit 5 and the broadcasting hole 6.

Detailed Description

Embodiments of the present invention will be described with reference to the accompanying drawings and related embodiments, wherein the following embodiments are only preferred embodiments for better illustrating the present invention, and the embodiments of the present invention are not limited to the following embodiments, and the related essential components of the present invention related to the technical field should be considered as known in the art and can be known and mastered by those skilled in the technical field.

In the description of the present invention, it is to be understood that the terms "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "inner," and the like are used in the orientation or positional relationship indicated in the drawings, merely for the purpose of describing the invention and simplifying the description, and are not intended to indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the invention.

Referring to fig. 1, a wired earphone pad with an external sound amplifying unit includes a wired earphone, the wired earphone is provided with an earphone pad, the earphone pad includes a pad body 1, a switch 2, a sound insulating layer 3, an audio chip 4, and a power amplifier unit 5, the sound insulating layer 3 is wrapped between the pad body 1 and an earphone shell of the wired earphone, the switch 2 is disposed at the outer edge of the pad body 1, the power amplifier unit 5 is disposed between the sound insulating layer 3 and the pad body 1, the audio chip 4 is disposed at the outer side of the sound insulating layer 3 and connected to the wired earphone through a circuit, and the pad body 1 is provided with a sound amplifying hole 6 corresponding to the power amplifier unit 5, in the utility model, the switch 2 and the audio chip 4 are electrically connected to the power amplifier unit 5, and the audio chip 4 is connected to the circuit of the wired earphone to form a complete loop, when the wired earphone is used, the switch 2 is not turned on, the earphone is played according to, when the user need let the external world hear the content of oneself listening, perhaps need become the earphone when small-size power amplifier equipment, then manually operation switch 2, make audio chip 4 and earphone circuit switch-on, audio signal gets into audio chip 4, turn into the electric pulse by audio chip 4 with the signal transformation, and then conduct power amplifier unit 5 and play, through 6 power amplifiers of broadcast hole, the earphone has just so converted the state that can play outward, under the preferred state, the earphone also can select whether to put through from the broadcast unit of taking, and the state of earphone is worn when the user, because the existence of puigging 3, make the state of playing outward and put between the state mutually influence less, do not influence user's use itself yet.

Referring to fig. 2, in a preferred embodiment, the sound insulation layer 3 is a PVC outer shell 30 having a liquid rubber layer 31 sandwiched therein, the PVC outer shell 30 is of a porous structure, a sealing layer 32 made of an organic material is disposed between the PVC outer shell 30 and the liquid rubber layer 31, the PVC outer shell 30 of the porous structure has a certain noise reduction function, the liquid rubber layer 31 can further perform a noise reduction function, and the sealing layer 32 can prevent the liquid rubber layer 31 from leaking to cause a problem.

In a preferred embodiment, the switch 2 is a push switch and is arranged in the middle of the outer side of the cushion body 1, so that a user can conveniently operate the switch 2 and a volume button of the earphone at the same time, and in a preferred state, the switch 2 can be a touch switch, so that the operation comfort is improved.

In a preferred embodiment, the audio chip 4 is RTL8763B, which has high cost performance.

In a preferred embodiment, the power amplifier unit 5 is RSX2508, has high cost performance and small size, and is suitable for wired earphones.

The beneficial effects of the utility model reside in that, on the basis of original wired earphone pad, make it increase

If a controllable sound amplification original piece is arranged, the mode of the sound box can be switched to a small sound box mode, and the effect of one machine with multiple purposes is achieved.

The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of improvements and decorations can be made without departing from the principle of the present invention, and these improvements and decorations should also be regarded as the protection scope of the present invention.

Claims (5)

1. Wired earphone pad with outside public address unit, including wired earphone, its characterized in that, wired earphone is equipped with the earphone pad, the earphone pad is including filling up body, switch, puigging, audio chip, power amplifier unit, the cladding has the puigging between the earphone casing of filling up the body and wired earphone, fill up the body outer fringe and be equipped with the switch, power amplifier unit is located between puigging and the pad body, the puigging outside is located to the audio chip to link to each other with wired earphone through the circuit, just the pad body has seted up the broadcast hole corresponding to the power amplifier unit.

2. The wired earphone pad with an external sound amplifying unit as claimed in claim 1, wherein the sound insulation layer is a PVC outer shell having a liquid rubber layer sandwiched therein, and the PVC outer shell has a porous structure, and a sealing layer made of organic material is disposed between the PVC outer shell and the liquid rubber layer.

3. The wired earphone pad with an external sound amplification unit as claimed in claim 1, wherein the switch is a push type switch provided at a middle portion of an outer side of the pad body.

4. The wired earphone pad with external sound amplification unit as claimed in claim 1, wherein the audio chip model is RTL 8763B.

5. The wired earphone pad with external sound amplification unit as claimed in claim 1, wherein the power amplification unit is RSX 2508.

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