CN209928328U - Embedded passive heat conduction case of computer - Google Patents
Embedded passive heat conduction case of computer Download PDFInfo
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- CN209928328U CN209928328U CN201920684948.1U CN201920684948U CN209928328U CN 209928328 U CN209928328 U CN 209928328U CN 201920684948 U CN201920684948 U CN 201920684948U CN 209928328 U CN209928328 U CN 209928328U
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Abstract
The utility model relates to the technical field of embedded computers, in particular to an embedded computer passive heat conduction case, which comprises a case body and a detachable case cover arranged on the case body, wherein the bottom wall of the case body is inwards sunken and is in a through hole shape, and a heat conduction device is arranged in the through hole and comprises a heat dissipation block, fins, a first water cooling pipe, a second water cooling pipe, a water tank and a water-stop film; the quick fixed connection of heat dissipation is on the lateral wall of through-hole, a plurality of fins of fixedly connected with on the quick lower lateral wall of heat dissipation, the fin all adopts the copper alloy to make with the heat dissipation soon, a water-cooling pipeline and No. two water-cooling pipelines have been arranged between the fin, through set up radiating block, fin, a water-cooling tube, No. two water-cooling tubes and water tank in the bottom of quick-witted case, realized the passive heat conduction heat dissipation of efficient, solved the tradition and used fan initiative heat dissipation, need the outage to detect the problem of maintenance, be applicable to non-high-power quick-witted case, convenient and practical.
Description
Technical Field
The utility model relates to an embedded computer technology field specifically is an embedded computer passive heat conduction machine case.
Background
An embedded computer is commonly used for intelligent transportation and industrial control, a fan is generally adopted for active heat conduction and heat dissipation of the existing embedded computer, the fan is generally installed on an upper cover or a side wall of a case, and when the embedded computer is detected, a power supply of the case needs to be closed for detection, so that the intelligent transportation and the industrial control are stopped.
SUMMERY OF THE UTILITY MODEL
This section is for the purpose of summarizing some aspects of embodiments of the invention and to briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this section and in the abstract of the specification and the title of the application to avoid obscuring the purpose of this section, the abstract of the specification and the title of the application, and such simplifications or omissions are not intended to limit the scope of the invention.
In view of the problems presented above, the present invention has been developed.
For solving the technical problem, according to the utility model discloses an aspect, the utility model provides a following technical scheme:
a passive heat conduction chassis of an embedded computer comprises a chassis body and a detachable chassis cover arranged on the chassis body, wherein the bottom wall of the chassis body is inwards sunken and is in a through hole shape, a heat conduction device is arranged in the through hole, and the heat conduction device comprises a heat dissipation block, fins, a first water cooling tube, a second water cooling tube, a water tank and a water-stop film; the quick fixed connection of heat dissipation is on the lateral wall of through-hole, a plurality of fins of fixedly connected with on the quick lower lateral wall of heat dissipation, the fin all adopts the copper alloy to make with the heat dissipation soon, a water cooling pipeline and No. two water cooling pipelines have been arranged between the fin, No. one water cooling pipeline's both ends are link up respectively on two water tanks, No. two water cooling pipeline's both ends are link up respectively on two water tanks, water tank fixed mounting is on the interior diapire of quick-witted case box, and the inside of water tank is provided with the water barrier film, the water barrier film has elasticity, and the water barrier film is No. one sump and No. two sumps with the internal partitioning of water tank, No. one water cooling pipeline's both ends all communicate with a sump, No. two water cooling pipeline's both ends all communicate with No. two sumps, and no.
Preferably, the first water-cooling tube is of an annular structure, the annular end of the first water-cooling tube is inserted into the fin, the second water-cooling tube is of an annular structure, the annular section of the second water-cooling tube is inserted into the fin, the outer diameter of the annular section of the second water-cooling tube is smaller than the inner diameter of the annular section of the first water-cooling tube, and the second water-cooling tube penetrates through the fin.
Preferably, the water tank is filled with ethanol.
Preferably, the first water-cooling pipe, the second water-cooling pipe and the water tank are all made of copper alloy; the first water-cooled tube, the second water-cooled tube and the water tank have the heat dissipation function, and the heat dissipation efficiency is improved.
Preferably, the joints of the first water-cooling tube, the second water-cooling tube and the fins are coated with heat-conducting silicone grease, and the coating thickness of the heat-conducting silicone grease is between 0.1 and 0.3 mm; the heat conduction efficiency among the first water-cooled tube, the second water-cooled tube and the fins is improved, and further better heat dissipation is provided.
The working principle is as follows: at first install the mainboard laminating heat dissipation soon, the heat that the heat dissipation produced the mainboard with the fin absorbs fast and gives off, heat on the fin can be absorbed to water-cooling tube and No. two water-cooling tubes simultaneously, because be filled with the air in No. two water-cooling tubes, because the coefficient of thermal expansion of air and alcohol is different, when being heated, the pressure in water-cooling tube and No. two water-cooling tubes is different, make the alcohol pressure in the water tank change, the water-stop film can take place deformation this moment, thereby drive the alcohol in water-cooling tube and No. two water-cooling tubes and take place to remove, improve endothermic effect, the normal efficient work of mainboard in the chassis box has been guaranteed.
Compared with the prior art: an embedded passive heat conduction machine case of computer, set up radiating block, fin, water-cooled tube, No. two water-cooled tubes and water tank through the bottom at quick-witted case, realized the passive heat conduction heat dissipation of efficient, solved the tradition and used fan initiative heat dissipation, need the outage to detect the problem of maintenance, be applicable to the high-power quick-witted case of non-, convenient and practical.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the present invention will be described in detail below with reference to the accompanying drawings and detailed embodiments, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive labor. Wherein:
fig. 1 is a schematic structural view of the present invention;
FIG. 2 is a side view of the first and second water cooling tubes of the present invention;
in the figure: the heat dissipation device comprises a case body 1, a case cover 2, a heat conduction device 3, a heat dissipation block 31, fins 32, a first water cooling pipe 33, a second water cooling pipe 34, a water tank 35, a first water sump 351, a second water sump 352 and a water separation film 36.
Detailed Description
In order to make the above objects, features and advantages of the present invention more comprehensible, embodiments of the present invention are described in detail below with reference to the accompanying drawings.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, but the present invention may be implemented in other ways than those specifically described herein, and one skilled in the art may similarly generalize the present invention without departing from the spirit of the present invention, and therefore the present invention is not limited to the specific embodiments disclosed below.
Next, the present invention will be described in detail with reference to fig. 1 to 2, and in the detailed description of the embodiments of the present invention, for convenience of explanation, the cross-sectional view showing the structure of the device will not be enlarged partially according to the general scale, and the schematic diagram is only an example, which should not limit the scope of the present invention. In addition, the three-dimensional dimensions of length, width and depth should be included in the actual fabrication.
The utility model provides an embedded passive heat conduction case of computer, including case box 1 and detachable case lid 2 installed on case box 1, the bottom wall of case box 1 is inwards sunken, is the through-hole form, is provided with heat conduction device 3 in this through-hole, heat conduction device 3 includes heat dissipation fast 31, fin 32, water-cooling tube 33, water-cooling tube 34, water tank 35 and water-stop membrane 36; the radiating block 31 is fixedly connected on the side wall of the through hole, the lower side wall of the radiating block 31 is fixedly connected with a plurality of fins 32, the fins 32 and the radiating block 31 are both made of copper alloy, a first water-cooling pipe 33 and a second water-cooling pipe 34 are arranged between the fins 32, two ends of the first water-cooling pipe 33 are respectively connected on the two water tanks 35 in a penetrating way, two ends of the second water-cooling pipe 34 are respectively connected on the two water tanks 35 in a penetrating way, the water tank 35 is fixedly arranged on the inner bottom wall of the case body 1, a water-stop film 36 is arranged inside the water tank 35, the water separation film 36 has elasticity, the water separation film 36 separates the inside of the water tank 35 into a first water chamber 351 and a second water chamber 352, both ends of the first water-cooling pipe 33 are communicated with the first water bin 351, both ends of the second water-cooling pipe 34 are communicated with the second water bin 352, and air is filled in the second water-cooling pipe 34.
As an embodiment of the utility model, No. one water-cooled tube 33 is the annular structure, and the ring end of No. one water-cooled tube 33 is pegged graft on fin 32, just No. two water-cooled tubes 34 are the annular structure, and No. two water-cooled tubes 34's ring section is pegged graft on fin 32, and No. two water-cooled tubes 34's ring section's external diameter is less than the internal diameter of a water-cooled tube 33's ring section, and No. two water-cooled tubes 34 run through the setting on fin 32.
As an embodiment of the present invention, the water tank 35 is filled with ethanol.
As an embodiment of the present invention, the first water-cooling tube 33, the second water-cooling tube 34 and the water tank 35 are made of copper alloy; the first water-cooling pipe 33, the second water-cooling pipe 34 and the water tank 35 have the heat dissipation function, and the heat dissipation efficiency is improved.
As an embodiment of the present invention, the joints of the first water-cooled tube 33, the second water-cooled tube 34 and the fins 32 are coated with heat-conducting silicone grease, and the coating thickness of the heat-conducting silicone grease is between 0.1 and 0.3 mm; the heat conduction efficiency among the first water-cooling tube 33, the second water-cooling tube 34 and the fins 32 is improved, and further better heat dissipation is provided.
The working principle is as follows: install the fast 31 of mainboard laminating heat dissipation at first, 31 and fin 32 absorb the heat that the mainboard produced and give off fast, No. two water-cooled tubes 33 and 34 can absorb the heat on fin 32 simultaneously, owing to be filled with air in No. two water-cooled tubes 34, because the coefficient of thermal expansion of air and alcohol is different, when being heated, pressure in No. one water-cooled tube 33 and No. two water-cooled tubes 34 is different, make the alcohol pressure in the water tank 35 change, deformation can take place for water-stop film 36 this moment, thereby drive the alcohol in No. one water-cooled tube 33 and No. two water-cooled tubes 34 and take place to remove, improve endothermic effect, the normal efficient work of mainboard in the machine case box 1 has been guaranteed.
While the invention has been described above with reference to an embodiment, various modifications may be made and equivalents may be substituted for elements thereof without departing from the scope of the invention. In particular, as long as there is no structural conflict, the various features of the disclosed embodiments of the present invention can be used in any combination with each other, and the non-exhaustive description of these combinations in this specification is merely for the sake of brevity and resource conservation. Therefore, it is intended that the invention not be limited to the particular embodiments disclosed, but that the invention will include all embodiments falling within the scope of the appended claims.
Claims (5)
1. The utility model provides a passive heat conduction machine case of embedded computer, includes quick-witted case box (1) and installs detachable case lid (2) on quick-witted case box (1), its characterized in that: the bottom wall of the case body (1) is inwards sunken to be in a through hole shape, a heat conduction device (3) is arranged in the through hole, and the heat conduction device (3) comprises a heat dissipation block (31), fins (32), a first water cooling pipe (33), a second water cooling pipe (34), a water tank (35) and a water-stop film (36); the heat dissipation block (31) is fixedly connected to the side wall of the through hole, a plurality of fins (32) are fixedly connected to the lower side wall of the heat dissipation block (31), the fins (32) and the heat dissipation block (31) are made of copper alloy, a first water cooling pipe (33) way and a second water cooling pipe (34) way are arranged between the fins (32), two ends of the first water cooling pipe (33) way are respectively connected to the two water tanks (35) in a penetrating manner, two ends of the second water cooling pipe (34) way are respectively connected to the two water tanks (35) in a penetrating manner, the water tanks (35) are fixedly installed on the inner bottom wall of the case body (1), water separation membranes (36) are arranged inside the water tanks (35), the water separation membranes (36) have elasticity, the inside of the water tanks (35) are divided into a first water sump (351) and a second water sump (352), two ends of the first water cooling pipe (33) way are respectively communicated with the first water sump (351), and two ends of the second water cooling pipe (34) are communicated with a second water sump (352).
2. The passive heat-conducting case of an embedded computer according to claim 1, wherein: a water-cooling tube (33) is of an annular structure, the ring end of the water-cooling tube (33) is inserted into the fin (32), a second water-cooling tube (34) is of an annular structure, the ring section of the second water-cooling tube (34) is inserted into the fin (32), the outer diameter of the ring section of the second water-cooling tube (34) is smaller than the inner diameter of the ring section of the first water-cooling tube (33), and the second water-cooling tube (34) penetrates through the fin (32).
3. The passive heat-conducting case of an embedded computer according to claim 1, wherein: and the water tank (35) is filled with ethanol.
4. The passive heat-conducting case of an embedded computer according to claim 1, wherein: the first water-cooling pipe (33), the second water-cooling pipe (34) and the water tank (35) are all made of copper alloy.
5. The passive heat-conducting case of an embedded computer according to claim 2, wherein: the connection parts of the first water-cooling tube (33), the second water-cooling tube (34) and the fins (32) are coated with heat-conducting silicone grease, and the coating thickness of the heat-conducting silicone grease is 0.1-0.3 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920684948.1U CN209928328U (en) | 2019-05-14 | 2019-05-14 | Embedded passive heat conduction case of computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920684948.1U CN209928328U (en) | 2019-05-14 | 2019-05-14 | Embedded passive heat conduction case of computer |
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| Publication Number | Publication Date |
|---|---|
| CN209928328U true CN209928328U (en) | 2020-01-10 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920684948.1U Expired - Fee Related CN209928328U (en) | 2019-05-14 | 2019-05-14 | Embedded passive heat conduction case of computer |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111240449A (en) * | 2020-02-25 | 2020-06-05 | 浙江广厦建设职业技术学院 | Portable computer heat dissipation module and computer heat dissipation device |
| CN111541164A (en) * | 2020-05-07 | 2020-08-14 | 杭州涸鲋科技有限公司 | Block terminal based on graphite alkene destatics self-starting radiating effect |
-
2019
- 2019-05-14 CN CN201920684948.1U patent/CN209928328U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111240449A (en) * | 2020-02-25 | 2020-06-05 | 浙江广厦建设职业技术学院 | Portable computer heat dissipation module and computer heat dissipation device |
| CN111541164A (en) * | 2020-05-07 | 2020-08-14 | 杭州涸鲋科技有限公司 | Block terminal based on graphite alkene destatics self-starting radiating effect |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200110 Termination date: 20200514 |
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| CF01 | Termination of patent right due to non-payment of annual fee |