CN209920332U

CN209920332U - Production mould of GIS stress cone

Info

Publication number: CN209920332U
Application number: CN201920582825.7U
Authority: CN
Inventors: 鲁佳乐; 杨超群; 狄友文; 钱伟东; 程玉燕; 郭德生
Original assignee: Kenaite And Polytron Technologies Inc
Current assignee: Kenaite And Polytron Technologies Inc
Priority date: 2019-04-26
Filing date: 2019-04-26
Publication date: 2020-01-10
Anticipated expiration: 2029-04-26

Abstract

The utility model provides a production mould of GIS stress cone, including the last mould that connects, the lower mould, go up the mould, set up the mould cavity in the lower mould, the plug runs through mould cavity center and extends to last mould top and lower mould bottom, the mould cavity of going up the mould embeds there is the semiconductor, semiconductor upper portion is the cylindricality, the card is between the inner wall and the plug of mould cavity, the semiconductor lower part is the horn type, its outside laminating is on the inner wall of mould cavity, the port is tangent with the plug on the inboard loudspeaker, the tail end of semiconductor stretches into in the mould cavity of lower mould and leaves the clearance with the inner wall of mould cavity, its characterized in that: the upper die is internally provided with a 7-shaped exhaust pipe, a horizontal pipe of the exhaust pipe is higher than the upper port of the inner horn of the semiconductor tangent to the core rod, the top end face of the lower die is provided with a circle of flash tank, the flash tank is communicated with the cavity of the die through a plurality of exhaust grooves, and the lower end of the exhaust pipe in the upper die is communicated with the flash tank. The utility model discloses make the sizing material can not run off because of gravity before the shaping, greatly improved the product percent of pass.

Description

Production mould of GIS stress cone

Technical Field

The utility model belongs to the cable accessories field, concretely relates to production mould of GIS stress cone.

Background

The stress cone is a key component in the GIS terminal of various cables in the prior art, and plays a role in the uniformity of an electric field at the cut-off position of a cable insulation shielding layer. Such stress cones are generally composed of an upper part and a lower part: the upper part is formed by a semi-conductive material through a die in advance, and the lower part is formed by an insulating material through a GIS stress cone die.

The conventional GIS stress cone mold structure is as follows: comprises an upper die and a lower die which are matched and connected, wherein the upper die and the lower die are internally provided with a die cavity, a core rod penetrates through the center of the die cavity and extends to the top of the upper die and the bottom of the lower die, a semiconductor is arranged in the die cavity of the upper die, the upper part of the semiconductor is cylindrical and is clamped between the inner wall of the die cavity and the core rod, the lower part of the semiconductor is horn-shaped, the outer side of the core rod is attached to the inner wall of the mold cavity, the upper port of the horn at the inner side is tangent with the core rod, the tail end of the semiconductor extends into the mold cavity of the lower mold and a gap is reserved between the tail end of the semiconductor and the inner wall of the mold cavity, the top end surface of the lower die is provided with an air outlet communicated with the die cavity, and due to the flowable characteristic of the liquid silicon rubber material, in the conventional die forming operation process, a small part of rubber can overflow from a unique exhaust port when careless, so that the upper part of a product is short of the rubber, the fatal defect of the product is formed, and the rate of certified products of the product is less than 20%.

Disclosure of Invention

Not enough to above-mentioned prior art, the utility model aims at providing a production mould of GIS stress cone makes the sizing material can not run off because of gravity before the shaping, has greatly improved the product percent of pass.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a production mould of GIS stress cone, including the last mould that connects, the lower mould, go up the mould, set up the mould cavity in the lower mould, the plug runs through mould cavity center and extends to last mould top and lower mould bottom, the mould cavity of going up the mould embeds there is the semiconductor, semiconductor upper portion is the cylindricality, the card is between the inner wall and the plug of mould cavity, the semiconductor lower part is the horn type, its outside laminating is on the inner wall of mould cavity, the port is tangent with the plug on the inboard loudspeaker, the tail end of semiconductor stretches into in the mould cavity of lower mould and leaves the clearance with the inner wall of mould cavity, its characterized in that: the mould is characterized in that the upper mould is internally provided with a 7-shaped exhaust pipe, the horizontal pipe of the exhaust pipe is higher than the upper port of the inner horn of the semiconductor tangent to the core rod, the top end face of the lower mould is provided with a circle of flash tank, the flash tank is communicated with the cavity of the mould through a plurality of exhaust grooves, and the lower end of the exhaust pipe in the upper mould is communicated with the flash tank. The horizontal pipe of the exhaust pipe is higher than the upper port of the inner horn of the semiconductor tangent to the core rod, and unvulcanized (i.e. cured) rubber in the die cavity cannot flow out of the exhaust pipe according to the hydraulic principle.

Furthermore, the flash groove is a semicircular groove or a rectangular groove, and can also be a groove with other shapes.

Furthermore, the number of the exhaust grooves is 6-12, and the exhaust grooves are uniformly distributed.

Compared with the prior art, the utility model discloses following beneficial effect has: the horizontal pipe of the exhaust pipe is higher than the upper port of the inner horn of the semiconductor tangent to the core rod, and unvulcanized (i.e. cured) rubber materials in the die cavity can not flow out of the die from the exhaust pipe according to the hydraulic principle, so that the defect of rubber shortage of products is overcome, and the product percent of pass is greatly improved.

Drawings

Fig. 1 is a schematic structural view of the present invention;

FIG. 2 is a top view of the lower die;

FIG. 3 is a schematic structural diagram of a conventional mold in the prior art;

wherein: 1. an upper die; 2. a lower die; 3. a core rod; 4. a semiconductor; 5. a mold cavity; 6. an exhaust pipe; 7. a flash tank; 8. an exhaust groove.

Detailed Description

In order to make the technical problem, technical solution and advantageous effects to be solved by the present invention more clearly understood, the following description is given in conjunction with the accompanying drawings and embodiments to illustrate the present invention in further detail. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the invention.

Example 1:

as shown in fig. 1 and 2, a GIS stress cone production mold comprises an upper mold 1 and a lower mold 2 which are matched and connected, a mold cavity 5 is arranged in the upper mold 1 and the lower mold 2, a core rod 3 penetrates through the center of the mold cavity 5 and extends to the top of the upper mold 1 and the bottom of the lower mold 2, a semiconductor 4 is arranged in the mold cavity 5 of the upper mold 1, the upper part of the semiconductor 4 is columnar and is clamped between the inner wall of the mold cavity 5 and the core rod 3, the lower part of the semiconductor 4 is horn-shaped, the outer side of the semiconductor 4 is attached to the inner wall of the mold cavity 5, the upper port of the inner horn is tangent to the core rod 3, the tail end of the semiconductor 4 extends into the mold cavity 5 of the lower mold 2 and has a gap with the inner wall of the mold cavity 5, a 7-shaped exhaust pipe 6 is arranged in the upper mold 1, the horizontal pipe of the exhaust pipe 6 is higher than, the flash groove 7 is communicated with the die cavity 5 through a plurality of exhaust grooves 8, and the lower end of the exhaust pipe 6 in the upper die is communicated with the flash groove 7. The flash tank 7 is a semicircular groove, and the number of the exhaust grooves 8 is 6, and the flash tanks are uniformly distributed.

The horizontal pipe of the exhaust pipe 6 is higher than the upper port of the inner horn of the semiconductor 4 tangent to the core rod 3, and unvulcanized (i.e. cured) rubber materials in the die cavity can not flow out of the die from the exhaust pipe 6 according to a hydraulic principle, so that the defect of rubber shortage of products is overcome.

The present invention is not limited to the above embodiments, and various changes can be made by those skilled in the art, but any changes equivalent or similar to the present invention are intended to be covered by the scope of the claims.

Claims

1. The utility model provides a production mould of GIS stress cone, including the last mould that connects, the lower mould, go up the mould, set up the mould cavity in the lower mould, the plug runs through mould cavity center and extends to last mould top and lower mould bottom, the mould cavity of going up the mould embeds there is the semiconductor, semiconductor upper portion is the cylindricality, the card is between the inner wall and the plug of mould cavity, the semiconductor lower part is the horn type, its outside laminating is on the inner wall of mould cavity, the port is tangent with the plug on the inboard loudspeaker, the tail end of semiconductor stretches into in the mould cavity of lower mould and leaves the clearance with the inner wall of mould cavity, its characterized in that: the mould is characterized in that the upper mould is internally provided with a 7-shaped exhaust pipe, the horizontal pipe of the exhaust pipe is higher than the upper port of the inner horn of the semiconductor tangent to the core rod, the top end face of the lower mould is provided with a circle of flash tank, the flash tank is communicated with the cavity of the mould through a plurality of exhaust grooves, and the lower end of the exhaust pipe in the upper mould is communicated with the flash tank.

2. The mold for producing the GIS stress cone according to claim 1, wherein: the flash tank is a semicircular groove or a rectangular groove.

3. The mold for producing the GIS stress cone according to claim 1, wherein: the number of the exhaust grooves is 6-12, and the exhaust grooves are uniformly distributed.