CN209914198U - DIY electronic circuit - Google Patents
DIY electronic circuit Download PDFInfo
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- CN209914198U CN209914198U CN201920410870.4U CN201920410870U CN209914198U CN 209914198 U CN209914198 U CN 209914198U CN 201920410870 U CN201920410870 U CN 201920410870U CN 209914198 U CN209914198 U CN 209914198U
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Abstract
The utility model provides a DIY electronic circuit relates to electronic circuit technical field. The utility model provides a DIY electronic circuit includes: the packaging structure comprises a base material, at least one electronic element, a liquid metal circuit, a power supply and a packaging film, wherein the base material is provided with a plurality of through holes corresponding to pins of the electronic element; the electronic element is positioned on the first surface of the substrate, and the pins of the electronic element pass through the through holes and extend to the second surface of the substrate; the liquid metal circuit comprises a first liquid metal circuit positioned on the second surface of the substrate, the power supply is positioned on the second surface of the substrate, the first liquid metal circuit is connected with the power supply and pins of the electronic element, and the power supply, the liquid metal circuit and the electronic element form a closed loop; the packaging film is positioned on the second surface of the substrate and covers the power supply, the liquid metal circuit and the pins of the electronic element. The technical scheme of the utility model can supply the user to make DIY electronic circuit simply, satisfy the demand that the user made to electronic circuit's DIY.
Description
Technical Field
The utility model relates to an electronic circuit technical field especially relates to a DIY electronic circuit.
Background
With the continuous progress of science and technology, the personalized requirements of users on electronic products are stronger and stronger, and strong requirements are put forward on DIY production of electronic circuits. In addition, with the development of education, many parents desire that children design and manufacture electronic circuits from small, and also have strong demands for DIY manufacturing of electronic circuits.
The traditional DIY electronic circuit manufacturing needs tools such as circuit boards, electronic elements, electric soldering irons, welding fluxes and the like, and has the disadvantages of complex manufacturing process, time consumption and environmental pollution. That is, the electronic circuit product can be obtained only through the professional steps, so that the electronic circuit manufacturing is difficult to be applied to non-professional users, and is not favorable for satisfying the user's DIY requirement for the electronic circuit.
SUMMERY OF THE UTILITY MODEL
The utility model provides a DIY electronic circuit can supply the user to make DIY electronic circuit simply, satisfies the demand that the user made to electronic circuit's DIY.
The utility model provides a DIY electronic circuit adopts following technical scheme:
the DIY electronic circuit comprises: a substrate, at least one electronic component, a liquid metal line, a power supply, and an encapsulation film, wherein,
the substrate is provided with a first surface and a second surface which are oppositely arranged, and the substrate is provided with a plurality of through holes corresponding to pins of the electronic element;
the electronic element is positioned on the first surface of the substrate, and the pins of the electronic element extend to the second surface of the substrate through the through holes;
the liquid metal circuit comprises a first liquid metal circuit positioned on the second surface of the substrate, the power supply is positioned on the second surface of the substrate, the first liquid metal circuit is connected with the power supply and pins of the electronic element, and the power supply, the liquid metal circuit and the electronic element form a closed loop;
the packaging film is positioned on the second surface of the substrate and at least covers the first liquid metal circuit and the pins of the electronic element.
Optionally, the pin of the electronic component includes a bent portion located on the second surface of the substrate, and the first liquid metal line is connected to the bent portion.
Furthermore, the connection position of the bending part and the first liquid metal circuit is covered with conductive adhesive.
Optionally, a liquid metal is filled between the inner wall of the through hole and the pin of the electronic component.
Optionally, the DIY electronic circuit further includes a decoration layer on the first side of the substrate, and the electronic element is located on a side of the decoration layer away from the substrate.
Further, the bottom of the electronic element is adhered to the decorative layer through glue.
Optionally, the DIY electronic circuit further includes a power base and two connecting members, the power base is fixed to the second surface of the substrate, the power is fixed to the power base, one of the connecting members is connected to a positive electrode of the power, the other connecting member is connected to a negative electrode of the power, and the first liquid metal line is correspondingly connected to the two connecting members.
Optionally, the packaging film is a transparent adhesive tape.
Optionally, the substrate is a plastic sheet, a projection film, coated paper, cardboard, waxed paper, high density sponge, or a foam board.
Optionally, the electronic component includes one or more of a chip, a light emitting diode, a buzzer, a speaker, a capacitor, a resistor, a switch, and a sensor.
Optionally, the liquid metal lines comprise only the first liquid metal lines.
Optionally, the liquid metal line further includes a second liquid metal line, the second liquid metal line is located on the first surface of the base material, a via hole is formed in the base material, a liquid metal connecting portion is filled in the via hole, one end of the liquid metal connecting portion is connected with the first liquid metal line, and the other end of the liquid metal connecting portion is connected with the second liquid metal line.
The utility model provides a have as above DIY electronic circuit of structure, what adopt among this DIY electronic circuit is liquid metal circuit, liquid metal circuit is made by the lower liquid metal of melting point, liquid metal circuit's preparation simple process, and the connected mode between electronic component and the liquid metal circuit is simple and connection effect good, need not to use the electric iron to carry out high temperature welding, consequently, make this DIY electronic circuit's manufacturing method simple, the user can make DIY electronic circuit simply, satisfy the demand of user to electronic circuit's DIY preparation.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive labor.
Fig. 1 is a top view of a DIY electronic circuit according to an embodiment of the present invention;
fig. 2 is a bottom view of a DIY electronic circuit according to an embodiment of the present invention;
fig. 3 is a schematic cross-sectional view one along the AA' direction in fig. 1 according to an embodiment of the present invention;
fig. 4 is a partial bottom view of a liquid metal circuit according to an embodiment of the present invention;
fig. 5 is a partial top view of a liquid metal line provided by an embodiment of the present invention;
fig. 6 is a schematic view of fig. 4 along the direction BB' according to an embodiment of the present invention;
fig. 7 is a schematic cross-sectional view along the AA' direction of fig. 1 according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
It should be noted that, in the present invention, the technical features may be combined with each other without conflict.
The embodiment of the utility model provides a DIY electronic circuit, specifically, as shown in FIG. 1, FIG. 2 and FIG. 3, FIG. 1 is the utility model provides a DIY electronic circuit's top view, FIG. 2 is the utility model provides a DIY electronic circuit's bottom view, FIG. 3 is the utility model provides a FIG. 1 along AA 'direction's cross-sectional schematic diagram one, this DIY electronic circuit includes: a substrate 1, at least one electronic component 2, a liquid metal line 3, a power supply 4 and an encapsulation film 5, wherein,
the substrate 1 has a first surface and a second surface which are oppositely arranged, and the substrate 1 is provided with a plurality of through holes (occupied by the pins 21 in fig. 3) corresponding to the pins 21 of the electronic element 2;
the electronic component 2 is located on the first surface of the substrate 1, and the pins 21 of the electronic component 2 extend to the second surface of the substrate 1 through the through holes;
the liquid metal circuit 3 comprises a first liquid metal circuit 31 positioned on the first surface of the substrate 1, the power supply 4 is positioned on the second surface of the substrate 1, the first liquid metal circuit 31 is connected with the power supply 4 and the pins 21 of the electronic element 2, and the power supply 4, the liquid metal circuit 3 and the electronic element 2 form a closed loop;
the encapsulation film 5 is located on the second surface of the substrate 1, and covers at least the first liquid metal line 31 and the leads 21 of the electronic component 2.
Note that, in fig. 2, the encapsulation film 5 is not shown in order to clearly show the connection relationship between the first liquid metal lines 31 and the leads 21.
What adopt in this DIY electronic circuit is liquid metal circuit 3, liquid metal circuit 3 is made by the lower liquid metal of melting point, liquid metal circuit 3's preparation simple process, and the connected mode between electronic component 2 and liquid metal circuit 3 (specifically with first liquid metal circuit 31) is simple and connection effect good, need not to use the electric iron to carry out high temperature welding, consequently, make this DIY electronic circuit's manufacturing method simple, the user can make DIY electronic circuit simply, satisfy the demand that the user made the DIY of electronic circuit.
The DIY electronic circuit can be used as a cultural creative product, a makeup product, a personality device, a teaching aid, a monitoring circuit, an alarm circuit and the like, and is a gospel of electronic enthusiasts, digital DIY enthusiasts, popular science educators, fashion pursuits, electronic research and development personnel and the like.
It should be noted that, in the embodiment of the present invention, the liquid metal line 3 may only include the first liquid metal line 31, and may also include other structures.
In one example, as shown in fig. 1, 2 and 3, the liquid metal lines 3 include only the first liquid metal lines 31, i.e., all of the liquid metal lines 3 are located on the second side of the substrate 1, which can make the first side of the substrate 1 more aesthetically pleasing.
In another example, as shown in fig. 4, 5 and 6, fig. 4 is a partial bottom view of a liquid metal circuit provided by an embodiment of the present invention, fig. 5 is a partial top view of a liquid metal circuit provided by an embodiment of the present invention, fig. 6 is a schematic view of fig. 4 along BB' direction provided by an embodiment of the present invention, the liquid metal circuit 3 further includes a second liquid metal circuit 32, the second liquid metal circuit 32 is located on the first surface of the substrate 1, a via hole (occupied by the liquid metal connecting portion 33 in fig. 4) is provided on the substrate 1, the via hole is filled with the liquid metal connecting portion 33, one end of the liquid metal connecting portion 33 is connected with the first liquid metal circuit 31, the other end of the liquid metal connecting portion 33 is connected with the second liquid metal circuit 32, such an arrangement can make the DIY electronic circuit be a double-layer circuit, which can have a more complex structure and function, the application range is wider.
For example, taking the example that the liquid metal line 3 only includes the first liquid metal line 31, the manufacturing process of the DIY electronic circuit includes:
step S1 is to form a plurality of through holes at positions where electronic components 2 are to be mounted on substrate 1.
Aiming at a base material 1 with small hardness, such as a plastic sheet, a projection film, coated paper, a hard board, wax paper, high-density sponge or a foam plastic board and the like, through holes can be made in the base material 1 through objects such as drawing pins, nails, needles, toothpicks and the like, and the method is simple and easy to operate.
Step S2, the electronic component 2 is placed on the first surface of the substrate 1, such that the leads 21 thereof extend to the second surface of the substrate 1 through the corresponding through holes.
Step S3, the first liquid metal lines 31 are formed on the second surface of the base material 1 by printing, spraying, hand painting, brush coating, direct writing, transfer printing, pad printing, etc., so that the first liquid metal lines 31 are connected to the leads 21 of the electronic component 2.
Step S4, placing the power source 4 on the second surface of the substrate 1, and encapsulating at least the liquid metal circuit 4 and the pins 21 of the electronic component 2 by the encapsulation film 5.
In the above steps, only step S2 needs to be executed after step S1, the order of step S3 and other steps is not limited, and the order of step S4 and other steps is not limited, and those skilled in the art can select the steps according to actual needs.
The embodiments of the present invention will be described in detail below with respect to the various structures included in the DIY electronic circuit.
Optionally, the substrate 1 is a plastic sheet, a projection film, a coated paper, a cardboard, a wax paper, a high-density sponge or a foam plastic plate, so that the substrate 1 is easy to obtain and a through hole is easy to be formed on the substrate 1, which helps to further simplify the manufacturing process of the DIY electronic circuit.
Optionally, the pin 21 of the electronic component 2 includes a bent portion located on the second surface of the substrate 1, and the first liquid metal line 31 is connected to the bent portion, so that a larger contact area may be formed between the pin 21 of the electronic component 2 and the first liquid metal line 31, which is beneficial to reducing contact resistance between the pin 21 and the first liquid metal line, and improving connection stability between the pin 21 and the first liquid metal line. The bent portion is formed by bending the pin 21 of the electronic component 2 after passing through the through hole.
Further, the connection position of the bending part and the first liquid metal circuit 31 is covered with the conductive adhesive, and the conductive adhesive not only can make the connection between the bending part and the first liquid metal circuit 31 firmer, but also can be beneficial to improving the electric connection effect between the bending part and the first liquid metal circuit 31.
In addition, the inventors found that in the course of manufacturing the DIY electronic circuit, the size of the through hole on the substrate 1 hardly corresponds to the size of the pin 21 of the electronic component 2, and is mostly larger than the size of the pin 21 of the electronic component 2, so that the pin 21 of the electronic component 2 can pass through the through hole easily. Under this situation, as shown in fig. 7, fig. 7 is a schematic cross-sectional view two along the AA' direction in fig. 1 provided in the embodiment of the present invention, and the embodiment of the present invention selects, and liquid metal (black structure on both sides of the pin 21 in the figure) is filled between the inner wall of the through hole and the pin 21 of the electronic component 2, and the filled liquid metal can effectively improve the stability of the pin 21 of the electronic component 2 in the through hole. The liquid metal with the melting point between room temperature and 60 ℃, such as bismuth indium tin eutectic alloy (the melting point is 58 ℃) is preferred, so that the liquid metal filled in the through hole is easy to melt, and the liquid metal filled in the through hole is solid at room temperature, and has good structural stability.
Optionally, the electronic component 2 includes one or more of a chip, a light emitting diode, a buzzer, a speaker, a capacitor, a resistor, a switch (e.g., a fingerprint touch switch, a voice-operated switch), and a sensor. In a specific example, in the DIY electronic circuit, the power source is a lithium ion battery with a voltage of 3V, which can drive 1-10 (for example, 5) light emitting diodes, and the type of the light emitting diode can be 0805LED or 5050 LED.
Further, the electronic component 2 may further include a control component, and the control component is configured to receive a control signal of an external device or receive an external stimulus generation control signal to control the other electronic components 2, so as to improve interactivity of the DIY electronic circuit. The external device can be a smart phone, a smart home, a computer and the like, and the external stimulus can be sound, light, vibration, touch and the like.
When the DIY electronic circuit includes two or more electronic components 2, the electronic components 2 may be all connected in parallel, may also be all connected in series, may also be both connected in parallel and in series, and is not limited herein as long as each electronic component 2, the power source 4, and the liquid metal line 3 can form a closed loop. In the example shown in fig. 1, 2 and 3, the DIY electronic circuit includes five light emitting diodes, which are connected in parallel with each other.
Optionally, the liquid metal in the liquid metal line 3 is a simple metal with a melting point below 300 degrees celsius, an alloy with a melting point below 300 degrees celsius, or a conductive mixture with the above simple metal and/or alloy as a main component. Preferably, the liquid metal has a melting point near room temperature, so that the liquid metal wiring 3 is easier to fabricate. For example, the liquid metal is a gallium-based liquid metal, such as gallium-indium eutectic alloy (melting point of 15.5 ℃), elemental gallium (melting point of 29.8 ℃), gallium-indium-tin eutectic alloy (melting point of 11 ℃) or gallium-indium-tin-zinc eutectic alloy (melting point of 9 ℃). In addition, the liquid metal can also be a mixture of gallium-based liquid metal and one or more of nickel powder, iron nickel powder and silver-coated copper powder, so that the liquid metal has proper viscosity and conductivity.
The power source 4 in the embodiment of the present invention may be an integral structure, and may also include a plurality of parts connected in series or in parallel, and those skilled in the art may select the parts according to actual needs. Illustratively, the power source 4 is a thin film battery, so that the DIY electronic circuit is small in size.
Optionally, the DIY electronic circuit further includes a power base and two connection members, the power base is fixed on the second surface of the substrate 1, the power source 4 is fixed on the power base, one connection member is connected with the positive electrode of the power source 4, the other connection member is connected with the negative electrode of the power source 4, and the liquid metal circuit 3 is correspondingly connected with the two connection members. The power supply base is arranged to effectively fix the power supply 4 and facilitate replacement of the power supply 4.
The previously mentioned "the encapsulation film 5 covers at least the first liquid metal line 31 and the leads 21 of the electronic component 2" includes various cases: in one example, the encapsulation film 5 only covers the first liquid metal line 31 and the pins 21 of the electronic component 2, in which case the material of the encapsulation film 5 is less and the power source 4 is exposed outside the encapsulation film 5, so that the power source 4 can be easily replaced; in yet another example, the encapsulation film 5 covers the entire second surface of the substrate 1, and covers the first liquid metal line 31, the pins 21 of the electronic component 2, and the power supply 4 therein, in which case the structure of the DIY electronic circuit is more stable. The selection can be made by those skilled in the art according to the actual situation. Illustratively, when the power source 4 is mounted on the power base, the encapsulation film 5 is selected to cover only the first liquid metal line 31 and the pins 21 of the electronic component 2 in the embodiment of the present invention.
Optionally, the packaging film 5 is a transparent adhesive tape, so that the packaging film 5 is not only easy to obtain, but also has a good packaging effect.
Optionally, as shown in fig. 1 and 3, the DIY electronic circuit further includes a decoration layer 6 on the first surface of the substrate 1, the electronic component 2 is located on a side of the decoration layer 6 away from the substrate 1, and the decoration layer 6 can improve the aesthetic appearance of the DIY electronic circuit. In the example shown in fig. 1, the decorative layer 6 comprises two differently colored areas, forming a five-pointed star pattern, with five light-emitting diodes located at the five respective corner positions thereof.
Based on this, the embodiment of the utility model provides a DIY electronic circuit can carry out DIY on article such as current drawing, books, greeting card, decoration drawing and obtain, and above-mentioned each current article can regard as substrate 1 and decorative layer 6 of DIY electronic circuit, and at DIY's in-process, first liquid metal circuit 31, power 4 all are located the reverse side of each current article, not only can not influence the aesthetic measure of current article, still can make it have electronic circuit's function.
Further, as shown in fig. 3 and 7, in order to improve the firmness of the installation of the electronic component 2, the bottom of the electronic component 2 is selected to be adhered to the decoration layer 6 through the fixing glue 7 in the embodiment of the present invention.
The embodiment of the utility model provides a DIY electronic circuit with as above structure, what adopt among this DIY electronic circuit is liquid metal circuit 3, liquid metal circuit 3 is made by the lower liquid metal of melting point, liquid metal circuit 3's preparation simple process, and the connected mode between electronic component 2 and the liquid metal circuit 3 is simple and connection effect good, need not to use the electric iron to carry out high temperature welding, therefore, make this DIY electronic circuit's manufacturing method simple, the user can make DIY electronic circuit simply, satisfy the demand of user to electronic circuit's DIY preparation.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention.
Claims (10)
1. A DIY electronic circuit, comprising: a substrate, at least one electronic component, a liquid metal line, a power supply, and an encapsulation film, wherein,
the substrate is provided with a first surface and a second surface which are oppositely arranged, and the substrate is provided with a plurality of through holes corresponding to the pins of the electronic element;
the electronic element is positioned on the first surface of the substrate, and the pins of the electronic element extend to the second surface of the substrate through the through holes;
the liquid metal circuit comprises a first liquid metal circuit positioned on the second surface of the substrate, the power supply is positioned on the second surface of the substrate, the first liquid metal circuit is connected with the power supply and pins of the electronic element, and the power supply, the liquid metal circuit and the electronic element form a closed loop;
the packaging film is positioned on the second surface of the substrate and at least covers the first liquid metal circuit and the pins of the electronic element.
2. The DIY electronic circuit of claim 1, wherein the leads of the electronic component comprise bent portions on the second side of the substrate, and the first liquid metal traces are connected to the bent portions.
3. The DIY electronic circuit of claim 2, wherein the connection position of the bending part and the first liquid metal line is covered with a conductive adhesive.
4. The DIY electronic circuit of any of claims 1-3, wherein a liquid metal is filled between the inner wall of the through hole and the pin of the electronic component.
5. A DIY electronic circuit as recited in any of claims 1-3, further comprising a decorative layer on the first side of the substrate, wherein the electronic component is located on a side of the decorative layer away from the substrate.
6. The DIY electronic circuit of claim 5, wherein the bottom of the electronic component is attached to the decorative layer by an adhesive.
7. A DIY electronic circuit as claimed in any of claims 1 to 3, wherein the encapsulating film is a transparent adhesive tape.
8. A DIY electronic circuit as recited in any of claims 1-3, wherein the substrate is a plastic sheet, a projection film, coated paper, cardboard, waxed paper, high density sponge, or foam board.
9. A DIY electronic circuit as claimed in any of claims 1 to 3, wherein the electronic components comprise one or more of a chip, a light emitting diode, a buzzer, a horn, a capacitor, a resistor, a switch, and a sensor.
10. The DIY electronic circuit of any of claims 1-3, wherein the liquid metal traces further comprise a second liquid metal trace on the first side of the substrate, the substrate having a via hole formed therein, the via hole filled with a liquid metal connecting portion, one end of the liquid metal connecting portion being connected to the first liquid metal trace, and the other end of the liquid metal connecting portion being connected to the second liquid metal trace.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920410870.4U CN209914198U (en) | 2019-03-28 | 2019-03-28 | DIY electronic circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920410870.4U CN209914198U (en) | 2019-03-28 | 2019-03-28 | DIY electronic circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209914198U true CN209914198U (en) | 2020-01-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920410870.4U Active CN209914198U (en) | 2019-03-28 | 2019-03-28 | DIY electronic circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209914198U (en) |
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2019
- 2019-03-28 CN CN201920410870.4U patent/CN209914198U/en active Active
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