CN209894355U

CN209894355U - Soil detection sensor and soil detector

Info

Publication number: CN209894355U
Application number: CN201920778844.7U
Authority: CN
Inventors: 马维泽
Original assignee: Shenzhen Heertai Home Furnishing Online Network Technology Co Ltd
Current assignee: Shenzhen Shuliantianxia Intelligent Technology Co Ltd
Priority date: 2019-05-27
Filing date: 2019-05-27
Publication date: 2020-01-03
Anticipated expiration: 2029-05-27

Abstract

The utility model discloses a soil detection sensor and soil detection appearance, this soil detection sensor includes: the probe body comprises a detection probe, an installation part and a cover plate, wherein the installation part is connected with the detection probe, the installation part is concavely provided with an installation groove and a counter bore communicated with the installation groove, and the cover plate is detachably covered on a notch of the installation groove; the circuit board is arranged in the mounting groove, and the detection probe is electrically connected with the circuit board; and the thermistor is accommodated in the counter bore and electrically connected with the circuit board. The utility model discloses aim at solving current soil temperature sensor and taking out and insert the in-process in soil and take place wearing and tearing easily, can influence the problem of its use.

Description

Soil detection sensor and soil detector

Technical Field

The utility model relates to a soil detection equipment technical field, in particular to soil detection sensor and applied this soil detection sensor's soil detection appearance.

Background

Soil monitor is the instrument of monitoring soil fertility parameter, and soil monitor mainly gathers a plurality of key parameters in to the soil environment, for example: ambient temperature, ambient humidity, ambient atmospheric pressure, ambient lighting, soil temperature, soil humidity, soil fertility (EC value), soil pH (pH value), and the like. However, the collection of parameters such as temperature, humidity, EC value, pH value and the like of the soil is mainly performed by a sensor for monitoring the soil.

The existing soil temperature sensor is usually required to be inserted into soil during detection so as to detect and acquire the temperature parameter of the soil, and because the thermistor of the sensing part in the soil temperature sensor directly contacts the soil, the soil temperature sensor is easy to wear in the process of being inserted into the soil in a drawing mode, and the use of the soil temperature sensor can be influenced.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a soil detection sensor aims at solving current soil temperature sensor and taking out and insert the in-process in soil and take place wearing and tearing easily, can influence the problem of its use.

In order to achieve the above object, the utility model provides a soil detection sensor includes:

the probe body comprises a detection probe, an installation part and a cover plate, wherein the installation part is connected with the detection probe, the installation part is concavely provided with an installation groove and a counter bore communicated with the installation groove, and the cover plate is detachably covered on a notch of the installation groove;

the circuit board is arranged in the mounting groove, and the detection probe is electrically connected with the circuit board; and

and the thermistor is accommodated in the counter bore and electrically connected with the circuit board.

Further, the lateral wall of mounting groove is formed with heavy platform, when the apron lid fits the notch of mounting groove, the periphery of apron with heavy platform butt.

Further, the apron towards the protruding spacing post that is equipped with in surface of circuit board, the apron has been seted up and has been link up the mounting hole of spacing post, the circuit board corresponds the through-hole has been seted up to the mounting hole, the diapire of mounting groove corresponds the connecting hole has been seted up to the through-hole, the apron lid fits during the notch of mounting groove, spacing post with the spacing butt of circuit board, just the apron passes in proper order through the fastener mounting hole, through-hole and connecting hole with the installation department is connected.

Further, the soil detection sensor is still located including the cover at least one lantern ring of installation department, the lantern ring towards the apron is equipped with the thimble, the apron corresponds the intercommunication is seted up to the thimble the perforating hole of mounting groove, the circuit board corresponds the perforating hole is equipped with the contact, the thimble passes the perforating hole with the contact is connected, so that the lantern ring with the circuit board electricity is connected.

Further, an insulating sleeve is arranged between the sleeve ring and the mounting portion, a communicating hole is formed in the insulating sleeve corresponding to the through hole, and the ejector pins sequentially penetrate through the communicating hole and the through hole to be connected with the contact.

Further, the soil detection sensor comprises two lantern rings, the outer wall of the insulating sleeve is provided with two spacing grooves which are arranged at intervals, the bottom wall of each spacing groove is provided with a communicating hole, and each lantern ring is accommodated and limited in one spacing groove.

Further, the installation part and the detection probe are of an integrally formed structure.

Further, soil detection sensor still includes connecting pipe and terminal, the connecting pipe connect in the installation department is kept away from test probe's one end, the intercommunication has been seted up to the installation department the mounting groove with the wire passing channel of connecting pipe, the terminal wears to locate in the connecting pipe, and passes through the wire passing channel with the circuit board electricity is connected.

Furthermore, the probe main body is made of metal capable of generating oxidation-reduction reaction;

and/or the mounting part and the detection probe are of an integrally formed structure;

and/or one end of the detection probe, which is far away from the mounting part, is arranged in a conical shape;

and/or the counter bore is arranged on the bottom wall of the mounting groove, and heat-conducting glue is arranged between the thermistor and the wall of the counter bore;

and/or the lantern ring is made of stainless steel metal.

The utility model also provides a soil detection appearance, including host computer equipment and the aforesaid soil detection sensor, host computer equipment with the circuit board electricity is connected.

The soil detection sensor of the technical scheme of the utility model is provided with the mounting groove and the counter bore in the mounting part of the probe main body in a concave manner, the circuit board is arranged in the mounting groove, the thermistor is arranged in the counter bore, and the cover plate is detachably covered on the notch of the mounting groove, thereby realizing the protection of the circuit board and the thermistor, effectively avoiding the abrasion of the thermistor, facilitating the disassembly and the maintenance and improving the use convenience; furthermore, the detection probe of the probe main body is electrically connected with the circuit board, so that the detection of one parameter of the soil is realized by using the detection probe; simultaneously, set up the counter bore of intercommunication mounting groove at the installation department of probe main part, install thermistor in the counter bore for thermistor is connected with the circuit board electricity, thereby utilizes the installation department of probe main part and thermistor cooperation to realize the detection to soil temperature parameter, so makes soil detection sensor realize measuring a plurality of parameters of soil simultaneously. Furthermore, the probe main body is designed into a structure formed by the installation part and the detection probe in an integrated mode, and the thermistor and the circuit board are installed on the installation part of the probe main body, so that the structural rigidity of the soil detection sensor is improved, and the soil detection sensor is prevented from being damaged when acquiring soil parameters.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

Fig. 1 is an exploded view of an embodiment of the soil detection sensor of the present invention;

fig. 2 is a schematic cross-sectional view of an embodiment of the soil detection sensor of the present invention;

fig. 3 is a schematic view of a partial structure of an embodiment of the soil detection sensor of the present invention;

fig. 4 is a schematic structural view of an embodiment of the probe body of the present invention;

fig. 5 is a schematic structural diagram of an embodiment of the cover plate of the present invention.

The reference numbers illustrate:

the objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

It should be noted that all the directional indicators (such as upper, lower, left, right, front and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicator is changed accordingly.

In the present application, unless expressly stated or limited otherwise, the terms "connected" and "fixed" are to be construed broadly, e.g., "fixed" may be fixedly connected or detachably connected, or integrally formed; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

Also, the meaning of "and/or" and/or "appearing throughout is meant to encompass three scenarios, exemplified by" A and/or B "including scenario A, or scenario B, or scenarios where both A and B are satisfied. In addition, descriptions in the present application as to "first", "second", and the like are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicit to the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.

The utility model provides a soil detection sensor 100 for a plurality of parameters of acquireing soil, thereby the monitoring to soil fertility parameter is realized.

Referring to fig. 1, fig. 2, fig. 3 and fig. 4, in an embodiment of the present invention, the soil detection sensor 100 includes a probe main body 1, a circuit board 2 and a thermistor 3, wherein the probe main body 1 includes a detection probe 12, an installation portion 11 connected to the detection probe 12, and a cover plate 13, the installation portion 11 is concavely provided with an installation groove 111 and a counter bore 113 communicating with the installation groove 111, and the cover plate 13 is detachably covered on a notch of the installation groove 111; the circuit board 2 is arranged in the mounting groove 111, and the detection probe 12 is electrically connected with the circuit board 2; the thermistor 3 is accommodated in the counterbore 113 and is electrically connected to the circuit board 2.

It will be understood that the probe body 1 is used, on the one hand, for acquiring parameters of the soil and, on the other hand, the probe body 1 serves as a support and mounting. In the present embodiment, the detecting probe 12 of the probe body 1 is electrically connected to the circuit board 2, so that the detecting probe 12 detects a parameter of soil, that is, the detecting probe 12 and the circuit board 2 acquire a parameter of soil, and the mounting portion 11 of the probe body 1 is used for mounting the circuit board 2 and the thermistor 3.

In the embodiment, the mounting portion 11 is concavely provided with the mounting groove 111, and the circuit board 2 is mounted in the mounting groove 111, so that the mounting, fixing and protection of the circuit board 2 are realized; through set up the counter bore 113 of intercommunication mounting groove 111 at installation department 11, install thermistor 3 in counter bore 113, the realization is fixed and the protection to thermistor 3's installation, and simultaneously, thermistor 3 is connected with circuit board 2 electricity, thereby utilize installation department 11 and the thermistor 2 cooperation of probe main part 1 to realize the detection to soil temperature parameter, 1 heat-conduction through the installation department of probe main part 1 gives thermistor 3, also the temperature that thermistor 3 accessible probe main part 1 obtained soil, make thermistor 3 not with the soil contact can obtain the temperature of soil.

Further, utilize apron 13 to cover the notch of mounting groove 111 for apron 13 and mounting groove 111 form inclosed installation cavity, are favorable to protecting thermistor 3 and circuit board 2, and when soil detection sensor 100 inserted soil, effectively avoided the moisture in the soil to cause the damage to thermistor 3 and circuit board 2, also make things convenient for the dismouting and the maintenance of thermistor 3 and circuit board 2 simultaneously, improve soil detection sensor 100's convenience of use. It is understood that the cover plate 13 and the groove wall of the mounting groove 111 may be detachably connected by a snap connection, a plug fit, a screw connection, or a pin connection, which is not limited herein.

In this embodiment, the mounting portion 11 of the probe body 1 and the detecting probe 12 may be formed integrally, that is, the mounting portion 11 and the detecting probe 12 are formed integrally, and the mounting portion 11 and the detecting probe 12 may be made of the same material. In order to enable the soil detection sensor 100 to measure the pH (potential of hydrogen) of the soil, the material of the probe body 1 may be selected from metals capable of generating an oxidation-reduction reaction, so that after the soil detection sensor 100 is inserted into the soil, the oxidation-reduction reaction is generated by the detection probe 12 to cause a current change, the current change is fed back to the circuit board 2, and the pH of the soil is obtained through circuit simulation correction.

Preferably, the probe body 1 is made of zinc (Zn) metal, that is, the mounting portion 11 and the detection probe 12 are made of zinc (Zn) metal. It can be understood that the mounting portion 11 is made of metal, thereby improving the rigidity requirement of the mounting portion 11 and the detection probe 12, and by mounting the circuit board 2 and the thermistor 3 on the mounting portion 11, when the soil detection sensor 100 is inserted into soil to obtain soil parameters, the damage of the soil detection sensor 100 is effectively avoided.

Of course, in other embodiments, the installation portion 11 and the detection probe 12 may be separately arranged, that is, the installation portion 11 and the detection probe 12 may be made of different materials, or the installation portion 11 and the detection probe 12 may be formed by connecting in a detachable connection manner such as a snap connection, a plug-in fit, a screw connection, or a pin connection, or in a connection manner such as an interference fit, and may be specifically set according to an actual use environment, which is not limited herein.

Further, as shown in fig. 1, 2, 3 and 4, in the present embodiment, an end of the detection probe 12 away from the mounting portion 11 is tapered. It can be understood that the detection probe 12 is set to be a conical structure, which is beneficial to reducing the resistance of the soil detection sensor 100 inserted into the soil, and can facilitate the insertion of the soil detection sensor 100 into the soil, which is beneficial to saving the strength of the user.

In order to improve the detection sensitivity of the thermistor 3, in this embodiment, a thermal conductive adhesive is disposed between the thermistor 3 and the hole wall of the counterbore 113, that is, when the thermistor 3 is installed in the counterbore 113, the thermal conductive adhesive is filled in the gap between the hole wall of the counterbore 113 and the thermistor 3, so that the thermal conductive adhesive can rapidly transmit the temperature of the soil obtained by the installation part 11 to the thermistor 3, and the thermistor 3 feeds back the temperature to the circuit board 2. It can be understood that the mounting part 11 of the probe body 1 is made of metal and has good thermal conductivity, and after the mounting part 11 enters the soil, the temperature in the soil can be rapidly transferred to the mounting part 11 and transferred to the thermistor 3 through the heat-conducting glue.

Optionally, the thermistor 3 is detachably mounted in the counterbore 113, that is, the thermistor 3 is mounted in the counterbore 113 in a detachable connection manner such as a snap connection, a plug-in fit, a screw connection or a pin connection, so that the mounting, the maintenance and the replacement of the thermistor 3 are facilitated. Circuit board 2 detachably installs in mounting groove 111, also adopts removable connected mode such as buckle connection, grafting cooperation, screw connection or pin joint to install in mounting groove 111 for circuit board 2, so is provided with and does benefit to assembly, maintenance and the change of circuit board 2.

In order to optimize the structure of the soil detection sensor 100, as shown in fig. 1 and 2, in the present embodiment, the counterbore 113 is formed in the bottom wall of the mounting groove 111, and when the thermistor 3 is mounted in the counterbore 113, the circuit board 2 may be mounted in the mounting groove 111, so that the thermistor 3 may be fixed in the counterbore 113, that is, no additional fixing structure is required to fix the thermistor 3, thereby saving material. The thermistor 3 may be directly electrically connected to the circuit board 2, or may be electrically connected through a wire, which is not limited herein.

The soil detection sensor 100 of the present invention is provided with the mounting groove 111 and the counter bore 113 in the mounting portion 11 of the probe body 1, the circuit board 2 is mounted in the mounting groove 111, the thermistor 3 is mounted in the counter bore 113, and the cover plate 13 is detachably fitted to the notch of the mounting groove 111, so that the protection of the circuit board 2 and the thermistor 3 is realized, the abrasion of the thermistor 3 is effectively avoided, the disassembly and the maintenance are convenient, and the convenience in use is improved; further, the detection probe 12 of the probe body 1 is electrically connected with the circuit board 2, so that the detection of one soil parameter is realized by the detection probe 12; meanwhile, the mounting part 11 of the probe body 1 is provided with a counter bore 113 communicated with the mounting groove 111, and the thermistor 3 is mounted in the counter bore 113, so that the thermistor 3 is electrically connected with the circuit board 2, the mounting part 11 of the probe body 1 is matched with the thermistor 3 to detect the temperature parameters of the soil, and the soil detection sensor 100 can measure a plurality of parameters of the soil simultaneously. Further, the probe body 1 is designed to be a structure formed by integrally forming the mounting part 11 and the detection probe 12, and the thermistor 3 and the circuit board 2 are mounted on the mounting part 11 of the probe body 1, so that the structural rigidity of the soil detection sensor 100 is improved, and the soil detection sensor 100 is prevented from being damaged when acquiring soil parameters.

Further, as shown in fig. 1, 2, 4 and 5, in the present embodiment, a sinking platform 112 is formed on a side wall of the mounting groove 111, and when the cover plate 13 is fitted to the notch of the mounting groove 111, the peripheral edge of the cover plate 13 abuts against the sinking platform 112. It will be appreciated that the provision of the platform 112 facilitates the mounting of the cover 13, while ensuring that the cover 13 does not interfere with the electronic components on the circuit board 2 when mounted.

In this embodiment, the sinking platform 112 is disposed around the side wall of the mounting groove 111, that is, the mounting groove 111 is a stepped groove, the circuit board 2 is mounted at the bottom of the stepped groove, and the cover plate 13 is limited on the sinking platform 112.

Further, as shown in fig. 1, fig. 2, fig. 4 and fig. 5, in this embodiment, a limiting post 131 is convexly disposed on a surface of the cover plate 13 facing the circuit board 2, the cover plate 13 is provided with a mounting hole 132 penetrating through the limiting post 131, the circuit board 2 is provided with a through hole 21 corresponding to the mounting hole 132, the bottom wall of the mounting groove 111 is provided with a connecting hole 114 corresponding to the through hole 21, when the cover plate 13 covers the notch of the mounting groove 111, the limiting post 131 is in limit abutment with the circuit board 2, and the cover plate 13 sequentially penetrates through the mounting hole 132, the through hole 21 and the connecting hole 114 to be connected with the mounting.

It can be understood that the arrangement of the limiting columns 131 is beneficial to the cover plate 13 to perform a limiting installation function on the circuit board 2 by using the limiting columns 131 when the cover plate 13 covers the notches of the installation grooves 111; on the other hand, the limiting column 131 also plays a role in strengthening and positioning, and when the fastener is arranged in the mounting hole 132 in a penetrating manner, the limiting column 131 strengthens the mounting hole 132 of the cover plate 13 and simultaneously realizes positioning of the limiting column 131.

In this embodiment, the circuit board 2 is further provided with a fastening hole spaced from the through hole 21, copper is laid around the fastening hole, and a screw lead penetrates through the fastening hole to electrically connect the circuit board 2 and the detection probe 12. Of course, in other embodiments, copper may be laid around the through hole 21, and the conductive wires may be fixedly connected to the through hole 21 and the connection hole 114 by using a fastener, so as to electrically connect the circuit board 2 and the detection probe 12.

It can be understood that the cover plate 13 is made of an insulating plastic member, and a boss (not labeled) is protruded on the surface of the cover plate 13 opposite to the circuit board 2, and a through hole 133 for the thimble 41 to pass through is formed in the center of the boss. The mounting hole 132 is internally provided with internal threads, the cover plate 13 is placed on the sinking platform 112 in the mounting groove 11, so that the cover plate 13 and the mounting groove 11 are matched to form an independent inner cavity for placing the circuit board 2, the cover plate 13 is fixed by a fastener (such as a screw) penetrating through the mounting hole 132, and the limiting column 131 of the cover plate 13 is pressed on the circuit board 2, thereby further fixing the circuit board 2.

Further, as shown in fig. 1, fig. 2 and fig. 3, in the present embodiment, the soil detection sensor 100 further includes at least one collar 4 sleeved on the mounting portion 11, the collar 4 is provided with a thimble 41 facing the cover plate 13, the cover plate 13 is provided with a through hole 133 corresponding to the thimble 41 and communicating with the mounting groove 111, the circuit board 2 is provided with a contact 22 corresponding to the through hole 133, and the thimble 41 penetrates through the through hole 133 and is connected with the contact 22, so that the collar 4 is electrically connected with the circuit board 2.

In the present embodiment, the mounting portion 11 is configured to be fitted with the ferrule 4, and the ferrule 4 is provided with the thimble 41 on the side facing the cover plate 13, so that the thimble 41 penetrates the cover plate 13 to be connected to the contact 22 of the circuit board 2. When the soil detection sensor 100 is inserted into soil, the soil detection sensor 100 may acquire a parameter of the soil using the collar 4, so that the soil detection sensor 100 enables simultaneous detection of a plurality of soil parameters. It is understood that, in order to enable the soil detection sensor 100 to simultaneously detect a plurality of soil parameters, the soil detection sensor 100 includes a plurality of collars 4, and the plurality of collars 4 are alternately fitted on the mounting portion 11.

In this embodiment, the collar 4 may be a metal collar, that is, the collar 4 has a cylindrical structure with two open ends, so as to be conveniently mounted on the mounting portion 11. An insulating layer is arranged between the lantern ring 4 and the mounting part 11, so that mutual interference of detection signals between the lantern ring 4 and the mounting part 11 is effectively avoided. It can be understood that the outer wall of the mounting portion 11 can be coated with an insulating layer, so that when the collar 4 is sleeved on the mounting portion 11, the collar 4 is insulated from the mounting portion 11. Of course, an insulating structure, such as an insulating sleeve, may be provided between the collar 4 and the mounting portion 11, which is not limited herein. Optionally, the material of the collar 4 is stainless steel.

It is understood that the collar 4 and the thimble 41 may be integrally provided or may be separately provided. In this embodiment, in order to facilitate the installation of the collar 4 and the thimble 41, the collar 4 and the thimble 41 are separately arranged, and the collar 4 and the thimble 41 are detachably connected by a snap connection, a plug-in fit, a screw connection, a pin connection, or the like.

In the present embodiment, when the thimble 41 is assembled in the through hole 133 of the cover plate, an interference fit is adopted, which is beneficial to fixing the thimble 41. In order to avoid damage to the contacts 22 on the circuit board 2 after the thimble 41 is assembled, the end of the thimble 41 remote from the collar 4 is provided with a resilient structure. Meanwhile, in order to enable the thimble 41 to normally conduct the thimble 4 and the circuit board 2, two ends of the thimble 41 are provided with elastic structures, so that an electric connection path between the thimble 4 and the circuit board 2 is realized.

Further, as shown in fig. 1 and 2, in the present embodiment, an insulating sleeve 5 is provided between the collar 4 and the mounting portion 11, a communication hole 51 is opened in the insulating sleeve 5 corresponding to the through hole 133, and the thimble 41 is connected to the contact 22 through the communication hole 51 and the through hole 133 in this order.

It will be appreciated that the provision of the insulating sleeve 5 facilitates the insulation between the collar 4 and the mounting portion 11, thereby effectively preventing the detection signals between the collar 4 and the mounting portion 11 from interfering with each other. The insulating sleeve 5 is formed by injection molding of soft rubber, and optionally, the insulating sleeve 5 is formed by injection molding of TPU. The TPU insulating sleeve 5 has good adhesion and elasticity, can fully play a role in sealing and water proofing, is wear-resistant and mould-resistant, and is more suitable for the soil detection sensor 100 to insert soil.

In this embodiment, installation department 11 sets up mounting groove 111 department is located to insulating cover 5 cover, also insulating cover 5 can realize the secondary seal to mounting groove 111 for the sealed space that apron 13 and mounting groove 111 cooperation formed is further favorable to protecting component spare not to damage in the sealed space, guarantees soil detection sensor 100's uniformity and production efficiency.

Further, as shown in fig. 1, fig. 2 and fig. 3, in the present embodiment, the soil detection sensor 100 includes two collar rings 4, two spacing grooves 52 are formed on the outer wall of the insulating sleeve 5, a through hole 51 is opened on the bottom wall of each spacing groove 52, and each collar ring 4 is accommodated and limited in one spacing groove 52.

It can be understood that the insulating sleeve 5 is a cylindrical structure with two open ends, so that the insulating sleeve can be conveniently installed on the installation part 11 of the probe body 1. In order to mount and position the insulating sleeve 5, as shown in fig. 1, a limit step (not shown) is formed at a connection portion between the detection probe 12 and the mounting portion 11, and when the insulating sleeve 5 is fitted on the mounting portion 11, the insulating sleeve 5 is in limit contact with the limit step. In order to ensure that the soil detection sensor 100 is smoothly inserted into the soil and reduce the resistance to the insertion into the soil, the outer circumferential surface of the detection probe 12 and the outer wall of the insulating sleeve 5 are located on the same circumferential surface, that is, the depth of the limit step is equivalent to the thickness of the insulating sleeve 5.

In this embodiment, the outer wall of the insulating sleeve 5 is formed with spacing grooves 52 arranged at intervals, and when the collar 4 is sleeved on the insulating sleeve 5, the collar is accommodated and limited in the spacing grooves 52, so that on one hand, the insulation between the collar 4 and the mounting portion 11 is facilitated, and meanwhile, the positioning and mounting of the collar 4 are realized; on the other hand, it is advantageous to achieve insulation between two adjacent collars 4. Of course, the collar 4 is insulated from the detection probe 12 by the side wall of the spacing groove 52 of the insulating sleeve 5.

It can be understood that, in order to ensure that the soil detection sensor 100 is inserted into the soil smoothly and reduce the resistance to the insertion into the soil, the outer wall surface of the collar 4, the outer wall of the insulating sleeve 5 and the outer circumferential surface of the detection probe 12 are located on the same circumferential surface, that is, the depth of the limit groove 52 is equivalent to the thickness of the collar 4.

Further, as shown in fig. 1, 2 and 3, in the present embodiment, the soil detection sensor 100 further includes a connection pipe 6, the connection pipe 6 is connected to one end of the mounting portion 11 away from the detection probe 12, and the mounting portion 11 is provided with a wire passage 115 communicating the mounting groove 111 and the connection pipe 6.

In this embodiment, the connecting tube 6 and the mounting portion 11 may be fixedly connected, such as interference fit or welding; the connection tube 6 and the mounting portion 11 may be detachably connected, such as a snap connection, a plug fit, a screw connection, a pin connection, or a threaded connection, which is not limited herein. Preferably, the one end that the test probe 12 was kept away from to installation department 11 is equipped with the external screw thread, and the one end of connecting pipe 6 is equipped with the internal thread, and connecting pipe 6 passes through internal thread and external screw thread spiro union with installation department 11, is favorable to guaranteeing the joint strength between connecting pipe 6 and the installation department 11, also guarantees the leakproofness between connecting pipe 6 and the installation department 11 simultaneously.

It will be appreciated that the provision of the connecting tube 6 facilitates the leading of the connecting wires out of the wire passage 115 and out through the connecting tube 6. The connecting pipe 6 can be selected as an insulating plastic part, so that the contact between the two lantern rings 4 and the soil area can be ensured to be consistent, and the discharge interference between the lantern rings 4 is reduced.

Further, as shown in fig. 1, 2 and 3, in the present embodiment, the soil detection sensor 100 further includes a terminal 7, and the terminal 7 is disposed in the connection pipe 6 and electrically connected to the circuit board 2 through the wire passage 115.

It can be understood that the arrangement of the terminal 7 is beneficial to connecting the lead led out by the connecting pipe 6 to the connecting terminal of the circuit board of the matching device, is beneficial to improving the assembly efficiency of the soil detection sensor 100 and other devices, and simultaneously prevents wrong wiring, which results in inaccurate final measuring results. In this embodiment, the terminal 7 may be inserted into a socket of the host circuit device, and the signal received by the circuit board 2 is corrected by the circuit simulation of the host circuit device, and finally, an accurate soil parameter is output.

The soil detection sensor 100 provided by the utility model can measure various parameters of soil at one time, and reduce the labor force of users; the circuit board 2 is used as a carrier for circuit connection, so that the reliability and the assembly efficiency of the circuit connection are ensured; the thimble 41 of the lantern ring 4 is used for connecting the circuit of the circuit board 2, so that the connection convenience and reliability are ensured; by designing the terminal 7 at the tail part of the soil detection sensor 100, the problem that a defective product or inaccurate inspection is caused due to wrong welding when the terminal is assembled with equipment is prevented; the soil detection sensor 100 adopts a rubber coating injection molding mode, so that the insulation sealing filling is realized, the detection probe 12, the plurality of lantern rings 4 and the thermistor 3 are mutually independent and do not interfere with each other, and the production efficiency of the soil detection sensor 100 is improved.

The utility model discloses a soil detection sensor 100 can realize temperature, pH value, EC value and the humidity detection of soil simultaneously, specifically detect the principle as follows:

the temperature of soil is detected through the thermistor 3, the thermistor 3 is arranged in the metal probe main body 1 with better heat-conducting property, and the heat-conducting glue is used as a filler in a gap between the thermistor 3 and the counter bore 113, so that the heat of the metal probe main body 1 is ensured to be rapidly transmitted to the thermistor 3. As shown in fig. 1, the thermistor 3 is provided with two lead wires and is electrically connected to the circuit board 2 through the two lead wires. Because the metal probe body 1 has good heat conductivity, the temperature of the soil is quickly transmitted to the thermistor 3 through the metal probe body 1, the resistance value of the thermistor 3 changes along with the temperature change, the current changes along with the resistance value, and the temperature value of the soil is obtained after circuit simulation correction.

The detection probe 12 is made of a special metal material (such as metal and zinc capable of generating an oxidation-reduction reaction), the end of the soil detection sensor 100 is in contact with soil, the current generated by the oxidation-reduction reaction of the detection probe 12 is utilized, and the lantern ring 4 is connected with the ground wire, so that the current changes caused by different acid and alkali of the soil, and the pH value of the soil is obtained after circuit simulation correction.

The EC value is measured by taking the lantern ring 4 as a sufficient part of the soil detection sensor 100 and soil, taking one of the two lantern rings 4 as a first electrode and the other one as a second electrode, taking the lantern ring 4 made of a special metal material such as a stainless steel metal material, and testing the resistance between the two lantern rings 4 after the two lantern rings 4 are contacted with the soil and connected to the circuit board 2 because of strong corrosion resistance and stable chemical performance, wherein the two lantern rings 4 are less interfered when being connected and conducted, so that the pressure difference between the two lantern rings 4 is tested, and the EC value of the soil is obtained after circuit simulation correction.

The humidity value measurement is also performed by using the lantern ring 4 as a sufficient part of the soil detection sensor 100 and the soil, and the lantern ring 4 is made of a special metal material, such as a stainless steel metal material, and according to the FDR principle (frequency domain reflection principle), the apparent dielectric constant of the soil is measured by using the electromagnetic pulse principle according to the propagation frequency of electromagnetic waves in a medium, so that the relative water content of the soil is obtained, and finally the soil humidity value is obtained.

The utility model discloses still provide a soil detection appearance, including host computer equipment and the aforesaid soil detection sensor 100. The concrete structure of the soil detection sensor 100 refers to the above embodiments, and since the soil detector adopts all the technical solutions of all the above embodiments, at least all the beneficial effects brought by the technical solutions of the above embodiments are achieved, and no further description is given here.

Wherein the host device is electrically connected to the circuit board 2. It can be understood that the host device is provided with an interface, the terminal 7 of the soil detection sensor 100 can be plugged into the interface of the host device, so that the host device is electrically connected with the circuit board 2, data detected by the detection probe 12, the thermistor 3 and the lantern ring 4 can be fed back to the host device through the circuit board 2, and accurate soil parameters are finally output after the host circuit simulation correction of the host device. Of course, in other embodiments, the terminal 7 may also be connected to an interface of the host device through a wire, and is not limited herein.

The above only is the preferred embodiment of the present invention, not limiting the scope of the present invention, all the equivalent structure changes made by the contents of the specification and the drawings under the inventive concept of the present invention, or the direct/indirect application in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A soil detection sensor, comprising:

2. The soil detection sensor according to claim 1, wherein a counter is formed on a side wall of the mounting groove, and when the cover plate is fitted to the notch of the mounting groove, a peripheral edge of the cover plate abuts against the counter.

3. The soil detection sensor of claim 2, wherein a limiting post is protruded from a surface of the cover plate facing the circuit board, the cover plate is provided with a mounting hole penetrating through the limiting post, the circuit board is provided with a through hole corresponding to the mounting hole, a connecting hole is formed in a bottom wall of the mounting groove corresponding to the through hole, when the cover plate is covered on the notch of the mounting groove, the limiting post is in limit contact with the circuit board, and the cover plate sequentially penetrates through the mounting hole, the through hole and the connecting hole to be connected with the mounting portion through a fastening member.

4. The soil detection sensor of claim 2, further comprising at least one collar disposed on the mounting portion, wherein the collar has a pin facing the cover plate, the cover plate has a through hole corresponding to the pin and communicating with the mounting groove, the circuit board has a contact corresponding to the through hole, and the pin passes through the through hole and is connected to the contact, so that the collar is electrically connected to the circuit board.

5. The soil detection sensor according to claim 4, wherein an insulating sleeve is provided between the collar and the mounting portion, the insulating sleeve has a through hole corresponding to the through hole, and the thimble sequentially passes through the through hole and the through hole to be connected to the contact.

6. The soil detection sensor according to claim 5, wherein the soil detection sensor comprises two collars, the outer wall of the insulating sleeve is formed with two spaced-apart retaining grooves, the bottom wall of each retaining groove is provided with the communication hole, and each collar is received and retained in one of the retaining grooves.

7. The soil detection sensor of any one of claims 1 to 6, wherein the mounting portion and the detection probe are of an integrally formed construction.

8. The soil detection sensor of any one of claims 1 to 6, further comprising a connection pipe and a terminal, wherein the connection pipe is connected to one end of the mounting portion away from the detection probe, the mounting portion is provided with a wire passage for communicating the mounting groove with the connection pipe, and the terminal is disposed in the connection pipe and electrically connected to the circuit board through the wire passage.

9. The soil detection sensor according to claim 5 or 6, wherein the probe body is made of a metal capable of generating an oxidation-reduction reaction;

and/or the lantern ring is made of stainless steel metal.

10. A soil testing apparatus comprising a host device and a soil testing sensor according to any one of claims 1 to 9, the host device being electrically connected to the circuit board.