CN209882437U - Power distributor and heat radiation structure thereof - Google Patents
Power distributor and heat radiation structure thereof Download PDFInfo
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- CN209882437U CN209882437U CN201920152274.0U CN201920152274U CN209882437U CN 209882437 U CN209882437 U CN 209882437U CN 201920152274 U CN201920152274 U CN 201920152274U CN 209882437 U CN209882437 U CN 209882437U
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Abstract
The utility model discloses a power supply distributor and a heat dissipation structure thereof, which comprises a casing and a water channel cover plate; the shell is internally provided with a partition plate, the partition plate divides the interior of the shell into a first accommodating cavity and a second accommodating cavity, a water cooling chamber is arranged in the first accommodating cavity, a water inlet, a water outlet and a flow dividing partition plate are arranged in the water cooling chamber, the flow dividing partition plate divides the interior of the water cooling chamber into a bent water cooling channel, the water inlet and the water outlet are respectively arranged at two ends of the water cooling channel, and a plurality of heat conduction columns are arranged in the water cooling channel at positions corresponding to the water inlet; the water channel cover plate covers the water cooling chamber; the surface of the water channel cover plate, which is back to the water cooling channel, is used for mounting a vehicle-mounted charger, and the surface of the partition plate, which is back to the water cooling channel, is used for mounting a DC/DC converter; this scheme makes rivers to be broken up by the heat conduction post after getting into the water-cooling passageway, has increased the mobility of rivers to strengthen the radiating effect, in order to ensure to dispel the heat simultaneously two kinds of different circuit devices and also can have the radiating quality of preferred.
Description
Technical Field
The utility model relates to a power supply distributor's technical field, in particular to power supply distributor and heat radiation structure thereof.
Background
The power distributor with small size and high power density has high heat dissipation requirement, and the requirement cannot be met only by natural air cooling or fan cooling heat dissipation; for example, the existing power distributor only depends on natural air cooling for heat dissipation, but the size of the equipment structure is overlarge, the weight is increased, and the heat dissipation effect of the heat dissipation mode is poor, so that the condition of uneven heat dissipation is easy to occur; if the fan is adopted for heat dissipation, the noise is huge, the fan has a certain service life, and if the fan is damaged, the temperature rise of the whole machine is increased, and the performance index is reduced.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a power supply distributor and heat radiation structure thereof to solve the not good problem of power supply distributor radiating effect.
In order to solve the technical problem, the utility model provides a power distributor heat radiation structure, which comprises a casing, wherein a partition plate is arranged inside the casing, the partition plate divides the inside of the casing into a first accommodating cavity and a second accommodating cavity, a water cooling chamber is arranged in the first accommodating cavity, a water inlet, a water outlet and a shunting partition plate are arranged in the water cooling chamber, the shunting partition plate divides the inside of the water cooling chamber into a bent water cooling channel, the water inlet and the water outlet are respectively arranged at two ends of the water cooling channel, and a plurality of heat conduction columns are arranged in the water cooling channel at the positions corresponding to the water inlet; and the water channel cover plate covers the water cooling chamber, and the surface of the water channel cover plate, which is back to the water cooling channel, and the surface of the partition plate, which is back to the water cooling channel, are radiating surfaces.
And a heat radiating fin is arranged in the water cooling channel, and the setting track of the heat radiating fin is matched with the setting track of the water cooling channel.
The cooling structure comprises a water cooling channel, a plurality of cooling fins and a plurality of cooling fins, wherein the cooling fins are arranged along the setting track of the water cooling channel to form a shunting line.
Wherein, the shunt lines are at least two.
Wherein, still be equipped with the water diversion post in the water-cooling passageway, the water diversion post is located same shunt canals is adjacent between the radiating fin.
The surface of the water cooling channel, which faces the water channel cover plate, is provided with an auxiliary flow distribution plate, and the auxiliary flow distribution plate corresponds to the distribution track of the flow distribution partition plate in a matching manner.
The surface of the water channel cover plate facing the water cooling channel is provided with auxiliary fins, and the auxiliary fins are matched with and correspond to the arrangement tracks of the radiating fins.
The heat conducting column is arranged between the radiating fin and the water inlet.
Wherein the plurality of heat conduction columns are arranged in at least two linear directions.
In order to solve the technical problem, the utility model also provides a power distributor, including on-vehicle charger, DC/DC converter and foretell power distributor heat radiation structure, on-vehicle charger is located the water route apron is back to the surface of water-cooling passageway, the DC/DC converter is located the division board is back to the surface of water-cooling passageway.
The utility model provides a power distributor and heat radiation structure thereof, because the water course apron closing cap the water-cooling chamber, the surface that the water course apron is back to the water-cooling passageway, and the surface that the partition plate is back to the water-cooling passageway are the cooling surface, and two cooling surfaces can both be used for dispelling the heat to the circuit device, so can realize the simultaneous heat dissipation of two kinds of circuit devices through a water-cooling heat radiation structure, like on-vehicle charger and DC/DC converter; and because the inside of the water-cooling channel is provided with the plurality of heat-conducting columns at the positions corresponding to the water inlets, water flow can be scattered by the heat-conducting columns after entering the water-cooling channel, so that the mobility of the water flow is increased, the heat dissipation effect is enhanced, and the heat dissipation effect of better heat dissipation effect can be realized by simultaneously dissipating heat of two different circuit devices.
Drawings
In order to more clearly illustrate the technical solution of the present invention, the drawings required for the embodiments will be briefly described below, and obviously, the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic top view of a power distributor with a water channel cover plate removed from a heat dissipation structure according to the present invention;
fig. 2 is a schematic view of a structure of a heat dissipation structure of a power distributor according to the present invention;
fig. 3 is a schematic diagram of a water channel cover plate structure in a heat dissipation structure of a power distributor provided by the present invention;
fig. 4 is a schematic side view of a heat dissipation structure of a power distributor according to the present invention.
Detailed Description
The technical solution of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings.
As can be seen from fig. 1, fig. 3 and fig. 4, the heat dissipation structure of the power supply distributor according to the embodiment of the present invention includes a casing 100, a partition plate 101 is disposed inside the casing 100, the partition plate 101 divides the inside of the casing 100 into a first accommodating cavity and a second accommodating cavity (as shown in fig. 4, the first accommodating cavity is disposed above the partition plate 101, and the second accommodating cavity is disposed below the partition plate 101), a water cooling chamber is disposed inside the first accommodating cavity, a water inlet 201, a water outlet 202 and a flow dividing partition plate 203 are disposed in the water cooling chamber, the flow dividing partition plate 203 divides the inside of the water cooling chamber into a curved water cooling channel 204, the water inlet 201 and the water outlet 202 are disposed at two ends of the water cooling channel 204, and a plurality of heat conduction columns 205 are disposed inside the water cooling channel 204 at positions corresponding to the; and the water channel cover plate 300 is used for covering the water cooling chamber, and the surface of the water channel cover plate 300 back to the water cooling channel 204 and the surface of the partition plate 101 back to the water cooling channel 204 are radiating surfaces.
When using, can place two kinds of different circuit device on two cooling surfaces, then rivers will get into to water-cooling channel 204 in through water inlet 201, and flow out from delivery port 202, because water-cooling channel 204 is inside to be equipped with many heat conduction posts 205 in the department of corresponding with water inlet 201, so heat conduction post 205 can break up rivers, with the mobility of this reinforcing rivers, make rivers can suck away the heat fast and take away the heat, guaranteed to dispel the heat simultaneously two kinds of different circuit device and also can have the radiating effect of preferred.
The dividing partition 203 is used for dividing the water cooling channel 204 in the water cooling chamber, and in order to form a longer water cooling channel 204 in the limited space of the water cooling chamber, the water cooling channel 204 can be lengthened by forming a plurality of turning points in the water cooling chamber through the dividing partition 203, as shown in fig. 1, at this time, the dividing partition 203 forms four turning points in the water cooling chamber to fully lengthen the water cooling channel 204, and of course, the specific number of the turning points should be determined by combining the size of the casing 100, that is, the number of the turning points formed by the dividing partition 203 is not limited.
Preferably, in the application process, the heat conduction column 205 absorbs heat from the partition plate 101 and transfers the heat to the water flow of the water cooling channel 204, but the heat conduction column 205 is only arranged at the position corresponding to the water inlet 201, so that the heat dissipation effect of other positions of the water cooling channel 204 is relatively poor, and for this purpose, a related structure needs to be provided to improve the heat dissipation effect of other positions of the water cooling channel 204, as shown in fig. 1, a preferred embodiment may be that a heat dissipation fin 206 is arranged in the water cooling channel 204, and the arrangement track of the heat dissipation fin 206 matches with the arrangement track of the water cooling channel 204.
At this time, the heat dissipation fins 206 also send the heat absorbed by the partition plate 101 to the water flow of the water cooling channel 204, and the setting track of the heat dissipation fins 206 is matched with the setting track of the water cooling channel 204, so that the heat can be taken away from all parts in the water cooling channel 204 in time, and the heat dissipation efficiency is greatly improved.
It should be noted that, at this time, the number of the heat dissipation fins 206 is not limited, the heat dissipation fins 206 may be a continuous integral structure, the extending setting track of which is matched with the setting track of the water cooling channel 204, or the heat dissipation fins 206 may be a plurality of blocks, the plurality of heat dissipation fins 206 are arranged along the setting track of the water cooling channel 204, and the two modes can both achieve the effect of improving the heat dissipation efficiency.
Preferably, the heat dissipation fins 206 may be of a continuous integral structure, and at this time, although the heat dissipation fins 206 may transfer heat to all parts of the water cooling channel 204, the flow of water is limited to a fixed flow direction, so in order to further improve the heat dissipation efficiency, the flow of water may be disturbed again to improve the flow of water, as shown in fig. 1 and fig. 2, and a preferred embodiment may be that the heat dissipation fins 206 are multiple, and multiple heat dissipation fins 206 are arranged along the installation track of the water cooling channel 204 to form a diversion line.
Taking fig. 2 as an example, each of the heat dissipation fins 206A constitutes a first shunt line, and each of the heat dissipation fins 206B constitutes a second shunt line; at this time, it can also be understood that the original heat dissipation fins 206 of a continuous integral structure are broken at a plurality of places, so that a plurality of heat dissipation fins 206 are formed and arranged to form a shunt line, and because a vacant area exists between adjacent heat dissipation fins 206, when water flows through the vacant area, the water flows along the designated direction no longer, so that the water flows are scattered again, the flowability of the water flows is further enhanced, and the heat dissipation efficiency is improved again.
Preferably, the branch lines are provided to break up the water flow to improve the fluidity of the water flow, thereby achieving an improvement in heat dissipation efficiency, so in order to continue the improvement in heat dissipation efficiency, as shown in fig. 1 and 2, a preferred embodiment may be that the branch lines are at least two.
As shown in fig. 1 and fig. 2, the number of the branch lines is two, so that the inside of the water cooling channel 204 is divided into three water flow channels, and compared with the case that only one branch line is arranged to form two water flow channels, the arrangement of two branch lines increases not only the scattering position of water flow, but also more heat transfer area, thereby improving the heat dissipation efficiency again.
Preferably, in order to further improve the heat dissipation efficiency, the scattering effect on the water flow can be enhanced again, as shown in fig. 1, a preferred embodiment may be that a water splitting column 207 is further disposed in the water cooling channel 204, and the water splitting column 207 is disposed between adjacent heat dissipation fins 206 of the same splitting line.
As shown in fig. 1, in the same branch line, an empty region exists between adjacent heat dissipation fins 206 to break up the water flow, and the water diversion column 207 is disposed at a corresponding position of the empty region, so as to enhance the breaking up effect on the water flow, and achieve the secondary improvement of the heat dissipation efficiency; of course, in the same branch line, the water dividing column 207 may be disposed between the adjacent heat dissipating fins 206, or the water dividing column 207 may be disposed between some of the adjacent heat dissipating fins 206, and the arrangement may be selected according to the needs.
Preferably, the waterway cover plate 300 is used for covering the water cooling chamber, so that the waterway cover plate 300 can also radiate heat to the water flow of the water cooling channel 204, and in order to improve the heat transmission efficiency of the waterway cover plate 300, the heat transmission area of the waterway cover plate 300 can be increased, as shown in fig. 1 and 3, a preferred embodiment may be that the surface of the waterway cover plate 300 facing the water cooling channel 204 is provided with an auxiliary flow distribution plate 301, and the auxiliary flow distribution plate 301 is matched and corresponds to the arrangement track of the flow distribution partition plate 101.
After the auxiliary flow distribution plate 301 is additionally arranged, the water channel cover plate 300 can be in contact with water flow not only towards the surface energy of the water cooling channel 204, but also in contact with the water flow through the auxiliary flow distribution plate 301, namely, the heat transfer area is greatly increased, so that heat on the water channel cover plate 300 can be transferred to the water flow more quickly, and the heat dissipation efficiency is practically improved.
Preferably, in order to further increase the heat transfer area of the waterway cover plate 300, as shown in fig. 1 and fig. 3, a preferred embodiment may be that the surface of the waterway cover plate 300 facing the water cooling channel is provided with auxiliary fins 302, and the auxiliary fins 302 are matched with the arrangement tracks of the heat dissipation fins 206.
After adding supplementary fin 302, water course apron 300 not only can be through its surface and supplementary flow distribution plate 301 and rivers contact, can also be through supplementary fin 302 and rivers contact, increased heat transfer area once more promptly to make the heat on the water course apron 300 can be faster transmit to rivers in, improved the radiating efficiency once more.
Preferably, the heat conducting column 205 is used for dissipating water flow and performing heat transfer, and the heat dissipating fins 206 are used for performing water channel separation and heat transfer, so in order to ensure that the heat dissipating fins 206 can perform heat transfer better, it should be ensured that the water flow flowing through the heat dissipating fins 206 has good fluidity, as shown in fig. 1, a preferred embodiment may be that the heat conducting column 205 is disposed between the heat dissipating fins 206 and the water inlet 201.
After adopting this mode, the rivers that flow into water-cooling passageway 204 through water inlet 201 can contact with heat conduction post 205 earlier, so heat conduction post 205 can break up rivers, and the rivers after being broken up just can flow through radiating fin 206, because the rivers after being broken up have the mobility of preferred to make the rivers that flow through radiating fin 206 can be more rapid take away the heat, thereby improved the radiating efficiency.
Preferably, the water flowing into the water cooling channel 204 through the water inlet 201 will contact with the heat conducting pillars 205 first, so that the heat conducting pillars 205 are arranged differently to generate different water flow scattering effects, and in order to achieve better water flow scattering effects, as shown in fig. 1, a preferred embodiment may be that a plurality of the heat conducting pillars 205 are arranged in at least two straight directions.
The arrangement mode can enable the heat conduction columns 205 to be arranged in different linear directions, so that different forms of scattering effects can be generated when water flows pass through the heat conduction columns 205, the water flows are more random, and the condition that the water flow mobility is increased unobvious due to the fact that the water flows are scattered in the same direction is avoided.
It should be noted that the heat conduction columns 205 may be arranged in at least two straight lines, for example, the heat conduction columns 205 may be arranged in two parallel straight lines, the heat conduction columns 205 may be arranged in two connecting lines having only one intersection (e.g., V-shaped, T-shaped, etc.), and the heat conduction columns 205 may be arranged in two staggered straight lines (e.g., X-shaped, cross-shaped, etc.).
Furthermore, applying above-mentioned improvement structure alright obtain power distributor, including on-vehicle charger, DC/DC converter and foretell power distributor heat radiation structure, on-vehicle charger is located water course apron 300 is back to the surface of water-cooling channel 204, the DC/DC converter is located division board 101 is back to the surface of water-cooling channel 204.
At this time, heat generated by the vehicle-mounted charger is sent to water flow of the water cooling channel 204 through the water channel cover plate 300, and heat generated by the DC/DC converter is sent to the water flow of the water cooling channel 204 through the partition plate 101, so that synchronous heat dissipation of the vehicle-mounted charger and the DC/DC converter is realized through one water cooling mechanism, the heat dissipation effect is good, the size of the power supply distributor is smaller, the weight of the power supply distributor is lighter, and the power supply distributor meets continuously improved use requirements of users.
The foregoing is a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of improvements and decorations can be made without departing from the principle of the present invention, and these improvements and decorations are also considered as the protection scope of the present invention.
Claims (10)
1. A heat dissipation structure of a power supply distributor is characterized by comprising,
the heat exchanger comprises a shell, wherein a partition plate is arranged in the shell and divides the interior of the shell into a first accommodating cavity and a second accommodating cavity, a water cooling chamber is arranged in the first accommodating cavity, a water inlet, a water outlet and a flow dividing partition plate are arranged in the water cooling chamber, the flow dividing partition plate divides the interior of the water cooling chamber into a bent water cooling channel, the water inlet and the water outlet are respectively arranged at two ends of the water cooling channel, and a plurality of heat conduction columns are arranged in the water cooling channel at positions corresponding to the water inlet;
and the water channel cover plate covers the water cooling chamber, and the surface of the water channel cover plate, which is back to the water cooling channel, and the surface of the partition plate, which is back to the water cooling channel, are radiating surfaces.
2. The power distributor heat dissipation structure of claim 1, wherein heat dissipation fins are arranged in the water cooling channel, and the arrangement track of the heat dissipation fins is matched with that of the water cooling channel.
3. The power distributor heat dissipation structure of claim 2, wherein the heat dissipation fins are multiple, and the multiple heat dissipation fins are arranged along the setting track of the water cooling channel to form a shunting line.
4. The power distributor heat dissipation structure of claim 3, wherein the number of the shunt lines is at least two.
5. The heat dissipation structure of the power supply distributor according to claim 4, wherein a water diversion column is further arranged in the water cooling channel, and the water diversion column is arranged between the adjacent heat dissipation fins of the same water diversion line.
6. The power distributor heat dissipation structure of claim 2, wherein an auxiliary flow distribution plate is disposed on a surface of the water channel cover plate facing the water cooling channel, and the auxiliary flow distribution plate corresponds to the distribution track of the flow distribution partition plate in a matching manner.
7. The power distributor heat dissipation structure according to claim 6, wherein the surface of the water channel cover plate facing the water cooling channel is provided with auxiliary fins, and the auxiliary fins are matched with and correspond to the arrangement tracks of the heat dissipation fins.
8. The power distributor heat dissipation structure of claim 2, wherein the heat conduction column is disposed between the heat dissipation fin and the water inlet.
9. The power distributor heat dissipation structure of claim 1, wherein the plurality of heat conduction columns are arranged in at least two linear directions.
10. A power distributor, comprising an on-board charger, a DC/DC converter and the heat dissipation structure of the power distributor as claimed in any one of claims 1 to 9, wherein the on-board charger is disposed on a surface of the water channel cover plate facing away from the water cooling channel, and the DC/DC converter is disposed on a surface of the partition plate facing away from the water cooling channel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920152274.0U CN209882437U (en) | 2019-01-29 | 2019-01-29 | Power distributor and heat radiation structure thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920152274.0U CN209882437U (en) | 2019-01-29 | 2019-01-29 | Power distributor and heat radiation structure thereof |
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| Publication Number | Publication Date |
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| CN209882437U true CN209882437U (en) | 2019-12-31 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201920152274.0U Active CN209882437U (en) | 2019-01-29 | 2019-01-29 | Power distributor and heat radiation structure thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111200923A (en) * | 2020-01-13 | 2020-05-26 | 贵州永红航空机械有限责任公司 | Miniature radiator structure for radiating large-scale electronic equipment |
-
2019
- 2019-01-29 CN CN201920152274.0U patent/CN209882437U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111200923A (en) * | 2020-01-13 | 2020-05-26 | 贵州永红航空机械有限责任公司 | Miniature radiator structure for radiating large-scale electronic equipment |
| CN111200923B (en) * | 2020-01-13 | 2022-02-22 | 贵州永红航空机械有限责任公司 | Miniature radiator structure for radiating large-scale electronic equipment |
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