CN209880535U - Reactive ion etching machine and cooling device thereof - Google Patents
Reactive ion etching machine and cooling device thereof Download PDFInfo
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- CN209880535U CN209880535U CN201920971940.3U CN201920971940U CN209880535U CN 209880535 U CN209880535 U CN 209880535U CN 201920971940 U CN201920971940 U CN 201920971940U CN 209880535 U CN209880535 U CN 209880535U
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- cooling plate
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- 238000001816 cooling Methods 0.000 title claims abstract description 115
- 238000001020 plasma etching Methods 0.000 title description 6
- 239000007788 liquid Substances 0.000 claims abstract description 70
- 239000000110 cooling liquid Substances 0.000 claims abstract description 41
- 238000003860 storage Methods 0.000 claims abstract description 24
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 24
- 238000006243 chemical reaction Methods 0.000 claims abstract description 11
- 238000005530 etching Methods 0.000 claims description 9
- 238000012546 transfer Methods 0.000 claims description 6
- 238000012545 processing Methods 0.000 claims description 5
- 239000004020 conductor Substances 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 2
- 239000003112 inhibitor Substances 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 abstract description 4
- 239000000498 cooling water Substances 0.000 abstract description 3
- 238000000992 sputter etching Methods 0.000 abstract description 2
- 239000012809 cooling fluid Substances 0.000 description 14
- 239000002826 coolant Substances 0.000 description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- 230000000903 blocking effect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000012530 fluid Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000004891 communication Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- Drying Of Semiconductors (AREA)
Abstract
A cooling device and a reaction ion etching machine are provided, wherein a cooling cavity is enclosed by a cooling disc and a cooling plate of the cooling device, a liquid inlet and a liquid outlet are arranged on the bottom wall of the cooling cavity, and a flow choking piece and at least one circle of water storage tank are arranged on the bottom wall of the cooling cavity in a protruding mode. The flow resisting piece is positioned between the liquid inlet and the liquid outlet and used for preventing cooling liquid (such as cooling water) from directly flowing from the liquid inlet to the liquid outlet, and the water storage tank surrounds the liquid inlet and the liquid outlet. Under the action of the flow resisting piece, the cooling liquid is forced to enter the water storage tank and the surrounding area to flow, the cooling liquid flows through the whole area of the cooling cavity as far as possible instead of directly flowing from the liquid inlet to the liquid outlet, and the flowing cooling liquid can be uniformly contacted with the cooling plate to carry out heat exchange. The cooling device can uniformly push the cooling liquid to flow so as to prolong the water retention period and reduce the influence of convection on heat dissipation.
Description
Technical Field
The application relates to a reactive ion etching device, in particular to a cooling device applied to a reactive ion etching process.
Background
The reactive ion etcher is an important etching device in the microelectronic process manufacturing technology, and along with the rapid development of the semiconductor manufacturing technology, the reactive ion etcher gradually becomes an indispensable device in related professional laboratories of domestic scientific research units and colleges and universities. The reactive ion etcher used in China at present is imported mainly from foreign countries, although the reactive ion etcher can provide required basic etching performance, the price is high, and because the design of domestic equipment is limited, key etching parameters such as selection ratio, uniformity, etching rate and the like often cannot reach the optimal matching state, the high-order etching performance is difficult to provide.
From a design point of view, the Cooling System (CS) of a reactive ion etcher is one of the leading factors of the performance of the etcher, and influences the cooling performance of an electrode and a silicon wafer, thereby obviously influencing the etching uniformity and the etching rate.
Disclosure of Invention
The application provides a novel cooling device and a reactive ion etching machine adopting the cooling device, so that the cooling efficiency of a counter electrode and a silicon wafer is improved.
An embodiment of the present application provides a cooling device of a reactive ion etcher, comprising:
the cooling disc is provided with a concave part, a liquid inlet and a liquid outlet, and the liquid inlet and the liquid outlet are arranged on the bottom wall of the concave part and used for enabling cooling liquid to enter the concave part and be discharged from the concave part; the bottom wall of the concave part is provided with a flow resisting piece arranged in a protruding way and at least one circle of water storage tank arranged in a protruding way; the flow resisting piece is positioned between the liquid inlet and the liquid outlet and used for preventing the cooling liquid from flowing from the liquid inlet to the liquid outlet directly; the liquid inlet and the liquid outlet are surrounded by the water storage tank;
the cooling plate is hermetically covered on the concave part and forms a cooling cavity with the concave part for containing cooling liquid, so that the cooling plate can be cooled by the cooling liquid; the top end of the flow resisting piece abuts against or penetrates through the cooling plate; the top end of the water storage tank is provided with a gap with the cooling plate, so that cooling liquid can enter the water storage tank through the gap;
and a tray for holding the processing object, the tray being mounted on the cooling plate so as to transfer heat to the cooling plate.
In one embodiment, the choke piece is a Y-shaped cylinder having a Y-shaped lift pin slot for mounting a lift pin for lifting a processing object mounted on the tray, the cooling plate has a lift opening matching with the Y-shaped cylinder, and a top end of the Y-shaped cylinder is hermetically disposed in the lift opening.
In one embodiment, the liquid inlet and the liquid outlet are symmetrically arranged on two sides of one supporting leg of the Y-shaped column body.
In one embodiment, the bottom surface of the tray has a first concave-convex portion having concave-convex undulations, the cooling plate is used for mounting a second concave-convex portion having concave-convex undulations on the top surface of the tray, a concave portion of the first concave-convex portion is fitted with a convex portion of the second concave-convex portion, and the convex portion of the first concave-convex portion is fitted with a concave portion of the second concave-convex portion, so that the contact area between the tray and the cooling plate is increased.
In one embodiment, the first concavo-convex part includes at least two circular ribs arranged in concentric circles and a circular groove between adjacent circular ribs, and the second concavo-convex part has a circular groove and a circular rib corresponding to the first concavo-convex part.
In one embodiment, the first concave-convex part further includes a radial rib arranged in a radial direction, the radial rib intersects with the circular rib, and the second concave-convex part has a radial groove correspondingly engaged with the radial rib.
In one embodiment, the reservoir is circular.
In one embodiment, a heat conducting member made of a heat conducting material is arranged between the cooling plate and the tray, and the heat conducting member is attached to the cooling plate and the tray.
In one embodiment, the heat conducting member is aluminum tinfoil.
The application provides in an embodiment a reaction ion etching machine, including the coolant liquid that is used for providing the coolant liquid provide the device and carry out the reaction chamber that the sculpture reacted, its characterized in that still includes as above-mentioned arbitrary one cooling device, at least the tray is located among the cooling device the reaction intracavity, at least inlet and coolant liquid provide the device intercommunication in cooling device's inlet and the leakage fluid dram for the coolant liquid inlet.
According to the cooling device of the embodiment, the cooling disc and the cooling plate enclose a cooling cavity, the liquid inlet and the liquid outlet are arranged on the bottom wall of the cooling cavity, and the bottom wall of the cooling cavity is further provided with the protruding flow resisting piece and at least one circle of water storage tank. The flow resisting piece is positioned between the liquid inlet and the liquid outlet and used for preventing cooling liquid (such as cooling water) from directly flowing from the liquid inlet to the liquid outlet, and the water storage tank surrounds the liquid inlet and the liquid outlet. Under the action of the flow resisting piece, the cooling liquid is forced to enter the water storage tank and the surrounding area to flow, the cooling liquid flows through the whole area of the cooling cavity as far as possible instead of directly flowing from the liquid inlet to the liquid outlet, and the flowing cooling liquid can be uniformly contacted with the cooling plate to carry out heat exchange. The cooling device can uniformly push the cooling liquid to flow so as to prolong the water retention period and reduce the influence of convection on heat dissipation.
Drawings
FIG. 1 is a schematic structural diagram of a reactive ion etcher in one embodiment of the present application;
FIGS. 2 and 3 are exploded views of a cooling device according to an embodiment of the present application;
FIG. 4 is a schematic view of the direction of the cooling fluid flow within the cooling plate according to an embodiment of the present application;
FIG. 5 is a cross-sectional view of a cooling plate and cooling plate in one embodiment of the present application to show the direction of flow of the cooling fluid;
FIG. 6 is a cross-sectional view of an assembled cooling plate and pallet in one embodiment of the present application to illustrate the mating relationship of the first asperity and the second asperity.
Detailed Description
The present invention will be described in further detail with reference to the following detailed description and accompanying drawings. Wherein like elements in different embodiments are numbered with like associated elements. In the following description, numerous details are set forth in order to provide a better understanding of the present application. However, those skilled in the art will readily recognize that some of the features may be omitted or replaced with other elements, materials, methods in different instances. In some instances, certain operations related to the present application have not been shown or described in detail in order to avoid obscuring the core of the present application from excessive description, and it is not necessary for those skilled in the art to describe these operations in detail, so that they may be fully understood from the description in the specification and the general knowledge in the art.
Furthermore, the features, operations, or characteristics described in the specification may be combined in any suitable manner to form various embodiments. Also, the various steps or actions in the method descriptions may be transposed or transposed in order, as will be apparent to one of ordinary skill in the art. Thus, the various sequences in the specification and drawings are for the purpose of describing certain embodiments only and are not intended to imply a required sequence unless otherwise indicated where such sequence must be followed.
The numbering of the components as such, e.g., "first", "second", etc., is used herein only to distinguish the objects as described, and does not have any sequential or technical meaning. The term "connected" and "coupled" when used in this application, unless otherwise indicated, includes both direct and indirect connections (couplings).
An embodiment of the application provides a reactive ion etching machine, which is used for improving the cooling efficiency of a counter electrode and a silicon wafer.
Referring to fig. 1, in one embodiment, the reactive ion etcher includes a cooling fluid supply device 100 for supplying a cooling fluid, a reaction chamber 200 for performing an etching reaction, a cooling device 300 for cooling components such as an electrode and a silicon wafer, and other related components. The present application is primarily described with respect to the structure of the cooling device 300, and other components will not be described again.
At least the tray 330 of the cooling device 300 is located in the reaction chamber 200, and for example, the entire cooling device 300 may be located in the reaction chamber 200. At least one of the liquid inlet and the liquid outlet of the cooling device 300 is connected to the cooling liquid supply device 100 for feeding the cooling liquid. Preferably, in one embodiment, the liquid inlet and the liquid outlet are both in communication with the cooling liquid supply device 100 for cyclically supplying the cooling liquid for cooling. Of course, in some embodiments, the drain port may be in communication with other containers for recycling or draining the cooling fluid. Usually, cooling water may be used as the cooling liquid, but of course, other liquids having a good cooling effect may be used as the cooling liquid.
Referring to fig. 2-5, the cooling device 300 includes a cooling plate 310, a cooling plate 320, and a tray 330. The tray 330 is used for holding a processing object such as a silicon wafer. The tray 330 is mounted on the cooling plate 320 so as to transfer heat to the cooling plate 320.
The cooling tray 310 has a recess 311, a liquid inlet 312, and a liquid outlet 313. The recess 311 is formed by recessing the top surface of the cooling plate 310. The liquid inlet port 312 and the liquid outlet port 313 are provided in the bottom wall of the recess 311 for allowing the cooling liquid to enter the recess 311 and to be discharged from the recess 311. In the present embodiment, the liquid inlet 312 and the liquid outlet 313 are communicated with the cooling liquid supply device 100 through the corresponding pipelines 110 (shown in fig. 2).
The bottom wall of the recess 311 has a protruding choke 314 and at least one ring of water storage slots 315 (including two slot walls). The obstruction 314 is located between the inlet port 312 and the outlet port 313 to prevent the coolant from flowing directly from the inlet port 312 to the outlet port 313. The reservoir 315 surrounds the liquid inlet 312 and the liquid outlet 313. As shown in fig. 4, some gaps may be left between the blocking element 314 and the wall of the water storage tank 315, so that not all the cooling liquid is blocked by the blocking element 314, and a portion of the cooling liquid may flow into the area where the liquid discharge port 313 is located from the gaps, thereby ensuring that the portion of the cooling plate 320 corresponding to the area where the liquid discharge port 313 is located can be cooled.
Referring to fig. 2, 3 and 5, the cooling plate 320 covers the recess 311 and forms a cooling cavity with the recess 311 for accommodating a cooling liquid. The cooling cavity is filled with cooling liquid, and the bottom surface of the cooling plate 320 is directly contacted with the cooling liquid, so that the cooling liquid can cool the cooling plate 320. The cooling plate 320 is fixed to the cooling plate 310 by fixing means such as welding, screwing, or bonding, while sealing the recess 311.
In the present embodiment, the choke 314 is designed to be higher than the wall height of the water storage tank 315. The top end of the flow blocking member 314 abuts or extends through the cooling plate 320 to completely close the flow of the cooling fluid in height, thereby causing the cooling fluid to flow toward the reservoir 315, as indicated by the arrows in fig. 4 and 5. The top of the water storage tank 315 has a gap with the cooling plate 320 so that the cooling liquid enters the water storage tank 315 through the gap. As shown in fig. 4, the water storage tank 315 has a circular shape. In other embodiments, the water storage tank 315 may have other shapes, such as a square, a triangle, other number of polygons, a special-shaped structure, and the like.
Referring to fig. 4 and 5, after the cooling fluid flows into the cooling cavity through the fluid inlet 312, the cooling fluid is forced to accumulate toward the water storage tank 315 by the flow blocking member 314, and once the cooling fluid reaches a certain height, the cooling fluid flows into the water storage tank 315 and the surrounding area (as indicated by arrows). By flowing the cooling fluid through the entire area of the cooling chamber as much as possible, rather than directly from the inlet port 312 to the outlet port 313, the cooling fluid flowing in can be uniformly brought into contact with the cooling plate 320 for heat exchange. After flowing into the water storage tank 315, the cooling liquid can flow uniformly within a predetermined range, the size of which depends on the size of the silicon wafer to be processed by the apparatus. The coolant in the reservoir 315 cannot easily flow out of the drain port 313, and the contact time of the coolant with the cooling plate 320 is prolonged. The cooling device 300 can uniformly push the cooling liquid to flow, so as to prolong the water retention period and reduce the influence of convection on heat dissipation.
Referring to fig. 2 to 4, in one embodiment, the choke 314 is a Y-shaped cylinder having a Y-shaped lift pin groove 3141 for mounting a lift pin for lifting a processing object mounted on the tray 330. The cooling plate 320 has a lifting port 322 matching the Y-shaped cylinder, and the top end of the Y-shaped cylinder is hermetically disposed in the lifting port 322. Wherein the top of the Y-shaped cylinder may be flush with the top wall of the cooling plate 320. In this embodiment, the choke 314 is used as a lift pin mounting seat, so that the choke and the lift pin can be integrated, which is beneficial to the compactness of the whole structure. Of course, in other embodiments, the obstruction 314 and the lift pin slot may be two parts, and the obstruction 314 only serves to block the flow of the cooling fluid from the fluid inlet 312 directly to the fluid outlet 313.
In order to increase the flow-blocking effect of the flow-blocking element 314, in an embodiment, referring to fig. 4, the liquid inlet 312 and the liquid outlet 313 are symmetrically disposed on two sides of one leg 3142 of the Y-shaped cylinder. Of course, the liquid inlet 312 and the liquid outlet 313 may be disposed elsewhere, and are not limited to the positions shown in FIG. 4.
In the present embodiment, the tray 330 dissipates heat through heat transfer with the cooling plate 320. In order to further enhance the cooling effect on the tray 330, in one embodiment, the bottom surface of the tray 330 has a first concave-convex portion with concave-convex fluctuation. The cooling plate 320 is used to mount a second concavo-convex portion having concavo-convex undulation on the top surface of the tray 330. The concave portion of the first concave-convex portion is fitted with the convex portion of the second concave-convex portion, and the convex portion of the first concave-convex portion is fitted with the concave portion of the second concave-convex portion, so that the contact area between the tray 330 and the cooling plate 320 is increased, and the heat dissipation efficiency of the tray 330 is improved.
Referring to fig. 2, 3 and 6, as an example, the first concavo-convex part includes at least two circular protruded ridges 3311 concentrically arranged and a circular groove 3312 between the adjacent circular protruded ridges 3311, and the second concavo-convex part has a circular groove 3211 and a circular protruded ridge 3212 corresponding to the first concavo-convex part.
Further, the first concavo-convex part may further include a radial protrusion 3313 disposed in a radial direction, the radial protrusion 3313 being disposed to intersect the circular protrusion 3311, and the second concavo-convex part has a radial groove 3213 to be fitted to the radial protrusion 3313.
Of course, the first concave-convex portion and the second concave-convex portion may have other shapes and structures of concave-convex undulations, and are not limited to the above-described structure.
Since the cooling plate 320 and the tray 330 are not necessarily made of the same material, and they may have different thermal expansion coefficients, a certain gap (for example, a gap of 0.2 mm) needs to be left in the concavo-convex fit structure of the two, in order to compensate the effect of the reserved gap on the concavo-convex fit and the thermal conduction of the two components, so as to further improve the heat transfer between the tray 330 and the cooling plate 320, in an embodiment, referring to fig. 2 and 3, a heat conducting member 340 made of a heat conducting material is disposed between the cooling plate 320 and the tray 330, and the heat conducting member 340 is attached to the cooling plate 320 and the tray 330. The heat-conductive member 340 may be a plate shape so as to be better fitted with the tray 330 and the cooling plate 320. As an example, the heat conducting member 340 is an aluminum foil, and the heat transfer is accelerated by utilizing the characteristic that the heat conduction of metal is faster. Of course, the heat conducting member 340 may be made of other heat conducting materials capable of improving heat conducting efficiency.
The present invention has been described in terms of specific examples, which are provided to aid understanding of the invention and are not intended to be limiting. For a person skilled in the art to which the invention pertains, several simple deductions, modifications or substitutions may be made according to the idea of the invention.
Claims (10)
1. A cooling apparatus of a reactive ion etcher, comprising:
the cooling disc is provided with a concave part, a liquid inlet and a liquid outlet, and the liquid inlet and the liquid outlet are arranged on the bottom wall of the concave part and used for enabling cooling liquid to enter the concave part and be discharged from the concave part; the bottom wall of the concave part is provided with a flow resisting piece arranged in a protruding way and at least one circle of water storage tank arranged in a protruding way; the flow resisting piece is positioned between the liquid inlet and the liquid outlet and used for preventing the cooling liquid from flowing from the liquid inlet to the liquid outlet directly; the liquid inlet and the liquid outlet are surrounded by the water storage tank;
the cooling plate is hermetically covered on the concave part and forms a cooling cavity with the concave part for containing cooling liquid, so that the cooling plate can be cooled by the cooling liquid; the top end of the flow resisting piece abuts against or penetrates through the cooling plate; the top end of the water storage tank is provided with a gap with the cooling plate, so that cooling liquid can enter the water storage tank through the gap;
and a tray for holding the processing object, the tray being mounted on the cooling plate so as to transfer heat to the cooling plate.
2. The cooling apparatus as claimed in claim 1, wherein the flow inhibitor is a Y-shaped cylinder having a Y-shaped lift pin slot for mounting a lift pin for lifting the work object mounted on the tray, the cooling plate has a lift port matching with the Y-shaped cylinder, and a tip end of the Y-shaped cylinder is sealingly disposed in the lift port.
3. The cooling device as claimed in claim 2, wherein the liquid inlet and the liquid outlet are symmetrically disposed on both sides of one leg of the Y-shaped column.
4. The cooling apparatus as claimed in claim 1, wherein the bottom surface of the tray has a first concavo-convex portion having concavo-convex undulations, the cooling plate is used for mounting a second concavo-convex portion having concavo-convex undulations on the top surface of the tray, a concave portion of the first concavo-convex portion is fitted with a convex portion of the second concavo-convex portion, and a convex portion of the first concavo-convex portion is fitted with a concave portion of the second concavo-convex portion to increase a contact area between the tray and the cooling plate.
5. The cooling apparatus as claimed in claim 4, wherein the first concavo-convex part includes at least two circular projected ridges concentrically arranged and a circular groove between the adjacent circular projected ridges, and the second concavo-convex part has a circular groove corresponding to the first concavo-convex part and a circular projected ridge.
6. The cooling device as claimed in claim 5, wherein said first concavo-convex part further includes radial ribs arranged in a radial direction, said radial ribs being arranged to intersect with the circular ribs, and said second concavo-convex part has radial grooves engaged with the radial ribs correspondingly.
7. A chiller as claimed in claim 1 wherein said reservoir is circular.
8. A cooling device according to any one of claims 1 to 7, wherein a heat conducting member made of a heat conducting material is provided between the cooling plate and the tray, and the heat conducting member is attached to the cooling plate and the tray.
9. The cooling device of claim 8, wherein the thermally conductive member is aluminum tinfoil.
10. A reactive ion etcher comprising a cooling liquid supply means for supplying a cooling liquid and a reaction chamber for carrying out an etching reaction, characterized by further comprising a cooling apparatus as claimed in any one of claims 1 to 9, wherein at least a tray of the cooling apparatus is located in the reaction chamber, and at least a liquid inlet of a liquid inlet and a liquid outlet of the cooling apparatus is communicated with the cooling liquid supply means for feeding the cooling liquid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920971940.3U CN209880535U (en) | 2019-06-26 | 2019-06-26 | Reactive ion etching machine and cooling device thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920971940.3U CN209880535U (en) | 2019-06-26 | 2019-06-26 | Reactive ion etching machine and cooling device thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209880535U true CN209880535U (en) | 2019-12-31 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920971940.3U Active CN209880535U (en) | 2019-06-26 | 2019-06-26 | Reactive ion etching machine and cooling device thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209880535U (en) |
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2019
- 2019-06-26 CN CN201920971940.3U patent/CN209880535U/en active Active
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Effective date of registration: 20240311 Address after: Room 601, 6th Floor, Building A, Nengjianheng, No. 32 Shihua Road, Fubao Community, Fubao Street, Futian District, Shenzhen City, Guangdong Province Patentee after: Zhongjin Semiconductor (Shenzhen) Co.,Ltd. Country or region after: China Address before: Room R, 11 / F, Weili Industrial Centre, 2-12 Back Bay Street, Fo Tan Au, Sha Tin, New Territories, Hongkong, China Patentee before: VITELIC TECHNOLOGY (INTERNATIONAL) LTD. Country or region before: Hongkong, China |
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