CN209879558U - Intelligent card with photosensitive sensor - Google Patents
Intelligent card with photosensitive sensor Download PDFInfo
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- CN209879558U CN209879558U CN201921158046.0U CN201921158046U CN209879558U CN 209879558 U CN209879558 U CN 209879558U CN 201921158046 U CN201921158046 U CN 201921158046U CN 209879558 U CN209879558 U CN 209879558U
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- chip
- card
- card body
- photosensitive sensor
- smart card
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Abstract
The utility model discloses an intelligent card with a photosensitive sensor, which comprises a card body, wherein the card body is provided with an antenna and a chip, the antenna is electrically connected with the chip, the chip is provided with a microcontroller and a photosensitive sensor, and the photosensitive sensor is electrically connected with the microcontroller; the photosensitive sensor is arranged on the surface of the chip; or the light sensitive sensor is located in a first light transmissive region of the chip. The utility model discloses can let the chip of smart card open or close the function of non-contact payment according to the change of external environment light intensity to reduce the manufacturing cost of smart card, improve the yields of smart card.
Description
Technical Field
The utility model relates to a smart card field especially relates to a take photosensitive sensor's smart card.
Background
Smart cards have been widely used in everyday life, with debit cards, credit cards, and the like, which are common smart cards used by people. At present, most debit cards and credit cards issued by banks are dual-interface cards, namely, smart cards have two functions of contact payment and non-contact payment. Typically, dual interface cards are provided with a chip that includes a microcontroller and a plurality of electrical contacts that need to be contacted and communicate with electrical contacts on a payment device, such as a POS machine, when using contact payment. In addition, the smart card is also provided with an antenna, which is connected with the chip and supplies power to the chip. When the non-contact payment function is used, the POS machine generates a magnetic field, and when the smart card is close to the POS machine, the antenna generates induction current under the magnetic field and supplies power to the chip.
With the development of the smart card technology, most of the smart cards issued by banks are provided with a small-amount input-free key function, for example, flash payment cards issued by banks are the most common non-contact smart cards in the smart cards, and the flash payment cards mainly aim at quick payment of some small amounts and can finish payment without inputting passwords and signatures. The flash payment function of the flash payment card brings a new payment mode, and the POS machine can read the flash payment card within the distance of 5 cm, thereby bringing convenience for people. However, because of these conveniences, lawless persons may think that the card is stolen by approaching the card reader, and the card holder may unknowingly steal the card and deduct the money. For example, lawbreakers can carry out transactions without a secret key only by taking the POS machine close-range smart card, which brings great convenience for embezzling the smart card. The embezzlement not only directly results in economic loss of the card holder, but also loses personal information, and is easy to be utilized for illegal activities.
Therefore, the chinese utility model patent with the publication number CN206907073 discloses an anti-embezzlement IC card, which is provided with a photosensitive switch, and the photosensitive switch is electrically connected with a coil, when the IC card is not in a strong light environment, the photosensitive switch is turned off, and the coil can not supply power to a chip, so that a lawless person can avoid the smart card close to a user by using a POS machine to realize embezzlement in a dark environment.
However, since the photosensitive switch is electrically connected to the coil, when the smart card is manufactured, a space for disposing the photosensitive switch needs to be reserved on the card body, and the photosensitive switch needs to be welded to the antenna, which increases the manufacturing cost of the card body and also leads to a more complex manufacturing process of the card body. In addition, because the antenna is flexible antenna mostly, the degree of difficulty of flexible antenna and photosensitive switch welding is great, influences the yields of smart card.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a simple and high smart card of taking photosensor of yields of production technology.
In order to achieve the main purpose, the utility model provides an intelligent card with a photosensitive sensor, which comprises a card body, wherein the card body is provided with an antenna and a chip, the antenna is electrically connected with the chip, the chip is provided with a microcontroller and a photosensitive sensor, and the photosensitive sensor is electrically connected with the microcontroller; the photosensitive sensor is arranged on the surface of the chip; or the light sensitive sensor is located in a first light transmissive region of the chip.
It is thus clear from the above-mentioned scheme that photosensitive sensor does not directly set up on the card body, but sets up on the chip, because the chip is provided with harder base plate usually, be provided with electronic components such as microcontroller on the base plate, consequently, weld photosensitive sensor together with electronic components such as microcontroller on the base plate in the lump, can avoid setting up photosensitive sensor on the card body when making the card body, the production technology of smart card has been simplified, and photosensitive sensor's the welding degree of difficulty greatly reduced, improve the yields of product.
Preferably, the chip includes a first surface, the first surface is provided with a plurality of electrical contacts, a gap is formed between two adjacent electrical contacts, and the first light-transmitting area is right below the gap.
Therefore, the photosensitive sensor is arranged right below the gap between the two electric contacts, and external light can penetrate through the gap between the two electric contacts to enter the photosensitive sensor, so that the photosensitive sensor can receive the external light.
In a further aspect, the first surface of the chip is exposed on a surface of the card body. Therefore, the gap between the two electric contacts of the chip can not be shielded by other parts of the card body, and the photosensitive sensor can be ensured to receive external light.
Optionally, the chip comprises a second surface, the light-sensitive sensor being arranged on the second surface of the chip; the card body forms a second light-transmitting area at the second surface of the chip.
Therefore, the photoresistor can be arranged on the back surface of the chip, and the second light-transmitting area formed on the back surface of the chip by the card body can ensure that light enters the photosensitive sensor, so that the photosensitive sensor can receive external light.
Further, the second light-transmitting area is a transparent window arranged on the surface of the card body. It can be seen that the transparent window is arranged on the surface of the card body, i.e. a part of the area of the card body is made of a transparent material, so that it can be ensured that light is not blocked.
Alternatively, the card body is a transparent surface on the side of the second surface of the chip. The back surface of the card body is set to be a transparent surface, so that light can be ensured to be incident to the second surface of the chip.
In a further embodiment, the light-sensitive sensor is a light-sensitive resistor. Because the photoresistor is a very mature electronic device and has low price and stable performance, the photoresistor is used as the photosensitive sensor, the production cost of the chip is not greatly improved, and the simple production process of the chip is also ensured.
Drawings
Fig. 1 is a schematic structural diagram of a first embodiment of the present invention.
Fig. 2 is a sectional view taken in the direction of a-a in fig. 1.
Fig. 3 is a schematic structural diagram of a chip according to a first embodiment of the present invention.
Fig. 4 is an electrical schematic diagram of the microcontroller and the photo resistor according to the first embodiment of the present invention.
Fig. 5 is a schematic structural diagram of a second embodiment of the present invention.
Fig. 6 is a schematic structural diagram of a third embodiment of the present invention.
The present invention will be further explained with reference to the drawings and examples.
Detailed Description
The utility model discloses a take smart card of photosensitive sensor can be debit card, credit card etc. that the bank issued, and is preferred, and the smart card has non-contact payment function, and the state through photosensitive sensor determines whether need open or close the function of non-contact payment.
The first embodiment:
referring to fig. 1 and 2, the smart card 10 of the present embodiment has a card body 11 and a chip 20 disposed on the card body 11, preferably, the card body 11 has a multilayer structure, for example, the card body includes, from top to bottom, a first protective film layer 12, a first printing layer 13, a first substrate layer 14, an intermediate layer 15, a second substrate layer 16, a second printing layer 17, and a second protective film layer 18, respectively, where an antenna 19 is disposed in the intermediate layer 15. In this embodiment, the surface of the first protective film layer 12 is the front surface of the card body 11, and the surface of the second protective film layer 18 is the back surface of the card body 11.
The chip 20 is arranged on a side of the card body 11 close to the front side, and the front side of the chip 20 close to the card body 11 is the front side of the chip 20, the front side of the chip 20 being provided with a plurality of electrical contacts, for example comprising electrical contacts 21, 22, etc. When the smart card contacts a card reader such as a POS machine, the plurality of electrical contacts on the chip 20 will contact the plurality of electrical contacts on the card reader, thereby achieving a contact connection, and the card reader reads data in the chip 20.
The card body 11 is provided with a chip mounting position, the chip mounting position is located on the surface of the front surface of the card body 11, and the chip 20 is mounted in the chip mounting position. Preferably, the chip 20 is embedded in the first protective film layer 12, the first printing layer 13, the first base material layer 14, and the intermediate layer 15, and is electrically connected to the antenna 19. When the smart card 10 approaches the contactless reader, the contactless reader generates a magnetic field signal, the antenna 19 induces an induced current in the magnetic field, and supplies power to the chip 20.
Referring to fig. 3, the chip 20 has a substrate 25, preferably, the substrate 25 is a circuit board, a microcontroller 26 and a photo resistor 27 are soldered on the substrate 25, the photo resistor 27 is a photo sensor of the present embodiment, and the photo resistor 27 is electrically connected to the microcontroller 26. A plurality of electrical contacts are located above the light dependent resistor 27 and the microcontroller 26, i.e. on the side close to the front side of the chip.
Due to the insulation process required between the plurality of electrical contacts on the chip 20, for example, a gap is formed between two adjacent electrical contacts, so that the two adjacent electrical contacts are prevented from being electrically connected with each other to affect the communication with the card reader. For example, the gap 23 is formed between the electrical contact 21 and the electrical contact 22, in this embodiment, the gap 23 forms a light-transmitting region, and the photo-resistor 27 is located right below the gap 23, so that external light can be incident on the photo-resistor 27 through the gap 23.
Generally, when using the function of contactless payment, the user needs to take out the smart card 10 and pay in a brighter place, so when performing contactless payment, the photo resistor 27 is in a brighter environment, and at this time, the resistance value of the photo resistor 27 is small. If the smart card is not fished out, for example, placed in a purse or pocket, the light dependent resistor 27 is in a darker environment and has a higher resistance value.
Referring to fig. 4, one end of the photo resistor 27 receives a dc power VCC, the other end is connected to one end of a common resistor 28, the other end of the resistor 28 is grounded, and a connection between the photo resistor 27 and the resistor 28 is connected to one pin of the microcontroller 26. Thus, when the smart card 10 is in a strong light environment, the resistance of the light dependent resistor 27 is small, and the level signal received by the pin of the microcontroller 26 is high, which can be regarded as a high level signal. When the smart card 10 is in a weak environment, the resistance of the light dependent resistor 27 is large, and the level signal received by the pin of the microcontroller 26 is low, which can be regarded as a low level signal.
In this way, the microcontroller 26 can determine the light intensity state of the current environment where the smart card 10 is located according to whether the signal of the pin is a high level signal or a low level signal, and can turn on the contactless payment function if the light intensity is strong, and turn off the contactless payment function if the light intensity is weak. The microcontroller 26 turns on or off the contactless payment function is a known technology and will not be described in detail here.
Since the present embodiment has the photo resistor 27 disposed on the chip 20 instead of on the card body 11, the smart card is manufactured without placing the photo resistor 27 on the card body 11, which can simplify the manufacturing process of the smart card. The process of soldering the photo resistor 27 to the circuit board 25 is simpler than soldering the photo resistor 27 to the card body 11, and since the production process of the smart card 10 is usually to first manufacture the chip 20, package the chip 20 into a module, and place the entire chip 20 in the card body 11. Therefore, the photo resistor 27 is already soldered to the substrate 25 during the production process of the chip 20, so that the soldering of the photo resistor 27 can be performed by using a mature technology such as a chip mounter, thereby improving the yield of the smart card 10.
Second embodiment:
referring to fig. 5, the smart card 30 of the present embodiment has a card body 31, a chip 32 is disposed on the card body 31, a front surface of the chip is provided with a plurality of electrical contacts, and the chip 32 has a substrate on which a microcontroller and a photo resistor are disposed. In contrast to the first exemplary embodiment, the photoresistor is not arranged on the front side of the chip, but on the rear side of the chip, i.e. on the side facing away from the electrical contacts.
In order to allow the photoresistor to receive external light, the light-transmitting region 33 is disposed on the back of the card body 31, for example, the middle layer, the second substrate layer, the second printing layer and the second protective film on the card body 31 are made of light-transmitting material, for example, transparent PVC material, in the region of the light-transmitting region, so that external light can be incident on the photoresistor through the light-transmitting region 33. Since the light-transmitting area 33 is a window provided on the back surface of the card body 31, the light-transmitting area 33 is a transparent window through which a user can see the back surface of the chip 32.
The third embodiment:
referring to fig. 6, the smart card 40 of the present embodiment has a card body 41, a chip 42 is disposed on the card body 41, a front surface of the chip is provided with a plurality of electrical contacts, and the chip 42 has a substrate on which a microcontroller and a photo resistor are disposed. In contrast to the first exemplary embodiment, the photoresistor is not arranged on the front side of the chip, but on the rear side of the chip, i.e. on the side facing away from the electrical contacts.
In order to avoid the middle layer, the second substrate layer, the second printing layer and the second protective film layer from shielding the external light, in this embodiment, the middle layer, the second substrate layer, the second printing layer and the second protective film layer may be made of a light-transmitting material, for example, a transparent PVC material, so that it is ensured that the photoresistor receives the external light.
Of course, the above-mentioned solution is only a preferred embodiment of the present invention, and the practical application is that there may be more changes, for example, the change of the multi-layer structure of the card body, or, other photosensitive sensors are used to replace the photosensitive resistors, etc., and these changes do not affect the implementation of the present invention, and should be included in the protection scope of the present invention.
Claims (7)
1. Smart card with photosensor, comprising:
the card comprises a card body, a card body and a card body, wherein the card body is provided with an antenna and a chip, and the antenna is electrically connected with the chip;
the method is characterized in that:
the chip is provided with a microcontroller and a photosensitive sensor, and the photosensitive sensor is electrically connected with the microcontroller;
the photosensitive sensor is arranged on the surface of the chip; or
The photosensor is located in a first light-transmitting region of the chip.
2. The smart card with photosensor according to claim 1, characterized in that:
the chip comprises a first surface, a plurality of electric contacts are arranged on the first surface, a gap is formed between every two adjacent electric contacts, and the first light-transmitting area is right below the gap.
3. The smart card with photosensor according to claim 2, characterized in that:
the first surface of the chip is exposed on the surface of the card body.
4. The smart card with photosensor according to claim 1, characterized in that:
the chip comprises a second surface, the photosensor is arranged on the second surface of the chip;
the card body forms a second light transmissive region at the second surface of the chip.
5. The smart card with photosensor according to claim 4, characterized in that:
the second light-transmitting area is a transparent window arranged on the surface of the card body.
6. The smart card with photosensor according to claim 4, characterized in that:
the card body is a transparent surface on one side of the second surface of the chip.
7. The smart card with photosensor according to any of claims 1 to 6, characterized in that:
the photosensitive sensor is a photoresistor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921158046.0U CN209879558U (en) | 2019-07-22 | 2019-07-22 | Intelligent card with photosensitive sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921158046.0U CN209879558U (en) | 2019-07-22 | 2019-07-22 | Intelligent card with photosensitive sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209879558U true CN209879558U (en) | 2019-12-31 |
Family
ID=68949373
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921158046.0U Active CN209879558U (en) | 2019-07-22 | 2019-07-22 | Intelligent card with photosensitive sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209879558U (en) |
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2019
- 2019-07-22 CN CN201921158046.0U patent/CN209879558U/en active Active
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