CN209861266U - Liquid metal circuit structure - Google Patents
Liquid metal circuit structure Download PDFInfo
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- CN209861266U CN209861266U CN201920435365.5U CN201920435365U CN209861266U CN 209861266 U CN209861266 U CN 209861266U CN 201920435365 U CN201920435365 U CN 201920435365U CN 209861266 U CN209861266 U CN 209861266U
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Abstract
The utility model discloses a liquid metal circuit structure, including the stratum basale, the upper surface of stratum basale is provided with the adhesive layer, and the overall dimension of adhesive layer is the same with the overall dimension of stratum basale, and the upper surface of adhesive layer is provided with liquid metal circuit layer, and the overall dimension of liquid metal circuit layer is less than the overall dimension of adhesive layer, and liquid metal circuit layer is provided with the encapsulated layer around and on the upper surface. The utility model discloses when having overcome liquid metal and the mutual non-adhesion problem of stratum basale, still have good anti-fake function and be convenient for the operator to master stability, mobility and the solid liquid form of the intraformational liquid metal of liquid metal circuit, have that structural design is reasonable, easy to carry out, preparation efficiency is high, application scope is wide advantage.
Description
Technical Field
The utility model belongs to the technical field of the flexible circuit, concretely relates to liquid metal circuit structure.
Background
Liquid metals are a class of lower melting point metals or alloys, such as the common metallic mercury. Metallic mercury has strong toxicity, and thus is difficult to apply to the field of daily life. Other types of liquid metals, such as gallium-based alloys, bismuth-based alloys and other materials, can also be kept in a liquid state at a lower temperature, and have the electrical conductivity and the thermal conductivity of the metal, and importantly, the alloys have lower biological toxicity and can be used in the field of daily life. In addition, there is a study of manufacturing a flat printed circuit using a low melting point alloy as a conductive material, and applying such a material to the field of metal 3D printing. Although liquid metal has good fluidity, is metal and has conductive property, when a circuit is manufactured by adopting the liquid metal, the liquid metal has larger surface tension, higher writing line type and stereoscopic impression, is very suitable for writing artistic calligraphy and painting, is metal, can be manufactured only on the smooth surfaces of specific substrates such as PVC, PET, acrylic boards and the like when the circuit is manufactured by adopting the conductive property, but can not be manufactured on common paper, wood, leather, cloth, stone, walls and the like, and greatly limits the application range of the circuit manufactured by the liquid metal. Therefore, it is objective to develop a liquid metal circuit structure which has reasonable structure design, easy implementation, greatly improved application range of liquid metal and anti-counterfeiting function.
Disclosure of Invention
An object of the utility model is to provide a structural design is reasonable, easy to implement, can be great improvement liquid metal's application scope, have anti-fake function's liquid metal circuit structure again.
The utility model aims at realizing like this, including the stratum basale, the upper surface of stratum basale is provided with the adhesive layer, and the overall dimension of adhesive layer is the same with the overall dimension of stratum basale, and the upper surface of adhesive layer is provided with liquid metal circuit layer, and the overall dimension of liquid metal circuit layer is less than the overall dimension of adhesive layer, and liquid metal circuit layer is provided with the encapsulated layer around and on the upper surface.
Further, the lower surface of the base layer is symmetrically provided with a thermosensitive color changing layer, an adhesive layer, a liquid metal circuit layer, an anti-counterfeiting layer and a packaging layer, the thermosensitive color changing layer, the adhesive layer, the liquid metal circuit layer, the anti-counterfeiting layer and the packaging layer are the same as the thermosensitive color changing layer, the adhesive layer, the liquid metal circuit layer, the anti-counterfeiting layer and the packaging layer in size, communication holes are formed between the liquid metal circuit layer above the base layer and the liquid metal circuit layer below the base layer, a fixing mechanism is arranged between the outer side of the packaging layer above the base layer and the outer side of the packaging layer below the base layer and comprises a lower fixing piece and an upper fixing piece, the lower fixing.
Further, a thermosensitive color changing layer is arranged between the substrate layer and the adhesive layer.
Furthermore, an anti-counterfeiting layer is arranged at a circuit gap in the liquid metal circuit layer or between the liquid metal circuit layer and the packaging layer.
Further, the substrate layer is one of plain paper, wood, leather, cloth, metal, glass, stone and a wall.
Further, the adhesive layer is water-based adhesive sticker or oil-based adhesive sticker.
Furthermore, the adhesive layer is manufactured by adopting a spraying, blade coating, screen printing or glue dispensing manner.
Further, the packaging layer is one of polydimethylsiloxane, polyurethane, silica gel and propylene polymer.
This practical beneficial effect who produces is: firstly, the adhesive force of the surface of the base layer is improved through the arranged adhesive layer, the problem that liquid metal is not adhered to the base layer is solved, the adaptability of the liquid metal to various base layers during circuit manufacturing is further improved, and a user can customize circuit patterns of various structures on the base layers made of various materials according to the requirements of the user so as to meet the user-defined design requirements and quality requirements of the user; the set anti-counterfeiting layer has a good anti-counterfeiting function, namely, each piece of circuit structure can be endowed with a unique identification information code during manufacturing, so that the same person can not imitate and imitate; the color of the arranged thermosensitive color-changing layer can change along with the change of temperature, the working environment for manufacturing the circuit is determined according to the color change of the thermosensitive color-changing layer, and an operator can conveniently master the stability, the fluidity and the solid-liquid form of the liquid metal in the liquid metal circuit layer while conveniently manufacturing the circuit structure; therefore, the efficiency of circuit manufacturing can be improved, and the manufacturing and later-stage use effects can be ensured; fourthly, the encapsulation layer can be used for encapsulating and protecting the liquid metal circuit layer, so that the liquid metal circuit layer is not easy to damage. To sum up, the utility model has the advantages of structural design is reasonable, easy to implement, preparation efficiency is high, application scope is wide, easily uses widely.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention;
in the figure: 1-lower fixing piece, 2-fixing rod, 3-upper fixing piece, 4-anti-counterfeiting layer, 5-packaging layer, 6-liquid metal circuit layer, 7-adhesive layer, 8-thermosensitive color changing layer, 9-substrate layer and 10-communication hole.
Detailed Description
The following further describes the present invention with reference to the attached drawings, but the present invention is not limited in any way, and any changes or improvements based on the teaching of the present invention all belong to the protection scope of the present invention.
As shown in fig. 1, the utility model comprises a substrate layer 9, the upper surface of the substrate layer 9 is provided with an adhesive layer 7, the overall dimension of the adhesive layer 7 is the same as the overall dimension of the substrate layer 9, the upper surface of the adhesive layer 7 is provided with a liquid metal circuit layer 6, the liquid metal used by the liquid metal circuit layer 6 is one or more of mercury, gallium, indium, tin, gallium indium alloy, gallium indium tin alloy, gallium zinc alloy, gallium indium zinc alloy, gallium tin zinc alloy, gallium indium tin zinc alloy, gallium tin cadmium alloy, gallium zinc cadmium alloy, bismuth indium alloy, bismuth tin alloy, bismuth indium zinc alloy, bismuth tin zinc alloy, bismuth indium tin zinc alloy, tin lead alloy, tin copper alloy, tin zinc copper alloy, tin silver copper alloy and bismuth lead tin alloy, the overall dimension of the liquid metal circuit layer 6 is smaller than the overall dimension of the adhesive layer 7, and the liquid metal circuit layer 6 is provided with an encapsulation layer 5 around and on the upper surface thereof. The adhesive force on the surface of the base layer 9 is improved through the arranged adhesive layer 7, the problem that the liquid metal circuit layer 6 is not adhered to the base layer 9 is solved, the adaptability of the liquid metal circuit layer to various base layers 9 is further improved, the arranged packaging layer 5 can realize packaging and protection of the liquid metal circuit layer 6, and the liquid metal circuit layer 6 is not easy to damage.
In order to further improve the application range of the utility model, the liquid metal circuit layer 6 g is arranged into a double-layer structure, the lower surface of the basal layer 9 is symmetrically provided with a thermosensitive discoloring layer 8, an adhesive layer 7, a liquid metal circuit layer 6, an anti-counterfeiting layer 4 and a packaging layer 5 which are the same with the upper surface structure and the size, a communication hole 10 is arranged between the liquid metal circuit layer 6 above the basal layer 9 and the liquid metal circuit layer 6 below the basal layer 9, the upper surface of the basal layer 9 and the liquid metal circuit layer 6 below the basal layer 9 are communicated through the communication hole 10, liquid metal is filled in the communication hole 10, so that the upper and lower liquid metal circuit layers 6 realize electric communication, a fixing mechanism is arranged between the outer side of the packaging layer 5 above the basal layer 9 and the outer side of the packaging layer 5 below the basal layer 9, the fixing mechanism comprises a, lower mounting 1 is connected on encapsulation layer 5 below stratum basale 9, goes up mounting 3 and installs on encapsulation layer 5 above stratum basale 9, link to each other through fixed column 2 between lower mounting 1 and the last mounting 3, lower mounting 1 and last mounting 3 can adopt frame embedding, edge to compress tightly, sticky or negative pressure adsorption's mode fixed with encapsulation layer 5.
The thermosensitive color-changing layer 8 is arranged between the substrate layer 9 and the adhesive layer 7, the working environment for manufacturing the circuit is determined according to the color change of the thermosensitive color-changing layer 8, the operator can conveniently master the stability, the flowability and the solid-liquid state form of the liquid metal in the liquid metal circuit layer 6 while conveniently manufacturing the circuit structure, the thermosensitive color-changing layer 8 is a thermosensitive material used in the prior art, the thermosensitive color-changing layer is a material which changes the property change of the thermosensitive material through the temperature change induction, the operator can conveniently sense the temperature of the environment after the thermosensitive material is coated on the substrate layer 9, and then the solid-liquid state form of the liquid metal is distinguished.
Further, be provided with anti-fake layer 4 between circuit space department in the liquid metal circuit layer 6 or liquid metal circuit layer 6 and the packaging layer 5, be in order to realize the anti-fake function of this structure, also can give the information code of each circuit structure unique identification when the preparation, let and can't imitate and imitate with going, anti-fake layer can be two-dimensional code, enterprise's sign etc, with two-dimensional code or enterprise's sign as for in the circuit structure, convenient to use person traces circuit structure, let circuit structure have traceability.
Furthermore, the substrate layer 9 is one of ordinary paper, wood, leather, cloth, metal, glass, stone and wall, the surface of the material is generally rough, the adhesion of the liquid metal on the contact surface is mainly due to the adhesion of the oxide layer and the contact surface, the action distance between the metal oxide layer and the substrate is increased due to the rough interface, the contact area is greatly reduced, the wettability of the metal is reduced, and intermolecular force cannot be formed, so that the liquid metal has poor adhesion or almost no adhesion on the material, and the circuit with a specific form can be prepared by utilizing the characteristics.
In order to ensure the adhesiveness and stability of the adhesive layer 7, the adhesive layer 7 is a water-based adhesive sticker or an oil-based adhesive sticker. The adhesive layer is made of a material which has adhesion to liquid metal, generally solid metal or high molecular polymer, wherein the solid metal can be gold, silver, copper, iron, nickel and the like, the liquid metal has strong wettability on the surface of the metal and is easy to spread and adhere on the surface of the metal, the surface of the water-based adhesive sticker or oil-based adhesive sticker has high adhesion, and the high van der Waals force can be provided and a certain degree of hydrogen bond interaction can be formed, so that the oxide layer of the liquid metal is easy to adhere on the surface of the material.
Preferably, the adhesive layer 7 is manufactured by spraying, blade coating, screen printing or a dispenser. A circuit pattern of a specific shape is printed on the thermochromic layer 8, for example, by screen printing, to form a liquid metal circuit adhesive layer. The liquid metal circuit adhesive layer can also be formed by printing a circuit pattern in a preset shape on the substrate layer by using additive manufacturing equipment such as a 3D printer, or by planning a circuit pattern in a specific shape on the substrate layer of the thermosensitive color-changing layer 8 by spraying and applying the above materials on the thermosensitive color-changing layer 8 by using spraying equipment such as a spray gun.
Preferably, the encapsulation layer 5 is one of polydimethylsiloxane, polyurethane, silicone and acrylic polymer, which have good flexibility and can maintain the structure of the liquid metal circuit layer 6 when used for encapsulating the liquid metal circuit layer.
When a circuit is manufactured, a thermosensitive color-changing layer 8 is coated on a selected substrate layer 9, then an adhesive layer 7 is coated on the upper surface of the thermosensitive color-changing layer 8, then a liquid metal circuit layer 6 is manufactured by utilizing the characteristic that liquid metal has good fluidity under the conditions of normal temperature and normal pressure, a specific circuit structure can be drawn on the adhesive layer 7 by virtue of a liquid metal electronic handwriting pen in the manufacturing of the liquid metal circuit layer 6, the liquid metal circuit layer 6 can also be directly printed on the adhesive layer 7 at present, an anti-counterfeiting layer 4 is pasted after the liquid metal circuit layer 6 is manufactured, and finally the packaging layer 5 is packaged. The utility model discloses because the preparation process can be accomplished at normal atmospheric temperature, and is not high to the environmental requirement, can show the preparation efficiency of effectual improvement circuit, when having anti-fake, temperature sensing function, can be applied to individualized electronic circuit preparation, circuit repair, electronic education teaching, decorative design, children's toy manufacturing and various cultural intention products, provide a large amount of brand-new application spaces as emerging technique, satisfy the needs of quick design electronic circuit and test.
Claims (9)
1. A liquid metal circuit structure, characterized by: the packaging structure comprises a substrate layer (9), wherein an adhesive layer (7) is arranged on the upper surface of the substrate layer (9), a liquid metal circuit layer (6) is arranged on the upper surface of the adhesive layer (7), and packaging layers (5) are arranged on the periphery and the upper surface of the liquid metal circuit layer (6).
2. The liquid metal circuit structure of claim 1, wherein: the packaging structure is characterized in that an adhesive layer (7), a liquid metal circuit layer (6) and a packaging layer (5) which are the same as the upper surface structure and size are symmetrically arranged on the lower surface of the base layer (9), a communicating hole (10) is formed between the liquid metal circuit layer (6) above the base layer (9) and the liquid metal circuit layer (6) below the base layer (9), and a fixing mechanism is arranged between the outer side of the packaging layer (5) above the base layer (9) and the outer side of the packaging layer (5) below the base layer (9).
3. A liquid metal circuit structure according to claim 2, wherein: the fixing mechanism comprises a lower fixing piece (1) and an upper fixing piece (3), the lower fixing piece (1) is connected to a packaging layer (5) below a base layer (9), the upper fixing piece (3) is installed on the packaging layer (5) above the base layer (9), and the lower fixing piece (1) is connected with the upper fixing piece (3) through a fixing column (2).
4. A liquid metal circuit structure according to claim 2, wherein: a thermosensitive color-changing layer (8) is arranged between the substrate layer (9) and the adhesive layer (7).
5. A liquid metal circuit structure according to claim 2, wherein: and an anti-counterfeiting layer (4) is arranged at a circuit gap in the liquid metal circuit layer (6) or between the liquid metal circuit layer (6) and the packaging layer (5).
6. The liquid metal circuit structure of claim 1, wherein: the base layer (9) is one of common paper, wood, leather, cloth, metal, glass, stone and a wall.
7. The liquid metal circuit structure of claim 1, wherein: the adhesive layer (7) is water-based adhesive sticker or oil-based adhesive sticker.
8. The liquid metal circuit structure of claim 1, wherein: the adhesive layer (7) is manufactured by adopting a spraying, blade coating, screen printing or glue dispenser mode.
9. The liquid metal circuit structure of claim 1, wherein: the packaging layer (5) is one of polydimethylsiloxane, polyurethane, silica gel and propylene polymer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920435365.5U CN209861266U (en) | 2019-04-02 | 2019-04-02 | Liquid metal circuit structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920435365.5U CN209861266U (en) | 2019-04-02 | 2019-04-02 | Liquid metal circuit structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209861266U true CN209861266U (en) | 2019-12-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920435365.5U Active CN209861266U (en) | 2019-04-02 | 2019-04-02 | Liquid metal circuit structure |
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| CN (1) | CN209861266U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111864400A (en) * | 2020-07-15 | 2020-10-30 | 航天材料及工艺研究所 | Novel metamaterial structure and preparation method thereof |
| CN114724770A (en) * | 2022-03-24 | 2022-07-08 | 西南民族大学 | Preparation method of liquid metal flexible conductor |
| CN114758844A (en) * | 2022-04-29 | 2022-07-15 | 厦门大学 | Flexible wire based on liquid metal and manufacturing method thereof |
-
2019
- 2019-04-02 CN CN201920435365.5U patent/CN209861266U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111864400A (en) * | 2020-07-15 | 2020-10-30 | 航天材料及工艺研究所 | Novel metamaterial structure and preparation method thereof |
| CN114724770A (en) * | 2022-03-24 | 2022-07-08 | 西南民族大学 | Preparation method of liquid metal flexible conductor |
| CN114758844A (en) * | 2022-04-29 | 2022-07-15 | 厦门大学 | Flexible wire based on liquid metal and manufacturing method thereof |
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