CN209859645U - Solvent bonding shaping silk covered wire - Google Patents

Abstract

The utility model provides a solvent bonding shaping silk covered wire, which comprises a conducting wire, an insulating paint layer and a silk covered wire main body; the wire, the bonding solvent, the coating layer, the reinforced insulating wire layer, the high-temperature resistant layer, the reinforced protective layer and the insulating paint layer jointly form a wire-covered wire main body; the high temperature resistant layer is in a reverse winding shape and is bonded outside the reinforced insulating thread layer through a bonding solvent, and the outer peripheral surface of the high temperature resistant layer is bonded with a reinforced protective layer through the bonding solvent. The reinforced insulating wire layer is bonded outside the coating layer, so that the reinforced insulating wire layer and the coating layer are bonded with the lead into a whole through a bonding solvent, the coating of the reinforced insulating wire layer in the wire coating adopts a wire bonding process technology, and the coating layer in the wire coating also adopts a gapless coating process technology, so that the insulativity of the wire coating is greatly improved.

Description

Solvent bonding shaping silk covered wire

Technical Field

The utility model belongs to the technical field of silk envelope curve, more specifically say, in particular to solvent bonding design silk envelope curve.

Background

Natural silk or glass silk is used as the insulated clad wire. The yarn is distinguished from a yarn covering using cotton yarn as an insulating layer. Usually made by wrapping a synthetic glass filament around a wire. If the insulating material is soaked in the organic silicon resin, the temperature resistance can reach 453K, and the insulating material has the characteristics of good insulating property, high mechanical strength and the like. Is widely used in precision electrical equipment.

As in application No.: CN201420069150.3 the utility model relates to an improved structure of a self-melting covered wire, which is composed of a stranded wire, a wire layer and a melting coating layer; the stranded wire is formed by twisting the enameled single wire into a single stranded wire in a multi-strand enameled single wire mode, the silk layer is wound on the outer layer of the stranded wire in a layer mode, the outer layer of the silk layer is coated with a layer of melting coating layer in a coating mode, and when the self-melting silk covered wire is wound side by side, the self-melting silk covered wire can be tightly bonded with each other through the melting coating layer in a hot air fusion mode, an electric heating fusion mode or a solvent fusion mode. The utility model discloses can reduce silk envelope curve coil's coil interval, improve inductance efficiency (Q value) efficiency.

Based on the search of the above patents and the discovery of the devices in the prior art, the insulation resistance of the silk covered wire in the existing market is low, generally between 1000V-2000V, and under the high-voltage working condition that the voltage reaches 2500V-3000V, the voltage resistance of the silk covered wire in the existing market cannot meet the product requirement, and finally the product is broken down and short-circuited, so that the normal operation of the electrical equipment is affected, and the silk covered wire in the existing market is easily subjected to a bulging phenomenon after being bent, so that the appearance is affected, and the product quality of the silk covered wire is also affected.

Therefore, in view of the above, research and improvement are made on the existing structure and defects, and a solvent bonding shaping filament covered wire is provided to achieve the purpose of higher practical value.

SUMMERY OF THE UTILITY MODEL

In order to solve the technical problem, the utility model provides a solvent bonding design silk envelope curve, with the resistant insulating nature ratio of silk envelope curve on solving current market is lower, generally be between 1000V-2000V, and under the high pressure operating condition that reaches 2500V-3000V at voltage, its withstand voltage of silk envelope curve on current market just can not reach the product demand, finally can lead to the product to be punctured the short circuit, influence electrical equipment's normal operation, and the silk envelope curve on current market produces the swell phenomenon after bending very easily, not only influence the aesthetic property, and can also influence the product quality's of silk envelope curve problem.

The utility model discloses purpose and efficiency of solvent bonding design silk envelope curve are reached by following concrete technological means:

a solvent bonding shaping silk covered wire comprises a conducting wire, a bonding solvent, a coating layer, a reinforced insulating silk layer, a high temperature resistant layer, a reinforced protective layer, an insulating paint layer and a silk covered wire main body; the wire, the bonding solvent, the coating layer, the reinforced insulating wire layer, the high-temperature resistant layer, the reinforced protective layer and the insulating paint layer jointly form a wire-covered wire main body; the peripheral surface of the lead is adhered with a coating layer through an adhesive solvent, and the peripheral surface of the coating layer is adhered with a layer of the reinforced insulating wire layer which is distributed in a winding shape through the adhesive solvent; the high-temperature resistant layer is in a reverse winding shape and is bonded outside the reinforced insulating wire layer through a bonding solvent, and the peripheral surface of the high-temperature resistant layer is bonded with a reinforced protective layer through the bonding solvent; and the outer peripheral surface of the reinforcing protective layer is coated with the insulating paint layer in a dipping mode.

Furthermore, the reinforced insulating wire layer, the high temperature resistant layer and the reinforced protective layer all adopt a silk thread bonding process technology in the silk covered wire main body, and the reinforced insulating wire layer is positioned inside the high temperature resistant layer.

Furthermore, the coating layer is positioned outside the lead, and a gapless coating process technology is adopted between the coating layer and the lead.

Furthermore, the reinforcing protective layer is distributed outside the high temperature resistant layer in a grid shape through the bonding solvent, and the thickness of the reinforcing protective layer accounts for one fourth of that of the high temperature resistant layer.

Further, the thickness of the high temperature resistant layer is equal to that of the reinforced insulating thread layer, and the winding directions of the high temperature resistant layer and the reinforced insulating thread layer are opposite.

Compared with the prior art, the utility model discloses following beneficial effect has:

the reinforced insulating wire layer is bonded outside the coating layer, so that the reinforced insulating wire layer and the coating layer are bonded with the lead into a whole through a bonding solvent, the coating of the reinforced insulating wire layer in the wire coating adopts a wire bonding process technology, and the coating layer in the wire coating also adopts a gapless coating process technology, so that the insulativity of the wire coating is greatly improved.

Strengthen the protective layer bonding outside high temperature resistant layer, through establishing the enhancement protective layer into latticedly, make it as an organic whole through bonding solvent bonding outside high temperature resistant layer, reduced the bulging phenomenon that silk envelope curve produced after bending, the effectual product quality who improves silk envelope curve.

Drawings

Fig. 1 is a schematic axial view of the present invention.

Fig. 2 is a schematic view of the structure of the utility model with the insulating paint layer removed.

Fig. 3 is a schematic sectional structure diagram of the present invention.

Fig. 4 is a schematic sectional view of the position a-a in fig. 3 according to the present invention.

Fig. 5 is a schematic diagram of a partially enlarged structure at B in fig. 4 according to the present invention.

In the drawings, the corresponding relationship between the component names and the reference numbers is as follows:

1. a wire; 2. a binding solvent; 3. a coating layer; 4. a reinforcing insulating filament layer; 5. a high temperature resistant layer; 6. reinforcing the protective layer; 7. an insulating paint layer; 8. the silk covered wire main body.

Detailed Description

The following describes embodiments of the present invention in further detail with reference to the accompanying drawings and examples. The following examples are intended to illustrate the invention, but are not intended to limit the scope of the invention.

In the description of the present invention, "a plurality" means two or more unless otherwise specified; the terms "upper", "lower", "left", "right", "inner", "outer", "front", "rear", "head", "tail", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are merely for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "connected" and "connected" are to be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; may be directly connected or indirectly connected through an intermediate. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Example (b):

as shown in figures 1 to 5:

the utility model provides a solvent bonding shaping silk covered wire, which comprises a lead 1, a bonding solvent 2, a coating layer 3, a reinforced insulating silk layer 4, a high temperature resistant layer 5, a reinforced protective layer 6, an insulating paint layer 7 and a silk covered wire main body 8; the wire 1, the bonding solvent 2, the coating layer 3, the reinforced insulating wire layer 4, the high temperature resistant layer 5, the reinforced protective layer 6 and the insulating paint layer 7 jointly form a wire-covered wire main body 8, as shown in the attached drawing 3; the outer peripheral surface of the lead 1 is adhered with a coating layer 3 through an adhesive solvent 2, and the outer peripheral surface of the coating layer 3 is adhered with a layer of the reinforced insulating wire layer 4 which is distributed in a winding shape through the adhesive solvent 2, as shown in the attached drawings 3 to 5; the high temperature resistant layer 5 is adhered to the outside of the reinforced insulating wire layer 4 in a reverse winding shape through the adhesive solvent 2, and the peripheral surface of the high temperature resistant layer 5 is adhered with the reinforced protective layer 6 through the adhesive solvent 2; the outer peripheral surface of the reinforcing protection layer 6 is coated with the insulating paint layer 7 in an impregnating manner, as shown in fig. 3 to 5.

The reinforced insulating wire layer 4, the high temperature resistant layer 5 and the reinforced protective layer 6 are all made of silk thread bonding technology in the silk covered wire main body 8, and the reinforced insulating wire layer 4 is located inside the high temperature resistant layer 5, as shown in figure 3, so that the silk covered wire has better insulating property, and the voltage resistance of the silk covered wire is improved.

The coating layer 3 is located outside the lead 1, as shown in fig. 3, and a gapless coating process technology is adopted between the coating layer 3 and the lead 1, so that the silk covered wire has better sealing performance, and the insulation performance of the silk covered wire is further improved.

The reinforcing protective layer 6 is distributed outside the high temperature resistant layer 5 in a grid shape through the bonding solvent 2, as shown in the attached drawing 2, the thickness of the reinforcing protective layer 6 accounts for one fourth of the thickness of the high temperature resistant layer 5, and the reinforcing protective layer is bonded outside the high temperature resistant layer 5 through the bonding solvent 2 into a whole, so that the bulging phenomenon generated after the silk covered wire is bent is reduced, and the product quality of the silk covered wire is effectively improved.

Wherein, the thickness on high temperature resistant layer 5 equals with the thickness on reinforcing insulated wire layer 4, and the winding direction on high temperature resistant layer 5 and reinforcing insulated wire layer 4 is opposite, through high temperature resistant layer 5, makes silk covered wire have better high temperature resistance, has improved the product quality of silk covered wire to it is safer when using to make silk covered wire.

The specific use mode and function of the embodiment are as follows:

in the utility model, when in use, the current is transmitted through the wire 1, when the voltage pressure on the wire 1 reaches 2500V-3000V under the high-pressure working condition, the wire covered wire can not be punctured by high voltage to cause short circuit under the working condition of 2500V-3000V by adopting the enhanced insulated wire layer 4 and the insulated paint layer 7 bonded by the silk thread bonding process technology, thereby effectively solving the market application problem and greatly improving the insulativity of the wire covered wire; when the silk covered wire needs to be bent, the reinforcing protective layer 6 is arranged to be in a grid shape, so that the silk covered wire is bonded outside the high temperature resistant layer 5 into a whole through the bonding solvent 2, the bulging phenomenon generated after the silk covered wire is bent is reduced, and the product quality of the silk covered wire is effectively improved.

The embodiments of the present invention have been presented for purposes of illustration and description, and are not intended to be exhaustive or limited to the invention in the form disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiment was chosen and described in order to best explain the principles of the invention and the practical application, and to enable others of ordinary skill in the art to understand the invention for various embodiments with various modifications as are suited to the particular use contemplated.

Claims (5)

1. A solvent bonding shaping silk covered wire which is characterized in that: the solvent bonding shaping silk covered wire comprises a lead (1), a bonding solvent (2), a coating layer (3), a reinforced insulating silk layer (4), a high temperature resistant layer (5), a reinforced protective layer (6), an insulating paint layer (7) and a silk covered wire main body (8); the wire (1), the bonding solvent (2), the coating layer (3), the reinforced insulating wire layer (4), the high-temperature resistant layer (5), the reinforced protective layer (6) and the insulating paint layer (7) jointly form a wire-coated wire main body (8); the outer peripheral surface of the lead (1) is adhered with a coating layer (3) through an adhesive solvent (2), and the outer peripheral surface of the coating layer (3) is adhered with a layer of the reinforced insulating wire layer (4) which is distributed in a winding shape through the adhesive solvent (2); the high-temperature resistant layer (5) is adhered to the outside of the reinforced insulating wire layer (4) in a winding shape through an adhesive solvent (2), and the peripheral surface of the high-temperature resistant layer (5) is adhered with a reinforced protective layer (6) through the adhesive solvent (2); the outer peripheral surface of the reinforcing protective layer (6) is coated with the insulating paint layer (7) in a dip-coating mode.

2. The solvent-bonded stock silk covered wire of claim 1, wherein: the reinforced insulating wire layer (4), the high temperature resistant layer (5) and the reinforced protective layer (6) are all made by adopting a silk thread bonding process technology in the silk covered wire main body (8), and the reinforced insulating wire layer (4) is positioned inside the high temperature resistant layer (5).

3. The solvent-bonded stock silk covered wire of claim 1, wherein: the coating layer (3) is positioned outside the lead (1), and a gapless coating process technology is adopted between the coating layer (3) and the lead (1).

4. The solvent-bonded stock silk covered wire of claim 1, wherein: the reinforcing protective layer (6) is distributed outside the high temperature resistant layer (5) in a grid shape through the bonding solvent (2), and the thickness of the reinforcing protective layer (6) accounts for one fourth of the thickness of the high temperature resistant layer (5).

5. The solvent-bonded stock silk covered wire of claim 1, wherein: the thickness of the high-temperature resistant layer (5) is equal to that of the reinforced insulating wire layer (4), and the winding directions of the high-temperature resistant layer (5) and the reinforced insulating wire layer (4) are opposite.