CN209859156U

CN209859156U - Fingerprint identification device and under-screen fingerprint identification electronic equipment

Info

Publication number: CN209859156U
Application number: CN201921020635.2U
Authority: CN
Inventors: 吕亮; 刘文涛
Original assignee: Silead Inc
Current assignee: Silead Inc
Priority date: 2019-07-01
Filing date: 2019-07-01
Publication date: 2019-12-27
Anticipated expiration: 2029-07-01

Abstract

The application discloses fingerprint identification device and under-screen fingerprint identification electronic equipment. Wherein, a fingerprint identification device includes: a circuit board; the circuit board is provided with a containing through hole for penetrating the circuit board; the light sensing assembly is electrically connected with the circuit board; the light sensing assembly is positioned in the accommodating through hole and used for processing light signals; the box dam structure is arranged on the circuit board; the dam structure surrounds the light sensation component; the glue filling space is positioned among the light sensing assembly, the dam structure and the circuit board; and the glue filling space is filled with an adhesive for fixing the light sensation assembly on the circuit board. The application provides a fingerprint identification device and screen fingerprint identification electronic equipment can be favorable to reducing fingerprint identification device's thickness.

Description

Fingerprint identification device and under-screen fingerprint identification electronic equipment

Technical Field

The application relates to the field of fingerprint identification, in particular to a fingerprint identification device and an electronic device for identifying fingerprints under a screen.

Background

The statements in this section merely provide background information related to the present disclosure and may not constitute prior art to the present disclosure.

The technology of optical fingerprint recognition under screen is rapidly developed and applied because it does not occupy the surface space of electronic devices (e.g., smart phones).

However, at present, the module structure that optical fingerprint identification technique adopted under the screen is more complicated, and its whole thickness is great, and the thickness that is subject to the cell-phone does not place the space of battery under the fingerprint identification structure, leads to being difficult to promote battery capacity in limited space, compares in the fingerprint cell-phone under the non-screen, and battery capacity is less, influences cell-phone duration.

In addition, when reworking is needed in the production process or repairing is conducted on a subsequent complete machine, the fingerprint structure needs to be installed and disassembled, the vulnerability of the fingerprint structure and the screen is limited, and the fingerprint structure or the screen is extremely easy to damage in the reworking or repairing process, so that the yield is affected, and the cost is lost.

It should be noted that the above background description is only for the convenience of clear and complete description of the technical solutions of the present application and for the understanding of those skilled in the art. Such solutions are not considered to be known to the person skilled in the art merely because they have been set forth in the background section of the present application.

SUMMERY OF THE UTILITY MODEL

In view of the deficiencies of the prior art, it is an object of the present application to provide a fingerprint identification device and an off-screen fingerprint identification electronic device that can facilitate reducing the thickness of the fingerprint identification device.

Another object of the present application is to provide a fingerprint recognition device and an electronic device for underscreen fingerprint recognition, which can be advantageous for preventing the fingerprint recognition device or the screen from being damaged when the fingerprint recognition device is mounted and dismounted.

In order to achieve at least one of the above purposes, the following technical scheme is adopted in the application:

a fingerprint recognition device, comprising:

a circuit board; the circuit board is provided with a containing through hole for penetrating the circuit board;

the light sensing assembly is electrically connected with the circuit board; the light sensing assembly is positioned in the accommodating through hole and used for processing light signals;

the box dam structure is arranged on the circuit board; the dam structure surrounds the light sensation component;

the glue filling space is positioned among the light sensing assembly, the dam structure and the circuit board; and the glue filling space is filled with an adhesive for fixing the light sensation assembly on the circuit board.

As a preferred embodiment, the light sensation member includes:

the light sensing chip is used for processing the optical signal to form an electric signal; the light sensing chip is provided with a first surface and a second surface which are opposite; the first surface is provided with a light sensing part for sensing optical signals;

a light modulating component disposed on the first surface of the light sensing chip; the light adjusting component is used for inputting light rays into the light sensing part in a parallel light mode.

In a preferred embodiment, the fingerprint identification device further comprises an adhesive base layer; the bonding base layer is provided with a first bonding surface bonded with the second surface, the surface of the circuit board, which faces away from the dam structure, and a second bonding surface which faces away from the first bonding surface.

As a preferred embodiment, the second adhesive surface is covered with a removable release film.

In a preferred embodiment, the height of the dam structure is lower than the height of the light adjusting component relative to the plane of the second surface; the filling height of the adhesive is below the height of the dam structure.

In a preferred embodiment, the light conditioning assembly includes a collimator adhered to the first surface; the collimator is bonded to the first surface by an adhesive layer.

In a preferred embodiment, the light transmittance of the adhesive layer is 95% or more; the thickness of the bonding layer is 10-50 microns.

As a preferred embodiment, the thickness of the collimator is 150 to 500 micrometers in the direction from the first surface to the second surface; the thickness of the fingerprint identification device is 0.28 mm to 1.5 mm.

In a preferred embodiment, a surface of the light modulation component facing the light sensing chip is plated with a filter.

In a preferred embodiment, the distance between the circuit board and the light sensing chip is more than 50 microns.

In a preferred embodiment, the distance between the dam structure and the light sensing chip is greater than the distance between the circuit board and the light sensing chip.

As a preferred embodiment, the circuit board is provided with a metal connecting part; the metal connecting part is positioned on one side of the dam structure, which is far away from the light sensation component.

An electronic device for identifying fingerprints under a screen comprises

A housing; a middle frame is arranged in the shell;

a display screen disposed on the housing;

the fingerprint identification device is fixed on the middle frame; the fingerprint identification device is arranged on the inner side of the display screen, and a spacing gap is formed between the fingerprint identification device and the display screen; the fingerprint identification device comprises:

In a preferred embodiment, the fingerprint identification device further comprises an adhesive base layer; the bonding base layer is provided with a first bonding surface and a second bonding surface, wherein the first bonding surface is bonded with the surface, back to the display screen, of the light sensation assembly, and the second bonding surface is back to the first bonding surface; the fingerprint identification device is fixedly bonded on the middle frame through the second bonding surface.

As a preferred embodiment, the middle frame is provided with a containing groove for containing the fingerprint identification device; the second bonding surface is bonded and fixed with the bottom surface of the accommodating groove.

Has the advantages that:

the application provides a fingerprint identification device holds the through-hole in order to place the light sense subassembly through setting up on the circuit board, and the circuit board does not occupy fingerprint identification device's thickness to can reduce fingerprint identification's thickness, the processing of being convenient for forms ultra-thin fingerprint identification device.

When this fingerprint identification device is applied to electronic equipment such as smart mobile phone, utilize this fingerprint identification device can form the characteristics of ultra-thin fingerprint identification structure, can place the battery in this fingerprint identification device's below with the thickness of preferred to electronic equipment can have bigger battery capacity, guarantees good battery continuation of the journey.

The utility model provides a fingerprint identification device can install in the center when installing in electronic equipment such as smart mobile phone, because fingerprint identification device has thinner thickness, thereby fingerprint identification device can and the screen between keep certain spacing distance, the two contactless, thereby when dismantling the installation with fingerprint identification device, the two is difficult for taking place the touching phenomenon, consequently, the fingerprint identification device that this embodiment provided can be favorable to avoiding fingerprint identification device or screen to be destroyed when dismantling the fingerprint identification device in the installation.

Specific embodiments of the present invention are disclosed in detail with reference to the following description and the accompanying drawings, which specify the manner in which the principles of the invention may be employed. It should be understood that the embodiments of the present invention are not so limited in scope.

Features that are described and/or illustrated with respect to one embodiment may be used in the same way or in a similar way in one or more other embodiments, in combination with or instead of the features of the other embodiments.

It should be emphasized that the term "comprises/comprising" when used herein, is taken to specify the presence of stated features, integers, steps or components but does not preclude the presence or addition of one or more other features, integers, steps or components.

Drawings

In order to illustrate the embodiments of the present invention or the technical solutions in the prior art more clearly, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.

FIG. 1 is a schematic diagram of a fingerprint recognition device according to an embodiment of the present application;

FIG. 2 is a top view of FIG. 1;

FIG. 3 is a labeled diagram of FIG. 1.

Detailed Description

In order to make the technical solutions in the present invention better understood, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, but not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts shall fall within the protection scope of the present invention.

It will be understood that when an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Please refer to fig. 1 to 3. An embodiment of the present application provides a fingerprint identification device, and this fingerprint identification device can be applied to fingerprint identification electronic equipment under the screen, and this electronic equipment can include touch screen cell-phone, or fingerprint punched-card machine, also can be applied to fingerprint input equipment certainly. Preferably, the fingerprint identification device is applied to a mobile phone, and particularly can be placed below (inside) a touch screen of the mobile phone, so that a full-screen mobile phone is formed.

Specifically, the fingerprint identification device includes: a circuit board 3; the light sensing assembly is electrically connected with the circuit board 3; and the box dam structure 6 is arranged on the circuit board 3. Wherein the circuit board 3 has a receiving through hole 31 penetrating therethrough; the light sensing assembly is positioned in the accommodating through hole 31 and is used for processing optical signals; the dam structure 6 surrounds the light sensing component.

The fingerprint identification device further comprises: and the glue filling space is positioned between the light sensing assembly and the dam structure 6 as well as the circuit board 3. The glue filling space is filled with an adhesive 8 for fixing the light sensing assembly on the circuit board 3.

The fingerprint identification device that this embodiment provided holds through-hole 31 in order to place the light sense subassembly through setting up on circuit board 3, and circuit board 3 does not occupy fingerprint identification device's thickness to can reduce fingerprint identification's thickness, the processing of being convenient for forms ultra-thin fingerprint identification device.

When the fingerprint identification device is applied to electronic equipment such as a smart phone, the battery can be placed below the fingerprint identification device in a better thickness by utilizing the ultrathin characteristic of the fingerprint identification device, so that the electronic equipment can have larger battery capacity, and excellent battery endurance is ensured.

The fingerprint identification device that this embodiment provided can install in the center when installing in electronic equipment such as smart mobile phone, because the fingerprint identification device has thinner thickness to the fingerprint identification device can and the screen between keep certain spacing distance, the two mutual contactless, thereby when dismantling the installation with the fingerprint identification device, the two is difficult for taking place the touching phenomenon, consequently, the fingerprint identification device that this embodiment provided can be favorable to avoiding fingerprint identification device or screen to be destroyed when the fingerprint identification device is dismantled in the installation.

In the embodiment of the present application, the optical sensing component can process the optical signal. The light sensing assembly can screen out parallel light in input light and process the parallel light to form an electric signal capable of carrying out fingerprint identification. Specifically, the light sensation component includes: a light sensing chip 1 and a light adjusting component 2. The light sensing chip 1 is used for processing the optical signal to form an electrical signal. The light sensing chip 1 is provided with a first surface and a second surface which are opposite; the first surface has a light sensing portion for sensing a light signal. The light adjusting component 2 is disposed on the first surface of the light sensing chip 1. The light adjusting member 2 is used to input light into the light sensing section in the form of parallel light.

In the present embodiment, the light modulation element 2 may cover the entire light sensing portion. The area of the first surface is larger than the projection area of the light adjusting component 2 on the first surface, and the light adjusting component 2 can be smaller than the area of the upper surface of the optical sensing chip 1, so that the cost can be reduced. At this time, the projection of the light conditioning assembly 2 is located within the first surface, i.e., the light conditioning assembly 2 may partially cover the first surface. Of course, the projection of the light conditioning assembly 2 may also be equal to the first surface in some embodiments.

The light adjusting component 2 screens light, screens parallel light in the input light and transmits the parallel light to a light sensing part on the light sensing chip 1. The light adjusting component 2 can be a glass collimator or a silicon pinhole collimating structure, and can also realize light collimation by manufacturing a photoresist structure with a customized pattern on the surface of the light sensing chip 1. In this embodiment, the light conditioning assembly 2 may be a glass collimator, such as a fiber collimator.

In order to substantially reduce the thickness of the fingerprint recognition device, the light adjusting assembly 2 includes a collimator adhered to the first surface. The collimator is bonded to the first surface by an adhesive layer 7. The adhesive layer 7 is made of transparent adhesive material. For example, the adhesive layer 7 is a transparent glue after curing. In order to avoid light intensity loss and ensure the success rate of fingerprint identification, the light transmittance of the bonding layer 7 is more than 95%. The thickness of the bonding layer 7 is 10-50 microns. The refractive index of the adhesive layer 7 may be 1.5 or less, and specifically, the refractive index of the adhesive layer 7 may be 1.48.

In order to have better light collimation effect and output parallel light with better parallelism, the thickness of the collimator is 150 micrometers to 500 micrometers along the direction from the first surface to the second surface. In the embodiment of the application, the thickness of the fingerprint identification device is 0.28 mm to 1.5 mm. Preferably, the fingerprint recognition device has a thickness of 0.8 or less. The direction from the first surface to the second surface is parallel to the thickness direction, and as shown in fig. 1, the direction F is the thickness direction. In the embodiment shown in fig. 1-3, the thickness T of the fingerprint recognition device may be 0.33 mm (the separation film 5 may be removed during use, and does not take up an actual thickness). In some embodiments, the fingerprint recognition device may not have an adhesive substrate, and thus, the fingerprint recognition device may be 0.3 mm or even 0.28 thick.

The surface of the light adjusting component 2 facing the light sensing chip 1 is plated with a light filter (not shown). The filter film is an IP filter film. The filter film is plated on the light adjusting component 2 and has an ultra-thin thickness. Specifically, the filter film may be deposited on the surface of the light modulation element 2 by PVD. In order to protect the filter film, the filter film is coated on the lower surface of the collimator and is covered by the adhesive layer 7, so that the filter film is prevented from being damaged due to exposure.

In this embodiment, the circuit board 3 and the light sensing chip 1 are electrically connected through the metal connecting wire 9, and the light sensing chip 1 forms an electrical signal carrying fingerprint information and transmits the electrical signal to the circuit board 3 through the metal connecting wire 9. The circuit board 3 can transmit the electric signal to the controller for fingerprint identification. Of course, the circuit board 3 may have electronic components for performing signal processing on the electric signals. The circuit board 3 may be a PCB board. The cured adhesive 8 can wrap the metal connecting wire 9, so that the metal connecting wire 9 is effectively protected.

For the thickness that reduces fingerprint identification device, circuit board 3 has been seted up and has been held through-hole 31, holds through-hole 31 and holds the light sense subassembly for circuit board 3 itself does not occupy fingerprint identification device thickness. The light sensing chip 1 (or light sensing element) does not contact the inner wall of the receiving through-hole 31. The shape of the receiving through hole 31 may or may not match the shape of the light sensing chip 1 (or the light sensing component), and the application is not limited thereto. The receiving through-hole 31 penetrates the circuit board 3 in the thickness direction of the circuit board 3, so that the circuit board 3 itself does not occupy the thickness of the fingerprint recognition assembly.

Considering that there is tolerance when the fixed position of light sense chip 1 and circuit board 3 and need leave the space when fixing metal connecting wire 9's both ends welded (there are two solder joints at metal connecting wire 9's both ends, just conveniently make the second solder joint to first solder joint welding completion need advance a distance in welding process), based on this consideration, certain distance is separated between circuit board 3 and the light sense chip 1, promptly, light sense chip 1 and the inner wall that holds through-hole 31 are contactless. As shown in fig. 3, the distance L1 between the circuit board 3 and the photo sensor chip 1 is more than 50 μm. In the present embodiment, the circuit board 3 and the photo sensor chip 1 are spaced apart by 200 μm.

In the embodiment of the present application, the dam structure 6 may be adhesively fixed to the upper surface of the circuit board 3. The annular shape of the dam structure 6 may be a regular circle, an ellipse, or an irregular ring, and the present application is not limited thereto. In order to enable the injected adhesive 8 to completely wrap the metal connecting wire 9 and effectively protect the metal connecting wire 9, the distance between the dam structure 6 and the light sensing chip 1 is larger than the distance between the circuit board 3 and the light sensing chip 1. In fig. 3, the distance between the dam structure 6 and the photo sensor chip 1 is the sum of L1 and L2. The dam structure 6 is an annular structure that is fixedly mounted on the upper surface of the circuit board 3. The dam structure 6 may be a plastic ring or a metal ring, and the application is not limited thereto.

Further, a metal connecting portion 10 is further provided on the circuit board 3. The metal connecting part 10 is located on one side of the dam structure 6 far away from the light sensing component. The metal connection 10 may be used for subsequent ACF bonding (ACF bonding), wherein the circuit board 3 may conduct electrical signals carrying fingerprints through the FPC through the metal connection 10.

In order to facilitate the injection of the adhesive 8 and the fixed mounting of the fingerprint recognition device, the fingerprint recognition device further comprises a bonding base layer 4. The bonding base layer 4 has a first bonding surface bonded to the second surface, a surface of the circuit board 3 facing away from the dam structure 6, and a second bonding surface facing away from the first bonding surface. Specifically, the adhesive base layer 4 may be a double-sided tape. The bonding base layer 4 is integrally arranged on one side of the light sensing assembly and the circuit board 3 back to the display screen. The bonding base layer 4 can temporarily fix the photosensitive assembly and the circuit board 3, and plugs the lower part of the glue filling space, so that the glue filling space forms an upward glue filling opening.

This bonding basic unit 4 not only can be with light sense subassembly and 3 position temporary fixation of circuit board, can also conveniently fill adhesive 8 to the filler space, at adhesive 8 solidification shaping, when light sense subassembly and box dam structure 6, circuit board 3 formed the overall structure of a structural stability preferred, this bonding basic unit 4 can continue to remain to utilize the second bonding surface to bond this fingerprint identification equipment at the target location when being applied to electronic equipment, for example on the inside center of cell-phone casing.

To avoid exposing the second adhesive surface to mis-adhere non-target sites or to adhere impurities, the second adhesive surface is covered with a removable release film 5. By providing the separation film 5, the second adhesive surface is prevented from being exposed, so that the fingerprint recognition device can stand alone to be transported or stand alone. In this embodiment, the isolation film 5 may be a release film. When the fingerprint identification device is installed at the target position, the operator can tear the isolation film 5 off and then fixedly adhere the fingerprint identification device to the target position in a manner that the second adhesion surface faces the target adhesion surface.

Of course, the base layer 4 may be eliminated in some other embodiments. For example, a temporary substrate can be arranged on one side of the light sensing assembly and the circuit board 3, which is opposite to the display screen, the lower part of the glue filling space is sealed through the temporary substrate so as to be convenient for glue injection, the temporary substrate is removed after the adhesive 8 is cured, the fingerprint identification device with the ultrathin characteristic can be obtained at the moment, the thickness of the fingerprint identification device can be made to be less than 0.3 mm under some conditions, and the fingerprint identification device has a very huge market application value.

It should be noted that "up" and "down" described in this embodiment may refer to the orientation when the reader faces fig. 1, and may also refer to the position of the fingerprint identification device in the intelligent electronic device relative to the display screen, for example: the display screen is "up" close to the display screen and "down" far from the display screen.

In the present embodiment, the adhesive 8 may be glue. Through to glue space injection glue, surround the light sense subassembly after waiting the glue solidification, form effective protection to the light sense subassembly to, glue after the solidification can be fixed in the light sense subassembly on circuit board 3 for this fingerprint identification device has the structural strength of preferred, has the life of preferred. The filled adhesive 8 is cured to protect the metal connecting wires 9 electrically connecting the circuit board 3 and the photosensitive elements.

For avoid the adhesive 8 to overflow, avoid disturbing the light input of light adjusting component 2, for the plane at second surface place, dam structure 6 highly is in light adjusting component 2 highly below. The filling level of the adhesive 8 is below the level of the dam structure 6. In this embodiment, the surface of the circuit board 3 facing away from the dam structure 6 is flush with the second surface, and both are placed on the adhesive base layer 4. The circuit board 3 and the light sensing chip 1 are located on the upper surface of the bonding base layer 4, the upper surface of the bonding base layer 4 forms a bearing plane for bearing the circuit board 3 and the light sensing chip 1, and the height of the dam structure 6 and the optical fiber adjusting assembly can be the height relative to the bearing plane.

As shown in fig. 3, the height direction is also the thickness direction of the fingerprint recognition device and its components (the light sensing chip 1, the collimator, the circuit board 3, and the dam structure 6). The height of the dam structure 6 is the distance L3 (also understood as the thickness) between the surface of the dam structure 6 facing away from the circuit board 3 (upper surface) and the plane of the second surface (or the lower surface of the circuit board 3); accordingly, the height of the light adjustment member 2 is the distance (also can be understood as the thickness) between the surface (upper surface) of the light adjustment member 2 facing away from the photo-sensing chip 1 and the second surface.

Based on the same concept, the present invention also provides an electronic device, as described in the following embodiments. Because the principle of solving the problems and the technical effect that can be obtained by the electronic equipment are similar to the fingerprint identification device, the implementation of the electronic equipment can refer to the implementation of the fingerprint identification device, and repeated parts are not repeated.

An embodiment of the present application further provides an electronic device for identifying fingerprints under a screen, including: a housing; a display screen; fingerprint identification device. The display screen is arranged on the shell. A middle frame is arranged in the shell; the fingerprint identification device is fixed on the middle frame. The fingerprint identification device set up in the display screen inboard and with be equipped with the interval clearance between the display screen.

Wherein, this fingerprint identification device includes: a circuit board 3; the light sensing assembly is electrically connected with the circuit board 3; and the box dam structure 6 is arranged on the circuit board 3. Wherein the circuit board 3 has a receiving through hole 31 penetrating therethrough; the light sensing assembly is positioned in the accommodating through hole 31 and is used for processing optical signals; the dam structure 6 surrounds the light sensing component. The fingerprint identification device further comprises: and the glue filling space is positioned between the light sensing assembly and the dam structure 6 as well as the circuit board 3. The glue filling space is filled with an adhesive 8 for fixing the light sensing assembly on the circuit board 3.

The fingerprint recognition device further comprises an adhesive base layer 4. The bonding base layer 4 has a first bonding surface bonded to the surface of the light sensing member facing away from the display screen, and a second bonding surface facing away from the first bonding surface. The fingerprint identification device is fixedly bonded on the middle frame through the second bonding surface.

The middle frame is provided with an accommodating groove for accommodating the fingerprint identification device; the second bonding surface is bonded and fixed with the bottom surface of the accommodating groove. The thickness of some fingerprint identification device can be consumed to this holding tank, and fingerprint identification device can be born to the tank bottom (bottom surface) of holding tank. This electronic equipment can further reduce the shared thickness of fingerprint identification device through the thickness that utilizes partial center, is favorable to placing the large capacity battery.

In summary, the fingerprint identification device can be fixed on the middle frame, and the fingerprint identification device is small in thickness, can be placed between the battery and the display screen and is not in contact with the battery and the display screen, so that the problem that the fingerprint identification device is damaged by touching the battery or the screen under some use conditions (such as repair, falling and the like) is avoided.

It should be noted that the electronic device provided in the present embodiment may have any suitable conventional configuration, such as a control portion, a display portion for displaying a screen, and other portions (e.g., a housing portion and a key portion). For clearly and briefly explaining the technical solution provided by the present embodiment, the above parts will not be described again, and the drawings in the specification are also simplified accordingly. It should be understood, however, that the present embodiments are not limited in scope thereby.

Any numerical value recited herein includes all values from the lower value to the upper value that are incremented by one unit, provided that there is a separation of at least two units between any lower value and any higher value. For example, if it is stated that the number of a component or a value of a process variable (e.g., temperature, pressure, time, etc.) is from 1 to 90, preferably from 20 to 80, and more preferably from 30 to 70, it is intended that equivalents such as 15 to 85, 22 to 68, 43 to 51, 30 to 32 are also expressly enumerated in this specification. For values less than 1, one unit is suitably considered to be 0.0001, 0.001, 0.01, 0.1. These are only examples of what is intended to be explicitly recited, and all possible combinations of numerical values between the lowest value and the highest value that are explicitly recited in the specification in a similar manner are to be considered.

Unless otherwise indicated, all ranges include the endpoints and all numbers between the endpoints. The use of "about" or "approximately" with a range applies to both endpoints of the range. Thus, "about 20 to about 30" is intended to cover "about 20 to about 30", including at least the endpoints specified.

The term "consisting essentially of …" describing a combination shall include the identified element, ingredient, component or step as well as other elements, ingredients, components or steps that do not materially affect the basic novel characteristics of the combination. The use of the terms "comprising" or "including" to describe combinations of elements, components, or steps herein also contemplates embodiments that consist essentially of such elements, components, or steps. By using the term "may" herein, it is intended to indicate that any of the described attributes that "may" include are optional.

It is to be understood that the above description is intended to be illustrative, and not restrictive. Many embodiments and many applications other than the examples provided will be apparent to those of skill in the art upon reading the above description. The scope of the present teachings should, therefore, be determined not with reference to the above description, but should instead be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled. The disclosures of all articles and references, including patent applications and publications, are hereby incorporated by reference for all purposes. The omission in the foregoing claims of any aspect of the subject matter that is disclosed herein is not intended to forego such subject matter, nor should the inventors be construed as having contemplated such subject matter as being part of the disclosed inventive subject matter.

Claims

1. A fingerprint recognition device, comprising:

2. The fingerprint recognition device as claimed in claim 1, wherein said light-sensing member comprises:

3. The fingerprint identification device of claim 2, wherein said fingerprint identification device further comprises an adhesive substrate; the bonding base layer is provided with a first bonding surface bonded with the second surface, the surface of the circuit board, which faces away from the dam structure, and a second bonding surface which faces away from the first bonding surface.

4. The fingerprint recognition device of claim 3, wherein said second adhesive surface is covered with a removable release film.

5. The fingerprint identification device of claim 2 wherein the height of the dam structure relative to the plane of the second surface is below the height of the light conditioning assembly; the filling height of the adhesive is below the height of the dam structure.

6. The fingerprint identification device of claim 2, wherein the light conditioning assembly comprises a collimator adhered to the first surface; the collimator is bonded to the first surface by an adhesive layer.

7. The fingerprint identification device of claim 6, wherein said adhesive layer has a light transmittance of 95% or more; the thickness of the bonding layer is 10-50 microns.

8. The fingerprint recognition device of claim 6, wherein the collimator has a thickness of 150 to 500 microns along the direction from the first surface to the second surface; the thickness of the fingerprint identification device is 0.28 mm to 1.5 mm.

9. The fingerprint recognition device as claimed in claim 2, wherein a surface of said light modulating element facing said light sensing chip is coated with a light filter.

10. The fingerprint identification device of claim 1, wherein the circuit board is spaced from the photo sensor chip by a distance of greater than 50 microns.

11. The fingerprint identification device as claimed in claim 1 wherein the dam structure is spaced from the photo sensor chip by a distance greater than the circuit board.

12. The fingerprint recognition device of claim 1, wherein the circuit board has a metal connection portion; the metal connecting part is positioned on one side of the dam structure, which is far away from the light sensation component.

13. An electronic device for identifying fingerprints under a screen, comprising

A housing; a middle frame is arranged in the shell;

a display screen disposed on the housing;

14. The underscreen fingerprint identification electronic device of claim 13, wherein said fingerprint identification device further comprises an adhesive substrate; the bonding base layer is provided with a first bonding surface and a second bonding surface, wherein the first bonding surface is bonded with the surface, back to the display screen, of the light sensation assembly, and the second bonding surface is back to the first bonding surface; the fingerprint identification device is fixedly bonded on the middle frame through the second bonding surface.

15. The electronic device of claim 14, wherein the middle frame is provided with a receiving slot for receiving the fingerprint recognition device; the second bonding surface is bonded and fixed with the bottom surface of the accommodating groove.