CN209811389U - Tin wave height monitoring device for selective wave crest soldering machine - Google Patents
Tin wave height monitoring device for selective wave crest soldering machine Download PDFInfo
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- CN209811389U CN209811389U CN201920093799.1U CN201920093799U CN209811389U CN 209811389 U CN209811389 U CN 209811389U CN 201920093799 U CN201920093799 U CN 201920093799U CN 209811389 U CN209811389 U CN 209811389U
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- supporting column
- tin
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- transmission mechanism
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Abstract
The utility model relates to a tin wave height monitoring device for selective wave crest soldering machine, which belongs to the technical field of wave crest soldering, a PCB workpiece is positioned above a diversion trench, the tin wave height monitoring device also comprises a first supporting column and a second supporting column which are arranged at two sides of a tin pan, a first cavity is arranged inside the first supporting column and the second supporting column, a transmission mechanism is respectively arranged in the first cavity, a signal transmitting device is fixedly arranged on the transmission mechanism on the first supporting column, the first supporting column and the second supporting column are respectively provided with a signal transmitting device and a signal receiving device, the signal transmitting device and the signal receiving device are mutually matched, the wave crest thickness blocked between the first supporting column and the second supporting column can be monitored in real time, then a display screen displays specific numerical values, when the numerical value is larger, the distance from the wave crest to the PCB workpiece is larger, the numerical value is smaller, the distance from the wave crest to the PCB, the tin wave height can be monitored in real time.
Description
Technical Field
The utility model relates to a selectivity crest soldering machine is tin ripples height monitoring device for machinery belongs to crest soldering technical field.
Background
Wave-soldering is that the face of weld who lets the plug-in board directly reaches the welding purpose with the contact of high temperature liquid tin, its high temperature liquid tin keeps an inclined plane, and make liquid tin form the phenomenon of a similar wave by special device, the miniaturization of present electronic product, surface-mounted welding technique is used mostly, but to some heavy current circuit, most still is wave-soldering as leading, present stage, mainly still regard as leading with staff's naked eye observation to the control of wave-soldering face, waste time and energy, and the data error of observation is great.
SUMMERY OF THE UTILITY MODEL
The utility model discloses the technical problem who solves overcomes current defect, provides a tin ripples height monitoring device for selectivity crest soldering machine tool, can effectively solve the problem in the background art.
In order to solve the technical problem, the utility model provides a following technical scheme:
a tin wave height monitoring device for selective wave crest tin soldering machinery comprises a tin pot, a diversion trench arranged in the tin pot and connected through a connecting rod, a PCB workpiece arranged above the diversion trench, a first supporting column and a second supporting column arranged at two sides of the tin pot, the first supporting column and the second supporting column are both internally provided with a first cavity, the first cavity is internally provided with a transmission mechanism, the transmission mechanism on the first supporting column is fixedly provided with a signal transmitting device, the transmission mechanism on the second supporting column is fixedly provided with a signal receiving device, the center of the signal transmitting device and the center of the signal receiving device are aligned with the ray and are positioned below the PCB workpiece, the first support column and the second support column are both fixedly connected with a power mechanism, and the power mechanisms are matched with the transmission mechanism;
the inside of first support column still is provided with the second cavity, just be provided with battery and controller in the second cavity, the side of first support column still is connected with the display screen through the connecting rod, the controller electricity respectively connect power unit, signal emission device, signal receiving arrangement in the display screen.
Further, the center of the signal transmitting device and the center of the signal receiving device are opposite to a ray and are 5mm away from the lower portion of the PCB workpiece.
Further, the signal transmitting device and the signal receiving device are respectively an ultrasonic transmitter and an ultrasonic thickness sensor.
Further, drive mechanism include the gear, with pinion rack and the fixed connection of gear engagement are in the bracing piece of pinion rack tip, the side of pinion rack passes through the pulley joint and is in on the slide rail that first cavity inner wall set up.
Furthermore, the power mechanism comprises a motor box and a motor fixedly arranged in the motor box, and a rotating shaft of the motor is rotatably connected with the gear.
The utility model discloses beneficial effect: the first supporting column and the second supporting column are respectively provided with the signal transmitting device and the signal receiving device, the signal transmitting device and the signal receiving device are matched with each other, the thickness of a wave crest between the first supporting column and the second supporting column can be monitored in real time, then a specific numerical value is displayed on a display screen, when the numerical value is larger, the larger the distance between the wave crest and a PCB workpiece is, the smaller the numerical value is, the larger the distance between the wave crest and the PCB workpiece is, and the effect of well monitoring the height of the tin wave in real time is achieved.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention.
Fig. 1 is a front view of the present invention;
FIG. 2 is a partial cross-sectional view of the present invention;
FIG. 3 is a partial cross-sectional view of the present invention;
FIG. 4 is a schematic view of a tin wave working surface of the present invention;
reference numbers in the figures: 1. a tin pan; 2. a diversion trench; 3. a PCB workpiece; 4. a first support column; 5. a second support column; 6. a first cavity; 7. a transmission mechanism; 7-1, a gear; 7-2, toothed plates; 7-3, a support rod; 8. a signal transmitting device; 9. a signal receiving device; 10. a power mechanism; 10-1, a motor box; 10-2, a motor; 11. A second cavity; 12. a storage battery; 13. a controller; 14. a display screen; 15. a slide rail; 16. sealing the cover; 17. A connecting rod.
Detailed Description
The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are presented herein only to illustrate and explain the present invention, and not to limit the present invention.
As shown in the figure, the tin wave height monitoring device for the selective wave soldering machine comprises a tin pot 1, a flow guide groove 2 which is arranged in the tin pot 1 and connected through a connecting rod 17, a PCB workpiece is arranged above the flow guide groove 2, a first supporting column 4 and a second supporting column 5 which are arranged at two sides of the tin pot 1, a first cavity 6 is formed in each of the first supporting column 4 and the second supporting column 5, a transmission mechanism 7 is arranged in each of the first cavities 6, a signal transmitting device 8 is fixedly arranged on each transmission mechanism 7 on each first supporting column 4, a signal receiving device 9 is fixedly arranged on each transmission mechanism 7 on each second supporting column 5, a central correlation line of each signal transmitting device 8 and each signal receiving device 9 is arranged below the PCB workpiece, a power mechanism 10 is fixedly connected to each first supporting column 4 and each second supporting column 5, and each power mechanism 10 is matched with each transmission mechanism 7;
the inside of first support column 4 still is provided with second cavity 11, and is provided with battery 12 and controller 13 in the second cavity 11, and the side of first support column 4 still is connected with display screen 14 through connecting rod 17, and power unit 10, signal transmitting device 8, signal receiving device 9 are connected in display screen 14 in the electricity respectively to controller 13.
The center opposite rays of the signal transmitting device 8 and the signal receiving device 9 are located 5mm away from the lower portion of the PCB workpiece, the signal transmitting device 8 and the signal receiving device 9 are respectively an ultrasonic transmitter and an ultrasonic thickness sensor, the transmission mechanism 7 comprises a gear 7-1, a toothed plate 7-2 meshed with the gear 7-1 and a support rod 7-3 fixedly connected to the end portion of the toothed plate 7-2, the side face of the toothed plate 7-2 is clamped on a sliding rail 15 arranged on the inner wall of the first cavity 6 through a pulley, the power mechanism 10 comprises a motor box 10-1 and a motor 10-2 fixedly arranged in the motor box 10-1, a rotating shaft of the motor 10-2 is rotatably connected with the gear 7-1, and the outer side of the second cavity 11 is connected with a sealing cover 16 through a hinge.
The utility model discloses the theory of operation:
firstly, calibration is carried out, the switch of the motor 10-2 controls the motors 10-2 in the two power mechanisms 10 to drive the gear 7-1 to rotate, the gear 7-1 further drives the rack to move up and down to respectively adjust the heights of the toothed plates 7-2 in the two transmission mechanisms 7, so that the centers of the ultrasonic transmitter and the ultrasonic thickness sensor are opposite, when the centers of the ultrasonic transmitter and the ultrasonic thickness sensor are opposite, the numerical value on the display screen 14 is 0, and the calibration is finished;
first support column 4 and second support column 5 have set up signal emission device 8 and signal receiving device 9 respectively, signal emission device 8 and signal receiving device 9 mutually support, real-time supervision blocks the crest thickness between the two, then show thickness numerical value on display screen 14 through controller 13, when numerical value is big more, it is big more to show the distance of crest distance PCB work piece, numerical value is little, it is big more to show the distance of crest distance PCB work piece, played the effect of good real time monitoring tin ripples height.
The above is the preferred embodiment of the present invention, and the technical personnel in the field of the present invention can also change and modify the above embodiment, therefore, the present invention is not limited to the above specific embodiment, and any obvious improvement, replacement or modification made by the technical personnel in the field on the basis of the present invention all belong to the protection scope of the present invention.
Claims (5)
1. The utility model provides a tin ripples height monitoring device for selectivity crest soldering tin machinery, includes tin pot (1) and sets up guiding gutter (2) connected through connecting rod (17) in tin pot (1), PCB work piece (3) are in the top of guiding gutter (2), its characterized in that: also comprises a first supporting column (4) and a second supporting column (5) which are arranged at the two sides of the tin pan (1), the first supporting column (4) and the second supporting column (5) are both internally provided with a first cavity (6), a transmission mechanism (7) is respectively arranged in the first cavity (6), a signal transmitting device (8) is fixedly arranged on the transmission mechanism (7) on the first supporting column (4), a signal receiving device (9) is fixedly arranged on the transmission mechanism (7) on the second supporting column (5), the center of the signal transmitting device (8) and the center of the signal receiving device (9) are opposite to the ray and are positioned below the PCB workpiece (3), the first supporting column (4) and the second supporting column (5) are both fixedly connected with a power mechanism (10), and the power mechanisms (10) are matched with the transmission mechanism (7);
the inside of first support column (4) still is provided with second cavity (11), just be provided with battery (12) and controller (13) in second cavity (11), the side of first support column (4) still passes through connecting rod (17) are connected with display screen (14), controller (13) electricity respectively connect power unit (10) signal emission device (8) signal reception device (9) in display screen (14).
2. The tin wave height monitoring device for selective wave soldering machine according to claim 1, wherein: the center of the signal emitting device (8) and the center of the signal receiving device (9) are opposite to the ray and are located 5mm away from the lower part of the PCB workpiece (3).
3. The tin wave height monitoring device for selective wave soldering machine according to claim 1, wherein: the signal emitting device (8) and the signal receiving device (9) are respectively an ultrasonic emitter and an ultrasonic thickness sensor.
4. The tin wave height monitoring device for selective wave soldering machine according to claim 1, wherein: the transmission mechanism (7) comprises a gear (7-1), a toothed plate (7-2) meshed with the gear (7-1) and a support rod (7-3) fixedly connected to the end of the toothed plate (7-2), and the side face of the toothed plate (7-2) is connected to a sliding rail (15) arranged on the inner wall of the first cavity (6) in a clamping mode through a pulley.
5. The tin wave height monitoring device for selective wave soldering machine as claimed in claim 4, wherein: the power mechanism (10) comprises a motor box (10-1) and a motor (10-2) fixedly arranged in the motor box (10-1), and a rotating shaft of the motor (10-2) is rotatably connected with the gear (7-1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920093799.1U CN209811389U (en) | 2019-01-21 | 2019-01-21 | Tin wave height monitoring device for selective wave crest soldering machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920093799.1U CN209811389U (en) | 2019-01-21 | 2019-01-21 | Tin wave height monitoring device for selective wave crest soldering machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209811389U true CN209811389U (en) | 2019-12-20 |
Family
ID=68871399
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920093799.1U Expired - Fee Related CN209811389U (en) | 2019-01-21 | 2019-01-21 | Tin wave height monitoring device for selective wave crest soldering machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209811389U (en) |
-
2019
- 2019-01-21 CN CN201920093799.1U patent/CN209811389U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20191220 Termination date: 20210121 |
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| CF01 | Termination of patent right due to non-payment of annual fee |