CN209806182U

CN209806182U - device for preventing PCB from sticking film

Info

Publication number: CN209806182U
Application number: CN201920239059.4U
Authority: CN
Inventors: 王�华; 何增灿; 陈志特
Original assignee: CSTMV AUTOMATION TECHNOLOGY Co Ltd
Current assignee: Guangdong Keshi Optical Technology Co.,Ltd.
Priority date: 2019-02-26
Filing date: 2019-02-26
Publication date: 2019-12-17
Anticipated expiration: 2029-02-26

Abstract

The utility model relates to a device for preventing a PCB from sticking a film, which comprises an air outlet component, and upper glass and lower glass which are oppositely arranged; the air outlet of the air outlet assembly is positioned between the upper glass and the lower glass; the air outlet is positioned at the edge of the upper glass or the lower glass; the air outlet is used for discharging air to the middle part; the lower glass is provided with a plate adjusting assembly, and the jacking direction of the plate adjusting assembly is perpendicular to the surface of the lower glass. The beneficial effects are that: the film bonding can be effectively prevented when the PCB performs secondary alignment action or repeated alignment action, manual intervention is not needed, and the production efficiency is improved; need not artifical the intervention, improved the precision of position counterpoint.

Description

device for preventing PCB from sticking film

Technical Field

The utility model belongs to the technical field of the production of the PCB board, especially, relate to a device of PCB board bonding film.

Background

With the rapid development of the electronic circuit board industry, in recent years, the traditional single-side contraposition single-side exposure transformation of the solder mask exposure machine in the industry is gradually changed into double-side contraposition double-side exposure; the original single-side contraposition single-side exposure can only be carried out for 1-1.5 sheets per minute, and the original double-side contraposition double-side exposure can reach 2-3 sheets per minute, so that the productivity of the solder mask exposure machine is greatly improved; meanwhile, the double-side alignment double-side exposure welding-proof exposure machine can also reduce the occupied area of a dust-free room and save the investment under the same effective output contrast with the traditional single-side alignment single-side exposure welding-proof exposure machine. However, the existing double-sided alignment double-sided exposure solder mask exposure machine is not widely popularized and used in the industry, and the most important reason is that the problem of sticking film on the PCB board in the actual production process of the double-sided alignment double-sided exposure solder mask exposure machine cannot be well solved.

the aim of the double-side contraposition and double-side exposure welding prevention machine is to move the PCB to the position coinciding with the upper film target and the lower film target through the contraposition mechanism and carry out vacuum-pumping verification according to the set contraposition precision so as to meet the set precision requirement. However, in actual production and manufacturing, due to the influence of factors such as front-end process, film expansion and contraction, and accuracy deviation of a PCB alignment target, vacuum-pumping verification is performed after the alignment of the PCB is completed, and the verification result cannot meet the set alignment accuracy requirement, so that one-time alignment success between the PCB and the upper film and the lower film cannot be achieved. At this time, the alignment mechanism is required to move the PCB plate to perform secondary alignment with the upper film and the lower film.

Releasing the frame vacuum again, and moving the PCB by the alignment mechanism again to perform secondary alignment, wherein the surface of the ink has viscosity due to the limitation of objective factors such as incomplete baking of the ink before exposure of the PCB and the like, and after the frame vacuum is pumped for the first time, as shown in FIG. 2, the PCB is firmly adhered to the film and is difficult to separate; after the frame vacuum is released, secondary alignment is carried out, and the alignment mechanism cannot move the PCB to cause failure of the secondary alignment process. At this moment, the frame needs to be opened manually, the PCB needs to be taken down, the frame is put in, and the alignment precision verification are carried out again, so that the working efficiency is greatly reduced.

SUMMERY OF THE UTILITY MODEL

[ problem ] to

Not enough to prior art, the utility model provides a prevent that PCB board from gluing device of film mainly has solved above-mentioned PCB board and hardly separates the scheduling problem after the counterpoint failure when the film bonds.

[ solution ]

In order to solve the problem, the utility model adopts the following technical scheme:

a device for preventing a PCB from sticking a film comprises an air outlet assembly, and upper glass and lower glass which are oppositely arranged;

the air outlet of the air outlet assembly is positioned between the upper glass and the lower glass; the air outlet is positioned at the edge of the upper glass or the lower glass;

The air outlet is used for discharging air to the middle part;

The lower glass is provided with a plate adjusting assembly, and the jacking direction of the plate adjusting assembly is perpendicular to the surface of the lower glass.

preferably, the air outlet assembly is arranged on the lower glass.

Preferably, the air outlet is positioned above the lower glass.

Preferably, the air outlet is positioned 0.5-5mm above the lower glass.

Preferably, the distance between the air outlet and the lower glass can be adjusted.

preferably, the plate adjusting assembly is located at the edge of the lower glass, and one end of a top rod of the plate adjusting assembly can penetrate through the lower glass and then reach the position above the lower glass.

Preferably, the panel adjusting assembly and the air outlet assembly are located on the same side of the lower glass.

Preferably, the tuning plate assembly is closer to the middle of the lower glass than the air outlet assembly.

preferably, the upper glass is arranged on the upper working frame, and the lower glass is arranged on the lower working frame; and a lifting assembly is arranged between the upper working frame and the lower working frame.

[ advantageous effects ]

The utility model has the advantages that:

1. when the PCB is aligned and verified to fail, the PCB is bonded with the film without manual intervention, so that the problem that the PCB is bonded with the film is solved, and the production efficiency is improved;

2. the manual intervention is not needed, and the position alignment accuracy is improved;

3. when the PCB is separated from the film, the film is not damaged.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic diagram of a prior art structure;

fig. 3 is a state diagram in the working process of the present invention.

In the figure:

10 upper glass, 20 lower glass, 30 top plate assembly, 31 mandril, 40 air outlet assembly, 41 air outlet, 50PCB, 51 upper film and 52 lower film.

Detailed Description

the present invention will be further explained with reference to the accompanying drawings:

as shown in fig. 1, an apparatus for preventing a PCB from sticking films includes an air outlet assembly 40 and upper and lower glasses 10 and 20 disposed opposite to each other;

The lower surface of the upper glass 10 is generally used for arranging the upper film 51, and the upper surface of the lower glass 20 is generally used for arranging the upper film 51;

The alignment mechanism conveys the PCB 50 between the upper glass 10 and the lower glass 20, and then the upper glass 10 and the lower glass 20 move closer, so that the upper and lower films 51 and 52 are attached to two sides of the PCB.

The air outlet 41 of the air outlet assembly 40 is positioned between the upper glass 10 and the lower glass 20; the air outlet 41 is positioned at the edge of the upper glass 10 or the lower glass 20;

The air outlet 41 is used for discharging air to the middle part; the film is positioned on the inner side of the air outlet 41, and the air outlet 41 can blow air to the side edge of the film;

the lower glass 20 is provided with a plate adjusting assembly 30, and the jacking direction of the plate adjusting assembly 30 is vertical to the surface of the lower glass 20; the film can be lifted up by the plate adjusting assembly 30 so that a portion of the film is detached from the glass plate.

the air outlet assembly 40 is arranged on the lower glass 20;

In the orientation of fig. 1, the air outlet 41 is located above the lower glass 20, and the air outlet 41 is slightly higher than the upper surface of the film on the lower glass 20, so that when the film is jacked up, the air in the air outlet 41 can better blow the lower surface of the film,

Further, the air outlet 41 is positioned 0.5-5mm above the lower glass 20.

meanwhile, the distance between the air outlet 41 and the lower glass 20 can be adjusted, and the height of the air outlet 41 can be adjusted by adjusting the position of the air outlet assembly 40 on the lower glass 20.

The plate adjusting assembly 30 is positioned at the edge of the lower glass 20, and one end of a top rod 31 of the plate adjusting assembly 30 can pass through the lower glass 20 and then reach the upper part of the lower glass 20; the specific installation position of the board adjusting assembly 30 is based on the fact that the ejector rod 31 can jack up the PCB 50; referring to the state of fig. 1, when the lift pins 31 lift up, the lift pins 31 lift up the PCB board 50 so that a portion of the PCB board 50 is separated from the lower film 52;

The tuning plate assembly 30 and the air outlet assembly 40 are located on the same side of the lower glass 20.

The plate adjusting assembly 30 is closer to the middle of the lower glass 20 than the air outlet assembly 40, and the arrangement mode enables the position where the PCB 50 is partially separated from the lower film 52 to be blown better by the air from the air outlet 41 after the PCB 50 is jacked up by the plate adjusting assembly 30; through the tension of the airflow, the effective contact area between the PCB and the lower film is reduced, and the adhesive force is reduced or disappears.

the upper glass 10 is arranged on the upper working frame, and the lower glass 20 is arranged on the lower working frame; a lifting assembly is arranged between the upper working frame and the lower working frame; the distance between the upper and lower work frames, and further, the distance between the upper glass 10 and the lower glass 20 is controlled by the elevating assembly.

The utility model discloses still include the antiseized film's of PCB board method suitable for above-mentioned device:

Firstly, the upper glass 10 and the lower glass 20 are far away from each other, and the lower film 52 is attached to the lower surface of the PCB 50, as shown in fig. 3;

secondly, the board adjusting component 30 jacks up the PCB 50 locally;

thirdly, the air outlet assembly 40 discharges air through the air outlet 41, and the air discharging direction is shown by a continuous arrow in fig. 1;

After the lower film 52 is separated from the PCB 50, the position of the PCB 50 is adjusted by the alignment mechanism, and the PCB 50 and the lower film 52 are aligned again;

Fifthly, checking whether the alignment of the PCB 50 and the lower film 52 is accurate; if not, repeating the steps 1-6; if the accuracy is correct, the next procedure is carried out.

It will be apparent to those skilled in the art that various modifications may be made to the above embodiments without departing from the general spirit and concept of the invention. Which all fall within the protection scope of the utility model. The protection scheme of the utility model is based on the appended claims.

Claims

1. A device for preventing a PCB from sticking a film comprises an air outlet assembly (40) and an upper glass (10) and a lower glass (20) which are oppositely arranged;

The method is characterized in that: the air outlet (41) of the air outlet assembly (40) is positioned between the upper glass (10) and the lower glass (20);

The air outlet (41) is used for discharging air to the middle part;

The PCB lifting device comprises a board adjusting component (30) for lifting up a PCB; the jacking direction of the plate adjusting assembly (30) is perpendicular to the surface of the lower glass (20).

2. The device for preventing PCB from sticking to film of claim 1, wherein: the air outlet (41) is positioned at the edge of the upper glass (10) or the lower glass (20); the plate adjusting assembly (30) is arranged on the lower glass (20).

3. the device for preventing PCB from sticking to film of claim 2, wherein: the air outlet assembly (40) is arranged on the lower glass (20).

4. The device for preventing PCB from sticking to film of claim 3, wherein: the air outlet (41) is positioned above the lower glass (20).

5. The device for preventing PCB from sticking to film of claim 4, wherein: the distance between the air outlet (41) and the lower glass (20) can be adjusted.

6. the device for preventing PCB from sticking to film of claim 1, wherein: the plate adjusting assembly (30) is located at the edge of the lower glass (20), and one end of a top rod (31) of the plate adjusting assembly (30) can penetrate through the lower glass (20) and then reach the upper part of the lower glass (20).

7. the device for preventing PCB from sticking to film of claim 6, wherein: the plate adjusting component (30) and the gas outlet component (40) are positioned on the same side of the lower glass (20).

8. The device for preventing PCB from sticking to film of claim 7, wherein: the adjusting plate component (30) is closer to the middle of the lower glass (20) relative to the air outlet component (40).