CN209804612U - Placing mechanism for placing chip tray on LED die bonder - Google Patents

Placing mechanism for placing chip tray on LED die bonder Download PDF

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Publication number
CN209804612U
CN209804612U CN201920860224.8U CN201920860224U CN209804612U CN 209804612 U CN209804612 U CN 209804612U CN 201920860224 U CN201920860224 U CN 201920860224U CN 209804612 U CN209804612 U CN 209804612U
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CN
China
Prior art keywords
fixed
placing
barrel
chip
bucket
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201920860224.8U
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Chinese (zh)
Inventor
吴小菊
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Yuzhiliang Electronics Shenzhen Co Ltd
Original Assignee
Yuzhiliang Electronics Shenzhen Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by Yuzhiliang Electronics Shenzhen Co Ltd filed Critical Yuzhiliang Electronics Shenzhen Co Ltd
Priority to CN201920860224.8U priority Critical patent/CN209804612U/en
Application granted granted Critical
Publication of CN209804612U publication Critical patent/CN209804612U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model relates to a be used for placing placement machine of chip dish on solid brilliant equipment of LED, it is including fixed bucket and fixed subassembly, and fixed bucket is fixed through fixed subassembly and is set up on the operation panel, has stacked a plurality of chip dish in the fixed bucket, and fixed subassembly sets up the below at fixed bucket. The utility model discloses have and to collect and fix, make the chip dish be difficult for appearing the effect of the condition of being touched by operating personnel mistake and turning over with the chip dish of placing operation panel department on the solid brilliant machine of LED.

Description

Placing mechanism for placing chip tray on LED die bonder
Technical Field
The utility model belongs to the technical field of the technique of solid brilliant equipment and specifically relates to a mechanism of placing that is used for placing the chip dish on LED solid brilliant equipment is related to.
Background
The LED die bonder is a special die bonder for LED products, is controlled by a computer and is provided with a CCD image sensing system, a CCD system scans the LED die bonder to determine a correct path, a set programming program is input, and a button is pressed easily to realize the whole working process, wherein the working process is as follows: fixing a product needing die bonding on a jig, dispensing red glue, sucking the LED chip from the chip tray through the suction nozzle, and fixing the LED chip on the product.
After the LED chip in the chip disc is sucked by the existing LED die bonder, an operator can take the chip disc off the fixing frame for fixing the chip disc, and the chip disc is replaced by a new chip disc.
The above prior art solutions have the following drawbacks: a plurality of chip dishes are stacked on the operation panel on the solid brilliant machine of LED, when operating personnel operating equipment, the condition of touching the chip dish appears easily, because of chip dish quality ratio is lighter, after operating personnel touched the chip dish by mistake, beat the chip dish easily and turn over, cause the condition that the LED chip fell out the chip dish, because of the LED chip volume ratio is smaller, it is difficult to pick up after falling out the chip dish, and also difficult recovery to original state after picking up back, be unfavorable for the solid brilliant machine later stage of LED to absorb the LED chip from the chip dish, so remain to improve.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a solid brilliant equipment of LED is last to be used for placing the mechanism of placing of chip dish, it has can collect and fix, make the chip dish be difficult for appearing touching the effect of the condition of turning over by the operating personnel mistake with the chip dish of placing operation panel department on the solid brilliant machine of LED.
The above utility model discloses an above-mentioned utility model purpose can realize through following technical scheme:
The utility model provides a mechanism of placing that is used for placing chip dish on solid brilliant equipment of LED, includes fixed bucket and fixed subassembly, and fixed bucket is fixed through fixed subassembly and is set up on the operation panel, has stacked a plurality of chip dish in the fixed bucket, and fixed subassembly setting is in the below of fixed bucket.
Through adopting above-mentioned technical scheme, it installs on the operation panel to pass through fixed subassembly with fixed bucket, later pile up a plurality of chip dishes in fixed bucket again, when operating personnel need to change the chip dish, can take out the chip dish from fixed bucket and change, compare with the current mode of directly stacking the chip dish on the operation panel, this kind of mode is placed the chip dish in fixed bucket, collect and arrange in order the chip dish by fixed bucket, make the chip dish be difficult for touching by the operating personnel mistake, and fix on the operation panel through fixed subassembly because of fixed bucket, operating personnel collides fixed bucket and also is difficult for turning over fixed bucket.
The utility model discloses further set up to, fixed subassembly includes: fixed pipe, sucking disc and depression bar, fixed pipe setting are in the below of fixed bucket and with fixed bucket lower extreme fixed surface be connected, the axis of fixed pipe is parallel with the axis of fixed bucket, the sucking disc setting in fixed pipe and the inboard surface orientation of sucking disc the operation panel one side, the depression bar rotate to set up in fixed pipe and be in between sucking disc outside surface and the fixed bucket, the lateral wall of fixed pipe is worn out at the depression bar both ends, is provided with the L shape hole that supplies the depression bar both ends to pass on the lateral wall of fixed pipe, after the sucking disc was pressed along L shape hole to the depression bar, rotates the depression bar, the depression bar card is in L shape hole.
Through adopting above-mentioned technical scheme, when fixed bucket need be fixed on the operation panel, at first place fixed bucket on the operation panel to the one end butt that fixed bucket was kept away from to fixed pipe lives the operation panel, later presses the depression bar along L shape hole, presses the sucking disc to the operation panel on, makes the sucking disc suck the surface of operation panel, later rotates the depression bar again, with the depression bar card in L shape hole, fixed bucket is fixed on the operation panel this moment, is difficult for taking place to remove.
The utility model discloses further set up to, the depression bar with be provided with a pressure disk between the sucking disc, the side of pressure disk with the inside wall butt of fixed pipe, the depression bar rotates with the pressure disk to be connected.
Through adopting above-mentioned technical scheme, the area that the sucking disc was pressed to the depression bar has been increased in the setting of pressure disk for the depression bar can be more convenient with the air escape in the sucking disc, promote the fixed effect of sucking disc.
the utility model discloses further set up to, fixed intraductal side wall is kept away from fixed bucket one end and is provided with annular fixture block, is provided with first spring between annular fixture block and the pressure disk, and first spring both ends are butt annular fixture block and pressure disk respectively.
Through adopting above-mentioned technical scheme, the setting of annular fixture block and first spring can play supplementary effect of lifting when the pressure disk rebound for operating personnel can be more convenient lift the pressure disk, reduced the physical power that consumes in the operation process.
The utility model discloses further set up to, the fixed bucket lateral wall is close to fixed pipe one end symmetry is provided with two supporting shoes, and two supporting shoes are in respectively the top at depression bar both ends.
Through adopting above-mentioned technical scheme, the setting of supporting shoe for operating personnel when the pulling depression bar, the palm can support on the supporting shoe, later uses the finger to pull up the depression bar, and the operating personnel application of force of being convenient for conveniently pulls up the depression bar.
The utility model discloses further set up to, fixed bucket bung hole is provided with the second spring, the chip dish is placed on the second spring, is provided with the bung on the bung hole of fixed bucket, and the bung is kept away from fixed bucket one end and is provided with the breach that supplies chip dish business turn over bung.
Through adopting above-mentioned technical scheme, the setting of second spring for the chip dish of placing in fixed bucket can be pushed up on the bung by the second spring, makes things convenient for operating personnel to take out the chip dish from fixed bucket.
The utility model discloses further set up to, the inboard edge of bung is provided with soft backing ring, soft backing ring with fixed barrel bottom of the drum surface butt is kept away from to the chip dish.
Through adopting above-mentioned technical scheme, the setting of cushion ring connects the thixotropy for the flexonics with the rigidity between chip dish and the bung for chip dish top is difficult for receiving the damage when the bung is gone up.
The utility model discloses further set up to, the depression bar stretches out be provided with the lug on the one end upper surface in L shape hole, the lug is kept away from fixed bucket one end tip parallel and level is kept away from to fixed bucket side surface and depression bar.
Through adopting above-mentioned technical scheme, the area of contact of depression bar has been promoted in the setting of lug for operating personnel's hand is pressed the difficult condition that takes place to skid when on the depression bar, has promoted the stability when pressing the depression bar.
To sum up, the utility model discloses a beneficial technological effect does:
1. The fixed barrel is installed on the operating platform through the fixed assembly, then a plurality of chip trays are stacked in the fixed barrel, when an operator needs to replace the chip trays, the chip trays can be taken out of the fixed barrel for replacement, compared with the existing mode of directly stacking the chip trays on the operating platform, the mode places the chip trays in the fixed barrel, the fixed barrel collects and arranges the chip trays, so that the chip trays are not easy to be touched by the operator by mistake, and the fixed barrel is fixed on the operating platform through the fixed assembly, so that the operator is not easy to overturn the fixed barrel when colliding with the fixed barrel;
2. When fixed bucket need be fixed on the operation panel, at first place fixed bucket on the operation panel to the one end butt that fixed bucket was kept away from to fixed pipe lives the operation panel, later presses the depression bar along L shape hole, presses the sucking disc to the operation panel on, makes the sucking disc suck the surface of operation panel, later rotates the depression bar again, with the depression bar card in L shape hole, fixed bucket is fixed on the operation panel this moment, difficult emergence is removed.
Drawings
fig. 1 is a schematic view of the overall structure of the present invention.
Fig. 2 is a partially enlarged schematic view of a portion a in fig. 1.
Fig. 3 is a partial sectional structural view of a portion a in fig. 1.
In the figure, 1, a fixed barrel; 11. a second spring; 12. a barrel cover; 121. a cushion ring; 122. a notch; 13. a support block; 2. a fixing assembly; 21. a fixed tube; 211. a platen; 212. an L-shaped hole; 213. an annular fixture block; 214. a first spring; 22. a suction cup; 23. a pressure lever; 231. a bump; 3. a chip tray; 4. an operation platform.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
Referring to fig. 1 and 3, for the utility model discloses a mechanism of placing that is used for placing chip dish 3 on solid brilliant equipment of LED, including fixed bucket 1 and fixed subassembly 2, fixed bucket 1 is fixed through fixed subassembly 2 and is set up on operation panel 4, has stacked a plurality of chip dish 3 in fixed bucket 1, and fixed subassembly 2 sets up the below at fixed bucket 1.
Referring to fig. 1 and 3, fixed bucket 1 is cylindrical and is stainless steel, fixed bucket 1 upper end opening, fixed bucket 1 is placed on operation panel 4, operation panel 4 is cuboid shape and shell is stainless steel, the welding of the barrel head of fixed bucket 1 has a second spring 11, second spring 11 is stainless steel, a plurality of chip trays 3 have been stacked in fixed bucket 1, chip tray 3 is the disc and is the rigid plastic material, chip tray 3 stacks on second spring 11, withstand the lower surface by second spring 11.
Referring to fig. 2 and 3, upper end port position at fixed bucket 1 is covered and is equipped with a bung 12, bung 12 is the disc and is stainless steel material, 12 side surface integrated into one piece of bung has a sunken, set up screw thread on the sunken lateral wall, 1 lateral wall of fixed bucket is close to opening one end and also sets up screw thread, bung 12 passes through threaded connection with fixed bucket 1, 12 sunken bottom edge adhesions of bung have soft backing ring 121, soft backing ring 121 is the semicircle ring shape and is the soft rubber material, soft backing ring 121 with be in the top chip dish 3 and keep away from 1 barrel head side surface butt of fixed bucket.
Referring to fig. 2 and 3, a gap 122 is formed at an end edge of the lid 12 away from the fixing barrel 1, the cross section of the gap 122 is semicircular, and when the chip tray 3 is pressed by the first spring 214, the uppermost chip tray 3 is exposed from the gap 122 by half of the volume.
Referring to fig. 1 and 3, the fixing assembly 2 includes: the fixing device comprises a fixing pipe 21, a sucker 22 and a pressure lever 23, wherein the fixing pipe 21 is in a round pipe shape and is made of stainless steel, the fixing pipe 21 is arranged below the fixing barrel 1, one end of the fixing pipe 21 is welded with the outer surface of the lower end of the fixing barrel 1, the outer diameter of the fixing pipe 21 is the same as that of the fixing barrel 1, and the axis of the fixing pipe 21 is superposed with that of the fixing barrel 1; the suction cup 22 is arranged in the fixed pipe 21, the inner side surface of the suction cup 22 faces one side of the operating platform 4, and the suction cup 22 is disc-shaped and made of soft rubber; the pressure lever 23 is rectangular and made of stainless steel, and the pressure lever 23 is rotatably arranged in the fixed pipe 21 and between the outer surface of the suction cup 22 and the fixed barrel 1.
Referring to fig. 2 and 3, a pressure plate 211 is arranged between a pressure rod 23 and a suction cup 22, the pressure plate 211 is disc-shaped and made of stainless steel, the side surface of the pressure plate 211 is abutted to the inner side wall of a fixed pipe 21, the pressure rod 23 is rotatably connected with the pressure plate 211 through a bolt, the bolt penetrates through the pressure rod 23 from the upper side of the pressure rod 23 and is rotatably connected with the pressure rod 23, the bolt penetrates through the pressure rod 23 and then is inserted into the pressure plate 211, a screw is in threaded connection with the pressure plate 211, the two ends of the pressure rod 23 penetrate through the side wall of the fixed pipe 21, L-shaped holes 212 for the two ends of the pressure rod 23 to penetrate through are formed in the side wall of the fixed pipe 21, the bending directions of the two L-shaped holes 212 are opposite.
Referring to fig. 2 and 3, a protrusion 231 is welded on an upper surface of one end of the pressing rod 23 extending out of the L-shaped hole 212, the protrusion 231 is rectangular and made of stainless steel, and a surface of one side of the protrusion 231 away from the fixing barrel 1 is flush with an end of the pressing rod 23 away from the fixing barrel 1.
Referring to fig. 2 and 3, an annular fixture block 213 is welded to a port of an inner side wall of the fixing tube 21, the end of the inner side wall is far away from the fixing barrel 1, the annular fixture block 213 is circular and is made of stainless steel, a cross section of the annular fixture block 213 is square, a first spring 214 is welded between the annular fixture block 213 and the pressure plate 211, the suction cup 22 is sleeved with the first spring 214, two ends of the first spring 214 are respectively welded to the annular fixture block 213 and the pressure plate 211, and the first spring 214 is made of stainless steel.
Referring to fig. 2 and 3, two supporting blocks 13 are symmetrically welded to one end, close to the fixed pipe 21, of the outer side wall of the fixed barrel 1, the two supporting blocks 13 are rectangular and made of stainless steel, and the two supporting blocks 13 are respectively located right above two ends of the pressing rod 23.
The implementation principle of the embodiment is as follows: after fixed bucket 1 is placed on operation panel 4, at first both hands press down the both ends that depression bar 23 stretches out L shape hole 212 along L shape hole 212, support sucking disc 22 on the upper surface of operation panel 4, pressure disk 211 extrudes inside sucking disc 22 with the air in sucking disc 22 simultaneously, make sucking disc 22 inhale on operation panel 4, reach the purpose that fixed bucket 1 fixes on operation panel 4, later open bung 12, put a plurality of chip dish 3 into on the first spring 214 in fixed bucket 1 again, then on bung 12, on the chip dish 3 upper surface butt that is the top at bung 12 sunken on ring cushion 121, when needing to take out chip dish 3, the operator follow breach 122 with chip dish 3 take out can.
The embodiment of this specific implementation mode is the preferred embodiment of the present invention, not limit according to this the utility model discloses a protection scope, so: all equivalent changes made according to the structure, shape and principle of the utility model are covered within the protection scope of the utility model.

Claims (8)

1. The utility model provides a mechanism of placing that is used for placing chip dish on solid brilliant equipment of LED, its characterized in that, including fixed bucket (1) and fixed subassembly (2), fixed bucket (1) is fixed through fixed subassembly (2) and is set up on operation panel (4), has stacked a plurality of chip dish (3) in fixed bucket (1), and fixed subassembly (2) set up the below at fixed bucket (1).
2. The placing mechanism for placing the chip tray on the LED die bonding equipment as recited in claim 1, wherein the fixing assembly (2) comprises: fixed pipe (21), sucking disc (22) and depression bar (23), fixed pipe (21) set up the below of fixed bucket (1) and with fixed bucket (1) lower extreme surface fixed connection, the axis of fixed pipe (21) is parallel with the axis of fixed bucket (1), sucking disc (22) set up in fixed pipe (21) and the inboard surface orientation of sucking disc (22) operation panel (4) one side, depression bar (23) rotate to set up in fixed pipe (21) and be in between sucking disc (22) outside surface and fixed bucket (1), the lateral wall of fixed pipe (21) is worn out at depression bar (23) both ends, is provided with L shape hole (212) that supply depression bar (23) both ends to pass on the lateral wall of fixed pipe (21), after depression bar (23) press sucking disc (22) along L shape hole (212), rotates depression bar (23), depression bar (23) card is in L shape hole (212).
3. The placing mechanism for placing the chip tray on the LED die bonding equipment according to claim 2, wherein a pressure plate (211) is arranged between the pressure rod (23) and the suction cup (22), the side surface of the pressure plate (211) is abutted against the inner side wall of the fixing tube (21), and the pressure rod (23) is rotatably connected with the pressure plate (211).
4. The placing mechanism for placing the chip tray on the LED die bonding equipment according to claim 3, wherein an annular clamping block (213) is arranged at one end of the inner side wall of the fixing tube (21) far away from the fixing barrel (1), a first spring (214) is arranged between the annular clamping block (213) and the pressing plate (211), and two ends of the first spring (214) are respectively abutted against the annular clamping block (213) and the pressing plate (211).
5. The placing mechanism for placing the chip tray on the LED die bonding equipment according to claim 3, wherein two supporting blocks (13) are symmetrically arranged at one end of the outer side wall of the fixed barrel (1) close to the fixed tube (21), and the two supporting blocks (13) are respectively positioned above two ends of the pressing rod (23).
6. The placing mechanism for placing the chip tray on the LED die bonding equipment according to claim 1, wherein a second spring (11) is arranged at the bottom of the fixing barrel (1), the chip tray (3) is placed on the second spring (11), a barrel cover (12) is arranged on the barrel opening of the fixing barrel (1), and a notch (122) for the chip tray (3) to enter and exit the barrel cover (12) is arranged at one end of the barrel cover (12) far away from the fixing barrel (1).
7. The placing mechanism for placing the chip tray on the LED die bonding equipment as claimed in claim 6, wherein a soft cushion ring (121) is arranged on the edge of the inner side of the barrel cover (12), and the soft cushion ring (121) is abutted against the surface of one side of the chip tray (3) away from the bottom of the fixed barrel (1).
8. The placing mechanism for placing the chip tray on the LED die bonding equipment according to claim 3, wherein a protrusion (231) is disposed on an upper surface of one end of the pressing rod (23) extending out of the L-shaped hole (212), and a surface of one side of the protrusion (231) far away from the fixing barrel (1) is flush with an end of one end of the pressing rod (23) far away from the fixing barrel (1).
CN201920860224.8U 2019-06-05 2019-06-05 Placing mechanism for placing chip tray on LED die bonder Expired - Fee Related CN209804612U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201920860224.8U CN209804612U (en) 2019-06-05 2019-06-05 Placing mechanism for placing chip tray on LED die bonder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201920860224.8U CN209804612U (en) 2019-06-05 2019-06-05 Placing mechanism for placing chip tray on LED die bonder

Publications (1)

Publication Number Publication Date
CN209804612U true CN209804612U (en) 2019-12-17

Family

ID=68833540

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201920860224.8U Expired - Fee Related CN209804612U (en) 2019-06-05 2019-06-05 Placing mechanism for placing chip tray on LED die bonder

Country Status (1)

Country Link
CN (1) CN209804612U (en)

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GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20191217

Termination date: 20210605

CF01 Termination of patent right due to non-payment of annual fee