CN209794568U - 3D printing circuit board substrate structure - Google Patents
3D printing circuit board substrate structure Download PDFInfo
- Publication number
- CN209794568U CN209794568U CN201920595436.8U CN201920595436U CN209794568U CN 209794568 U CN209794568 U CN 209794568U CN 201920595436 U CN201920595436 U CN 201920595436U CN 209794568 U CN209794568 U CN 209794568U
- Authority
- CN
- China
- Prior art keywords
- cooling
- circuit board
- base member
- cooling box
- heat conduction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 title claims description 27
- 238000010146 3D printing Methods 0.000 title claims description 15
- 238000001816 cooling Methods 0.000 claims abstract description 69
- 239000002826 coolant Substances 0.000 claims abstract description 6
- 239000007788 liquid Substances 0.000 claims abstract description 4
- 238000007789 sealing Methods 0.000 claims description 9
- 238000001514 detection method Methods 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- 238000007639 printing Methods 0.000 abstract description 6
- 238000009434 installation Methods 0.000 abstract description 3
- 239000000110 cooling liquid Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 230000009286 beneficial effect Effects 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000036760 body temperature Effects 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
the utility model discloses a 3D printed circuit board base structure belongs to circuit board technical field, including the base member body, the concave three recess that is equipped with in one side of base member body, every all install a temperature sensor in the recess, the equal fixed mounting in four corners position of base member body bottom has the heat conduction post, the below of base member body is equipped with the cooling box, be provided with the cooling chamber in the cooling box, the cooling intracavity is equipped with the coolant liquid, four the bottom of heat conduction post all extends to the cooling intracavity, one side fixed mounting at cooling box top has the inlet funnel with cooling chamber intercommunication, the outlet with cooling chamber intercommunication is installed to one side of cooling box. The utility model provides a current 3D print circuit board base member radiating rate lower problem of printing efficiency that leads to slowly, have simple structure and characteristics that the installation cost is low.
Description
Technical Field
the utility model relates to a circuit board technical field especially relates to a 3D prints circuit board base structure.
background
At present, for the large-scale production of electronic circuit boards, methods of exposure development and chemical etching are generally adopted for manufacturing, but the method has the disadvantages of large material loss, serious environmental pollution, complex equipment and process and low production yield. With the continuous progress of the color-increasing manufacturing equipment and materials, some 3D printing electronic circuit boards are already on the market, and during printing, a 3D printer prints circuits on a base body. The present base body of 3D printed wiring board often can be burnt out because of the high temperature when being printed the circuit, and the yields is not high.
To above-mentioned problem, the utility model discloses a 3D prints circuit board base structure is disclosed to utility model patent of publication No. CN109348641A, detects the base member body temperature through temperature sensor, detects the high temperature that the base member body receives, and outside controlling means just controls 3D printing device and stops to print, lets the cooling of base member body, and when temperature sensor detected the temperature of base member body reduced appointed temperature, outside controlling means just controls 3D printing device and prints the circuit board again.
However, the patent has the following problems in practical application: the cooling device for cooling the substrate body is not arranged, so that the cooling speed of the substrate body is low, the printing efficiency is low, and a 3D printing circuit board substrate structure needs to be designed urgently.
SUMMERY OF THE UTILITY MODEL
the purpose of the utility model is to solve the shortcoming that exists among the prior art, if: the cooling device for cooling the base body is not arranged on the base body structure of the existing 3D printing circuit board, so that the cooling speed of the base body is low, and the printing efficiency is low.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
The utility model provides a 3D printing circuit board substrate structure, includes the base member body, the concave three recess that is equipped with in one side of base member body, every all install a temperature sensor in the recess, the equal fixed mounting in four corners position of base member body bottom has the heat conduction post, the below of base member body is equipped with the cooling box, be provided with the cooling chamber in the cooling box, the cooling intracavity is equipped with coolant liquid, four the bottom of heat conduction post all extends to the cooling intracavity, one side fixed mounting at cooling box top has the water inlet funnel with cooling chamber intercommunication, the outlet with cooling chamber intercommunication is installed to one side of cooling box.
Preferably, two installation bases are symmetrically installed at the top of the cooling box, each installation base is provided with a second temperature sensor, and the detection ends of the second temperature sensors extend into the cooling cavity.
Preferably, four fans are installed above the cooling box, air outlets are formed in the four fans, and each air outlet is aligned with the bottom of the base body.
Preferably, the base body is provided with three sealing rings, and the three sealing rings are respectively sleeved on the three first temperature sensors.
Preferably, the four heat conduction columns are fixedly connected through a mounting substrate, the four fans are all mounted at the top of the mounting substrate, a heat conduction rod is fixedly mounted at the center of the bottom of the mounting substrate, and the bottom end of the heat conduction rod extends into the cooling cavity.
Preferably, the bottom ends of the four heat-conducting columns and the heat-conducting rod are fixedly provided with heat-conducting bottom plates, and each heat-conducting bottom plate is fixedly arranged on the inner wall of the bottom of the cooling cavity.
Compared with the prior art, the beneficial effects of the utility model are that:
1. the utility model realizes the heat dissipation of the base body by the cooperation of the heat-conducting column, the heat-conducting bottom plate, the mounting base plate, the heat-conducting rod and the cooling box, utilizes the heat-conducting column to transfer the heat into the cooling box, and absorbs the heat by the cooling liquid in the cooling box, thereby accelerating the cooling effect of the base body and being beneficial to improving the printing speed of the base body;
2. the utility model discloses a fan has accelerated the heat dissipation of base member body, has avoided the lower air of temperature to be blown to the accuracy that influences first temperature sensor detection effect in the first temperature sensor through utilizing the sealing ring, and the staff of being convenient for knows the actual temperature of base member body.
Drawings
fig. 1 is a schematic structural diagram of a substrate structure of a 3D printed circuit board according to the present invention;
Fig. 2 is the utility model provides a structural schematic diagram of 3D printed circuit board base structure base body bottom.
In the figure: the heat-conducting base plate comprises a base body 1, a groove 2, a first temperature sensor 3, a sealing ring 4, a heat-conducting column 5, a cooling box 6, a fan 7, a base plate 8, a mounting seat 9, a second temperature sensor 10, a water inlet funnel 11, a heat-conducting rod 12 and a heat-conducting bottom plate 13.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.
Referring to fig. 1-2, a 3D printing circuit board substrate structure, including base member 1, one side of base member 1 is concave to be equipped with three recess 2, all install first temperature sensor 3 in every recess 2, the equal fixed mounting in four corners position of base member 1 bottom has heat conduction post 5, the below of base member 1 is equipped with cooling box 6, be provided with the cooling chamber in the cooling box 6, the cooling intracavity is equipped with the coolant liquid, the bottom of four heat conduction posts 5 all extends to the cooling intracavity, one side fixed mounting at cooling box 6 top has the inlet funnel 11 with the cooling chamber intercommunication, the outlet with the cooling chamber intercommunication is installed to one side of cooling box 6.
It should be noted that the three first temperature sensors 3 are used for detecting the temperature of the base body 1, the heat is transferred to the cooling box 6 by the heat conduction column 5, and the heat is absorbed by the cooling liquid in the cooling box 6, so that the cooling effect of the base body 1 is accelerated, the printing speed of the base body 1 is favorably improved, the cooling liquid is only required to be clean water, the resource is favorably saved, and the device is practical and economical;
The top of the cooling box 6 is symmetrically provided with two mounting seats 9, each mounting seat 9 is provided with a second temperature sensor 10, and the detection ends of the two second temperature sensors 10 extend into the cooling cavity;
It should be noted that the temperature of the cooling liquid in the cooling cavity is monitored in real time through the two mounting seats 9, and when the temperature of the cooling liquid is high, the cooling liquid can be replaced selectively, so that the heat conducted out of the base body 1 can be absorbed;
Wherein, four fans 7 are arranged above the cooling box 6, air outlets are arranged on the four fans 7, and each air outlet is aligned with the bottom of the matrix body 1;
It should be noted that, the fan 7 blows air towards the bottom of the base body 1, so as to accelerate the air flow speed and thus the heat exchange speed between the air and the base body 1;
The three sealing rings 4 are arranged on the base body 1, and the three sealing rings 4 are respectively sleeved on the three first temperature sensors 3;
it should be noted that the fan 7 blows air towards the bottom of the base body 1, heat exchange between the air and the base body 1 is realized by accelerating the flow of the air, and the sealing ring 4 is utilized to prevent the air with lower temperature from being blown into the first temperature sensor 3 to affect the accuracy of the detection effect of the first temperature sensor 3, so that the worker can conveniently know the actual temperature of the base body 1;
The four heat conduction columns 5 are fixedly connected through a mounting substrate 8, the four fans 7 are all mounted at the top of the mounting substrate 8, a heat conduction rod 12 is fixedly mounted at the center of the bottom of the mounting substrate 8, and the bottom end of the heat conduction rod 12 extends into the cooling cavity;
It should be noted that the heat-conducting columns 5 and the mounting substrate 8 are made of copper, so that a good heat-conducting effect is achieved, the four heat-conducting columns 5 are connected through the mounting substrate 8, so that the mounting stability is improved, meanwhile, the mounting substrate 8 can be used for conducting heat, and heat is transferred to the cooling cavity from the heat-conducting rod 12 for cooling;
The bottom ends of the four heat conduction columns 5 and the heat conduction rod 12 are fixedly provided with heat transfer bottom plates 13, and each heat transfer bottom plate 13 is fixedly arranged on the inner wall of the bottom of the cooling cavity;
it should be noted that, the heat transfer bottom plate 13 is a cylindrical structure, and has a large contact area with the coolant, which is beneficial to increasing the heat exchange rate with the coolant, thereby increasing the heat dissipation effect of the base body 1.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.
Claims (6)
1. the utility model provides a 3D printing circuit board substrate structure, includes base member (1), one side of base member (1) is concave to be equipped with three recess (2), every all install first temperature sensor (3) in recess (2), a serial communication port, the equal fixed mounting in four corners position of base member (1) bottom has heat conduction post (5), the below of base member (1) is equipped with cooling box (6), be provided with the cooling chamber in cooling box (6), the cooling intracavity is equipped with the coolant liquid, four the bottom of heat conduction post (5) all extends to the cooling intracavity, one side fixed mounting at cooling box (6) top has into water funnel (11) with the cooling chamber intercommunication, the outlet with the cooling chamber intercommunication is installed to one side of cooling box (6).
2. The 3D printing circuit board substrate structure as claimed in claim 1, wherein two mounting seats (9) are symmetrically mounted on the top of the cooling box (6), each mounting seat (9) is mounted with a second temperature sensor (10), and the detection ends of the two second temperature sensors (10) extend into the cooling cavity.
3. 3D printing circuit board substrate structure according to claim 1, characterized in that four fans (7) are installed above the cooling box (6), and each of the four fans (7) is provided with an air outlet, and each air outlet is aligned with the bottom of the substrate body (1).
4. the 3D printing circuit board substrate structure according to claim 1, wherein three sealing rings (4) are installed on the substrate body (1), and the three sealing rings (4) are respectively sleeved on the three first temperature sensors (3).
5. The 3D printing circuit board substrate structure according to claim 3, wherein four heat conduction columns (5) are fixedly connected through a mounting substrate (8), four fans (7) are all mounted on the top of the mounting substrate (8), a heat conduction rod (12) is fixedly mounted at the center of the bottom of the mounting substrate (8), and the bottom end of the heat conduction rod (12) extends into the cooling cavity.
6. The 3D printing circuit board base structure according to claim 5, characterized in that the bottom ends of the four heat conducting columns (5) and the heat conducting rods (12) are fixedly provided with heat transfer bottom plates (13), and each heat transfer bottom plate (13) is fixedly arranged on the inner wall of the bottom of the cooling cavity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920595436.8U CN209794568U (en) | 2019-04-28 | 2019-04-28 | 3D printing circuit board substrate structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920595436.8U CN209794568U (en) | 2019-04-28 | 2019-04-28 | 3D printing circuit board substrate structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209794568U true CN209794568U (en) | 2019-12-17 |
Family
ID=68831398
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920595436.8U Expired - Fee Related CN209794568U (en) | 2019-04-28 | 2019-04-28 | 3D printing circuit board substrate structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209794568U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11910521B2 (en) | 2022-03-21 | 2024-02-20 | Toyota Motor Engineering & Manufacturing North America, Inc. | Power device assemblies having embedded PCBS and enhanced cooling and methods of fabricating the same |
-
2019
- 2019-04-28 CN CN201920595436.8U patent/CN209794568U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11910521B2 (en) | 2022-03-21 | 2024-02-20 | Toyota Motor Engineering & Manufacturing North America, Inc. | Power device assemblies having embedded PCBS and enhanced cooling and methods of fabricating the same |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20191217 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |