CN209794243U - Silicon rod cutting device - Google Patents

Abstract

The utility model relates to a device that cuts of silicon rod, include: an infrared detector (11) for detecting impurity layers of the silicon rod (20) and determining a cut-off position (X1, X2); a coding machine (12) for printing an identification code (30) on the surface of the silicon rod (20) to identify the number of the silicon rod (20); and a guillotine (13) comprising: -a memory (131) for storing the truncation positions (X1, X2) and parameter information of the silicon rods (20), -a scanner (132) for scanning the identification code (30) for identifying the number of the silicon rods (20), -a controller (133) for retrieving the corresponding truncation positions (X1, X2) from the memory (131) in dependence on the number of the silicon rods (20), and-a manipulator (134) for grasping the silicon rods (20) and placing them to a target position for cutting from the truncation positions (X1, X2) under the control of the controller (133).

Description

silicon rod cutting device

Technical Field

The utility model relates to a technical field that cuts of silicon rod especially relates to device that cuts of silicon rod.

background

the silicon rod or the silicon ingot is a product prepared by directional solidification of a silicon material. After being melted in a polycrystalline furnace, the silicon material can be grown into a polycrystalline silicon ingot through a series of working procedures, and the silicon ingot is cut into silicon rods by using a squaring machine. Generally, impurities at both ends of the silicon rod are large, and cutting is required. In order to remove impurity layers at two ends of the silicon rod, the cutting positions need to be accurately determined, waste of expensive materials is avoided, the silicon rod is placed through a manipulator, and the silicon rod is cut. In the existing silicon rod cutting equipment, the length of impurity layers to be cut at two ends of a silicon ingot is determined through an infrared detection device, the surface of the silicon ingot is manually scribed, and the scribing position on the silicon ingot is detected by visual shooting. Since the surface of the silicon ingot is black, the mark line is blurred sometimes, water marks remain on the surface of the silicon ingot sometimes, and the position of the mark line cannot be accurately recognized by photographing sometimes.

SUMMERY OF THE UTILITY MODEL

one of the purposes of the utility model is to provide a device for cutting off silicon rods, which has accurate and reliable cutting-off position and saves materials.

an aspect of the utility model provides a device that cuts of silicon rod, include:

The infrared detector is used for detecting an impurity layer of the silicon rod and determining a truncation position;

The coding machine is used for printing an identification code on the surface of the silicon rod so as to identify the number of the silicon rod; and

A guillotine machine comprising:

A memory which can acquire and store the cut-off position from the infrared detector and also store the parameter information of the silicon rod,

A scanner for scanning the identification code to identify the number of the silicon rod,

A controller for acquiring the corresponding cut-off position from the memory according to the number of the silicon rod read by the scanner, and

and a manipulator which grasps the silicon rod and places it to a target position for cutting from the cut-off position under the control of the controller.

In an exemplary embodiment of the silicon rod cutting device, the silicon rod cutting device further comprises an input device for inputting parameter information of the silicon rod, wherein the parameter information comprises number information and geometric dimensions; the coding machine acquires the number of the silicon rod from the input device to generate the identification code, and the storage device acquires and stores the parameter information of the silicon rod from the input device.

in another exemplary embodiment of the silicon rod cutting device, the silicon rod cutting device further comprises an ethernet communication device for transmitting the parameter information in the input device and the cutting position in the infrared detector to the cutting machine.

In a further exemplary embodiment of the cutting device for silicon rods, the cutting machine further comprises a cutting device which is capable of cutting the silicon rods from the cutting position.

in a further exemplary embodiment of the silicon rod truncation device, the identification code is a two-dimensional code or a bar code.

The embodiment of the utility model provides a device that cuts of silicon rod cuts the position through the identification code relevance, can confirm to cut the position accurately reliably, has practiced thrift the material.

drawings

The above features, technical features, advantages and modes of realisation of the present invention will be further explained in a clear and understandable manner by the description of preferred embodiments thereof in conjunction with the attached drawings, wherein:

Fig. 1 is a schematic structural view of a silicon rod cutting device according to an embodiment of the present invention;

Fig. 2 is a schematic structural view of a silicon rod printed with an identification code according to an embodiment of the present invention.

Description of reference numerals:

10 cut-off device

11 infrared detector

12 code printer

13 clipper

131 memory

132 scanner

133 controller

134 manipulator

135 cutting device

14 input device

20 silicon rod

30 identification code

X1 and X2 truncation positions

Detailed Description

In order to clearly understand the technical features, objects, and effects of the present invention, embodiments of the present invention will be described with reference to the accompanying drawings, in which like reference numerals refer to like parts in the drawings.

The figures discussed below, and the various embodiments used to describe the principles of the present disclosure in this patent document are by way of illustration only and should not be construed in any way to limit the scope of the disclosure. Those skilled in the art will understand that the principles of the present disclosure may be implemented in any suitably arranged device. The various innovative teachings of the present application will be described with reference to exemplary non-limiting embodiments.

"exemplary" means "serving as an example, instance, or illustration" herein, and any illustration, embodiment, or steps described as "exemplary" herein should not be construed as a preferred or advantageous alternative.

For the sake of simplicity, only the parts relevant to the present invention are schematically shown in the drawings, and they do not represent the actual structure as a product. In addition, in order to make the drawings concise and understandable, components having the same structure or function in some of the drawings are only schematically illustrated or only labeled.

fig. 1 is a schematic structural view of a silicon rod cutting apparatus according to an embodiment of the present invention. Fig. 2 is a schematic structural view of a silicon rod printed with an identification code according to an embodiment of the present invention. As can be seen from fig. 1 and 2, the truncating means 10 of the silicon rod 20 comprises:

The infrared detector 11 is used for detecting the impurity layer of the silicon rod 20 and determining the truncation position;

A coding machine 12 for printing an identification code 30 on the surface of the silicon rod 20 to identify the number of the silicon rod 20; and

a guillotine machine 13, comprising:

A memory 131 capable of acquiring and storing the cut-off position from the infrared detector 11, the memory 131 further storing parameter information of the silicon rod 20,

a scanner 132 for scanning the identification code 30 to identify the number of the silicon rod 20,

a controller 133 for retrieving the corresponding cut-off position from the memory 131 according to the number of the silicon rod 20 read by the scanner 132, and

a robot 134, which grasps the silicon rod 20 and places it to a target position to cut from the cut-off positions X1, X2 under the control of the controller 133.

Specifically, referring to fig. 1 and 2, the infrared detector 11 detects an impurity layer of the silicon rod 20, and determines cutoff positions X1 and X2. In fig. 2, the portion on the left side of the cutoff position X1 is an impurity layer, and the portion on the right side of the cutoff position X2 is also an impurity layer, and both need to be cut. The cutoff positions X1 and X2 are transmitted to the cutoff machine 13 and stored in the memory 131. The memory 131 also stores parameter information of the silicon rod 20, which includes number information and geometric dimensions (e.g., length, width, height dimensions). The coding machine 12 prints an identification code 30 on the surface of the silicon rod 20 according to the number of the silicon rod 20. In this way, the scanner 132 can identify the number of the silicon rod 20 by scanning the identification code 30. The controller 133 identifies the number of the silicon rod 20 currently to be cut off, and determines the corresponding cut-off positions X1 and X2. The robot 134 is then controlled to grasp the silicon rod 20 and place it to a target position for cutting from the cut-off positions X1, X2. Therefore, the truncation position can be accurately and reliably determined by correlating the identification code with the truncation position, and materials are saved.

The infrared detector 11 is communicatively connected to the memory 131 of the guillotine 13 and transmits the cut-off positions X1 and X2 to the memory 131 for storage. The scanner 132 is communicatively coupled to the controller 33 and the controller 133 is communicatively coupled to the memory 131. The controller 133 acquires the identification code 30 from the scanner 132 and identifies the number of the silicon rod 20 to be currently cut off according to the identification code 30, and determines the corresponding cutting positions X1 and X2. The controller 133 is also communicatively coupled to the robot 134 and controls the operation of the robot 134.

In an exemplary embodiment, the silicon rod truncation device 10 further comprises an input device 14 for inputting parameter information of the silicon rod 20, wherein the parameter information comprises number information and geometric dimensions; the coding machine 12 acquires the number of the silicon rod 20 from the input device 14 to generate the identification code 30, and the memory 131 acquires and stores parameter information of the silicon rod 20 from the input device 14. Alternatively, the input device 14 may include a mouse, a keyboard, a touch screen, etc. for manual input, or may include an automatic measuring device. The input device 14 is communicatively connected to the coding machine 12 and transmits the number of the silicon rod 20 to the coding machine 12. The input device 14 is also communicatively connected to the memory 131 of the chopper 13, and transmits and stores parameter information of the silicon rod 20 in the memory 131.

in an exemplary embodiment, the silicon rod cutting device 10 further includes an ethernet communication device (not shown) for transmitting the parameter information in the input device 14 and the cutting positions X1 and X2 in the infrared detector 11 to the cutting machine 13.

In an exemplary embodiment, the guillotine 13 further comprises a cutting device 135, which is capable of cutting the silicon rod 20 from the cutting positions X1 and X2. The controller 133 is also communicatively connected to the cutting device 135 to control the cutting device 135 to cut the silicon rod 20 from the cut-off positions X1 and X2.

in one exemplary embodiment, the identification code 30 is a two-dimensional code or a bar code.

It should be understood that although the present description has been described in terms of various embodiments, not every embodiment includes only a single embodiment, and such description is for clarity purposes only, and those skilled in the art will recognize that the embodiments described herein can be combined as a whole to form other embodiments as would be understood by those skilled in the art.

The above detailed description is only for the purpose of illustrating the practical embodiments of the present invention, and they are not intended to limit the scope of the present invention, and all equivalent embodiments or modifications that do not depart from the technical spirit of the present invention are intended to be included within the scope of the present invention.

Claims (5)

1. A silicon rod cutting device is characterized by comprising:

an infrared detector (11) for detecting impurity layers of the silicon rod (20) and determining a cut-off position (X1, X2);

a coding machine (12) for printing an identification code (30) on the surface of the silicon rod (20) to identify the number of the silicon rod (20); and

A guillotine machine (13) comprising:

A memory (131) which is able to acquire and store the cut-off positions (X1, X2) from the infrared detector (11), the memory (131) further storing parameter information of the silicon rod (20),

a scanner (132) for scanning the identification code (30) to identify the number of the silicon rod (20),

A controller (133) which retrieves the corresponding cut-off position (X1, X2) from the memory (131) in dependence on the number of the silicon rod (20) read by the scanner (132), and

A robot (134) which grips the silicon rod (20) and places it to a target position for cutting from the cut-off position (X1, X2) under the control of the controller (133).

2. the silicon rod truncation device as set forth in claim 1, wherein the silicon rod truncation device (10) further comprises an input device (14) for inputting the parameter information of the silicon rod (20), the parameter information including number information and geometric dimensions; the coding machine (12) acquires the number of the silicon rod (20) from the input device (14) to generate the identification code (30), and the memory (131) acquires and stores the parameter information of the silicon rod (20) from the input device (14).

3. The apparatus for truncating a silicon rod as set forth in claim 2 wherein the apparatus (10) for truncating a silicon rod further comprises an ethernet communication device for transmitting the parameter information in the input device (14) and the truncating position (X1, X2) in the infrared detector (11) to the truncating machine (13).

4. the device according to claim 3, characterized in that the guillotine (13) further comprises a cutting device (135) which is capable of cutting the silicon rod (20) from the cutting position (X1, X2).

5. The silicon rod truncation device as set forth in claim 1, wherein the identification code (30) is a two-dimensional code or a bar code.