CN209786274U

CN209786274U - High frequency connector with element protection member

Info

Publication number: CN209786274U
Application number: CN201920466657.5U
Authority: CN
Inventors: 姜士尧; 郑杰明
Original assignee: JIABIQI INTERNATIONAL CO Ltd
Current assignee: JIABIQI INTERNATIONAL CO Ltd; Jess Link Products Co Ltd
Priority date: 2019-04-09
Filing date: 2019-04-09
Publication date: 2019-12-13
Anticipated expiration: 2029-04-09

Abstract

The utility model provides a high frequency connector with component protection component contains shell, circuit board, component protection component and cable. The circuit board is arranged in the shell and is provided with an electronic element and a plurality of welding pads. The element protection member includes a housing and is disposed on the circuit board. An opening is arranged on one side of the shell, and an accommodating space is formed by the opening and the inner surface of the shell. And the outer surface of the other side of the housing forms a straddle structure. When the element protection component is arranged on the circuit board, the element protection component covers the electronic element in the accommodating space so as to maintain the transmission characteristic of the electronic element.

Description

high frequency connector with element protection member

Technical Field

The present invention relates to a high-frequency component protection member, and more particularly, to a high-frequency component protection member which is applied to a high-frequency connector and can maintain the characteristics of signal transmission of a high-frequency electronic component.

Background

The connector refers to a connecting element and an accessory for electronic signals, and the electronic devices are connected with each other by cables and connectors to convert and transmit signals, i.e., the connectors are also bridges between signals. Connectors are widely used in automotive and computer peripheral applications for data communication applications, industrial, military aviation, transportation, consumer electronics, medical, instrumentation, commercial equipment, etc., and thus, connectors play an important role in a variety of fields. In the generation with advanced information and high efficiency, the transmission speed of signal is continuously increasing. Therefore, high frequency connectors have also been developed to increase the transmission rate of signals.

However, when signal transmission is performed in a high frequency band, signal attenuation is a problem to be faced, and the signal loss includes conductor loss and dielectric loss, and the degree of the signal loss increases with the distance. The signal transmission distance of the high frequency connector is reduced due to the above-mentioned factors.

When designing a circuit board of a high-frequency connector, the high-frequency electronic components on the circuit board and the medium covered by the circuit traces directly affect the signal transmission characteristics (e.g., transmission speed, signal integrity). Generally, the most preferable covering medium is air (dielectric constant Dk 1). Therefore, the design of circuit boards in the connector industry typically places wire solder joints on the edges of the circuit board to avoid affecting high frequency electronic components.

With the rapid development of the technology, various electronic devices are increasingly light, thin, short and small, and circuit boards, electronic components and wires inside the connectors are also increasingly finer. Due to the limitations of circuit boards and the need for multiple functions at high frequencies, some of the wire bonding pads must be located at the non-edge of the circuit board, which means that some of the wire must straddle the high frequency electronic components. In the prior art, in order to make the wire span the electronic component, an insulating glue or other similar fixed material is coated between the wire and the circuit board to make the wire span the high-frequency electronic component through the insulating glue to connect the circuit board, but the high-frequency electronic component on the circuit board will be covered by the insulating glue, so that the dielectric coefficient around the high-frequency electronic component is increased, and the dielectric loss is increased, thereby seriously affecting the signal transmission characteristic.

therefore, there is a need to develop a high frequency device protection member that can ensure the electronic devices of the high frequency connector to maintain good signal transmission characteristics, so as to solve the problems of the prior art.

SUMMERY OF THE UTILITY MODEL

In view of the above, an object of the present invention is to provide a high frequency connector with a component protection member, which has a simple structure, is convenient to assemble and disassemble, is convenient to operate, can overcome the defects of the prior art, can effectively protect high frequency electronic components on a circuit board, and can further maintain signal transmission characteristics.

In order to achieve the above object, the present invention discloses a high frequency connector, which is characterized by comprising:

A housing;

A circuit board, which is arranged in the shell and is provided with an electronic element and a plurality of welding pads;

The element protection component is arranged on the circuit board and comprises a shell, wherein one side of the shell is provided with an opening, the opening and the inner surface of the shell form an accommodating space, the outer surface of the other side of the shell is provided with a spanning structure, and the electronic element is accommodated in the accommodating space; and

The cable comprises an insulating part and a conductor part positioned at the tail end of the cable, wherein the insulating part of the cable is arranged on the spanning structure in a spanning mode, and the conductor part is welded to the welding pads of the circuit board.

Wherein the circuit board further comprises at least one positioning hole, and the element protection member comprises at least one positioning post, and the size of the positioning post corresponds to that of the positioning hole.

The positioning column is a structure extending outwards from the opening direction of the element protection component.

the positioning column is sleeved in the positioning hole, and the element protection component is attached to the circuit board at the opening so that the electronic element is accommodated in the element protection component.

The maximum height of the accommodating space is greater than that of the electronic element, and the electronic element does not contact with the inner surface of the shell.

Wherein, the shape of the spanning structure is selected from one of circular arc, polygon and the combination of the circular arc and the polygon.

wherein, the straddling structure further comprises at least one groove, and the cable straddles the groove.

The cable further comprises a colloid coated on the cable and the circuit board, and the element protection component blocks the colloid outside the accommodating space.

The element protection component is coated between the shell and the circuit board, and the element protection component blocks the colloid outside the accommodating space.

wherein, the component protection member further comprises at least one rib structure disposed on the inner surface of the housing and not contacting the electronic component.

According to the above structure, the utility model discloses a high frequency connector can realize following technological effect:

1. The structure is simple, and the operation is convenient;

2. the electronic element and the corresponding circuit on the circuit board are covered by the element protection component, so that the electronic element can be ensured to be in good contact with the dielectric medium, and the transmission characteristic of the electronic element is maintained;

3. Reliable protection, high structural strength and longer service life.

Drawings

FIG. 1: an exploded view of a high frequency connector according to an embodiment of the present invention is shown.

Fig. 2A and 2B: the structure of the device protection component according to fig. 1 is schematically shown.

FIG. 3: an assembly diagram of the circuit board and the element protection member according to fig. 1 is shown.

FIG. 4: a schematic diagram of a circuit board and an element protection member according to an embodiment of the present invention is shown.

Fig. 5A, 5B, and 5C: respectively, a schematic diagram of the element protection members in different shapes according to another embodiment of the present invention is shown.

FIG. 6A: a schematic diagram of a high frequency connector according to another embodiment of the present invention is shown.

FIG. 6B: 3 a 3 cross 3- 3 sectional 3 view 3 of 3 the 3 high 3 frequency 3 connector 3 of 3 fig. 3 6A 3 is 3 shown 3 along 3 line 3 a 3- 3 a 3. 3

FIG. 7: a schematic diagram of an element protection component according to another embodiment of the present invention is shown.

FIG. 8: an assembly of the element protection member and the circuit board of fig. 7 is illustrated.

FIG. 9: a flow chart of a method of making a high frequency connector according to one embodiment of the present invention is shown.

FIG. 10: a flow chart of a method of making a high frequency connector according to one embodiment of the present invention is shown.

FIG. 11: a flow chart of a method of making a high frequency connector according to one embodiment of the present invention is shown.

FIG. 12: a flow chart of a method of making a high frequency connector according to another embodiment of the present invention is shown.

Detailed Description

In order to provide the advantages, spirit and features of the present invention, which will be more readily understood and appreciated, reference will now be made in detail to the preferred embodiments and accompanying drawings. It is noted that these embodiments are merely exemplary embodiments of the present invention, and the particular methods, devices, conditions, materials, etc., that are illustrated are not intended to limit the present invention or the corresponding embodiments. Also, the devices shown in the drawings are merely for relative positional representation and are not drawn to scale as they are actually drawn.

Referring to fig. 1, fig. 2A and 2B, fig. 3 and fig. 4, fig. 1 is an exploded schematic view of a high frequency connector 1 according to an embodiment of the present invention, fig. 2A and 2B are schematic structural diagrams of an element protection member 13 according to fig. 1, fig. 3 is a schematic combination diagram of a circuit board 12 and the element protection member 13 according to fig. 1, and fig. 4 is a schematic diagram of the circuit board 12 and the element protection member 13 according to an embodiment of the present invention.

As shown in fig. 1, the high-frequency connector 1 of the present embodiment includes a housing 11, a circuit board 12, an element protection member 13, and a cable 14. The circuit board 12 is disposed in the housing 11 and is provided with a plurality of pads 127, 128, an electronic component 122 and at least two positioning holes 124. The device protection component 13 includes a housing 131 and at least two positioning posts 132 extending from the housing 131, so that the high frequency device protection component 13 can be disposed on the circuit board 12 by inserting the positioning posts 132 into the positioning holes 124 of the circuit board 12. One side of the housing 11 includes an opening, and the circuit board 12 is nestable through the opening of the housing 11 and is disposed in the housing 11.

As shown in fig. 2A and 2B, the element protection component 13 of the present embodiment has an opening 134 on one side of the housing 131, the opening 134 and the inner surface of the housing 131 form an accommodating space 133, and the outer surface of the other side of the housing 131 has a straddle structure 135. The positioning posts 132 extend outward from the housing 131, and in detail, the positioning posts 132 in this embodiment are extended outward from the opening 134 of the housing 131. The position and shape of the positioning post 132 respectively correspond to the position and shape of the positioning hole 124 of the circuit board 12, and the size of the positioning post 132 can be slightly smaller than the size of the positioning hole 124.

In practice, when the component protection member 13 is disposed on the circuit board 12, the component protection member 13 is disposed on the circuit board 12 by the positioning column 132 being inserted into the positioning hole 124 on the circuit board 12, at this time, the opening 134 of the housing 131 of the component protection member 13 is attached to the circuit board 12, so that the accommodating space 133 can accommodate the electronic component 122 on the circuit board 12, and further, the component protection member 13 covers the electronic component 122 on the circuit board 12. The electronic component 122 may be a high frequency transmission or communication electronic component. In the embodiment, the number of the electronic components 122 covered by the component protection member 13 is 3, but the implementation is not limited thereto, and the number of the high frequency electronic components 122 may be 1, 2, or 3 or more. Since the component protection member 13 can be mounted on the circuit board 12 only by inserting the positioning posts 132 into the positioning holes 124 of the circuit board 12, the mounting time can be saved. Please note that, although the two positioning pillars 132 of the device protection component 13 in fig. 2A and fig. 2B are located on the same side of the housing 131 and at the corners of the housing 131, the implementation is not limited thereto. In another embodiment, the two positioning posts 132 of the high frequency device protection component 13 can also be located at opposite corners of the housing 131 or can be located at non-corners of the housing 131, which are corresponding to the positioning holes 124 on the circuit board 12. The positioning posts 132 and the positioning holes 124 may be polygonal or have corresponding shapes, besides being circular or semicircular (as shown in fig. 2A and 2B). In addition, the number of the positioning posts 132 is not limited to 2 in fig. 1 and fig. 2A and 2B, but 1, 2 or more than 3 positioning posts 132 may be further disposed on the housing 131, and similarly, the circuit board 12 also has a corresponding number and position of the positioning holes 124.

Generally, the soldering position of the cable of the connector is usually designed at the edge of the circuit board to avoid the cable from touching the electronic component, thereby affecting the transmission characteristics of the electronic component. As shown in fig. 1, the first pad 127 is located at the edge of the circuit board 12, and when the conductor portion 144 of the first cable 141 is soldered to the first pad 127, the first cable 141 can be soldered to the first pad 127 without contacting an electronic component. However, in the case where the space for the circuit board arrangement is insufficient, the position of the wire bonding must be located at the non-edge of the circuit board. As shown in fig. 1 and 4, the second pads 128 are located between the electronic components 122 of the circuit board 12. Therefore, when the conductor portion 144 of the second wire 142 is soldered to the second pad 128, the insulating portion 143 of the second wire 142 contacts the electronic element 122. In practice, the dielectric covering the electronic components 122 on the circuit board 12 affects the signal transmission characteristics (e.g., transmission speed and signal integrity) of the electronic components 122, and the optimal covering medium is air (dielectric constant is 1, Dk ═ 1). Therefore, when the insulating portion 143 of the second cable 142 contacts the electronic element 122, the dielectric constant of the electronic element 122 is greater than 1, and at this time, the transmission characteristics of the electronic element 122 are affected, such as: the signal attenuation degree is increased, the transmission speed is reduced, etc. Therefore, when the component protection member 13 is disposed on the circuit board 12, the component protection member 13 can block the electronic component 122 and the second cable 142, so that the electronic component 122 does not directly contact the second cable 142, thereby maintaining the transmission characteristics of the electronic component 122. In the present embodiment, when the second wire 142 is soldered to the second solder pad 128, the second wire 142 straddles over the straddling structure 135 of the device protection component 13, as shown in fig. 4. Therefore, the element protection member 13 blocks the second cable 142 by the housing 131 and protects the electronic element 122 by the accommodating space 133 to ensure that the electronic element 122 is at an optimal dielectric constant, thereby maintaining the transmission characteristics of the electronic element 122.

In addition, in the present embodiment, the maximum height of the accommodating space 133 of the component protection member 13 is greater than the maximum height of the electronic component 122 of the circuit board 12. In practice, the device protection member 13 can prevent the second cable 142 from contacting the electronic device, and also can prevent the electronic device 122 from contacting the inner surface of the housing 131 of the device protection member 13, so as to further keep the electronic device 122 at the optimal dielectric constant to maintain the signal transmission characteristics of the electronic device 122.

In the above embodiment, the element protection member 13 is an arc-shaped sheet, but the implementation is not limited thereto. Referring to fig. 5A, 5B and 5C, fig. 5A, 5B and 5C are schematic diagrams illustrating different shapes of the element protection members 13 ', 13 "and 13'" according to another embodiment of the present invention. As shown in fig. 5A, 5B and 5C, the shape of the straddling structures 135 ', 135 "and 135'" of the element protection members 13 ', 13 "and 13'" may also be a polygon (e.g., trapezoid or polygon including rounded corners), or a combination of arc and polygon (e.g., polygon including rounded corners). In practice, any structure that can form the accommodating space and can span the wire can be used as the spanning structure of the high-frequency device protection member of the present invention. In yet another embodiment, at least one rib structure may be included at the inner surface of the case of the element protection member 13 to reinforce the structural strength of the element protection member 13.

Please refer to fig. 4, fig. 6A and fig. 6B. 3 fig. 3 6A 3 is 3 a 3 schematic 3 view 3 of 3 a 3 high 3- 3 frequency 3 connector 31 3 according 3 to 3 another 3 embodiment 3 of 3 the 3 present 3 invention 3, 3 and 3 fig. 36 3 B 3 is 3 a 3 sectional 3 view 3 of 3 the 3 high 3- 3 frequency 3 connector 31 3 of 3 fig. 3 6A 3 taken 3 along 3 line 3 a 3- 3 a 3. 3 As shown in fig. 6A and 6B, the difference between the present embodiment and the previous embodiment is that after the first cable 141 and the second cable 142 of the present embodiment are soldered on the circuit board 12, the colloid 15 is used to adhere and fix the conductor portions 144 of the first cable 141 and the second cable 142 to the first pad 127 and the second pad 128 of the circuit board 12, respectively. In the present embodiment, the glue 15 is further coated on the insulation portions of the first cable 141 and the second cable 142 and the element protection member 13. In practice, the glue 15 fixes the first cable 141, the second cable 142 and the component protection member 13 on the circuit board 12, which not only increases the holding strength of the first cable 141 and the second cable 142 and prevents the first cable 141 and the second cable 142 from being pulled and falling off, but also prevents the component protection member 13 from falling off. When the glue 15 is coated on the circuit board 12, the element protection member 13 can exclude the glue 15 from the accommodating space 133, so that the electronic element 122 located in the accommodating space 133 does not contact the glue 15, and the electronic element 122 can still maintain the signal transmission characteristic. In practice, the glue 15 may be a waterproof glue or an insulating glue. In another embodiment, the glue 15 may be applied between the circuit board 12 and the housing 11 in addition to the circuit board 12, so that the structure of the high frequency connector 1 is more stable.

Referring to fig. 7 and 8, fig. 7 is a schematic diagram illustrating an element protection member 23 according to another embodiment of the present invention, and fig. 8 is a schematic diagram illustrating an assembly of the element protection member 23 and the circuit board 12 of fig. 7. As shown in fig. 7 and 8, the present embodiment is different from the previous embodiments in that the housing 231 of the component protection member 23 of the present embodiment includes at least one groove 236 disposed on the outer surface of the spanning structure 235, so that when the component protection member is assembled on the circuit board 12, the second cable 142 spans in each groove 236. In practice, the element protecting member 23 including the groove 236 not only enables the second cables 142 to be aligned with less ease of winding, but also saves space. Although the number of the grooves 236 of the element protection member 23 in fig. 7 and 8 is 4, the number of the grooves 236 may be 1, 2, 3, or 4 or more to match the number of the second cables 142 spanning the high-frequency element protection member 23.

Referring to fig. 9, fig. 9 is a flowchart illustrating a method for manufacturing a high frequency connector according to an embodiment of the invention. The utility model also provides a method for making high frequency connector, contains following step: step S1, soldering the conductor portion of the first cable to the first pad of the circuit board; a step S2 of placing the element protection member on the circuit board so that the element protection member covers the electronic elements of the circuit board; step S3, straddling a second cable over the element protection member and soldered to a second pad of the circuit board; step S4, coating glue on the first and second pads of the circuit board; and a step S5 of disposing the circuit board, the component protective member, the first cable, and the second cable in the housing. The method of manufacturing the high-frequency connector shown in fig. 9 can be achieved by the high-frequency connector 1 shown in fig. 1 and 4. The functions of the units mentioned in the steps of this embodiment are substantially the same as the functions of the corresponding units of the previous embodiment, and therefore, the detailed description thereof is omitted here. Please note that, in practice, the steps S1 and S2 can be interchanged.

Referring to fig. 10, fig. 10 is a flow chart illustrating a method for manufacturing a high frequency connector according to an embodiment of the invention. Wherein, the step S2 can be further a step S21: the at least two positioning columns of the element protection component are sleeved into the at least two positioning holes of the corresponding circuit board, so that the accommodating space of the element protection component accommodates the electronic element.

Referring to fig. 11, fig. 11 is a flow chart illustrating a method for manufacturing a high frequency connector according to an embodiment of the invention. Wherein, the step S3 can be further a step S31: the insulating portion of the second cable is straddled over the straddling structure of the element protecting member, and the conductor portion of the second cable is soldered to the second pad of the circuit board.

Referring to fig. 12, fig. 12 is a flow chart illustrating a method for manufacturing a high frequency connector according to another embodiment of the present invention. Wherein, the step S3 can be further a step S32: the second cable is straddled over the at least one groove of the element protection member and soldered to a second pad of the circuit board.

to sum up, the high frequency connector of the present invention covers the electronic component on the circuit board with the component protection member to ensure that the electronic component can contact the good dielectric medium and thus maintain the transmission characteristic of the electronic component.

The foregoing detailed description of the preferred embodiments is intended to more clearly illustrate the features and spirit of the present invention, and not to limit the scope of the invention by the preferred embodiments disclosed above. On the contrary, the intention is to cover various modifications and equivalent arrangements included within the spirit and scope of the invention. The scope of the claims is thus to be accorded the broadest interpretation so as to encompass all such modifications and equivalent arrangements as is within the scope of the appended claims.

Claims

1. A high-frequency connector having an element protecting member, characterized by comprising:

A housing;

2. The high-frequency connector according to claim 1, wherein the circuit board further comprises at least one positioning hole, and the component protection member comprises at least one positioning post having a size corresponding to that of the positioning hole.

3. The high-frequency connector as claimed in claim 2, wherein said positioning post is a structure extending outwardly from said opening of said component protection member.

4. The high frequency connector as claimed in claim 2, wherein the positioning posts are received in the positioning holes, and the component protection member is attached to the circuit board at the opening such that the electronic component is received in the component protection member.

5. the high-frequency connector as claimed in claim 1, wherein the maximum height of the receiving space is greater than the maximum height of the electronic component, and the electronic component does not contact the inner surface of the housing.

6. The high frequency connector as claimed in claim 1, wherein the shape of the straddling structure is selected from the group consisting of circular arc shape and polygonal shape.

7. The high-frequency connector as claimed in claim 1, wherein the straddling structure further comprises at least one groove, and the cable straddles the groove.

8. The high-frequency connector as claimed in claim 1, further comprising a sealant, wherein the sealant is coated on the cable and the circuit board, and the element protection member blocks the sealant from the accommodating space.

9. The high-frequency connector as claimed in claim 1, further comprising a sealant, wherein the sealant is coated between the housing and the circuit board, and the element protection member blocks the sealant from the accommodating space.

10. The high-frequency connector according to claim 1, wherein the component protection member further comprises at least one rib structure provided on an inner surface of the housing and not contacting the electronic component.