CN209785900U - Blade pushing device - Google Patents
Blade pushing device Download PDFInfo
- Publication number
- CN209785900U CN209785900U CN201920605163.0U CN201920605163U CN209785900U CN 209785900 U CN209785900 U CN 209785900U CN 201920605163 U CN201920605163 U CN 201920605163U CN 209785900 U CN209785900 U CN 209785900U
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- wafer
- wafer box
- placing plate
- unit
- pushing
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Abstract
The utility model relates to a push jack device has the locking unit, plays the locking effect to the push jack unit. When the wafer box is not placed on the bump, the pushing sheet unit is locked by the limiting part of the locking unit and cannot move to push the wafer placed in the wafer box, and therefore fragments cannot be generated. Furthermore, the locking unit is provided with two bumps, and only when two wafer boxes are placed at corresponding positions simultaneously and are in contact with the two bumps, the wafer pushing unit can be completely separated from the locking unit to lock the wafer pushing unit, so that the wafer placed in one wafer box can be smoothly pushed out to the other wafer box, the wafer is prevented from being damaged when the wafer is transferred from one wafer box to the other wafer box, and the wafer processing yield is improved.
Description
Technical Field
The utility model relates to a wafer production and processing equipment field, concretely relates to push away piece device.
Background
In the wafer production process, due to the requirements of equipment production, process flow, transportation and storage, etc., wafers are often required to be transferred from one wafer cassette to another wafer cassette. In the transfer process, a vacuum suction pen is usually used to transfer a wafer from one wafer cassette to another wafer cassette, but the operation is purely manual operation, which has risks of wafer dropping and scratching, and the efficiency is extremely low.
However, in the push rod method, two wafer cassettes need to be butted, and a spurious phenomenon occurs in the butting process, which results in that all wafers placed in one wafer cassette are pushed out and damaged, and the yield of wafer processing is seriously affected.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a push away piece device can increase the yield of wafer processing.
In order to solve the technical problem, the utility model provides a push jack device, include: the wafer box placing plate is used for placing a wafer box to be subjected to wafer pushing; the wafer pushing unit is arranged on the wafer box placing plate, can move in the horizontal direction relative to the wafer box, comprises a push rod, is vertical to the horizontal plane, is positioned above the wafer box placing plate, can extend into the wafer box to push wafers placed in the wafer box, and further comprises a locking block positioned below the wafer box placing plate; the locking unit, set up in the board is placed to wafer box includes: the lug is arranged on the upper surface of the wafer box placing plate in a protruding mode; the limiting piece is connected to the protruding block, penetrates through the wafer box placing plate, protrudes out of the lower surface of the wafer box placing plate, is in contact with the locking piece, and limits the locking piece so as to limit the horizontal position of the push piece unit; when a wafer box is placed above the lug, the limiting part is lifted relative to the wafer box placing plate, and the locking block is separated from limiting.
Optionally, the number of the bumps is two, the number of the limiting members is also two, and one bump is correspondingly connected to one limiting member.
Optionally, a connecting line of the two bumps is parallel to a moving direction of the wafer pushing unit when pushing the wafer.
Optionally, a connecting line of the two limiting members is parallel to a moving direction of the wafer pushing unit when pushing the wafer.
Optionally, the device further comprises a driving member connected to the blade pushing unit for driving the blade pushing unit.
Optionally, the device further comprises a push rod handle connected to the push sheet unit for a user to manually drive the push sheet unit.
optionally, the limiting member and the bump are integrally connected, and an integrated structure formed by the limiting member and the bump can rotate around a rotating shaft, and the rotating shaft passes through the integrated structure, so that the size of the limiting member exposed out of the wafer box placing plate changes.
Optionally, the method further includes: and the limiting guide rail is arranged on the upper surface of the wafer box placing plate in a protruding manner, is matched with the bottom of the wafer box and is used for limiting the wafer box placed on the upper surface of the wafer box placing plate so as to enable the wafer box to be placed to a preset position.
The push sheet device is provided with a locking unit which has a locking effect on the push sheet unit. When the wafer box is not placed on the bump, the pushing sheet unit is locked by the limiting part of the locking unit and cannot move to push the wafer placed in the wafer box, and therefore fragments cannot be generated. Furthermore, the locking unit is provided with two bumps, and only when two wafer boxes are placed at corresponding positions simultaneously and are in contact with the two bumps, the wafer pushing unit can be completely separated from the locking unit to lock the wafer pushing unit, so that the wafer placed in one wafer box can be smoothly pushed out to the other wafer box, the wafer is prevented from being damaged when the wafer is transferred from one wafer box to the other wafer box, and the wafer processing yield is improved.
Drawings
Fig. 1 is a schematic cross-sectional view of a blade pushing device according to an embodiment of the present invention.
Fig. 2 is a partially enlarged dynamic schematic view of a blade pushing device according to an embodiment of the present invention.
Fig. 3 is a schematic perspective view of a blade pushing device according to an embodiment of the present invention.
Fig. 4 is a schematic side view of a blade pushing device according to an embodiment of the present invention.
Fig. 5 is a partially enlarged schematic view of a blade pushing device according to an embodiment of the present invention.
Detailed Description
The following describes a blade pushing device according to the present invention in detail with reference to the accompanying drawings and the following detailed description.
please refer to fig. 1 to 5, wherein fig. 1 is a schematic sectional view of a slide mechanism in an embodiment of the present invention, fig. 2 is a schematic partial enlarged dynamic view of the slide mechanism in an embodiment of the present invention, fig. 3 is a schematic perspective view of the slide mechanism in an embodiment of the present invention, fig. 4 is a schematic side view of the slide mechanism in an embodiment of the present invention, and fig. 5 is a schematic partial enlarged view of the slide mechanism in an embodiment of the present invention.
in this embodiment, the blade pushing device includes: a wafer cassette placing plate 100 for placing a wafer cassette 101 to be subjected to wafer pushing; the wafer pushing unit 102 is mounted on the wafer cassette placing plate 100, can move in the horizontal direction relative to the wafer cassette 101, comprises a pushing rod 1021, is perpendicular to the horizontal plane, is positioned above the wafer cassette placing plate 100, can extend into the wafer cassette 101 to push the wafer 104 placed in the wafer cassette 101, and further comprises a locking block 301 positioned below the wafer cassette placing plate 100; a locking unit 105 provided on the wafer cassette mounting plate 100, and including: a bump 201 protruding from the upper surface of the wafer cassette mounting plate 100 and serving as a mounting position mark for the wafer cassette 101; a stopper 302 connected to the bump 201, penetrating through the wafer cassette placing plate 100, protruding out of the lower surface of the wafer cassette placing plate 100, contacting the lock block 301, and stopping the lock block 301, thereby stopping the horizontal position of the blade pushing unit 102; when a wafer cassette is placed above the bump 201, the stopper 302 is lifted up relative to the wafer cassette placing plate 100, and the lock piece is disengaged from the stopper.
In this embodiment, the blade pushing device has a locking unit 105, which locks the blade pushing unit 102. When the wafer cassette 101 is not placed above the bump 201, the blade pushing unit 102 is locked by the stopper 302 of the locking unit 105 and cannot move to push the wafer 104 placed in the wafer cassette 101, which will not cause fragments. Furthermore, the locking unit 105 is provided with two bumps 201, and only when two cassettes 101 are placed at corresponding positions and are disposed above the two bumps 201, the blade pushing unit 102 can completely disengage from the locking unit 105 to lock the two cassettes, so as to smoothly push the wafer 104 placed in one cassette 101 out of the other cassette 101, thereby preventing the wafer 104 from being damaged when the wafer 104 is transferred from one cassette 101 to the other cassette 101, and improving the processing yield of the wafer 104.
In one embodiment, the length of the wafer cassette positioning plate 100 should be sufficient to position two wafer cassettes 101, so that when the wafer 104 in one wafer cassette 101 needs to be pushed into another wafer cassette 101 by the wafer pushing device, both wafer cassettes 101 can be positioned on the wafer cassette positioning plate 100 to have the same horizontal height. Referring to fig. 1, two cassettes 101 are placed on the upper surface of the cassette placing plate 100 and are completely aligned.
In one embodiment, the length of the push rod 1021 in the vertical direction is sufficient to match the height of the cassette, so that all the wafers 104 placed in the cassette 101 can be pushed out in one pushing process.
In one embodiment, the lock block 301 and the push rod 1021 are connected through a connecting rod, and the lock block 301 and the push rod 1021 have the same motion state, that is, when the push rod 1021 moves horizontally, the lock block 301 moves horizontally, and when the push rod 1021 is stationary, the lock block 301 is stationary. The push rod 1021 can be limited by limiting the lock block 301.
In one embodiment, the blade pushing device further comprises a driving member, which is not shown in the figure. The driving shaft of the driving member is connected to the blade pushing unit 102, and is used for driving the blade pushing unit 102 to make the blade pushing unit 102 move in the horizontal direction.
in one embodiment, when the blade pushing device is in an operating state, the driving member continuously pushes the blade pushing unit 102. When the lock block 301 is locked, the blade pushing unit 102 cannot be displaced in the horizontal direction with respect to the wafer cassette mounting plate 100 even if the driving action of the driving member is applied. Only when the lock block 301 is released from the limit, the wafer pushing unit 102 can move under the driving of the driving member to generate a horizontal displacement, so as to push all the wafers in the first wafer box into the second wafer box.
In practice, the push rod 1021 may be performed by means of a push rod handle 202 connected to the push sheet unit 102 without providing a driving member. As shown in fig. 1 to 3. A pusher handle 202 is also provided below the cassette mounting plate 100, and a user can push the blade pushing unit 102 to move in the horizontal direction by holding the pusher handle 202 and pushing the pusher handle 202 in the horizontal direction. The use of the pusher handle 202 can effectively reduce the cost of the wafer pushing device, and the processing yield of the wafer 104 can be improved because the user determines whether to perform the wafer 104 transferring operation according to the seen position of the wafer box 101.
Referring to fig. 2, in this embodiment, the limiting member 302 and the bump 201 are integrally connected. The integral structure formed by the limiting member 302 and the protrusion 201 can rotate around a rotation axis, and the rotation axis passes through the integral structure. Specifically, the rotation axis is disposed at a connection position between the limiting member 302 and the bump 201, and the length direction is perpendicular to the paper surface. In the integrated structure, the volume of the stopper 302 exposed from the wafer cassette mounting plate 100 changes, increases, or decreases in the process of rotating around the rotation axis.
In fig. 2, when the bump 201 is pressed by the wafer cassette 101 placed above, the integrated structure rotates counterclockwise or clockwise, the stopper 302 retracts into the wafer cassette placing plate 100, and does not contact with the lock block 301 with a certain height, the stopper 301 is lost, and the blade pushing unit 102 can push.
When there is no wafer cassette 101 above the bump 201, the integrated structure exposes most of the limiting member 302 to the wafer cassette placement board 100 under the action of gravity, and at this time, the limiting member 302 contacts with the lock block 301 to limit the lock block 301, and the blade pushing unit 102 cannot push.
In one embodiment, the position-limiting member 302 can be further connected to the protrusion 201 through an elastic connection member. By providing the elastic connection member, when the bump 201 is not pressed by the cassette 101, the stopper 302 protrudes from the lower surface of the cassette mounting plate 100 more, so as to limit the lock block 301 and lock the wafer pushing unit 102, so that the wafer pushing unit 102 cannot be pushed. When the bump 201 is pressed by the pod 101, the stopper 302 retracts, the portion exposed in the pod placing plate 100 decreases, the lock block 301 is no longer limited, the blade pushing unit 102 is unlocked and can be pushed, and the wafer 104 in the pod 101 can be pushed and transferred.
In other embodiments, a photosensitive sensor may be disposed on the surface of the bump 201. When the photosensitive sensor detects that the wafer cassette 101 is placed above the bump and the light inlet amount is reduced, the photosensitive sensor transmits a signal to a controller, the controller is connected to the driving module of the limiting member, the controller controls the driving module to drive the limiting member 302 to retract, so that the portion of the wafer cassette placing plate 100 exposed is reduced, and the locking of the lock block 301 is released. In this embodiment, when the controller does not receive the signal, the controller controls the limiting member 302 to expose more of the wafer placing board 100, so as to limit the lock block 301.
In one embodiment, the number of the bumps 201 and the stoppers 302 is two, and one bump 201 is correspondingly connected to one stopper 302. The two bumps 201 may be used to mark the placement positions of the two cassettes 101, to prompt the user where to place the two cassettes 101, respectively, and to enable the two cassettes 101 to be approximately aligned when placed on the upper surface of the cassette placement plate 100, so that the user can push the wafer 104 in one cassette 101 out of the other cassette 101.
Meanwhile, two bumps 201 and two limiting parts 302 are arranged, and the positions of the two bumps 201 are planned, so that only when two wafer cassettes 101 are placed on the surface of the wafer cassette placing plate 100 and the two wafer cassettes 101 are placed at corresponding positions, the wafer pushing unit 102 can be completely pushed to completely push the wafer 104 in the first wafer cassette into the second wafer cassette, and the two wafer cassettes 101 are prevented from being aligned incompletely when the wafer 104 in one wafer cassette 101 is pushed into the other wafer cassette 101, so that all the wafers 104 placed in the first wafer cassette are pushed out and fall off, the wafer 104 is damaged, and the processing yield of the wafer 104 is influenced.
In one embodiment, the bump 201 is provided at a place where the wafer cassette 101 placed on the cassette placing plate 100 can be pressed. In one embodiment, the wafer cassette 101 contacts the cassette placement board 100 only through two side edges of the ground, and therefore, in this embodiment, the protrusion 201 is disposed at a position where it can contact with two side edges of the wafer cassette 101, so as to unlock the lock block 301 from the wafer cassette 101 after the wafer cassette 101 is placed.
In one embodiment, the top view of the two bumps 201 is elongated, and the connection line of the two bumps 201 is parallel to the moving direction of the wafer 104 pushed by the pushing sheet unit 102, so as to facilitate the alignment of the two cassettes 101. A connecting line of the two limiting members 302 is parallel to a moving direction of the wafer 104 pushed by the blade pushing unit 102, so that the limiting members 302 are disposed in the moving direction of the locking block 301, and both the two limiting members 302 can be used for limiting the locking block 301, thereby locking a horizontal position of the blade pushing unit 102.
In the embodiment shown in fig. 1 to 5, the two stoppers 302 have slightly different shapes, but both can be hooked to the lock block 301 in the locked state to prevent the lock block 301 from being displaced in the horizontal direction. In fact, the position-limiting member 302 may be provided in other shapes as needed, as long as the displacement of the lock block 301 in the direction of pushing the wafer 104 can be prevented. In this embodiment, the two bumps 201 are slightly different in shape. In fact, the bump 201 may be provided in other shapes as desired.
In a preferred embodiment, the distance between the two position-limiting members 302 should be small enough, so that when only one wafer cassette 101 is placed on the wafer cassette placing plate 100, only one bump 201 is pressed by the wafer cassette 101, and one position-limiting member 302 no longer limits the lock block 301, the wafer 104 will not be dropped out of the wafer cassette 101 and the wafer 104 will be damaged because the wafer pushing unit 102 can only advance a small distance during the process of moving the lock block 301 from the first position-limiting member 302 to the second position-limiting member 302.
In one embodiment, the distance between the two bumps 201 should be large enough to prevent one wafer cassette 101 from being placed above the two bumps 201 at the same time, and only one wafer cassette 101 will cause the two stoppers 302 to retract, and the wafer 104 will be damaged by pushing the wafer pushing unit 102 to push out of the first wafer cassette in case that only one wafer cassette 101 is placed.
In a specific embodiment, the wafer pushing device further includes a limiting rail 203 protruding from the upper surface of the wafer cassette placing plate 100, matching with the bottom of the wafer cassette 101, for limiting the wafer cassette 101 placed on the upper surface of the wafer cassette placing plate 100, so that the wafer cassette 101 is placed at a predetermined position.
In one embodiment, the length direction of the position-limiting guide rails 203 is parallel to the moving direction of the blade-pushing unit 102, and the number of the position-limiting guide rails is two. The distance between the two limit rails 203 coincides with the width of the bottom of the wafer cassette 101, and the two wafer cassettes 101 are restricted from being aligned in a direction parallel to the moving direction of the blade pushing unit 102 by placing the wafer cassette 101 between the two limit rails 203.
Furthermore, the limit guide rail 203 is a limit guide rail 203 which is arranged between the two bumps 201 and the length direction of which is perpendicular to the moving direction of the blade pushing unit 102. When the limit guide rail 203 is used, the first surface of the first wafer box and the second surface of the second wafer box are close to the limit guide rail, and the wafer is pushed out from the first surface of the first wafer box and pushed in from the second surface of the second wafer box. After the limiting guide rails 203 are used, the openings of the two wafer boxes 101 can be completely aligned, so that the wafer 104 in one wafer box 101 can be conveniently pushed to the corresponding position in the other wafer box 101, and the wafer 104 can be prevented from falling and being damaged.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of improvements and decorations can be made without departing from the principle of the present invention, and these improvements and decorations should also be regarded as the protection scope of the present invention.
Claims (8)
1. A blade pushing device, comprising:
The wafer box placing plate is used for placing a wafer box to be subjected to wafer pushing;
The wafer pushing unit is arranged on the wafer box placing plate, can move in the horizontal direction relative to the wafer box, comprises a push rod, is vertical to the horizontal plane, is positioned above the wafer box placing plate, can extend into the wafer box to push wafers placed in the wafer box, and further comprises a locking block positioned below the wafer box placing plate;
The locking unit, set up in the board is placed to wafer box includes:
The lug is arranged on the upper surface of the wafer box placing plate in a protruding mode;
The limiting piece is connected to the protruding block, penetrates through the wafer box placing plate, protrudes out of the lower surface of the wafer box placing plate, is in contact with the locking piece, and limits the locking piece so as to limit the horizontal position of the push piece unit;
when a wafer box is placed above the lug, the limiting part is lifted relative to the wafer box placing plate, and the locking block is separated from limiting.
2. The blade pushing device according to claim 1, wherein the number of the protrusions is two, the number of the position limiting members is also two, and one protrusion is correspondingly connected to one position limiting member.
3. the wafer pushing device according to claim 2, wherein a connecting line of the two bumps is parallel to a moving direction of the wafer pushing unit when pushing the wafer.
4. The wafer pushing device according to claim 2, wherein a connecting line of the two limiting members is parallel to a moving direction of the wafer pushing unit when pushing the wafer.
5. The blade pushing device of claim 1, further comprising a driving member connected to the blade pushing unit for driving the blade pushing unit.
6. The blade pushing device of claim 1, further comprising a pusher handle connected to the blade pushing unit for manual actuation of the blade pushing unit by a user.
7. The wafer pushing device according to claim 1, wherein the limiting member and the protrusion are integrally connected, and the integrated structure of the limiting member and the protrusion can rotate around a rotation axis, and the rotation axis passes through the integrated structure, so that the volume of the limiting member exposed out of the wafer box placing plate changes.
8. The blade pushing device of claim 1, further comprising:
And the limiting guide rail is arranged on the upper surface of the wafer box placing plate in a protruding manner, is matched with the bottom of the wafer box and is used for limiting the wafer box placed on the upper surface of the wafer box placing plate so as to enable the wafer box to be placed to a preset position.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920605163.0U CN209785900U (en) | 2019-04-29 | 2019-04-29 | Blade pushing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920605163.0U CN209785900U (en) | 2019-04-29 | 2019-04-29 | Blade pushing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209785900U true CN209785900U (en) | 2019-12-13 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920605163.0U Active CN209785900U (en) | 2019-04-29 | 2019-04-29 | Blade pushing device |
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| CN (1) | CN209785900U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112736002A (en) * | 2020-12-31 | 2021-04-30 | 至微半导体(上海)有限公司 | Wafer high-speed loading method for wafer cleaning equipment |
-
2019
- 2019-04-29 CN CN201920605163.0U patent/CN209785900U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112736002A (en) * | 2020-12-31 | 2021-04-30 | 至微半导体(上海)有限公司 | Wafer high-speed loading method for wafer cleaning equipment |
| CN112736002B (en) * | 2020-12-31 | 2022-06-07 | 至微半导体(上海)有限公司 | Wafer high-speed loading method for wafer cleaning equipment |
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