CN209775835U

CN209775835U - Flexible container for printing devices

Info

Publication number: CN209775835U
Application number: CN201822207862.8U
Authority: CN
Inventors: 冯雪; 张柏诚; 陈颖; 蒋晔; 刘兰兰
Original assignee: Tsinghua University; Institute of Flexible Electronics Technology of THU Zhejiang
Current assignee: Tsinghua University; Institute of Flexible Electronics Technology of THU Zhejiang
Priority date: 2018-12-26
Filing date: 2018-12-26
Publication date: 2019-12-13
Anticipated expiration: 2028-12-26

Abstract

the flexible container for the printing device comprises a cavity for containing glue solution and a channel for the glue solution to flow out. The utility model discloses a but flexible container one shot forming can be arranged in the method of printing preparation device, the preparation of carrying out extensive device and circuit that can quick repeatability.

Description

Flexible container for printing devices

Technical Field

the utility model relates to a printing technology field especially relates to a flexible container for printing device.

Background

in the electronic field, the preparation process of electronic devices and electronic circuits is complex, and processing technologies such as oxidation, photoetching, diffusion, epitaxy, construction, deposition and the like are required, and the technologies are characterized by complex process, high energy consumption, high pollution, high cost and the like. If the electronic device and the electronic circuit can be prepared by adopting a printing mode, a fast, efficient and green production and manufacturing process can be realized.

The printing electronic technology is an additive process, and can directly attach fluid substances such as organic polymer conductor ink or liquid slurry, liquid metal and the like on a substrate, thereby solving the problems of pollution and the like to a certain extent. At present, the graphical design of liquid/colloidal slurry is realized by sliding a gun head on the surface of a substrate in the 3D printing or circuit printing process, and although the method has high autonomy, the forming speed is slow, so that the method is not suitable for large-scale circuit production.

the foregoing description is provided for general background information and is not admitted to be prior art.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a flexible container for printing device, this flexible container can be used to large-scale circuit production.

the utility model provides a flexible container for printing device, including the cavity that is used for holding the glue solution and can supply the passageway that the glue solution flows.

Further, the glue container also comprises one or more grooves, the cavity is connected with the grooves through the channels, and the grooves are used for wrapping glue flowing out of the channels.

Further, the cross-sectional shape of the groove includes a triangle, a square, or a semicircle.

Further, the shape of the flexible container includes a long bar shape, a plate shape, a cylindrical shape, or a shape corresponding to the shape of a printing device to be prepared.

further, the material of the flexible container comprises a flexible shape memory material.

Further, the flexible shape memory material includes one or more of a thermotropic shape memory polymer, an electro-shape memory polymer, a photo-shape memory polymer, or a chemo-inductive shape memory polymer.

Further, editing the shape of the flexible container by using a manipulator; applying external force to the flexible container by using a manipulator to open the channel of the container, and extruding the glue solution in the cavity; and picking and placing the flexible container or positioning the flexible container by utilizing a mechanical arm.

further, editing the shape of the flexible container by using a manipulator; picking and placing the flexible container or positioning the flexible container by using a manipulator; providing a memory stimulus to the flexible container using a shape memory conditioning device, enabling the flexible container to remember a shape in a particular state.

Further, the channel has a first memory state formed in response to a first memory stimulus, the first memory state including a channel open state.

Further, the first memorized state also comprises a state in which the shape of the flexible container corresponds to the shape of the device to be prepared.

Further, the channel also has a second memory state formed in response to a second memory stimulus, the second memory state including a channel closed state.

The utility model discloses one of them of following beneficial effect has at least:

1. The utility model discloses compare present syringe needle printing technique, its flexible container one shot forming, the preparation of carrying out extensive device and circuit that can quick repeatability.

2. the utility model discloses not only confine the preparation of conducting material to, still can carry out the graphical preparation of non-conducting polymer.

3. The shape memory condition stimulating device is used for applying memory stimulation to the flexible container made of the shape memory material, so that the flexible container deforms in response to the memory stimulation, the action of external force on the flexible container is not needed, the external force can be prevented from being transmitted to the substrate, and the substrate is prevented from deforming.

Drawings

fig. 1 is a schematic view showing a part of a process of using an elongated or plate-shaped flexible container according to a first embodiment of the present invention.

Fig. 2 is a schematic flow chart of a device manufactured by using the flexible container according to the first embodiment of the present invention.

Fig. 3 is a schematic view of a control system and a flexible container according to a first embodiment of the present invention.

fig. 4 is a schematic view of a part of the process of using the cylindrical flexible container according to the second embodiment of the present invention.

Fig. 5 is a schematic flow chart of a method for manufacturing a device by printing according to a second embodiment of the present invention.

Fig. 6 is a schematic view of a control system and a flexible container according to a second embodiment of the present invention.

Fig. 7 is a schematic top view of a flexible microchannel chip prepared in a third embodiment of the present invention.

Fig. 8 is a schematic structural view of a flexible container according to a third embodiment of the present invention.

fig. 9 is a schematic top view of a flexible container made in a third embodiment of the present invention.

Fig. 10 is a schematic top view of an interdigital capacitor fabricated in a fourth embodiment of the present invention.

Fig. 11 is a schematic structural view of a flexible container according to a fourth embodiment of the present invention.

fig. 12 is a schematic top view of a single interdigital electrode of an interdigital capacitor fabricated in a fourth embodiment of the present invention.

Detailed Description

The following detailed description of the embodiments of the present invention is provided with reference to the accompanying drawings and examples. The following examples are intended to illustrate the invention, but are not intended to limit the scope of the invention.

First embodiment

As shown in fig. 1, the present invention provides a flexible container 10 for use in the manufacture of flexible electronic devices by printing. The flexible container 10 comprises a cavity 11 for containing glue solution 30, a channel 13 for allowing the glue solution 30 to flow out, and a groove 12 connected with the channel 13;

In the present invention, the flexible container 10 may be formed in one step by a casting method. The flexible container 10 may be made of a flexible material such as rubber, plastic, silicone, organic elastic material, organic fiber, or shape memory material, and may have a shape such as an elongated strip, a plate, a cylinder (as shown in fig. 4), or a shape corresponding to the shape of a device to be manufactured. If the shape of the flexible container 10 does not correspond to the shape of the device to be prepared, the flexible container needs to be bent, pushed in, pulled out, folded, etc. before printing to change its shape to correspond to the shape of the device to be prepared. The groove 12 is disposed on the outer side of the flexible container 10, for example, on the bottom of the elongated or plate-shaped flexible container 10, or on the outer edge of the cylindrical flexible container 10 in the radial direction, and is used for wrapping the glue solution 30 flowing out from the channel 13. The channel 13 is disposed between the groove 12 and the cavity 11, and connects the groove 12 and the cavity 11, and the groove 12 and the channel 13 may be one or more and are continuously or discretely distributed along the length direction of the flexible container 10. When the flexible container 10 includes one recess 12, the shape of the flexible container 10 at the time of printing needs to correspond to the shape of the device to be prepared, and when the flexible container 10 includes a plurality of recesses 12, the flexible container 10 is preferably formed at one time at the time of preparation so that the shape of the single recess 12 of the flexible container 10 at the time of printing needs to correspond to the shape of the device to be prepared. The channel 13 of the flexible container 10 is in a closed state in a normal state, so that the flexible container 10 can contain and wrap the glue solution 30 inside. The cross-sectional shape of the groove 12 is determined according to the cross-sectional shape of the device to be manufactured, and the shape and size of the groove 12 can control the molding shape of the glue 30, the total flow rate of the glue 30 and the contact area of the glue 30 and the substrate 40. Specifically, the cross-section of the groove 12 may be triangular, rectangular, semicircular, semi-elliptical, or the like.

Referring to fig. 2, the present invention provides a flexible container 10 for manufacturing a flexible electronic device by a printing manufacturing method of the device, the first embodiment of the printing manufacturing method comprising the steps of:

Step S11: as shown in fig. 1(a), providing a substrate 40 and a flexible container 10 with a glue solution 30 disposed therein;

Step S12: as shown in fig. 1(b), applying a first stimulus to the flexible container 10 to open the channel 13 of the flexible container 10 and allow the glue solution 30 to flow out to fill the groove 12 of the flexible container 10;

Step S13: as shown in fig. 1(c), the glue solution 30 is attached to the substrate 40, and the glue solution 30 on the substrate 40 forms a pattern having the same shape as the device to be manufactured after being cured;

Step S14: solidifying the glue solution 30 on the substrate 40;

Step S15: and obtaining the device to be prepared.

In step S11, the flexible container 10 is provided as the flexible container described above. The substrate 40 to be provided may be a rigid substrate or a flexible substrate, and the substrate 40 may be a flat substrate or a curved substrate. When the flexible container 10 provided is a long-sized or plate-shaped flexible container, the corresponding substrate 40 may be a plate-shaped substrate; as shown in fig. 4a to 4c, when the provided flexible container 40 is a cylindrical flexible container, the corresponding substrate 40 may be a curved substrate, and the cylindrical flexible container and the curved substrate may be manufactured by a roll-to-roll process. The substrate 40 material can be PDMS (polydimethylsiloxane), PU (polyurethane), PET (poly-p-phenylene-terephtalate plastic), rubber, flexible glass, flexible silicon wafer, rigid glass, etc. The providing of the substrate 40 may further include: according to the liquid amount of the required glue solution and/or the shape of the solidified glue solution, the surface of the substrate 40 is treated, so that the glue solution 30 and the substrate 40 keep a certain contact angle, and the glue solution 30 is just attached to the substrate 40 and is not randomly diffused. That is, the contact angle of the surface of the substrate 40 is determined according to the liquid amount of the desired glue and/or the shape of the glue after curing. The contact angle refers to the included angle between the glue solution 30 and the contact surface of the substrate 40, taking an aqueous solution as an example, when the contact angle between water and the substrate 40 is greater than 90 degrees, the substrate 40 is considered to be a hydrophobic material, otherwise, the substrate is considered to be a hydrophilic material, and when the contact angle is greater than 90 degrees, the glue solution 30 cannot arbitrarily increase the contact area with the surface of the substrate 40. The size of the contact angle can affect the amount of the adhesive liquid and the shape of the adhesive liquid 30 after being cured, for example, a large contact angle can make the adhesive liquid 30 after being cured flat and can adhere more adhesive liquid 30, and a small contact angle can make the adhesive liquid 30 after being cured round and can adhere relatively less adhesive liquid. The surface treatment of the substrate 40 may be performed by both physical and chemical methods, the chemical method may include controlling the contact interface of the aqueous phase or the oil phase, such as water-based oil-based treatment, the physical method may include surface roughening, increasing the surface roughness of the substrate 40, increasing the contact angle, and preventing the glue solution 30 from arbitrarily increasing the contact area with the surface of the substrate 40, and the surface roughening may include roughening the surface of the substrate 40 by a subtractive process (e.g., plasma bombardment) or an additive process (e.g., surface doping, adding metal or metal oxide nanoparticles to the surface, growing nanorod arrays on the surface, etc.).

In step S11, the glue solution 30 in the flexible container 10 is a liquid or colloidal material for a molding device, which may be one or more of liquid metal, liquid rubber, liquid photo-cured material, metal particle slurry, and carbon material slurry. The liquid photo-cured material may be a liquid monomer or a liquid oligomer of a photosensitive resin, such as epoxy resins and liquid monomers or liquid oligomers of acrylates. When injecting the glue solution 30 into the cavity 11 of the flexible container 10, the glue solution 30 can be injected by directly penetrating the flexible container 10 by using a syringe.

In step S11, if the shape of the provided flexible container 10 or its groove 12 corresponds to the shape of the device to be prepared, the process may proceed directly to step S12. If the shape of the flexible container 10 or the groove 12 thereof provided does not correspond to the shape of the device to be prepared, step S11 further includes: the shape of the flexible container 10 or the recess 12 is prepared to a shape corresponding to the shape of the device to be prepared. If it is desired to prepare the shape of the flexible container 10 to a shape corresponding to the shape of the device to be prepared, the shape of the flexible container 10 can be edited using the manipulation system, using system programming and control of the robot 70. As shown in fig. 2, the manipulation system includes a control device 60 and a robot 70. The control device 60 may be a computer that can accept external inputs of the shape of the device to be fabricated and can accept external inputs of programming to control the operation of the robot 70 according to the programming. The manipulator 70 is used for bending, pushing in, pulling out, folding, etc. the flexible container 10, and the flexible container 10 is made into a mold corresponding to the shape of the device to be prepared, and the made mold can be used for preparing various devices such as gratings, circuits, micro-channel chips, electronic devices (e.g. interdigital capacitors), etc.

The robot 70 may also be configured to apply a first stimulus to the flexible container 10 to cause the glue solution 30 in the cavity 11 of the flexible container 10 to flow out and fill the groove 12 below the flexible container 10. In the present embodiment, the first stimulus is a squeezing force applied to the flexible container 10, and when the first stimulus is applied to the flexible container 10, the glue 30 in the flexible container 10 is squeezed out of the cavity 11 of the flexible container 10. In order to make the extrusion amount of the glue solution 30 more accurate, the volume of the glue solution 30 required for filling the groove 12 can be calculated in advance according to the size of the groove 12, then the extrusion amplitude is calculated according to the shape and size of the part of the manipulator 70 for applying the first stimulus, a control program is programmed according to the calculation result, and the manipulator 70 is controlled by the control device 60 to extrude the glue solution 30 with a proper volume. In other embodiments of the present invention, the robot 70 may not be used, and the flexible container 10 may be squeezed manually. In other embodiments of the present invention, a special extrusion device (e.g., a block-shaped body with a regular cross-sectional shape, such as a rectangular block, etc.) may be designed, and the extrusion amplitude is calculated according to the shape and size of the extrusion device. In embodiments utilizing a press device, the press device may be a stand-alone device controlled by the control device 60 or may be a device mounted or integrated on the robot 70. If the extrusion device is an independent device independent of the manipulator 70, the control device 60 directly controls the extrusion device to extrude the glue solution 30 with a proper volume; if the squeezing means is mounted or integrated on the robot 70, the control means 60 squeezes out a suitable volume of glue 30 by controlling the movement of the robot 70. If the squeezing means is mounted on the robot 70, it may be held in the robot 70 or fixed to the robot 70 by a fixing means; if the squeezing means is integrated in the robot 70, it may be a part of the robot 70, for example a finger of the robot 70.

Corresponding to step S12 (applying the first stimulus to the flexible container 10 to open the channel 13 of the flexible container 10), the method for print-making a device further includes: the first stimulus is removed to close the passage 13 of the flexible container, and since the flexible container 10 of the present invention is elastically deformable, the passage 13 of the flexible container 10 automatically closes after the first stimulus is removed (e.g., the squeezing force is removed).

In addition, the robot 70 may also be used to pick and place the flexible container 10 or to position the flexible container 10. Accessing the flexible container 10 includes placing the flexible container 10 on the substrate 40 and removing the flexible container 10 from the substrate 40, positioning the flexible container 10 includes positioning the flexible container 10 during movement of the flexible container 10 (e.g., moving the flexible container 10 to a next station), and the like.

In step S14, the curing glue 30 may be implemented by the following methods: heat curing, cool curing, photo curing, chemical curing, and the like. When the glue solution 30 in the flexible container 10 is metal nano-particle slurry, the slurry is accelerated to volatilize by a heating mode to form the metal nano-wire. When the glue solution 30 in the flexible container 10 is liquid metal, the liquid metal can reach the freezing point in a cooling mode and be solidified into a solid metal wire. When the glue solution 30 in the flexible container 10 is a liquid photo-cured material, the internal photo-curing agent can be stimulated by means of UV light irradiation to cure the liquid material. If the glue solution 30 in the flexible container 10 is liquid rubber, the liquid rubber may be coupled to form solid rubber by heating. In order to accelerate the curing of the glue 30, the printing preparation method of the device further comprises the following steps: the substrate 40 is placed on a curing tray 50. the curing tray 50 may include a heat curing tray, a light curing tray, a chemical curing tray, and a cool curing tray to perform a curing operation on the glue 30 through the curing tray 50.

in the method for manufacturing a device by printing, step S14 may be followed by: the cured glue 30 is peeled off from the substrate 40. When the solidified glue solution 30 is peeled off from the substrate 40, laser cutting, scraping with a scraper, manual peeling, or smearing grease on the substrate 40 in advance (facilitating peeling after solidification) may be adopted.

Second embodiment

As shown in fig. 4, the present invention provides a flexible container 10 for manufacturing flexible electronic devices by printing. The flexible container 10 comprises a cavity 11 for containing the glue 30, a channel 13 through which the glue 30 can flow out, and a groove 12 connected to the channel 13.

In the present invention, the flexible container 10 may be formed in one step by a casting method. Flexible container 10 is formed from a shape memory material including one or more of a thermotropic shape memory polymer, an electro-shape memory polymer, a photo-shape memory polymer, a chemically induced shape memory polymer, and the like. The flexible container 10 may be in the shape of an elongated strip, a plate, a cylinder (as shown in fig. 4), a shape corresponding to the shape of the device to be prepared, or the like. If the shape of the flexible container 10 does not correspond to the shape of the device to be prepared, the flexible container needs to be bent, pushed in, pulled out, folded, etc. before printing to change its shape to correspond to the shape of the device to be prepared. The groove 12 is disposed on the outer side of the flexible container 10, for example, on the bottom of the elongated or plate-shaped flexible container 10, or on the outer edge of the cylindrical flexible container 10 in the radial direction, and is used for wrapping the glue solution 30 flowing out from the channel 13. The channel 13 is disposed between the groove 12 and the cavity 11, and connects the groove 12 and the cavity 11, and the groove 12 and the channel 13 may be one or more and are continuously or discretely distributed along the length direction of the flexible container 10. When the flexible container 10 includes one recess 12, the shape of the flexible container 10 at the time of printing needs to correspond to the shape of the device to be prepared, and when the flexible container 10 includes a plurality of recesses 12, the flexible container 10 is preferably formed at one time at the time of preparation so that the shape of the single recess 12 of the flexible container 10 at the time of printing needs to correspond to the shape of the device to be prepared. The channel 13 of the flexible container 10 is in a closed state in a normal state, so that the flexible container 10 can contain and wrap the glue solution 30 inside. The cross-sectional shape of the groove 12 is determined according to the cross-sectional shape of the device to be manufactured, and the shape and size of the groove 12 can control the molding shape of the glue 30, the total flow rate of the glue 30 and the contact area of the glue 30 and the substrate 40. Specifically, the cross-section of the groove 12 may be triangular, rectangular, semicircular, semi-elliptical, or the like.

Referring to fig. 5, the present invention provides a flexible container 10 for manufacturing a flexible electronic device by a printing manufacturing method of the device, the second embodiment of the printing manufacturing method comprising the steps of:

Step S21: providing a substrate 40 and a flexible container 10 with a glue solution 30 inside, as shown in fig. 4(a), the flexible container 10 is provided with a cavity 11 for accommodating the glue solution 30, a channel 13 for allowing the glue solution 30 to flow out, and one or more grooves 12 connected with the channel 13, and the flexible container 10 has a shape memory function;

step S22: as shown in fig. 4(b), applying a first stimulus to the flexible container 10 to open the channel 13 of the flexible container 10 and allow the glue solution 30 to flow out to fill the groove 12 of the flexible container 10;

Step S23: as shown in fig. 4(c), the glue solution 30 is attached to the substrate 40, and the glue solution 30 on the substrate 40 forms a pattern having the same shape as the device to be manufactured;

Step S24: solidifying the glue solution 30 on the substrate 40;

Step S25: and obtaining the device to be prepared.

In step S21, the flexible container 10 is provided as the flexible container described above. The substrate 40 to be provided may be a rigid substrate or a flexible substrate, and the substrate 40 may be a flat substrate or a curved substrate. When the flexible container 10 provided is a long-sized or plate-shaped flexible container, the corresponding substrate 40 may be a plate-shaped substrate; as shown in fig. 4, when the flexible container 40 is provided as a cylindrical flexible container, the corresponding substrate 40 may be a curved substrate, and the cylindrical flexible container and the curved substrate may be manufactured by a roll-to-roll process. The substrate 40 material can be PDMS (polydimethylsiloxane), PU (polyurethane), PET (poly-p-phenylene-terephtalate plastic), rubber, flexible glass, flexible silicon wafer, rigid glass, etc. In providing substrate 40, further comprising: according to the liquid amount of the required glue solution and/or the shape of the solidified glue solution, the surface of the substrate 40 is treated, so that the glue solution 30 and the substrate 40 keep a certain contact angle, and the glue solution 30 is just attached to the substrate 40 and is not randomly diffused. That is, the contact angle of the surface of the substrate 40 is determined according to the liquid amount of the desired glue and/or the shape of the glue after curing. The contact angle refers to the included angle between the glue solution 30 and the contact surface of the substrate 40, taking an aqueous solution as an example, when the contact angle between water and the substrate 40 is greater than 90 degrees, the substrate 40 is considered to be a hydrophobic material, otherwise, the substrate is considered to be a hydrophilic material, and when the contact angle is greater than 90 degrees, the glue solution 30 cannot arbitrarily increase the contact area with the surface of the substrate 40. The size of the contact angle can affect the amount of the adhesive liquid and the shape of the adhesive liquid 30 after being cured, for example, a large contact angle can make the adhesive liquid 30 after being cured flat and can adhere more adhesive liquid 30, and a small contact angle can make the adhesive liquid 30 after being cured round and can adhere relatively less adhesive liquid. The surface treatment of the substrate 40 may be performed by both physical and chemical methods, the chemical method may include controlling the contact interface of the aqueous phase or the oil phase, such as water-based oil-based treatment, the physical method may include surface roughening, increasing the surface roughness of the substrate 40, increasing the contact angle, and preventing the glue solution 30 from arbitrarily increasing the contact area with the surface of the substrate 40, and the surface roughening may include roughening the surface of the substrate 40 by a subtractive process (e.g., plasma bombardment) or an additive process (e.g., surface doping, adding metal or metal oxide nanoparticles to the surface, growing nanorod arrays on the surface, etc.).

In step S21, the glue solution 30 in the flexible container 10 is a liquid or colloidal material for a molding device, which may be one or more of liquid metal, liquid rubber, liquid photo-cured material, metal particle slurry, and carbon material slurry. The liquid photo-cured material may be a liquid monomer or a liquid oligomer of a photosensitive resin, such as epoxy resins and liquid monomers or liquid oligomers of acrylates. When injecting the glue solution 30 into the cavity 11 of the flexible container 10, the glue solution 30 can be injected by directly penetrating the flexible container 10 by using a syringe.

In step S21, if the shape of the provided flexible container 10 or its groove 12 corresponds to the shape of the device to be prepared, the process may proceed directly to step S22. If the shape of the flexible container 10 or the groove 12 thereof provided does not correspond to the shape of the device to be prepared, step S21 further includes: the shape of the flexible container 10 or the recess 12 is prepared to a shape corresponding to the shape of the device to be prepared. If it is desired to prepare the shape of the flexible container 10 to a shape corresponding to the shape of the device to be prepared, the shape of the flexible container 10 can be edited using the manipulation system, using system programming and control of the robot 70. In step S21, the flexible container 10 is provided as a cylindrical flexible container, the substrate 40 is provided as a curved substrate, and in the specific operation of step S21, the flexible container 10 is rolled into a cylindrical shape and placed outside the shape memory condition stimulation apparatus 80, and the substrate 40 is placed outside the flexible container 10 in a curved shape so that the substrate 40 can move together with the flexible container 10.

As shown in fig. 6, the manipulation system of the present invention includes a control device 60, a manipulator 70, and a shape memory condition stimulation device 80. The control device 60 in this embodiment may be a computer that can receive an external input of the shape of the device to be manufactured and can receive an external input of a programming program to control the operation of the manipulator 70 and the shape memory condition stimulation device 80 according to the programming program. Shape memory condition stimulation device 80 is configured to provide a memory stimulus, which may be a light stimulus, an electrical stimulus, a thermal stimulus, a chemical stimulus, or the like, to flexible container 10 to place flexible container 10 in a shape memory state. The manipulator 70 is used for cooperating with the shape memory condition stimulating device 80, bending, pushing inwards, pulling outwards, folding, extruding and the like are carried out on the flexible container 10 when the flexible container 10 is in a state capable of carrying out shape memory, the flexible container 10 is made into a mould corresponding to the shape of a device to be prepared, or pushing force is applied to the flexible container 10 when the flexible container 10 is in a state capable of carrying out shape memory, so that the channel 13 of the flexible container 10 is opened, the glue solution 30 flows out, the groove 12 is filled, and then the pushing force is removed, so that the channel 13 is closed. The memory stimulus applied by the shape memory condition stimulus device 80 to the flexible container 10 includes: a first memory stimulus, such as a thermal stimulus, applied to the flexible container 10 in a state where the shape of the flexible container 10 or the groove 20 is in correspondence with the shape of the device to be prepared and the channel 13 of the flexible container 10 is opened; a second memory stimulus, such as another thermal stimulus, is applied to the flexible container 10 with the pushing force removed, closing the channel 13. When a first memory stimulus is applied to the flexible container 10, the flexible container 10 has a first memory state including a state in which the channel 13 is open and a state in which the shape of the flexible container 10 or the recess 20 corresponds to the shape of the device to be prepared. The first stimulus applied to the flexible container 10 in step S22 of the present embodiment is a first memory stimulus. When a second memory stimulus is applied to the flexible container 10, the flexible container 10 has a second memory state, which includes a state in which the channel 13 is closed. In the second memory state, the shape of the flexible container 10 may correspond to the shape of the device to be prepared in the first memory state, or may be other shapes, such as returning to the shape of the flexible container 10 before the first memory state, or other device shapes different from the shape of the device to be prepared in the first memory state. In other embodiments of the present invention, the memory stimulation applied to the flexible container 10 by the shape memory condition stimulation device 80 may also include: a first memory stimulus, such as a first thermal stimulus, applied to the flexible container 10 in a state where the channel 13 of the flexible container 10 is open; a second memory stimulus, such as a second thermal stimulus, applied to the flexible container 10 in a state where the pushing force is removed and the passage 13 of the flexible container 10 is closed; and a third memory stimulus, such as a third thermal stimulus, applied to the flexible container 10 in a state where the shape of the flexible container 10 or the recess 20 is in correspondence with the shape of the device to be prepared. When a first memory stimulus is applied to the flexible container 10, the flexible container 10 has a first memory state comprising a state in which a portion of the container wall is deformed and the passageway 13 is open. In step S22 of this embodiment, the first stimulus applied to the flexible container 10 is a first memory stimulus, for example, as shown in fig. 4(a), the first memory stimulus is applied to the flexible container 10 by the first memory stimulus device 81, so that the channel 13 of the flexible container 10 is opened, and the glue solution 30 flows out to fill the groove 12. When a second memory stimulus is applied to the flexible container 10, the flexible container 10 has a second memory state comprising a state in which the channel 13 is closed, for example, as shown in fig. 4(b), after the glue solution 30 fills the groove 12, the second memory stimulus is applied to the flexible container 10 by the second memory stimulus device 82, so that the channel 13 of the flexible container 10 is closed, leaving the glue solution 30 on the substrate 40.

When the third memory stimulus is applied to the flexible container 10, the flexible container 10 has a third memory state including a state in which the shape of the flexible container 10 corresponds to the shape of the device to be prepared, in the printing preparation method, the third memory stimulus may be applied to the flexible container 10 to form the shape of the flexible container 10 and/or the shape of the groove 12 into a shape corresponding to the shape of the device to be prepared, before step S22. After the step of applying the second memory stimulus, a fourth memory stimulus, such as a fourth thermal stimulus, may also be applied to the flexible container 10 to cause the flexible container 10 to have a fourth memory state, such as to return the shape of the flexible container 10 to the shape prior to having the third memory state, or to have another device shape that is different from the shape of the device to be prepared. In the present embodiment, the shape memory condition stimulation device 80 applies memory stimulation such as optical stimulation, electrical stimulation, thermal stimulation, or chemical stimulation to the flexible container 10 to deform the flexible container 10 in response to the memory stimulation, so that an external force does not need to be applied to the flexible container 10, the external force is prevented from being transmitted to the substrate 40, no interaction occurs between the flexible container 10 and the substrate 40, and the substrate 40 is prevented from being deformed by the force.

additionally, in this embodiment, the robot 70 may also be used to position the flexible container 10. In the present disclosure, positioning the flexible container 10 includes placing the flexible container 10 on the substrate 40, removing the flexible container 10 from the substrate 40 after extruding the glue solution 30, or moving the flexible container 10 to the next station, etc.

in step S24, the curing glue 30 may be implemented by the following methods: heat curing, cool curing, photo curing, chemical curing, and the like. When the glue solution 30 in the flexible container 10 is metal nano-particle slurry, the slurry is accelerated to volatilize by a heating mode to form the metal nano-wire. When the glue solution 30 in the flexible container 10 is liquid metal, the liquid metal can reach the freezing point in a cooling mode and be solidified into a solid metal wire. When the glue solution 30 in the flexible container 10 is a liquid photo-cured material, the internal photo-curing agent can be stimulated by means of UV light irradiation to cure the liquid material. If the glue solution 30 in the flexible container 10 is liquid rubber, the liquid rubber may be coupled to form solid rubber by heating. In order to facilitate the curing operation, the printing preparation method of the device further comprises the following steps: the substrate 40 is placed on a curing tray 50. the curing tray 50 may include a heat curing tray, a light curing tray, a chemical curing tray, and a cool curing tray to perform a curing operation on the glue 30 through the curing tray 50.

in the method for manufacturing a device by printing, step S24 may be followed by: the cured glue 30 is peeled off from the substrate 40. When the solidified glue solution 30 is peeled off from the substrate 40, laser cutting, scraping with a scraper, manual peeling, or smearing grease on the substrate 40 in advance (facilitating peeling after solidification) may be adopted.

third embodiment

The target is as follows: preparing a flexible micro-flow channel chip, wherein the appearance of the flexible micro-flow channel chip is shown in fig. 7, the adopted flexible container is a PDMS flexible container, as shown in fig. 8, the cross section of the PDMS flexible container is 3mm by 3mm, the length of the PDMS flexible container is 20cm, a cavity with the size of 1mm by 1mm is arranged in the PDMS flexible container, and a triangular groove (the width of the bottom end of the groove is 0.5mm) and a channel for connecting the triangular groove and the cavity are arranged at the bottom of the PDMS flexible container.

The preparation process comprises the following steps: providing the PDMS flexible container, wherein a mixed solution of a light curing material polyacrylate monomer and a light curing agent 819 is filled in a cavity of the PDMS flexible container, and the mixing ratio is 95: 5-99: 1 (preferably 96:4 wt%);

Providing a PDMS flexible substrate, and carrying out oxygen plasma gas striking on the surface of the PDMS flexible substrate for 3min to form a rough structure on the surface of the PDMS flexible substrate, so that polyacrylic acid liquid can be attached to the surface of the PDMS flexible substrate and is not randomly diffused;

Folding the PDMS flexible container by a manipulator according to the shape of the flexible micro flow channel chip to be prepared, and making the shape as shown in FIG. 9;

Placing a PDMS flexible container on a PDMS flexible substrate;

Applying a pushing force on the flexible container from the top of the PDMS flexible container to open a channel of the PDMS flexible container, and pushing out a mixed solution of the polyacrylate monomer and the light curing agent 819 inside to fill the triangular groove below the PDMS flexible container;

Removing the PDMS flexible container, and leaving the extruded mixed solution on the PDMS flexible substrate, wherein the extruded mixed solution forms the shape of the micro flow channel shown in FIG. 7;

Irradiating the mixed solution by using a 25W mercury lamp light source for 2 minutes to solidify the mixed solution on the surface of the flexible substrate;

stripping the cured mixed solution from the flexible substrate;

the preparation of the flexible micro-channel chip is completed.

fourth embodiment

The target is as follows: an interdigital capacitor was fabricated, the appearance of which is shown in fig. 10, and provided as a flexible container of PLA (polylactic acid, a thermotropic shape memory polymer), which has a cross section of 5mm by 5mm and a length of 3cm and a cavity therein having a size of 3mm by 3mm, as shown in fig. 11.

the preparation process comprises the following steps: providing the PLA flexible container, wherein a cavity of the PLA flexible container is filled with liquid metal E-GaIn gallium-indium alloy (the solidification temperature of the liquid metal E-GaIn gallium-indium alloy is 40 ℃;

Providing a PU flexible substrate, and carrying out argon plasma gas striking on the surface of the PU flexible substrate for 1min to form a rough structure on the surface of the PU flexible substrate, so that liquid metal can be attached to the surface of the PU flexible substrate and is not randomly diffused;

According to the shape of the interdigital capacitor to be prepared, a mechanical arm is utilized to fold the PLA flexible container, the PLA flexible container is edited into a shape corresponding to a single interdigital electrode shown in figure 12, a shape memory condition stimulation device is utilized to carry out radiation heating, the temperature of the PLA flexible container is raised to 120 ℃, two memory shapes are given to the PLA flexible container in the process, and the opening and closing actions of a channel can be respectively carried out on the PLA flexible container at 55 ℃ and 75 ℃;

Placing a PLA flexible container on the surface of the PU flexible substrate;

The shape memory condition stimulating device is used for applying radiation heating to the PLA flexible container, a channel of the PLA flexible container is opened at 75 ℃, liquid metal flows out, the temperature is reduced to 55 ℃ after the liquid metal flows out, the channel is closed, and the liquid metal is filled in a semicircular groove of the PLA flexible container;

Removing the PLA flexible container, leaving an extruded liquid metal on the PU flexible substrate, the extruded liquid metal constituting the interdigitated electrode shape shown in fig. 12;

Preparing another interdigital electrode with the same pattern on the surface of another PU flexible substrate in the same way;

And (3) reducing the two interdigital electrodes to 25 degrees to solidify the liquid metal, and overlapping the two interdigital electrodes according to the relative position shown in the figure 10 to finish the preparation of the interdigital capacitor.

As can be seen from the above description, the present invention has at least one of the following advantages:

3. The utility model discloses it is lower to the substrate requirement, carries out surface treatment such as indiscriminate plasma bombardment to the substrate, need not to need to prepare complicated mask plate and carry out patterned surface treatment to the substrate like some prior art (make liquid can attach to local substrate, realize the graphical of preparation device), and surface treatment process is fairly simple to it is various to handle the form.

4. The shape memory condition stimulating device is used for applying memory stimulation to the flexible container made of the shape memory material, so that the flexible container deforms in response to the memory stimulation, the action of external force on the flexible container is not needed, the external force can be prevented from being transmitted to the substrate, and the substrate is prevented from deforming.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

As used herein, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, including not only those elements listed, but also other elements not expressly listed.

the above description is only for the specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions within the technical scope of the present invention, and all should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims

1. The flexible container for the printing device is characterized by comprising a cavity for containing glue solution and a channel for the glue solution to flow out.

2. a flexible container for printing devices as in claim 1 further comprising one or more grooves connecting the chamber with the groove for enveloping glue flowing from the groove.

3. A flexible container for printing devices as in claim 2 wherein the cross-sectional shape of the groove comprises a triangle, square or semi-circle.

4. A flexible container for printing devices as in claim 2 wherein the shape of the flexible container comprises an elongated strip, a plate, a cylinder or a shape corresponding to the shape of the printing device to be prepared.

5. A flexible container for a printing device as in claim 1 wherein the material of the flexible container comprises a flexible shape memory material.

6. a flexible container for printing devices as in claim 5 wherein the flexible shape memory material comprises one or more of a thermotropic shape memory polymer, an electro-shape memory polymer, a photo-shape memory polymer, or a chemically induced shape memory polymer.

7. the flexible container for printing devices as claimed in claim 1, wherein the shape of the flexible container is edited using a robot; applying external force to the flexible container by using a manipulator to open the channel of the container, and extruding the glue solution in the cavity; and picking and placing the flexible container or positioning the flexible container by utilizing a mechanical arm.

8. The flexible container for printing devices as claimed in claim 5, wherein the shape of the flexible container is edited using a robot; picking and placing the flexible container or positioning the flexible container by using a manipulator; providing a memory stimulus to the flexible container using a shape memory conditioning device, enabling the flexible container to remember a shape in a particular state.

9. The flexible container for printing devices as recited in claim 8, wherein the channel has a first memory state in response to a first memory stimulus, the first memory state comprising a channel open state.

10. A flexible container for printing devices as in claim 9 wherein the first memory state further comprises a state in which the shape of the flexible container corresponds to the shape of a device to be prepared.

11. The flexible container for printing devices as recited in claim 9 or 10, wherein the channel further has a second memory state in response to a second memory stimulus, the second memory state comprising a channel closed state.